Component Mounting Flexible Circuit Board (Component Mounting FPC)
Support for component mounting is also available.
This is an FPC with electronic components mounted.
- 企業:スコットデザインシステム
- 価格:Other
更新日: 集計期間:Jul 16, 2025~Aug 12, 2025
※当サイトの各ページの閲覧回数を元に算出したランキングです。
1~15 件を表示 / 全 96 件
Support for component mounting is also available.
This is an FPC with electronic components mounted.
This is a flexible substrate, FPC, and flexible board that is effective for wiring related to large-scale devices. FPC.
Adopted as an alternative to cables, we propose a reduction in assembly costs (improved wiring efficiency). It is used in display devices and industrial robots. FPC.
An FPC that can withstand continuous use for 1,000 hours at a high temperature of up to 150℃ has been developed.
The "Heat-Resistant FPC" is a heat-resistant substrate (FPC) that excels in heat resistance, allowing for continuous use in high-temperature environments. By leveraging the inherent characteristics of FPC, such as high-density wiring, collective connectivity, and lightweight design, which were previously impossible in high-temperature environments, it contributes to new wiring styles in fields such as medical, lighting, and industrial equipment. 【Features】 ■ Can be used without issues in electrical characteristics even after 1,000 hours at 150°C ■ Maintains adhesion strength of the insulating film ■ Allows for the direct use of conventional FPC design rules *For more details, please refer to the PDF document or feel free to contact us.
The most standard specifications at a low cost.
This is the most basic structure of an FPC with a conductor pattern formed only on one side.
It is a flexible circuit board that can be repeatedly stretched and contracted, and can follow deformation. FPC
While general flexible materials can be bent, they face challenges in folding and stretching. Due to their flexibility, stretchability, and ability to conform, they are expected to be used in a wide range of fields for flexible electronics devices, including wearables, sensors, displays, robotics, as well as pressure sensors and seat heaters. FPC.
Flying lead structure
It is an FPC that can make electrical contact from both sides.
Noise countermeasure structure
This is an FPC with a shield structure that is effective for noise countermeasures.
We will support and propose ideas to enhance development capabilities, working closely with the development technology personnel! FPC
- Circuit investigation - Component investigation (creating parts list, investigating constants and sizes, collecting catalogs) - Design specification investigation (minimum hole diameter, minimum L/S investigation) - Substrate destruction investigation (layer composition, plating thickness, inner layer pattern arrangement) - Substrate non-destructive investigation (X-ray transmission, CT images) - Assembly analysis investigation (solder composition, wettability, bonding strength, etc.) - Quality investigation (thermal shock testing, temperature and humidity cycles, etc.) FPC
It is a flexible substrate, FPC, flexible circuit board with noise reduction structure.
This is a flexible substrate with a noise countermeasure structure against radiated noise from FPC, due to the high-speed transmission signal. Suppressing noise radiated by high-speed circuits is important.
We will provide design proposals that consider product requirements and mass production processes from the prototype stage! FPC
- Software design and embedded software development - Hardware development and electronic circuit design - Printed circuit board pattern design (digital/analog/high frequency) - 3D CG design, design creation, resin, metal cutting - Product graphic design - Mechanical design (enclosures/jigs/demo units) FPC
It is a flexible substrate that combines heat resistance and transparency. FPC
Compared to glass materials, it is possible to create unique design concepts not only for flat surfaces but also for curved surfaces, folding, and wrapping, thereby expanding the design possibilities for mounted devices. It is expected to be used as a substitute for glass substrates in applications such as: - Transparent conductive substrates for touch panels - Organic EL and LED lighting substrates - Displays for mobile phones. Additionally, bare chip LEDs will be implemented on transparent polyimide substrates using wire bonding, followed by resin encapsulation. Light will pass through the transparent polyimide and beautifully illuminate the opposite side.
Achieves a transmission distance more than three times that of a typical high-speed transmission FPC!
The "Long-Length High-Speed Transmission FPC" is a flexible printed circuit board (FPC) that enables the transmission of high-speed signals over long distances, achieved through the fusion of our long-length technology and high-speed transmission technology. It can be used for high-speed signal transmission wiring in large equipment and is also adopted in astronomical observation devices. 【Features】 ■ Transmission distance is more than three times that of typical high-speed transmission FPCs. ■ Enables long-length high-speed transmission comparable to cables while maintaining the thinness and lightness of FPCs. ■ By using low-breakage materials and unique pattern design, it can transmit up to 1 meter under the "USB3.0" standard. ■ Supports measurement of various transmission characteristics such as characteristic impedance, loss, and crosstalk. *For more details, please refer to the PDF document or feel free to contact us.
Introducing a flexible printed circuit board (FPC) that balances transparency and solderability!
"Transparent FPC" is a flexible printed circuit board (FPC) that excels in transparency and heat resistance, using transparent polyimide film as its substrate. We have worked on developing an FPC that achieves both high heat resistance and transparency by adopting a highly heat-resistant transparent polyimide film, thereby solving the issues of warping and dimensional changes caused by heat during reflow. As a result, it can be applied to various fields such as wearable devices and medical equipment, which prioritize design. [Features] - Uses highly heat-resistant transparent polyimide film - Can utilize the existing design rules of conventional FPCs - Proposes new wiring styles in fields such as medical, lighting, and industrial equipment *For more details, please refer to the PDF document or feel free to contact us.
Printed Circuit Board Thermal Fluid Analysis Service Thermal Management Support and Assistance FPC
We will conduct thermal fluid analysis (thermal simulation) during the pattern design stage of printed circuit boards. This includes not only predicting heat generation from heat-generating components and analyzing the heat of the patterns, but also considering thermal measures for the entire module, including the housing, from various perspectives. We will provide proposals for thermal measures. Additionally, we will support and assist in the establishment of thermal measures in the medium to long term, not only through our contracted services for pattern design and thermal fluid analysis (thermal simulation). Flexible substrates, flex PCBs, FPC. Achievements: Automotive junction boxes (J/B), relay boxes (R/B), room lamp FPC.