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substrate(fpc) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Last Updated： Aggregation Period:Feb 25, 2026～Mar 24, 2026
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substrate Product List

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[Exhibition Report] We exhibited at JPCAshow 2025!

[Exhibition Report] We exhibited at JPCAshow 2025!

I would like to briefly introduce the successful exhibition content of FPC.

◎Introducing Our Company's "Strengths" in the Processing Engineering 　　>> There are multiple important processing steps in FPC manufacturing. 　　　　Improving the "strengths" of each step directly leads to advancements in technology and quality, as well as new product development. 　　　　We have introduced the "strengths" we have cultivated over many years in each process: 　　　　　<Design>　　 Circuit design, artwork, S-parameter analysis 　　　　　<Layer Connection> Build-up FPC, filled vias, small-diameter vias 　　　　　<Circuit Formation> MSAP method, thin copper, thick copper 　　　　　<Insulation Processing> High-precision openings ±20μm, LCP coverlay 　　　　　<Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) 　　　　　<Post-Processing> High-precision contour processing ±50μm, a variety of tools 　　　　　<Mounting Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◎Introducing Samples of Each Processing Step During Manufacturing 　　>> Normally, there are no opportunities to see anything other than the finished product, 　　　　but we have provided a chance to view the actual samples of the processes involved in FPC manufacturing. 　　　　　*Through-hole drilling, exposure/development, etching, contour processing, etc.

  • Printed Circuit Board
  • Visual Inspection Equipment
  • Transport and handling robots
  • substrate

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TTL Exhibition Participation Guide: JPCAShow 2025

TTL Exhibition Participation Guide: JPCAShow 2025

Newly developed material.

◆FPC (Flexible Printed Circuit Board)◆ 　　　~Taiyo Techno-Rex's Strengths in FPC Manufacturing Processes~ 　　　　　FPC manufacturing requires multiple critical processing steps. 　　　　　Improving the "strengths" of each process directly leads to advancements in technology and quality, as well as new product development. 　　　　　This time, we will introduce the "strengths" we have cultivated over many years in each process! 　　　　　<Design> Circuit design, artwork, S-parameter analysis 　　　　　<Layer Connection> Build-up FPC, filled vias, small-diameter vias 　　　　　<Circuit Formation> MSAP method, thin copper, thick copper 　　　　　<Insulation Treatment> High precision openings ±20μm, LCP coverlay 　　　　　<Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) 　　　　　<Post-Processing> High precision outline processing ±50μm, diverse tools 　　　　　<Mounting Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◆Various Substrates and Ceramic Materials◆ 　　　Introduction of AI technology, final appearance inspection equipment, and electrical testing equipment ◆Efficiency and Automation◆ 　　　Proposals for utilizing FA and collaborative robots

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  • Printed Circuit Board
  • substrate

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Silicone flexible printed circuit board (Si FPC)

Silicone flexible printed circuit board (Si FPC)

Let's expand the application of products using "Si FPC" in fields that require excellent flexibility and weather resistance, such as IoT, medical devices, smart textiles, and industrial sectors.

FPC has six main features: 1) High-elasticity silver paste that can be printed with silicone 2) Flexible and foldable 3) Excellent weather resistance 4) Excellent electrical insulation 5) High chemical resistance 6) Biocompatibility Additionally, it has passed ROHS, ISO9000, and IECQ080000 certifications.

  • Printed Circuit Board
  • substrate

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Exhibiting at the Nepcon Autumn Show @ Makuhari Messe! Leave printed circuit boards to Matsuwa Sangyo!

Exhibiting at the Nepcon Autumn Show @ Makuhari Messe! Leave printed circuit boards to Matsuwa Sangyo!

We will be exhibiting at the Nepcon Japan Autumn Exhibition at Makuhari Messe from September 4 to 6! Please feel free to consult us about anything related to circuit boards!

Build-up substrates, high-frequency substrates, FPC and rigid FPC substrates... All of these are manufactured in-house at our own factory with a fully integrated process! The ultra-short delivery times achieved by eliminating outsourcing are astonishingly fast! Through-hole substrates ⇒ as short as 1.05 days! Through-hole resin-filled substrates ⇒ as short as 2.1 days! 1-2-1 build-up substrates ⇒ as short as 3 days! FPC substrates ⇒ as short as 2 days! 4-layer rigid FPC substrates ⇒ as short as 5 days! Surface treatment with gold flash is also handled in-house, so there are no fluctuations in delivery times! Not only the delivery times but also the wide range of materials we handle is one of the attractions of Matsuwa Sangyo. Even for materials we have no processing experience with, we are flexible in our response! We accept orders for any type of substrate, even in small quantities, so if you have even a slight desire to "want to make a substrate..." Why not start with a light consultation? We will be exhibiting at the Nepcon Japan Autumn Exhibition held at Makuhari Messe from September 4 (Wed) to September 6 (Fri)! On the day, members who can consult on technology will be gathered at our booth, so please stop by the Matsuwa Sangyo booth [6-37]! Pre-registration for your visit can be done here↓!

  • Printed Circuit Board
  • substrate

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High-frequency compatible flexible substrate (MPI specification)

High-frequency compatible flexible substrate (MPI specification)

Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

The "High-Frequency Compatible FPC (MPI Specification)" is a product designed to support low transmission loss and impedance matching. 〇 It has excellent heat resistance and can accommodate solder mounting and bonding. 〇 It allows for high flexibility in processing, similar to standard polyimide. ● FPC high-frequency analysis service (optional) It can be used for various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance #ShortLeadTime #MassProduction

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  • Other electronic parts
  • substrate

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High-frequency fluororesin FPC substrate

High-frequency fluororesin FPC substrate

Effective in millimeter wave bands such as 5G communication! Products with low transmission loss, low dielectric constant, and high flexibility.

The "High-Frequency Fluororesin FPC Substrate" manufactured by Sumitomo Electric Industries enables low-loss data transmission of high-frequency signals ranging from 20GHz to 100GHz. As a type of flexible substrate, it allows for wiring in tight spaces, contributing to the miniaturization and lightweight design of devices. When used with millimeter-wave planar antennas, it can achieve either antenna miniaturization or enhanced performance per antenna size. 【Features】 ■ Low Transmission Loss: Can be utilized as a wiring material that achieves low transmission loss in high-frequency signal transmission. ■ Thinness and Narrow Pitch: Achieves both thinness and narrow pitch, while offering high design flexibility, contributing to airflow within enclosures and high-density designs. ■ Excellent Gain: By routing antenna circuits on a fluororesin substrate, it can be utilized as an antenna with efficient space usage and excellent gain. *For more details, please download the PDF or feel free to contact us.

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  • Printed Circuit Board
  • substrate

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Taiyo Technorex Co., Ltd. Company Profile

Taiyo Technorex Co., Ltd. Company Profile

This is the company profile of Taiyo Technorex. (Company name change effective December 21, 2023)

Taiyo Industrial Co., Ltd. (Established December 1960) Taiyo Technolex Co., Ltd. (Name changed December 2023) [Thoughts Behind the New Company Name] The coined term "TECHNOLEX," derived from "Technology" and "Flexible," symbolizes the flexibility of our main product, FPC (Flexible Printed Circuit Board), as well as our commitment to adapt flexibly not only to conventional technologies but also to new technologies and areas such as technology trading. We are evolving beyond the confines of "industry" and looking towards a transition to a more global market.

  • Printed Circuit Board
  • Circuit Board Inspection Equipment
  • Transport and handling robots
  • substrate

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FPC - Flexible Printed Circuit Board (Flexible Substrate)

FPC - Flexible Printed Circuit Board (Flexible Substrate)

We welcome inquiries and consultations regarding flexible procurement challenges! We respond to various requests, including halogen-free types. We cater to everything from digital cameras to the aerospace field!

Please leave it to us for everything from small-scale prototypes (for research and development purposes) to mass production. 'FPC (Flexible Printed Circuit)' is a type of printed circuit board that is based on flexible and thin insulating materials such as polyimide, allowing for flexible bending. Taiyo Kogyo has extensive experience and achievements, enabling us to manufacture FPCs tailored to various needs. They are used in digital cameras, smartphones, laptops, robots, automobiles, car navigation systems, medical devices, aerospace, and more. Additionally, we also offer halogen-free types, and please feel free to consult us regarding combinations of various types and thicknesses. [Features] - A type of printed circuit board - Good flexibility with materials like polyimide - Based on thin insulating materials - Flexibly bendable - Halogen-free types are also available *For more details, please refer to the PDF materials or feel free to contact us.

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Other electronic parts
  • substrate

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Substrate "Flexible Printed Circuit (FPC)" / NOK

Substrate "Flexible Printed Circuit (FPC)" / NOK

Replacement from the harness is also possible! An extremely thin and flexible circuit board that can be bent freely.

"Flexible Printed Circuit (FPC)" is a circuit board with excellent bending durability, formed on a thin and sturdy film. It can replace harnesses (wires), and it is also capable of shielding processing, waterproofing, and component mounting. Leveraging its features of being "thin," "light," "flexible," and "high-density mounting," it is an indispensable product for miniaturization and weight reduction of portable electronic devices, as well as for space-saving and wiring simplification in various industrial equipment, devices, and automobiles. 【Features】 ■ Extremely thin and can be bent freely ■ Can replace harnesses (wires) ■ Much thinner and lighter compared to rigid boards and harnesses ■ Capable of shielding processing, waterproofing, and component mounting *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Specification for filling holes! "Ultra-small diameter through hole."

Specification for filling holes! "Ultra-small diameter through hole."

It is possible to form through holes with a diameter of 25μm or less on double-sided FPC. Additionally, it is also possible to form holes with a minimum diameter of 20μm and a minimum pad diameter of 95μm.

"Ultra-small diameter through holes" are formed with a diameter of φ20μm on both sides of the FPC through laser processing. It is possible to create holes with a minimum diameter of 20μm and a minimum pad diameter of 95μm. By using through-hole plating to fill the holes and arranging the through holes on the pattern, it enables narrower pitch and contributes to the miniaturization of the product. 【Features】 ■ Formation of through holes with a diameter of Φ25μm or less on both sides of the FPC is possible. ■ The holes are filled with 15μm through-hole plating specifications. *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials
  • substrate

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Special substrate

Special substrate

The era is 【SPECIAL PCB!】

Recently, the specifications for substrates have diversified, and at Matsuwa Industries, we are trying various special substrates. The substrates listed all started from customer requests. We have been working together with customers who have said, "Other companies have turned us down, but perhaps Matsuwa Industries can make it happen?" Thick copper substrates ⇒ MAX 500μ * foil thickness 400μ in stock, inner layer core material foil thickness 140μ Copper inlays ⇒ round and square shapes * board thickness t1.0 to t3.0mm, round: φ1.0 to φ8.0mm, square: please consult Rigid FPC (build structure) ⇒ available in 1-layer and 2-layer Matsuwa Industries has established a prototype development room, so please contact us at the following for inquiries. TEL: 0598-52-1855

  • Circuit board design and manufacturing
  • EMS
  • Printed Circuit Board
  • substrate

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Substrate manufacturing

Substrate manufacturing

Select and propose suitable manufacturers for the project! Procurement is possible not only from domestic but also from overseas PCB manufacturers.

At Tokai Corporation, we can manufacture from a single printed circuit board. We support a variety of boards, including "rigid boards (single-sided to high multilayer)," "IVH and BVH boards," "build-up boards," and "special boards (such as Teflon, aluminum, glass, etc.)." We will select and propose the most suitable manufacturers based on specifications, quality, and cost for each project. Additionally, we can procure from domestic as well as overseas board manufacturers, so please feel free to consult us when needed. 【Supported Boards (partial)】 ■ Rigid boards (single-sided to high multilayer) ■ IVH and BVH boards ■ Build-up boards ■ Flexible boards (single-sided to multilayer) ■ Rigid-flex boards *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Transparent flexible printed circuit board (transparent FPC)

Transparent flexible printed circuit board (transparent FPC)

A transparent flexible substrate with wiring that cannot be seen with the naked eye.

It is a flexible substrate with invisible wiring that has a total light transmittance of 92.0% and allows for component mounting.

  • Printed Circuit Board
  • Touch Panel
  • Sensors
  • substrate

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Flexible (FPC) substrate / Rigid-flex substrate

Flexible (FPC) substrate / Rigid-flex substrate

We also accept orders starting from one piece. For small quantities, we offer reasonable prices without using a die.

- It has thinness and flexibility, allowing it to be bent repeatedly for use, and it maintains its electrical characteristics even when deformed. - We also offer rigid-flex PCBs, flexible PCBs with resist specifications, and flexible PCBs that excel in noise countermeasures, so please feel free to contact us.

  • Printed Circuit Board
  • substrate

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Flexible printed circuit board (FPC). Bendable!

Flexible printed circuit board (FPC). Bendable!

Conducting electrical inspections and comprehensive inspections! Laminates are available up to a maximum size of 500mm × 2000mm.

The product is a flexible printed circuit board that can be bent. It is compact, thin, and lightweight, allowing for a reduction in connections with connectors that can be integrated into small spaces. It can be used in digital cameras, laptops, smartphones, printers, and other small devices. We provide a detailed introduction to the manufacturing process in the PDF document, so please download and take a look. 【Features】 ■ Flexible and bendable ■ Reduces connections with connectors that can be integrated into small spaces ■ Compact, thin, and lightweight *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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Small-scale production of flex rigid.

Small-scale production of flex rigid.

We are happy to accept small-scale production! We have a wide variety of materials for both PCBs and FPCs in stock, and we can make proposals that meet our customers' needs!

We accept small-scale production of flexible rigid boards. We can assist those who are struggling with "how to create flexible rigid boards or consider specifications" and those who are facing difficulties with "small lot production of flexible rigid boards." Our company has internalized most of the processes, making us suitable for small lot production. We can produce from just one piece. We can also procure materials that are not regularly stocked, so please feel free to consult with us. 【Features】 ■ Most processes are internalized, making us suitable for small lot production ■ Production is possible from one piece ■ We have extensive knowledge of both FPC and PCB production methods ■ A wide variety of materials for both PCB and FPC are readily available *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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Flexible Printed Circuit Board "Low-Rebound FPC"

Flexible Printed Circuit Board "Low-Rebound FPC"

Customize softness! We offer a variety that meets low rebound needs!

We have revamped the lineup of Maruwa Manufacturing's thin FPC representative brand "MK Series" to offer variations that meet the demand for low rebound. Here are solutions for making devices thinner and more compact. 【Applications】 ○ Suppressing springback in thin LCD modules, etc. ○ Sliding applications in compact areas such as small camera modules, etc. For more details, please contact us or download the catalog.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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[Notice_26.2] Regarding the Publication of Our Articles - Related to Space Business -

[Notice_26.2] Regarding the Publication of Our Articles - Related to Space Business -

Announcement of the "Kii Space HUB" feature and participation in "Ecosystem Link #44".

~ Taiyo TechnoRex Accelerates Its Efforts in the Space Industry ~ An interview article introducing our company's challenges in the space sector has been published on the official website of "Kii Space HUB," a space industry support project promoted by Wakayama Prefecture. ▼ https://kii-space-hub.jp/reports/action-workshop-vol1.html The article summarizes our efforts to apply the FPC technology we have cultivated over many years to the space business, as well as our learnings from entering the field and future prospects. Additionally, on February 24, 2026, our employee Akihiro Moriwaki will present on the potential of FPC for satellites at the event "Ecosystem Link #44 presented by It’s Sta." ▼ https://u-fino.com/event/list/detail/000503.html This event will be held as a gathering place for diverse players in the space industry. Our company will continue to promote the application of technology and business expansion in the space industry.

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • cable
  • substrate

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Printed Circuit Board Manufacturing Delivery Schedule

Printed Circuit Board Manufacturing Delivery Schedule

The printed circuit boards will be shipped tomorrow. Industry-leading ultra-short delivery times! Please give it a try!!

We have been in the printed circuit board business for over 30 years. We have steadily and diligently accumulated know-how for short lead-time manufacturing with honesty and sincerity. We have absolute confidence in our express and short lead-time manufacturing. Please feel free to consult with us.

  • Printed Circuit Board
  • substrate

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TAB flexible substrate

TAB flexible substrate

Quality improvement is achievable through the non-contact method using the reel-to-reel process! Please consult us first, regardless of large lots.

The printed circuit board "TAB flexible board" supports a variety of FPCs from prototyping to mass production through R to R lines. Additionally, we conduct simulations from the circuit design stage to provide high-performance, high-quality products. All products are quality assured through automatic visual inspection and electrical testing. We possess a variety of analytical equipment to confirm quality and measure/length at each stage. We offer FPCs compliant with RoHS and made from flame-retardant materials. 【Features】 ■ Mass production of FPCs is realized through R to R ■ We have Ni (nickel)/Au (gold) electroplating equipment to achieve quality that meets customer needs ■ The structure formation of inner leads for connection points is realized *For more details, please request materials or view the PDF data available for download.

  • Printed Circuit Board
  • substrate

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Printed Circuit Board "Ultra Long Flexible Circuit Board (Ultra Long FPC)"

Printed Circuit Board "Ultra Long Flexible Circuit Board (Ultra Long FPC)"

Leave the manufacturing of long FPC to us! Standard: Capable of producing sizes up to 2000×500mm. *For lengths beyond that, please consult us (we have experience with lengths up to 20M).

Aiming to be "the leader in long-length printed electronics," we are dedicated to meeting our customers' needs every day. Are you facing challenges such as considering long substrates but finding it difficult to find a suitable provider, or struggling with high labor costs and low-volume production? With over half a century of experience and more than 10,000 types of manufacturing achievements, we are here to assist you with our proposal capabilities for specialized products. 【Specifications】 ○ Board thickness: Single-sided and double-sided 0.0125mm, 0.025mm, 0.05mm ○ L/S (Line & Space): 0.15/0.15mm or more ○ Hole diameter: φ0.3mm or more For more details, please contact us or download the catalog.

  • Circuit board processing machine
  • Contract manufacturing
  • Processing Contract
  • substrate

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Achieving a thickness of 0.98mm with 12 layers! 'High-Density High-Multilayer Flexible Circuit Board'

Achieving a thickness of 0.98mm with 12 layers! 'High-Density High-Multilayer Flexible Circuit Board'

When you want to implement high-density wiring with over 200 pins in a limited space! It can be bent for use, allowing for high-density wiring in a compact space.

The "High-Density High-Multilayer Flexible Circuit Board" is an FPC developed for devices that require many signals. Despite having a 12-layer structure, it achieves a thickness of less than 1mm. The cable section can be bent for use, enabling high-density wiring in compact spaces. 【Features】 ■ The harness section can be bent for use. ■ Ideal for applying high-density wiring with over 200 pins in limited spaces. *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials
  • substrate

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Impedance control flexible substrate

Impedance control flexible substrate

Achieving high-frequency and high-speed transmission by matching the characteristic impedance.

This is an FPC that matches characteristic impedance and achieves high-frequency, high-speed transmission.

  • Printed Circuit Board
  • substrate

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[Example of Printed Circuit Board Manufacturing] Rigid-Flexible Board

[Example of Printed Circuit Board Manufacturing] Rigid-Flexible Board

Effective even in cases where component mounting is limited! Here are examples of rigid-flexible circuit board manufacturing.

We would like to introduce an example of our "Rigid-Flexible Printed Circuit Board" manufacturing. This board integrates rigid and flexible substrates. It is effective for use in compact spaces, such as small modules, or in cases where component placement is limited. Please feel free to contact us when you need assistance. 【Overview】 ■ 6-layer IVH structure (FPC layers L4-5) ■ 4-layer 1-2-1 build-up structure (FPC layers L2-3) *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Connector for board-to-board (FPC) connections | FB35C series

Connector for board-to-board (FPC) connections | FB35C series

Connector with a height of 0.7mm, 0.35mm pitch, compact, low profile, and narrow pitch.

The FB35C series connector is designed for connecting PCBs to FPCs with a 0.35mm pitch, a mating height of 0.7mm, and a depth of 1.9mm. It adopts a metal cap method with a metal part integrally molded at the plug end, enhancing strength against damage in case of misalignment, resulting in a robust structure. 【Features】 ■ The adoption of the metal cap method achieves a robust structure. ■ The tabs can carry current up to 3A as power contacts, allowing for a reduction in the number of contact pins and contributing to space-saving. ■ It features a highly reliable two-point contact structure. ■ A recess is provided in the plug contact to improve the click feel and extraction force during insertion. *For more details, please refer to the PDF materials or feel free to contact us.

  • Automotive Connectors
  • substrate

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Connector for board-to-board (FPC) connection | FB35K series

Connector for board-to-board (FPC) connection | FB35K series

Connector with a height of 0.6mm, 0.35mm pitch, compact, low profile, and narrow pitch.

The FB35K series connector is designed for board-to-FPC connections with a 0.35mm pitch, a mating height of 0.6mm, and a depth of 1.8mm. It adopts a metal cap method where the metal is integrally molded at the plug end, enhancing strength against damage in case of misalignment, resulting in a robust structure. 【Features】 ■ The adoption of the metal cap method achieves a robust structure. ■ The tabs can carry up to 3A as power contacts, allowing for a reduction in the number of contact pins and contributing to space-saving. ■ It features a highly reliable two-point contact structure. ■ A recess is provided in the plug contact to improve the click feel and extraction force during insertion. *For more details, please refer to the PDF materials or feel free to contact us.

  • Automotive Connectors
  • substrate

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Connector for board-to-board (FPC) connection | FB35L series

Connector for board-to-board (FPC) connection | FB35L series

Connector with a height of 0.7mm, 0.35mm pitch, compact, low profile, and narrow pitch.

The FB35L series connector is designed for board-to-FPC connections with a 0.35mm pitch, a mating height of 0.7mm, and a depth of 1.9mm. It employs a metal cap method where the metal is integrally molded at the plug end, enhancing strength against damage in case of misalignment, resulting in a robust structure. Additionally, metal is placed in the center of the receptacle connector to further improve strength. 【Features】 - The adoption of the metal cap method achieves a robust structure. - The tabs can carry up to 3A as power contacts, allowing for a reduction in the number of contact pins and contributing to space-saving. - It features a highly reliable two-point contact structure. - A recess is provided in the plug contact to improve the click feel and extraction force during insertion. *For more details, please refer to the PDF document or feel free to contact us.*

  • Automotive Connectors
  • substrate

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Connector for board-to-board (FPC) connection | FB35AT6 series

Connector for board-to-board (FPC) connection | FB35AT6 series

Connector with a height of 0.6mm, 0.35mm pitch, compact, ultra-low profile, and narrow pitch.

The FB35AT6 series connector is a connector for board-to-board (FPC) connections with a pitch of 0.35mm, a mating height of 0.6mm, and a depth of 1.65mm. 【Features】 ■ Pitch of 0.35mm, product width of 1.65mm, mating height of 0.6mm ■ Available core lineup: 6 cores, 8 cores, 10 cores, 18 cores ■ Adoption of a metal cap design achieves a robust structure ■ Metal is placed in the center of the receptacle connector: further strength enhancement through an inner metal armor structure ■ The metal cap can carry up to 3A as a power contact → realization of space-saving due to reduction in the number of contact cores ■ Highly reliable two-point contact structure ■ Plug contact recess structure: improves the click feel and extraction force during mating *For more details, please refer to the PDF materials or feel free to contact us.

  • Automotive Connectors
  • substrate

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Flexible printed circuit board "High Flex FPC" [Over 10 million bending cycles]

Flexible printed circuit board "High Flex FPC" [Over 10 million bending cycles]

A flexible circuit board that achieved over 10 million bending characteristics at 70℃! It is flexible and excels in bending performance even in high-temperature environments, ensuring high reliability!

The "High Flex FPC" is a flexible printed circuit board (FPC) with bending characteristics that exceed 10 million cycles at 70°C. By using a high Tg (glass transition temperature) coverlay, it suppresses the degradation of bending characteristics at high temperatures. It is flexible and excels in bending performance even in high-temperature environments, offering high reliability. 【Features】 ■ Significantly improved bending characteristics by using rolled copper foil ■ Capable of high-speed transmission of over Gbps with low loss ■ Easy to match characteristic impedance 　・Characteristic impedance value can be matched at differential 100±15Ω *For more details, please request materials or view the PDF data from the download.

  • Printed Circuit Board
  • substrate

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High-temperature resistant and oil-resistant flexible printed circuit board (FPC)

High-temperature resistant and oil-resistant flexible printed circuit board (FPC)

Compared to polyimide, it has low dielectric constant, low dielectric loss tangent, and low water absorption, resulting in excellent high-frequency transmission characteristics! It also has long-term heat resistance of 240°C.

The "High-Temperature Durable and Oil-Resistant Flexible Printed Circuit Board (FPC)" made entirely of LCP substrate excels in long-term heat resistance and passes the flexibility test (AB test) equivalent to MOT 180°C required by UL standards. Additionally, it has better high-frequency transmission characteristics due to its low dielectric constant, low dielectric loss, and low water absorption compared to polyimide. In the oil resistance test, there were almost no changes in conduction resistance and appearance before and after the test, and the conductor peel-off test also met the standard values. 【Features】 ■ Uses liquid crystal polymer (LCP) for the base and cover materials ■ Has long-term heat resistance of 240°C ■ Exhibits oil resistance against engine oil, brake pedals, and ATF *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials
  • substrate

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