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substrate(fpc) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Last Updated： Aggregation Period:Sep 02, 2026～Sep 29, 2026
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substrate Product List

121～150 item / All 220 items

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Reduce reflection points! "Multilayer flexible substrate for high-speed transmission"

Reduce reflection points! "Multilayer flexible substrate for high-speed transmission"

It is suitable for high-frequency applications in the tens of GHz range, and because it allows for high-density RF lines compared to PCBs, it is effective for miniaturizing products.

The "high-speed transmission multilayer flexible substrate" reduces reflection points by integrating FPC and rigid substrates. It is suitable for high-frequency applications in the 10-30GHz range and allows for high-density RF lines compared to rigid substrates, making it effective for miniaturization of products. It also supports wire bonding and can have metal or ceramic reinforcement plates attached for heat dissipation measures. 【Features】 ■ Heat dissipation measures can be implemented by attaching reinforcement plates made of metal or ceramics ■ Miniaturization is possible due to high-density RF lines ■ Compatible with wire bonding *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials
  • substrate

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Prototype circuit board support

Prototype circuit board support

We will respond to prototype production, handle each process individually, and accommodate all aspects of a single prototype with a short delivery time.

Our company offers support for prototype circuit boards, with individual responses for each process, and we handle all aspects of a single prototype with a short lead time. 【Features】 ■ Support starting from one prototype ■ Quick response and short lead time ■ Comprehensive support from design to implementation, with individual process handling *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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Image Analysis Using a Microscope / Flexible Substrate Mock Production

Image Analysis Using a Microscope / Flexible Substrate Mock Production

It is possible to create a simple mock-up of the base for those who want to analyze the internal structure of FPC products, troubleshoot issues, or pre-verify complex product shapes.

We would like to introduce the services provided by Stay Electronics Co., Ltd. The "Flexible Circuit Board Mock Production using a High-Performance Cutting Plotter" is a service that creates simple mock-ups of flexible circuit boards using polyimide film for those who have never handled flexible circuit boards before or wish to pre-validate complex product shapes. Additionally, the "Image Analysis using a Super Depth Multi-Angle Lens Microscope" can be utilized for internal structure analysis and defect analysis of FPC products. *For questions or inquiries, please call us or contact us at the email address below. 042-774-4555 stay-4555@staydenshi.jp Contact Person: Kumada, Kikuchi [Service Operations] ■ Image Analysis using a Super Depth Multi-Angle Lens Microscope ■ Flexible Circuit Board Mock Production using a High-Performance Cutting Plotter *For more details, please refer to the PDF document or feel free to contact us.

  • Microscope
  • substrate

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Printed circuit board "multilayer flexible printed circuit board (multilayer FPC)"

Printed circuit board "multilayer flexible printed circuit board (multilayer FPC)"

Space-saving can be achieved! A multilayer flexible substrate that can reduce manufacturing costs.

Multilayer flexible circuit boards help save space! When wiring in tight spaces, it can become densely packed. By using multilayer flexible circuit boards, it is possible to arrange components while maintaining a certain degree of flexibility and thinness. We are available for consultation even from the decision-making stage, so please feel free to contact us★ 【Features】 ○ Reduction in soldering points ○ Elimination of wiring errors ○ Improved reliability ○ Labor-saving in processing and assembly ○ Reduction in manufacturing costs For more details, please contact us or download the catalog.

  • Printed Circuit Board
  • substrate

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【Ultra-Short Delivery Response】For last-minute requests during the New Year holidays, contact Matsuwa Sangyo!

【Ultra-Short Delivery Response】For last-minute requests during the New Year holidays, contact Matsuwa Sangyo!

With the "Breakthrough Course," you can ship printed circuit boards in as little as 12 hours! Let's make circuit boards this year and welcome a refreshing New Year!

The year 2024 is about to come to an end in the blink of an eye. Are there any circuit boards you are about to give up on arranging for delivery by the end of the year? If you consult with Matsuwa Sangyo, known for its ultra-short delivery times, we can accommodate your desired schedule even with tight timelines. Common year-end and New Year’s issues can be resolved with Matsuwa, making us a strong ally for your company! - Through-hole boards ⇒ as fast as 1.05 days! - Through-hole resin-filled boards ⇒ as fast as 2.1 days! - 1-2-1 build-up boards ⇒ as fast as 3 days! - FPC boards ⇒ as fast as 2 days! - 4-layer rigid FPC boards ⇒ as fast as 5 days! Furthermore… with our unbeatable <Limit Break Course>, - 4-layer through-hole boards ⇒ 17 hours - 6-layer through-hole resin-filled boards ⇒ 24 hours - 1-2-1 build-up ⇒ 48 hours - 6-layer 2-2-2 build-up ⇒ 72 hours to complete the boards! Our impressive delivery capabilities are made possible by Matsuwa Sangyo’s fully in-house manufacturing and 24-hour factory operations. Additionally, our compliance rate of 99.94% is another attractive feature. We guarantee delivery by the promised deadline. For more details, please refer to our catalog or feel free to contact us through our website.

  • Printed Circuit Board
  • substrate

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Printed Circuit Board Business Products and Services

Printed Circuit Board Business Products and Services

Improved performance in heat dissipation, dust resistance, and water resistance! Ensures the reliability of the mounted circuit board.

At Yoho Electronics, we achieve high product quality and reduced lead times through a consistent production system, unique manufacturing technology, and a quality control framework. The supported substrates include double-sided boards, high multilayer boards, aluminum boards, paper phenolic boards, flexible boards (FPC boards), and ceramic boards. By molding (resin encapsulation) the assembled boards, we enhance performance in heat dissipation, dust resistance, and drip resistance, ensuring the reliability of the assembled boards. In addition to molding, we can also accommodate substrate coating. 【Products and Services】 <Supported Substrates> ■ Double-sided boards, high multilayer boards, aluminum boards, paper phenolic boards, flexible boards (FPC boards), ceramic boards, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Circuit board processing machine
  • substrate

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Ultra-small, high-precision flexible substrate

Ultra-small, high-precision flexible substrate

Custom-made high-definition and ultra-high-definition substrates with narrow pitch! Leave it to us for flexible substrates (high-definition FPC)!

Our company is a specialized manufacturer of circuit boards, celebrating approximately 50 years this year. With our extensive experience and track record in solving various challenges in flexible circuit boards, we can produce high-resolution FPC prototypes in a short lead time, covering everything from cost considerations to prototype manufacturing and mass production. We cater to customer needs with features such as staggered layout narrow pitch, single-sided narrow pitch BGA, and sensor coils with both sides pitch, as well as single-sided, double-sided, and multilayer options. Please feel free to contact us with your requests. 【Features】 ■ Custom-made high-resolution and ultra-high-resolution boards with narrow pitch ■ Single-sided 20μ pitch ■ Subtractive method ■ Staggered layout narrow pitch ■ Semi-additive method *For more details, please download the PDF or contact us.

  • Board to FPC connector
  • substrate

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Interposer flexible substrate

Interposer flexible substrate

Are you having trouble procuring build-up substrates for the main board?

By adopting it for the IC substrate of the locally high-density part of the main board, it achieves a reduction in the specifications of the main board, which can be used for semiconductor packages and lead frames.

  • Other semiconductors
  • substrate

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Ultra-small, high-precision flexible substrate

Ultra-small, high-precision flexible substrate

Custom-made support for narrow pitch high-definition and ultra-high-definition substrates! Leave flexible substrates (high-definition FPC) to us!

Our company is a specialized manufacturer of circuit boards, celebrating approximately 50 years this year. With our extensive experience and track record in solving various challenges in flexible circuit boards, we can produce high-resolution FPC prototypes in a short lead time, covering everything from cost considerations to prototype manufacturing and mass production. We utilize advanced techniques such as micro-hole processing using chemical etching, BVH connections, and polyimide micro-hole processing technology that allows for simultaneous hole drilling to meet our customers' needs. Please feel free to contact us with your requests. 【Features】 ■ Custom-made high-resolution and ultra-high-resolution boards with narrow pitch ■ Micro-hole processing and BVH connections using chemical etching ■ Introduction of polyimide micro-hole processing technology that allows for simultaneous hole drilling *For more details, please download the PDF or contact us.

  • Board to FPC connector
  • substrate

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Substrate manufacturing, substrate materials, special processing achievements

Substrate manufacturing, substrate materials, special processing achievements

We handle various types of substrates. We also accept inquiries regarding base materials and substrate processing.

Substrate materials FR-4, EL230T, HL950SK, MCL-FX-II, MEGTRON6, MCF-5000I, FPC, and others.

  • others
  • substrate

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Manufacturing of Flexible Circuit Boards *Product Achievements Introduction

Manufacturing of Flexible Circuit Boards *Product Achievements Introduction

Are you facing any issues with flexible substrates? We have extensive experience in various fields, including medical devices and automotive control systems.

This is an introduction to our "Flexible Circuit Board Manufacturing." "Flexible Printed Circuit Boards" are used in applications such as communication devices and measurement instruments, and we handle various types including "Single-Sided FPC," "Double-Sided FPC," and "Rigid-Flex." Materials used include polyimide and polyester. For "Multilayer Flex" and "Rigid-Flex," we collaborate with partner companies for production. *For questions or inquiries, please call us or contact us at the email address below. 042-774-4555 stay-4555@staydenshi.jp Contact Person: Kumada, Kikuchi 【Product Achievements (Excerpt)】 ■ Flexible for ultrasound diagnostic probes ■ Flexible for motor field winding (for high electromagnetic field generation) ・Source: Gunma University ■ Flexible for superconducting devices operating at -269℃ (for superconducting circuit evaluation) ・Main Source: Yokohama National University *For more details, please refer to the PDF document or feel free to contact us.

  • Board to FPC connector
  • substrate

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Standard specification product 'BigElec (high current FPC)' for connection between terminal screws.

Standard specification product 'BigElec (high current FPC)' for connection between terminal screws.

Suitable for incorporation into curved and narrow spaces. It can form high current circuits with a thin shape and low inductance.

BigElec is a flexible printed circuit board designed for high current wiring, intended as an alternative to busbars and wire harnesses, featuring a slim and flat design. Similar to printed circuit boards, it can accommodate pattern formation and assembly according to your requirements. We have newly introduced the "BigElec Standard Specification Products," which are easy to implement for connections between screw terminals. The BigElec Standard Specification Products have no initial costs, allowing for reduced upfront expenses. 【BigElec Standard Specification Product Specifications】 ■ Layers: 2 layers, 4 layers, 6 layers, 8 layers ■ Wiring width: 8mm to 11mm (integers only) ■ Total length: 30mm to 210mm (integers only) ■ Terminal screw diameters: M3 (hole diameter φ3.8mm), M4 (hole diameter φ4.4mm), M5 (hole diameter φ5.4mm), M6 (hole diameter φ6.5mm), M8 (hole diameter φ8.5mm) *For more details, please download the PDF or contact us.

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  • Wiring materials
  • substrate

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Low transmission loss substrate "xCH3008H" and "xCCF-500"

Low transmission loss substrate "xCH3008H" and "xCCF-500"

A substrate for millimeter-wave radar that suppresses transmission loss and prevents collisions.

■ "xCH3008H" This is a glass cloth reinforced substrate that uses ultra-low roughness copper foil, suppressing the dielectric loss tangent and linear expansion coefficient compared to conventional fluoroplastic substrates (CGP-500A). Generally, fluoroplastic substrates are considered difficult to laminate, but it is also possible to laminate with dissimilar substrates such as FR-4. 【Charateristics】 DK3, DF0.0011, CTE (X:11, Y:11, Z:54) ■ "xCCF-500" This is a glass cloth-free substrate that uses a special fluoroplastic film as a dielectric and ultra-low roughness foil. 【Characteristics】 DK3, DF0.0013, CTE (X:28, Y:29, Z:29) *For more details, please refer to the PDF materials or feel free to contact us.

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  • High frequency/microwave parts
  • substrate

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Flexible printed circuit board (FPC) design, prototyping, small lot, impedance

Flexible printed circuit board (FPC) design, prototyping, small lot, impedance

Impedance control of flexible substrates and UL certification can be achieved with short lead times and the ability to manufacture small quantities.

We can respond to circuit board manufacturing and component mounting in just one working day at the shortest. Additionally, we manufacture high-performance flexible circuit boards with impedance control during the artwork design phase. We also accommodate small lot production. Please feel free to consult with us.

  • others
  • substrate

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Are you giving up on the quality of overseas-made circuit boards? We can support you with our proven track record in major automotive circuit boards.

Are you giving up on the quality of overseas-made circuit boards? We can support you with our proven track record in major automotive circuit boards.

Attention those struggling with substrate quality, cost reduction, and delivery times! We offer thorough quality control at overseas factories with over 10 years of experience. Special substrates like thick copper are also acceptable.

If you are looking for cost reduction and shorter delivery times for printed circuit boards but are worried about the many defects and troubles with overseas products, this is a must-read! Please consult with our company, which has 10 years of experience in automotive printed circuit boards for major manufacturers. 【Do you have any of these concerns?】 ■ Defects occurred with overseas products. The response from the overseas factory was poor, and in the end, we had to re-inspect and re-package domestically, resulting in unnecessary costs... ■ Despite multiple business trips to overseas factories, we were unable to produce satisfactory products... ■ Unexpected defects arose due to differences in temperament and language barriers with overseas partners... ■ I want to change the factory I order from, but I can't move forward due to many concerns... and more. Our engineers provide total support from design to printed circuit board assembly, inspection, and packaging as needed. We also accept orders for small quantities of various types, mass-produced boards, and special boards, starting from a single prototype sample. (Domestic manufacturing boards are also available.) *For more details, please feel free to contact us or download from the PDF.

  • Circuit board design and manufacturing
  • substrate

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[In Development] GND Slit Structure Flexible Circuit Board

[In Development] GND Slit Structure Flexible Circuit Board

The "GND slit structure technology" solves the issues of "dielectric thickness" and "transmission loss" that arise in microstrip line structures.

The "GND slit structure" under development addresses the challenges of "dielectric thickness" and "transmission loss" that arise in microstrip line structures. This technology allows for the reduction of dielectric thickness while maintaining transmission characteristics by incorporating a slit design in the GND plane directly beneath the RF line. As a result, it minimizes signal loss while maximizing flexibility. For high-speed transmission compatible YFC products (RFM, RFS series), we provide cable FPCs that reduce transmission loss by adopting the GND slit design, enabling low-loss signal transmission. Please refer to the PDF catalog for the measurement results of transmission loss and flexibility.

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  • GNDスリット2.jpg
  • GNDスリット3.jpg
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  • Printed Circuit Board
  • substrate

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Printed Circuit Board Design Service

Printed Circuit Board Design Service

We will accommodate short delivery times, design, and prototype implementation!

Our company designs, manufactures, and sells various printed wiring boards (PWBs) used in electrical products, automotive applications, and LED lighting, based in Japan and Asia. For mass-produced general PWBs manufactured in Thailand, Japanese YKC staff enter the production site to manage and ensure quality. Please feel free to contact us if you have any requests. 【Product Lineup】 ■ 16-layer boards ■ Boards for LEDs ■ Flexible boards ■ Thick copper foil boards ■ Carbon printed 4-layer boards, etc. *For more details, please feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • substrate

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Tanaka Giken Co., Ltd. Company Profile

Tanaka Giken Co., Ltd. Company Profile

We can accommodate a wide variety of orders! Leave it to us for flexible printed circuit boards.

At Tanaka Giken Co., Ltd., we manufacture printed circuit boards, flexible boards, and rigid-flex boards. Although we are a circuit board manufacturing company, we collaborate with partner companies to handle everything from circuit board design to component mounting. We possess various equipment, including NC drilling machines, routers, etching machines, exposure machines, and hot press machines. 【Technologies We Handle】 ■ Rigid Boards ■ Flexible Boards (FPC) ■ Rigid-Flexible Boards *For more details, please feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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Transparent flexible substrate

Transparent flexible substrate

Ideal for wearable devices! Applicable to medical and smartphones, etc.

We provide transparent FPC with excellent transparency in a short delivery time. We can use low-cost PET material "Polyethylene Terephthalate," and we also adopt PEN material "Polyethylene Naphthalate" for the insulation layer, enabling low-temperature reflow mounting. Additionally, we support the transparency of the resist. 【Features】 ■ Achieving short delivery times from order to delivery, possible only with our company ■ Use of low-cost PET material "Polyethylene Terephthalate" ■ Adoption of PEN material "Polyethylene Naphthalate" for the insulation layer, enabling low-temperature reflow mounting ■ Support for the transparency of the resist *For more details, please download the PDF or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Small lot order

Small lot order

We solve problems related to small lots, such as being time-consuming and having a small quantity!

- I wonder if they can handle such a small number of pieces? - The production plan and specifications keep changing a bit. - Since it's a small lot, the quantity doesn't flow, it takes time, and requires manpower. Do you have any concerns like these? Our company can accommodate orders starting from just one piece. We will take the time and effort to produce on your behalf. Please feel free to contact us when you need assistance. *For more details, please refer to the PDF document or feel free to reach out to us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • substrate

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Sanwa Electronics Circuit Co., Ltd. Business Introduction

Sanwa Electronics Circuit Co., Ltd. Business Introduction

We will take on and respond to all kinds of special substrates.

Sanwa Electronic Circuit Co., Ltd. was established in 1955 as Sanwa Electric Manufacturing Co., Ltd. and has consistently engaged in the production of printed circuit boards for over half a century. Currently, with the dramatic evolution of electronic devices, printed circuit boards are required to fulfill new roles beyond their traditional electrical functions, including thermodynamic, optical, and structural roles, necessitating different perspectives and ideas in manufacturing. To swiftly respond to these customer needs, we integrated our group companies involved in printed circuit boards in 2004, marking a new beginning as Sanwa Electronic Circuit Co., Ltd. Through this integration, we have consolidated the development, production, and sales capabilities cultivated over many years by our group companies, establishing a system that can comprehensively meet QCD (Quality, Cost, Delivery) requirements while maintaining and developing a production system that leverages the unique characteristics of each factory. This has allowed us to build a flexible production system capable of accommodating a wide range of product specifications and lot sizes, from small to large. Moving forward, we will focus on strengthening our proposal-based sales capabilities and enhancing the development, production technology, and production management necessary to realize this. For more details, please contact us or download our catalog.

  • Printed Circuit Board
  • substrate

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Low-loss flexible substrate

Low-loss flexible substrate

Combining PTFE base and low dielectric coverlay to produce various low-loss FPCs!

Our company manufactures low-loss flexible substrates (GHz band, Microstrip Line). We would like to introduce a flexible substrate that significantly improves transmission loss compared to the combination of polyimide-based and standard coverlay products. Using a PTFE base with a low-dielectric coverlay, we can expect a 60-70% improvement in transmission loss at the 40GHz band compared to standard products. Additionally, while the performance is slightly lower compared to PTFE-based substrates, a combination of LCP base and LCP coverlay can also expect about a 50% improvement in transmission loss and is suitable for long-term heat resistance and low outgassing applications due to the absence of adhesives. *For more details, please refer to the PDF materials or feel free to contact us. *Abbreviation explanations: PTFE ... Fluoropolymer LCP ... Liquid Crystal Polymer

  • Wiring materials
  • substrate

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Thick copper substrate / copper inlay substrate

Thick copper substrate / copper inlay substrate

Outer layer maximum 762μm, inner layer 381μm. Compatible with copper inlay and copper core. For EV chargers and power semiconductors.

We provide thick copper substrates for applications requiring high current and high heat dissipation, such as EV (electric vehicle) chargers, power semiconductors, and power supply equipment. We support outer layer copper foil thicknesses up to 762μm and inner layers up to 381μm. We also accommodate copper inlays (embedded metal from 1.0 to 3.0mm) and copper core substrates, achieving high current and high voltage resistance. We have a track record of manufacturing substrates for electric vehicle chargers, including 12-layer t=5.0mm boards with 3.0mm copper inlays. It is also possible to combine T-type copper coin embedding with high-frequency compatible materials and create composite structures with rigid FPCs.

  • Circuit board design and manufacturing
  • substrate

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It's also okay to use it twisted! "Flexible substrate compatible with high-speed transmission connectors."

It's also okay to use it twisted! "Flexible substrate compatible with high-speed transmission connectors."

Supports high-speed transmission up to 15GHz! We have combined the high-speed transmission connectors from Irisoh Electronics with our flexible substrates.

The "Flexible substrate compatible with high-speed transmission connectors" combines the high-speed transmission connectors from Irisoh Electronics, [IMSA-11600S-30Y900 and IMSA-11501S-30Y900], with our YFC series (LVDS type microstrip line) RFM. By integrating them, it supports high-speed transmission up to 15GHz. 【Features】 ■ The LVDS-compatible FPC has been slotted. ■ It is easy to bend and can also be twisted for use. *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials
  • substrate

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The world's only orthogonal soldering dedicated robot, L-CAT EVO-2.

The world's only orthogonal soldering dedicated robot, L-CAT EVO-2.

Soldering dedicated orthogonal robot

It is a best-selling soldering robot developed specifically for soldering, boasting a delivery record of over 500 units worldwide in the 10 years since its release.

  • Soldering Equipment
  • Circuit board processing machine
  • substrate

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Long-length multi-layer flexible substrate [Substrate manufacturing achievements]

Long-length multi-layer flexible substrate [Substrate manufacturing achievements]

4-layer flexible printed circuit board (FPC) using LCP materials! Introducing our manufacturing achievements for a product size of 1300mm.

We would like to introduce our achievements in circuit board manufacturing. We produced an ultra-long multilayer LCP board with a product size of 1300mm. The features include pattern exposure, drilling, lamination, copper plating, coverlay thermal pressing, and gold plating, all compatible with the 1300mm size. This is a 4-layer flexible board made from LCP material, outputting a 175μ exposure film in the standard size of 1350×250mm. 【Basic Specifications】 ■ Material: LCP/0.1t×3 4-layer Cu outer layer 9/9 (plating 35)μ - inner layer 9/9μ ■ Process: Lamination, drilling, copper plating, etching, coverlay 25/35μ both, electroless Ni2-AuF (0.03)μ, manual processing of outer shape ■ Board size: 1300×59 ■ Others: Minimum L/S=140/130μ Flying checker not available *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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Printed circuit board

Printed circuit board

Reliable, high processing capability, unique processing technology. We continue to challenge new manufacturing technologies.

We handle various prototypes, manufacturing, and mass production of printed circuit boards. With reliable and high-capacity processing, and unique processing technologies, we specialize in flexible circuit boards, acrylic and copper plates, router processing, laser processing, press processing, V-cut processing, and various other services. We strive for reliable and fast processing, so please feel free to contact us for inquiries and quotes, especially if you are in a hurry. 【Business Contents】 ■ Prototyping and manufacturing of flexible circuit boards ■ Processing of special materials such as acrylic and copper plates ■ Creation of molds specifically for aluminum substrates ■ Support for various plating on printed circuit boards ■ Production of dip jigs for soldering, etc. *For more details, please download the PDF or feel free to contact us.

  • Processing Contract
  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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4-layer blind via flexible circuit board

4-layer blind via flexible circuit board

Space-saving is possible! Suitable for high-resolution imaging diagnostic devices that require miniaturization.

The "4-layer blind via filled blind via flexible printed circuit board" is a multilayer FPC that enables high-density wiring while achieving miniaturization, lightweight, and thinness. It applies filled plating to blind vias, allowing for the creation of pads for component mounting on the vias. It possesses bending performance that rigid boards do not have. It is suitable for high-resolution imaging diagnostic devices, including endoscopes and catheters, where miniaturization is required. 【Features】 ■ Blind vias can be filled with plating on a 4-layer flexible board ■ Space-saving is possible as components can be mounted on top of the vias ■ It can be made lighter compared to rigid boards *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials
  • substrate

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Achieved without adhesive! Long-term high-temperature durable flexible substrate.

Achieved without adhesive! Long-term high-temperature durable flexible substrate.

Passed long-term heat resistance test at 200℃ for 1000 hours! High-temperature durable flexible substrate with insulation characteristics exceeding JIS standards.

The "Long-term High-Temperature Durable Flexible Circuit Board" is an FPC that achieves long-term heat resistance without the use of epoxy-based adhesives, making it suitable for harsh conditions in high-temperature environments. Even after undergoing our unique long-term high-temperature test conditions of 200°C for 1000 hours, the insulation resistance, continuity resistance change rate, and dielectric strength meet the JIS passing standards. 【Main Features】 1. Achieves high-temperature durability with a structure that does not use epoxy-based adhesives. 2. Heat resistance suitable for long-term use in high-temperature environments. 3. Insulation properties are maintained even after the long-term high-temperature test of 200°C for 1000 hours. For more details, please refer to the PDF document or feel free to contact us.

  • Wiring materials
  • substrate

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[Information] Understand in just 5 minutes! Basic knowledge of printed circuit boards.

[Information] Understand in just 5 minutes! Basic knowledge of printed circuit boards.

There are four main categories! We will explain printed circuit boards in an easy-to-understand manner!

"Printed circuit boards" are used in very familiar items in our daily lives. This document provides an easy-to-understand explanation of the basic knowledge of "printed circuit boards." Their main role is to attach electronic components such as resistors, ICs, and capacitors to non-conductive materials through soldering, connecting the electronic components with conductive paths. By transmitting electricity through the electronic circuits of these products, we can conveniently use the electrical devices around us. It includes information on their roles, types, and where they are utilized. We encourage you to read it. [Contents] ■ What is a printed circuit board? ■ The role of printed circuit boards ■ Types of printed circuit boards ■ Places where they are utilized ■ Introduction to Shinko Seisakusho *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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