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substrate(fpc) - メーカー・企業と製品の一覧

更新日： 集計期間:Jan 14, 2026～Feb 10, 2026
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substrateの製品一覧

181～207 件を表示 ／ 全 207 件

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Flexible printed circuit board (FPC) [Solving the issues in the prototype development of flexible printed circuit boards!]

Flexible printed circuit board (FPC) [Solving the issues in the prototype development of flexible printed circuit boards!]

Solving the issues of prototype development for flexible PCBs with many limitations! We manufacture high-performance flexible PCBs!

We can respond to circuit board manufacturing and component mounting in as little as one working day each. Additionally, we manufacture high-performance flexible circuit boards with impedance control during artwork design. We also accommodate small lot production. 【We can also support the following specifications】 ■ Component mounting FPC (double-sided mounting, lead-free mounting, mounter/reflow, bare chip mounting) ■ Bonding processing with other boards using ACF (FPC + FPC, FPC + PBC, FPC + glass substrate, etc.) ■ Multi-layer FPC (supports 3 to 6 layers; double-sided mounting is also possible) ■ Fine pitch FPC (single-sided board... minimum L/S 12/30μm; double-sided board... minimum L/S 25/50μm) *For details, please request materials or view the PDF data from the download.

  • others
  • substrate

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[Hardware Development Achievements] 64ch FPIX Board

[Hardware Development Achievements] 64ch FPIX Board

The created histogram is transferred to the PC via SiTCP! It has a structure with a heat-dissipating aluminum block placed at the bottom.

We assisted with KEK's FPIX project. This is a substrate developed in the measurement instrument development room to collect signals from a Si-APD chip, where the signals are sampled at 0.5 ns by an FPGA and histogrammed within the FPGA. The created histogram is transferred to a PC via SiTCP. To efficiently dissipate heat from components like the FPGA, most of the components are placed on the underside, and a heat-dissipating aluminum block is structured on the bottom. 【Overview of Achievements】 ■ Service: Hardware Development ■ Client: High Energy Accelerator Research Organization ■ Location: KEK PF *For more details, please refer to the related link page or feel free to contact us.

  • Other embedded systems (software and hardware)
  • Embedded system design service
  • substrate

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Printed circuit board manufacturing service, short delivery time.

Printed circuit board manufacturing service, short delivery time.

IVH, resin filling, build-up, impedance, flexible substrate compatible! Unmatched ultra-short delivery time faster than anywhere else!

Our company manufactures all processes of printed circuit board production in-house. Therefore, we can ship a variety of printed circuit boards with reliable and assured short delivery times. We also handle gold flash, lead-free leveling, and terminal gold plating in-house, which is a characteristic of our company that ensures stable delivery times. Additionally, even for repeat orders, we can accommodate the delivery times listed in the schedule without any changes from the initial order. *Examples of short delivery times: - Through-hole boards (2 to 10 layers): Minimum shipping in 1.05 days* (Data submission and orders by 20:00 on business days will ship the next business day) - Build-up boards: Minimum shipping in 3.1 days* (Data submission and orders by 16:00 on business days will ship on the 3rd business day from the next business day) - Flexible (FPC) boards: Minimum shipping available on the 2nd day - Rigid FPC boards: Minimum shipping available on the 5th day ☆ The above is also applicable even if the surface treatment is gold flash finish. [Products Handled] ■ Through-hole resin-filled boards ■ Build-up boards ■ IVH boards ■ Impedance control boards ■ Copper bump boards ■ Various resist colors ■ Flexible (FPC) boards ■ Rigid FPC boards ■ Copper inlay boards ■ Metal boards *For more details, please feel free to contact us.

  • Printed Circuit Board
  • substrate

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Board "SY-KUS-01"

Board "SY-KUS-01"

PCI Express board capable of high-capacity data transmission and reception using high-speed serial communication.

The "SY-KUS-01" is a PCI Express board equipped with a Xilinx Kintex UltraScale FPGA. It enables high-speed serial communication for large-capacity data transmission and reception. It features two channels of DDR4 as external memory. It is equipped with the FPGA XCKU035-2FFVA1156C, and options for 025, 040, and 060 are also available. Additionally, it includes two QSPI (totaling 512Mbit). 256Mbit can be used as user space. 【Features】 ■ PCI Express (supports up to Gen3 x 8) ■ Oscillator ・ Equipped with 100MHz, 200MHz, and 250MHz ■ Two channels of DDR4 (1 channel = 32Gbit 64bit_DataBus) ■ SFP+ 4ch ■ MMCX 2Lane (Tx/Rx) + RefCLK ■ 8-pin PinHeader external interface *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Contract manufacturing
  • substrate

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Artwork design for high-frequency substrates

Artwork design for high-frequency substrates

We accept artwork design for various types of circuit boards, including high-frequency impedance control boards and power supply boards.

We specialize in the design of impedance control PCBs, with proven experience in high-frequency PCBs ranging from 10GHz to 40GHz and high-speed transmission PCBs from 40Gbps to 100Gbps. Additionally, we consider various aspects from PCB manufacturing to component assembly and propose the optimal layout.

  • Image Processing Software
  • substrate

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Circuit board "Arm Frogs BLUE"

Circuit board "Arm Frogs BLUE"

Space-saving, high reliability, high precision! A board that is also optimal for industrial applications and evaluation boards.

Gofeltec's "Arm Frogs BLUE" is a space-saving, highly reliable, and high-precision circuit board that combines a CPU and FPGA into a single chip. It supports ECC, making it ideal for industrial applications. It can also be used as a PCIe card and is perfect as an evaluation board. The SoC part is on a separate board, allowing for direct mass production of the SoC after evaluation. 【Features】 ■ CPU and FPGA in one chip ■ Supports ECC, making it ideal for industrial applications ■ Can be used as a PCIe card, perfect for evaluation boards ■ SoC part on a separate board ■ Space-saving, highly reliable, and high-precision circuit board *For more details, please refer to the PDF materials or feel free to contact us.

  • Evaluation Board
  • Printed Circuit Board
  • Memory
  • substrate

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We will be exhibiting at the Kyushu Semiconductor Industry Exhibition! Printed Circuit Boards [SHOWA]

We will be exhibiting at the Kyushu Semiconductor Industry Exhibition! Printed Circuit Boards [SHOWA]

Anyway, it's fast! Leave the printed circuit boards to 【SHOWA】!

Our company is one of Japan's leading ultra-fast printed circuit board manufacturers. We possess top-level equipment and specialize in the production of high-difficulty circuit boards. With over 30 years of industry experience, we currently have business dealings with more than 2,200 companies in Japan. Of course, in addition to circuit board manufacturing, we can also accommodate customer requests for AW design and component mounting. 【Build-up Boards】⇒ We can handle narrow pitch BGA mounting, multi-layer builds, and any layer configurations. 【Heat Dissipation】⇒ We can accommodate aluminum base boards, high thermal conductivity CEM-3, and copper inlay boards. 【Thick Copper Boards】⇒ We can handle high current boards, thicker plating in through holes, and automotive boards. 【Flexible Boards】⇒ We can accommodate FPC, multi-layer FPC, rigid FPC, and transparent polyimide FPC. 【High Frequency】⇒ We have standard stock of Megtron 6 (manufactured by Panasonic) and have processing experience with many low dielectric constant materials. 【Special Processing】⇒ We can also accommodate bump formation and back drilling. ↓ Please also visit our website https://www.showanet.jp/ We look forward to hearing from you.

  • Printed Circuit Board
  • substrate

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Development Board Example: "High-Speed Optical Data Processing Board"

Development Board Example: "High-Speed Optical Data Processing Board"

Introducing examples of development boards created using advanced embedded technology!

At Toyo Electric Co., Ltd., which engages in engineering business, we handle various development boards. The "High-Speed Optical Data Processing Board" samples large amounts of data from the upper layer at high speed and converts and transmits it into optical data according to requirements. Our company supports everything from circuit design to embedded software development, providing development tailored to customer needs. 【Features】 ■ External Interface - Optical Input/Output SFP (3.125Gbps) × 3 channels - PCI Express Gen1 × 4 ■ Equipped with FPGA *For more details, please refer to the PDF materials or feel free to contact us.

  • others
  • Circuit board design and manufacturing
  • Embedded Board Computers
  • substrate

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Simulation-based substrate design

Simulation-based substrate design

If you provide the required specifications, we will propose suitable board specifications and designs.

We will solve various issues related to printed circuit boards through simulation. We provide one-stop solutions for printed circuit boards that balance performance and cost. If you provide us with your required specifications, we can propose suitable board specifications and designs, leveraging our extensive background data and manufacturing technology unique to PCB manufacturers to suggest optimal characteristics. [Issues] - Non-functional, distorted waveforms, do not meet standards - Unstable operation under high load - Time-consuming cause investigation and countermeasures - Do not meet EMC standards *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Delivery record: Platform substrate

Delivery record: Platform substrate

Systematizing measurement and mechatronics! Introducing the delivery achievements of Applied Electric.

At Applied Electric, we specialize in non-standard small-lot production and are constantly handling and delivering a wide variety of products, numbering in the thousands. In response to customer requests, we develop and design controllers that serve as the core of inspection and control devices, using suitable CPUs and FPGAs. [Development Examples] ■ CPU: H8, SH-2, SH-2A, SH-3, SH-4, SH-4A, RX, i.MX3x, ARM, DSP ■ Communication: USB2.0, USB3.0, 1G/100/10baseT, RocketIO, MIPI ■ Bus: VME, CompactPCI, PCI, PCIExpress *For more details, please refer to the PDF materials or feel free to contact us.

  • Other measurement, recording and measuring instruments
  • Other inspection equipment and devices
  • Circuit board design and manufacturing
  • substrate

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Printed circuit board assembly fine pitch board

Printed circuit board assembly fine pitch board

We provide support for everything from the design and development of various microcontroller controllers to printed circuit board assembly and controller assembly.

We will strive for further "evolution and development" under the theme of "Creative, Evolving, Developing Enterprises."

  • Circuit board design and manufacturing
  • substrate

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[Web Seminar Now Available] Flexible Printed Circuits with Japanese Subtitles

[Web Seminar Now Available] Flexible Printed Circuits with Japanese Subtitles

How flexible printed circuit boards save space in harsh automotive and industrial environments.

We are currently offering a webinar titled "Flexible Printed Circuits (#FPC) with Japanese Subtitles." In today's continuously evolving environment, it is crucial for engineers in both the automotive and industrial sectors to incorporate more functionality into limited spaces. As the emergence of new communication protocols increases complexity, power density and signal integrity are becoming more critical design elements. Significant investments are made in custom designs, making reuse essential. In this webinar, a senior manager from Molex's FPC division will share insights based on 14 years of design expertise, exploring how flexible printed circuits (FPC) address these modern challenges. [Learning Content] ■ Space-saving techniques ■ Addressing protocol complexity ■ Strengthening design metrics ■ Promoting efficient reuse *For more details, please feel free to contact us.

  • Printed Circuit Board
  • substrate

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Electronic device development

Electronic device development

We provide board development solutions.

We provide planning and development solutions for electronic device development through a comprehensive technical approach from both hardware and software. With our accumulated technology and the latest electronics technology, we respond to various requests in hardware development and help realize our customers' product visions.

  • Printed Circuit Board
  • EMS
  • substrate

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Foresight glass print wiring board

Foresight glass print wiring board

We will form circuit patterns of thick copper on glass using the subtractive method and semi-additive method.

It has a high transmittance and can be used for substrates of optical passive components. It has a low coefficient of thermal expansion, excellent dimensional stability, and mounting reliability. It has minimal warping, excellent flatness, and is easy to mount.

  • Touch Panel
  • substrate

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Evaluation of the "56G-PAM4 Board" implementation completed.

Evaluation of the "56G-PAM4 Board" implementation completed.

We will support the upcoming high-speed communication standards with PAM4 signal communication boards!

To Matsudo Co., Ltd. and RITA Electronics, the main FPGA board for the '56G-PAM4 communication board' created during the technical study session aimed at solving customer challenges has been completed! After completing the basic checks, we will proceed with waveform verification using this board and continue to verify the operation in combination with the evaluation boards that will be successively completed thereafter. In an increasingly high-speed communication environment, we aim to accumulate high-speed technologies leading to PCIe Gen6.0, DDR, and 400G Ethernet, and provide solutions to our customers.

  • Communications
  • Circuit board design and manufacturing
  • substrate

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Trends in the development of high-functionality, compact, and lightweight materials for automotive control devices, components, and electrical materials.

Trends in the development of high-functionality, compact, and lightweight materials for automotive control devices, components, and electrical materials.

~Technologies for ensuring high reliability, wiring, and miniaturization of inverters centered around metal substitute resin components~

★Development status of new plastic materials for electrification and weight reduction! Development of PBT resin with high reliability! ★What characteristics are required for automotive FPC (Flexible Printed Circuit)? Which components can contribute to weight reduction? ★What are the needs for thermal conductivity and material strength? Are there parts that cannot be replaced by metals? ★What technological innovations are most important for achieving miniaturization of inverters and automotive electronic products? 【Speakers】 Part 1: Representative from Japan Mectron Co., Ltd. AI Business Division, Automotive FPC Planning Department Part 2: Representative from Polyplastics Co., Ltd. Technical Solution Center Part 3: Mr. Hideo Shikano, Director of Lintec Engineering Office Part 4: Mr. Yoshihiro Kamiya, Hardware Development Department, Electrical and Electronic Technology Development Division, Denso Corporation 【Venue】 Tekuno Kawasaki, 4th Floor Conference Room [Kanagawa, Kawasaki] 【Date and Time】November 26, 2013 (Tuesday) 10:30-16:35

  • 企業：AndTech
  • 価格：10,000 yen-100,000 yen
  • Technical Seminar
  • substrate

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Various glass substrates and processing *Capable of handling everything from a single prototype to mass production.

Various glass substrates and processing *Capable of handling everything from a single prototype to mass production.

From procurement of glass materials to film processing! There are also high-performance glass cutting holes that can beautifully cut glass with protective sheets.

At DRS, we perform various glass processing operations, including cutting, beveling, polishing, printing, and AG/AR/AF processing. We handle everything from the procurement of glass materials to film formation processing, providing various manufacturers and types of glass materials. We also accept size reduction cutting processing for photomask substrates, accommodating customer requests from single prototypes to mass production. Additionally, we offer the high-performance glass cutting tool 'FINE SCRATCH', which is suitable for cutting glass for FPD applications. It achieves high-strength cutting that minimizes horizontal cracking. Stable cutting can also be performed on glass substrates with metal deposition films. 【Types of Glass Materials】 ■ Gorilla Glass ■ Dragontrail Glass ■ Soda Lime Glass ■ Non-Alkali Glass *For more details, please refer to the PDF materials or feel free to contact us.

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  • Processing Contract
  • Glass
  • Other contract services
  • substrate

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We will be exhibiting at the 2024 International Aerospace Exhibition!

We will be exhibiting at the 2024 International Aerospace Exhibition!

We will exhibit at the 2024 International Aerospace Exhibition and the 2024 New Technology Creation Exchange Meeting!

Build-up substrates, high-frequency substrates, FPC and rigid FPC substrates... All of these are manufactured in-house at our own factory, with a fully integrated production process! The ultra-short delivery times achieved by eliminating outsourcing are astonishingly fast! Since surface treatment, such as gold flash, is also handled in-house, there are no fluctuations in delivery times! Not only the delivery times but also the wide range of materials we handle is one of the attractions of Matsuwa Sangyo. Even if the material has no processing track record, we are flexible in accommodating your needs! We accept orders for any type of substrate, even in small quantities, so if you have even a slight desire to "want to make a substrate," why not start with a light consultation? - 2024 International Aerospace Exhibition ⇒ 10/16 (Wed) - 10/18 (Fri) @ Tokyo Big Sight Please be sure to stop by the Matsuwa Sangyo booth on the day!

  • Printed Circuit Board
  • substrate

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Flexible printed circuit board (FPC) impedance control

Flexible printed circuit board (FPC) impedance control

Impedance control of flexible substrates and UL certification can be achieved with short lead times and small lot production.

We can respond to circuit board manufacturing and component assembly in just one working day at the shortest. Additionally, we manufacture high-performance flexible circuit boards with impedance control during the artwork design phase. We can also accommodate small lot production. Please feel free to consult with us.

  • others
  • Prototype Services
  • substrate

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Flexible printed circuit board (FPC) short delivery time

Flexible printed circuit board (FPC) short delivery time

Impedance control of flexible substrates and UL certification can be achieved with short lead times and small lot production.

We will respond to circuit board manufacturing and component assembly in just one working day at the shortest. Additionally, we will manufacture high-performance flexible circuit boards with impedance control during artwork design. We can also accommodate small lot production. Please feel free to consult with us.

  • others
  • substrate

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Rigid-flexible substrate

Rigid-flexible substrate

The flexible parts can be multilayered, and there are also specifications for the rigid parts that are multilayered or have a build-up structure!

We would like to introduce the "Rigid Flexible Circuit Board" handled by Matsuwa Sangyo Co., Ltd. This board integrates rigid and flexible circuit boards and is also referred to as rigid flex or rigid FPC. Our product not only combines the features of rigid and flexible circuit boards but also eliminates the need for connectors in the interconnection between boards, making it effective for lightweight, compact, and three-dimensional assembly and wiring. 【Example Specifications for Flexible Circuit Board Manufacturing (Excerpt)】 ■ Base Material Thickness: 25μm, 50μm ■ Copper Foil Thickness: 18μm, 35μm ■ Copper Foil Types: Rolled Copper Foil, Special Electrolytic Copper Foil ■ Coverlay Color: Amber ■ Resist Color: Amber, Green, Black, White *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • substrate

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2005 Two-layer FPC/COF Market Demand Outlook and Two-layer CCL Production Trend Analysis

2005 Two-layer FPC/COF Market Demand Outlook and Two-layer CCL Production Trend Analysis

2005 Two-layer FPC/COF Market Demand Outlook and Analysis of Two-layer CCL Production Trends

Focusing on the rapidly growing two-layer FPC, we conducted demand forecasting by application and clarified trends in the market, applications, manufacturers, and types. Additionally, regarding the two-layer CCL, which is facing supply constraints due to a sharp increase in demand, we investigated and analyzed the production status and expansion plans of each two-layer CCL manufacturer to clarify the current supply and demand situation. This provides an outlook on the future of two-layer FPC/CCL.

  • Printed Circuit Board
  • Adhesive tape
  • substrate

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Mouse Emulation System [Embedded System Development Case Study]

Mouse Emulation System [Embedded System Development Case Study]

Capture and process analog waveforms! Leave FPGA development to us.

We would like to introduce a case where we delivered a mouse emulation system to a display manufacturer. The company requested whether we could develop an FPGA program for an FPGA-equipped board and a LabVIEW program that communicates with the FPGA-equipped board via USB to execute mouse emulation on a PC. Our company has a proven track record in FPGA development, and we have a specialized partner who excels in LabVIEW programming. In this case, the client has expressed satisfaction after delivery. [Case Overview] ■ Request - Development of an FPGA program for an FPGA-equipped board and a LabVIEW program ■ Our Strengths - Proven track record in FPGA development - Specialized partner for LabVIEW programming ■ Result: The client is satisfied after delivery *For more details, please refer to the PDF document or feel free to contact us.

  • Other embedded systems (software and hardware)
  • substrate

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Printed circuit board design high-frequency board

Printed circuit board design high-frequency board

We accept artwork design for various types of boards, including high-frequency impedance control boards and power supply boards.

We specialize in the design of impedance control PCBs, with proven experience in high-frequency boards ranging from 10GHz to 40GHz and high-speed transmission boards from 40Gbps to 100Gbps. Additionally, we consider various aspects from PCB manufacturing to component mounting and propose the optimal layout.

  • others
  • substrate

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Industrial ITX motherboard 'MIX-H810WV1' with rich I/O.

Industrial ITX motherboard 'MIX-H810WV1' with rich I/O.

Equipped with a wide range of USB, serial, and video outputs. An ideal Mini-ITX board for embedding in industrial equipment that requires multiple input/output control.

The "MIX-H810WV1" is a Mini-ITX motherboard designed for industrial equipment that requires a variety of I/O options. It comes standard with a powerful array of interfaces that can connect directly to diverse devices, including USB3.2 Gen2×2, USB2.0×4, four serial ports (RS-232/422/485), 8-bit DIO, and HDMI/DP. The CPU can be selected from the Intel Core Ultra 200S series (LGA1851). It supports DDR5 SODIMM×2 (up to 96GB), ensuring stable operation even in control and monitoring systems that require long-term operation. Additionally, with M.2, SATA, and PCIe Gen5, adding storage or dedicated cards is easy. With a DC12-24V input and an operating range of 0-60°C, it can be safely used in a wide range of environments, including manufacturing lines, FA equipment, and embedded PCs. *CPU, memory, storage, and OS are not included.

  • Embedded Board Computers
  • substrate

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Mini-ITX motherboard for industrial machinery integration 'MIX-H810WV1'

Mini-ITX motherboard for industrial machinery integration 'MIX-H810WV1'

Achieves high-speed computation and stability. An industrial Mini-ITX motherboard that can be smoothly integrated into NC devices, control panels, and automated processing equipment.

The industrial Mini-ITX motherboard 'MIX-H810WV1' is designed with a focus on the required "stable operation," "high-speed response," and "long-term supply" for control systems in working machinery. By adopting the latest Intel Core Ultra 200S series, it can comfortably handle complex interpolation calculations and high-speed communication with peripherals. It is equipped with specifications that support high-speed processing for control applications, including up to 96GB of DDR5 memory, PCIe Gen5 x4, and M.2 NVMe. Standard I/O includes USB3.2, 2.5GbE x2, serial x4, and DIO, ensuring connectivity with on-site PLCs, sensors, and display devices, and it serves as a central controller for NC devices and automation equipment. It supports DC 12-24V input and operates within a temperature range of 0-60°C, demonstrating robustness suitable for installation inside machinery.

  • Embedded Board Computers
  • substrate

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