Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
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46～60 item / All 198 items
We propose an extremely thin and highly flexible FPC.
It excels in various characteristics such as thinness, lightness, flexibility, resistance to bending, and resistance to breaking. Due to its excellent properties, it is used in movable parts such as sliding and twisting.
![[Exhibition Report] We exhibited at NEPCON Japan 2025!](https://image.mono.ipros.com/public/product/image/c7a/2001510480/IPROS11956591292795024490.jpg?w=280&h=280)
Here is a brief introduction to the successful exhibition content.
<Main Exhibition Content> ◆ FPC (Flexible Printed Circuit) ◆ ~ Touch, Compare, Experience FPC! ~ ● Comparison of weight between rigid boards and FPC ● Reduction of board area through high-density wiring ● Difference in heat generation temperature due to copper thickness ● Improved work efficiency with transparent FPC, etc. ~ Technology Topics ~ ● High-frequency compatible FPC... Proposing optimal designs and materials based on analysis results ● Fine pitch thick copper FPC... Contributing to miniaturization of devices with high-density wiring ● Pattern via fill FPC... Achieving high-density wiring and pad-on-via ● 6-layer stack via FPC... High-density wiring with a stack via structure that forms vias on top of vias ◆ FA Automation ◆ By achieving teaching-less implementation through visual feedback control, eliminating calibration burdens and realizing high-precision, high-speed automation. ◆ Board Inspection Equipment ◆ TY-VISION XAIS AI-based defect detection and false report reduction ・M111SC (manual machine) high-definition (package) board × high-resolution inspection ・M109SC (manual machine) diverse workpieces × large format
FPC with a structure that has both Rigid and Flexible properties!
"RIGID FPCB" is a type of FPC that combines the characteristics of Rigid (hard) and Flexible (soft), making it easy to implement SMD (Surface Mount Device) components. It is suitable for applications requiring high connection reliability between circuit boards. Additionally, we offer two types of lineups to suit different applications. Please feel free to contact us. 【Features】 ■ Combines Rigid (hard) and Flexible (soft) characteristics ■ Ideal for inter-board connection applications *For more details, please contact us or download the catalog.
It is possible to achieve conductivity on both sides through through-hole plating!
"Double-sided FPC" is a printed circuit board with a base film (insulating substrate) at its center and conductor patterns on both sides. It is mainly used in products such as cameras and mobile LCDs, and it is possible to achieve conductivity on both sides through through-hole plating. [Features] - Conductor patterns on both sides - Capability for conductivity on both sides *For more details, please refer to the catalog or feel free to contact us.
Button-plated FPC that enables high-speed transmission, ultra-thinness, and flexibility in a new dimension.
Button-plated flexible printed circuit boards (FPC) can utilize the original thickness and characteristics of copper foil by applying through-hole plating only to the through-holes and through-hole lands. This allows for uniform maintenance of conductor thickness, enabling the formation of high-precision wiring, which is expected to provide high-accuracy impedance control, making it ideal for high-speed transmission applications. Compared to conventional panel plating methods, button-plated FPCs excel in flexibility and bendability, achieving ultra-thin designs. This enables the lightweight and compact design of products. The new method also allows for button plating on narrow pitch patterns. Product Features: 1. By applying copper plating only to the through-holes, the original characteristics of the copper foil are maximized. 2. High-precision impedance control is possible, demonstrating performance suitable for high-speed transmission. 3. Compared to panel plating methods, it excels in flexibility and bendability while achieving ultra-thin designs. 4. It provides stable quality with technology that has cleared reliability evaluations based on JISC5016. 5. Through-hole plating is possible even for narrow pitch patterns, which were previously difficult to achieve.
Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.
The "High-Frequency Compatible FPC (Fluoropolymer Composite Material Specification)" is a product designed to address low transmission loss and impedance matching. 〇 The fluoropolymer composite material has particularly excellent inductive characteristics. 〇 Achieves extremely low transmission loss for stable high-speed, high-capacity communication. ● FPC high-frequency analysis service (optional) It can be used for various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedWiringBoard #CircuitBoard #PrintedCircuitBoard #ShortLeadTime #MassProduction
We respond to any customer requests with flexibility. We accommodate small and medium lots as well as prototypes.
We manufacture flexible printed circuit boards (FPC) tailored to our customers' needs with a diverse range of materials, configurations, and lineups. We are happy to accept orders for just one piece or a single process, and we also provide fine-pitch FPCs with a mass production base for small to medium lots, such as L/S = 50/50μm. Leveraging the surface treatment technology we have built over many years, we respond to our customers' diverse requests under thorough process management. 【Four Reasons to Choose Us】 ■ Years of expertise ■ Support for small and medium lots and prototypes ■ Proven track record of safety and reliability ■ Planning and proposal services available *For more details, please download the PDF or feel free to contact us.
![[Use Case] Achieving 'Future Co-Creation' between Humans and Robots with Automation Solutions](https://image.mono.ipros.com/public/product/image/345/2001115336/IPROS7936531049190541673.gif?w=280&h=280)
FA and automation systems, introduction of operational examples. "Future co-creation" between humans and robots.
〇 Introduction of Use Cases We have introduced our proposed automation system in the customer's PR video. We have received consent for its publication on this site, so please view it via the video link. Our automation system: 13-23 seconds, 38-49 seconds *Only the input and output of materials using a dual-arm robot transport system. Elephantech Inc. https://www.elephantech.co.jp/ Elephantech "Elephantech - A startup leading the world in FPC printing" With the mission of "creating a sustainable world through the power of new manufacturing," we manufacture and sell FPC (Flexible Printed Circuit) using environmentally friendly unique methods with inkjet printing and copper plating.
Achieving fine pattern processing that was not possible with conventional FPC boards!
【Features】 1. Fine patterning with a pitch of 30μm (L&S = 15/15μm) is possible. 2. Depending on specifications, connection bumps can be formed on the pattern or the backside. 3. By combining laser processing and plating technology, through-hole conduction treatment on both sides is possible.
Ideal for flexible bending and effective use of embedded space!
"Single-sided FPC" is a printed circuit board that has a conductor pattern on only one side. Due to its thinness, it allows for flexible bending and effective use of assembly space, and we also offer fine-pitch specifications in addition to standard specifications. This product is mainly used in backlights and motors. 【Features】 ■ Conductor pattern on one side only ■ Allows for flexible bending and effective use of assembly space *For more details, please refer to the catalog or feel free to contact us.
We will manufacture multi-layer flexible printed circuit boards (3 to 6 layers) entirely from polyimide. Please look forward to our quick delivery response! (Multi-layer boards, FPC)
Taiyo Industry supports everything from prototyping to mass production. ■ Achieves high density through pad-on-bead technology. ■ Compatible with 400μm pitch BGA. ■ Improved design flexibility with multilayer structures for high-density wiring. ■ Also supports impedance management. For more detailed information, please feel free to contact our representative. #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance
Short delivery times and small lot sizes! Supports high-quality and high-performance specifications such as high flexibility and impedance control.
Asunics collaborates with Taiwanese FPC manufacturers to provide high-quality and short-lead-time FPCs. We support high-quality and high-performance specifications such as high flexibility and impedance control. We provide speedy support from component mounting, bump and Gerber data creation assistance, to prototyping and mass production. 【Features】 ■ Materials: Polyimide / Liquid Crystal Polymer, etc. ■ High-speed signal support: LVDS / HDMI / USB / MIPI ■ Short lead time / Small lot *For more details, please download the PDF or feel free to contact us.
Approximately one-third the rebound force compared to conventional structures! Low-rebound FPC for communication devices that combines noise reduction and high-speed transmission.
The low-rebound, high-speed transmission FPC adopts a stripline structure and is an excellent flexible substrate for noise countermeasures using shielding materials. Compared to conventional 3-layer FPCs, it is approximately 200μm thinner and reduces rebound force to about one-third, while keeping transmission loss at the same level or lower. This innovative FPC, developed for communication devices, is expected to improve assembly workability and be used in movable parts. 【Four Features】 1. Reduces transmission loss to the same level or lower compared to conventional 3-layer FPCs and decreases rebound force to about one-third. 2. Improves assembly workability and allows for use in movable parts. 3. Enhances noise countermeasures through the adoption of stripline structure and shielding materials. 4. Supports compact device design due to its thin profile. For more details, please refer to the PDF materials or feel free to contact us.
Achieving a 40% reduction in thickness! Introducing a flexible, low-rebound, and excellent multilayer flexible substrate.
The "Ultra-thin Flexible Multi-layer FPC" is a multi-layer flexible substrate that achieves a thinner profile while maintaining the same wiring density as standard multi-layer FPCs. It enables bending wiring in narrow spaces, which was previously difficult, contributing to the ongoing lightweight and compact development of digital electronic devices. It can be applied to wearable devices used in various fields, including mobile devices, medical and nursing care, robotics, sports, and healthcare. 【Features】 ■ Achieves a 40% reduction in thickness ■ Uses polyimide as the substrate, ensuring sufficient reliability while being thin ■ Excellent embedability due to its thin, flexible, and low-rebound characteristics *For more details, please refer to the PDF document or feel free to contact us.
Can be used with bent shapes and supports high-speed transmission! Ideal for integration in tight spaces. Integration of connections between circuit boards is also possible. *There is a video that explains it in 2 minutes!
The "Card Edge Compatible Multi-Layer Flexible Printed Circuit Board (FPC)" provided by our company is a multi-layer flexible circuit board designed to accommodate card edge connectors with double-sided contacts. By reducing the connection points between printed circuit boards and flexible circuit boards, a stable impedance line is formed, which is expected to improve signal integrity at high frequencies of 10 GHz and above. The substrate uses polyimide film, and soft resist ink is used as the insulating material, allowing for flexibility, making it suitable for installation in tight spaces. 【Features】 ■ A partially bendable structure that has similar functionality to rigid-flex boards, enabling the formation of highly reliable vias. ■ A structure that integrates flexible and rigid parts without connection points or via transitions, allowing for the formation of stable impedance lines. ■ High-density wiring is possible with 100μm pitch wiring and vias with a land diameter of 300μm or less. ■ Integration of connections between boards contributes to a reduction in assembly labor. *For more details, please refer to the PDF materials. Feel free to contact us with any inquiries.
