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substrate(fpc) - メーカー・企業と業務用製品 | イプロスものづくり

更新日： 集計期間:Jun 03, 2026～Jun 30, 2026
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substrateの製品一覧

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Low dielectric materials for communication equipment Smart Cellular Board

Low dielectric materials for communication equipment Smart Cellular Board

Achieved further reduction in dielectric constant of engineering plastics and super engineering plastics with unique foaming technology. Contributed to solving design challenges arising from multi-band and high-frequency applications.

The Smart Cellular Board (SCB) from Furukawa Electric is a low dielectric material in a finely foamed sheet form. Our proprietary foaming technology allows us to foam resins that are highly heat-resistant and difficult to foam, such as engineering plastics and super engineering plastics. As a result, we can fill air into various inherently low dielectric resins, reducing their dielectric properties to levels that are difficult to achieve with conventional resin materials. In particular, the low dielectric constant (Dk) achieves a value below 2.0, which is challenging with solid resins. If you are facing challenges in designing communication devices for high frequency and multi-band applications, please consider our product. 【SCB Features for Substrate Applications】 - Reduction of transmission loss due to low Dk and low Df - Compatibility of low height and low transmission loss due to low Dk - Suppression of miniaturization of array antennas associated with high frequency 【SCB Features for Radome Applications】 - Suppression of radio wave reflection due to low Dk - Assurance of radio wave transparency over a wide bandwidth and wide angle without worrying about radome thickness - Suppression of reflection and interference of radio waves within the antenna - Lightweight radome design

  • plastic
  • Engineering Plastics
  • substrate

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Rishorite® ES-3753K (CEM-3, Rishō Kōgyō)

Rishorite® ES-3753K (CEM-3, Rishō Kōgyō)

Standard type CEM-3 made of glass cloth + glass non-woven fabric.

Glass composite substrate (CEM-3) is a substrate made by impregnating epoxy resin into a base material that combines glass cloth and glass non-woven fabric. It has electrical properties equivalent to epoxy glass and is used as a cost-effective alternative, but it has inferior mechanical properties and dimensional stability. RISHOLITEⓇ (Rishorite) ES-3753K, manufactured by Rishou Industry Co., Ltd., is an epoxy resin composite board of CEM-3 that combines glass cloth and glass non-woven fabric, excelling in processability such as punching. Applications include "punched products *thick plates for machine parts." We also offer a lineup of CEM-3 types such as "ES-3753KP," which further improves processability with thin glass cloth, and "ES-3753KJ," which uses ultra-thin glass cloth. Myojo Electric provides one-stop support from material selection and procurement of thermosetting resins, including glass epoxy, and engineering plastics such as thermoplastic resins, to various processing methods including cutting, molding, polishing, bending, and bonding. If you have any questions or inquiries, please feel free to contact us.

  • plastic
  • substrate

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Substrates, etc. Brain Power [Authorized Dealer]

Substrates, etc. Brain Power [Authorized Dealer]

From memory modules to 5G optical transceivers and rigid-flex. PCB technology that excels in high density and high reliability.

Brain Power (Qing Yuan) Co., Ltd. is a PCB specialized manufacturer and a JEDEC member headquartered in Guangdong, China, with a large-scale factory. The company handles double-sided, multilayer, HDI, FPC, rigid-flex, high-frequency, and optical module compatible boards, with a maximum monthly production capacity of 120,000 square meters and an average of 1,200 employees, developing high-density and high-performance products for the global market. Major customers include memory module, SSD, automotive equipment, and communication equipment manufacturers.

  • Printed Circuit Board
  • substrate

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Can you find hints for improving manufacturing with special substrates? [Materials available for distribution]

Can you find hints for improving manufacturing with special substrates? [Materials available for distribution]

In fact, Sanwa's special substrates are used in such places. We support the resolution of various challenges such as implementation defects, costs, and man-hours with substrate technology.

Our company is a specialized manufacturer of printed circuit boards, actively challenging complex processing and difficult requests, with a wealth of experience and trust. We cater to a wide range of needs, from general circuit boards to special boards aimed at solving challenges related to assembly and product commercialization. Your development concerns, on-site work improvements, and issues related to enhancing product value may be resolved with our printed circuit boards. 【Are you facing any of these issues?】 ■ I want to make the product smaller. ■ I want to use a cavity structure to reduce the height of the product. ■ I am looking for alternatives to FPC. ■ I want to bend FR-4 or aluminum boards for use inside equipment. ■ I want to eliminate copper burrs on side electrodes. ■ I want to eliminate glass cloth or resin debris from the edge of the board. ■ I want to suppress heat generation from components using the board. ■ I want to use boards that are cost-effective and suitable for high-frequency applications. We will work together to address your challenges, supporting your product development with a consistent system from the design stage to prototyping and mass production. No matter how trivial the matter may seem, please feel free to contact us with your ideas or concerns!

  • Printed Circuit Board
  • substrate

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Long-sized printed circuit board ☆ up to 1500mm ☆

Long-sized printed circuit board ☆ up to 1500mm ☆

Leave everything related to printed circuit boards to us! We can handle everything from single-sided to build-up, aluminum core, and rigid-flex, even in small quantities.

Our company provides electronic devices, including printed circuit boards, based on our unique value chain and network with "high quality," "low price," and "short delivery time." ---------------------------- ◆ Quality <Q> We ensure reliable quality by having a QA organization centered around Japanese personnel that works closely with the factory. We can accommodate from AW design, enabling designs that consider manufacturing. ◆ Price <C> Depending on the type and quantity of the circuit boards, we can procure them at prices 30% to over 50% lower than domestic products. ◆ Delivery <D> We have a dedicated organization for delivery management, minimizing delivery issues through detailed management. ---------------------------- Our feature is that we can provide "Chinese-produced products at low prices with Japanese quality." We can flexibly utilize short delivery domestic manufacturing and low-cost overseas manufacturing, accommodating a wide range from single-sided boards to build-up mass production. We have our own factory in China, and we are also equipped to produce special-shaped boards, such as long boards over 1 meter and thin boards of 0.2 mm. *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • substrate

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All LCP Flexible Printed Circuit Board (FPC)

All LCP Flexible Printed Circuit Board (FPC)

Next-generation flexible substrate with high heat resistance, low loss, and chemical resistance, all made of LCP!

All LCP is a high-performance flexible printed circuit board (FPC) made entirely of liquid crystal polymer (LCP) without the use of adhesives. Compared to conventional polyimide FPCs, it features high heat resistance, low moisture absorption, low loss characteristics, chemical resistance, and low outgassing properties, providing stable performance even in harsh environments. It is particularly suitable for applications that require reduced transmission loss of high-frequency signals and improved durability in environments where oils and chemicals are used.

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • substrate

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Printed circuit boards (wiring boards) for space and defense equipment.

Printed circuit boards (wiring boards) for space and defense equipment.

We supply printed circuit boards for space and defense applications. The printed circuit boards that withstand harsh operating environments are a testament to the high reliability of our products.

OKI Circuit Technology Co., Ltd. is a manufacturer of printed circuit boards that primarily engages in the development, design, and manufacturing of printed wiring boards, electronic devices, and electronic components, and is part of the OKI Group (OKI Electric Industry Co., Ltd.). The company has obtained certification from the Ministry of Defense and the Japan Aerospace Exploration Agency (JAXA), achieving high quality and high reliability in printed circuit boards that can cater to the aerospace industry, earning a high reputation within the industry. Among the products created with our technology, the "flex-rigid board," which combines flexible printed circuits (FPC) with standard rigid boards, eliminates the need for connector space for connecting cables, achieving space-saving and lightweight designs. Furthermore, it provides high reliability by eliminating concerns about connector connections due to vibrations, contributing to the development of the aerospace industry. Please feel free to consult with us. Our article has been published in MONOist. [Reducing a cumulative 480 hours over three years: How we advanced smart manufacturing in a low-volume, high-mix factory] https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html

  • Printed Circuit Board
  • substrate

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3D circuit board (MID wiring) / substrate with embedded electronic components

3D circuit board (MID wiring) / substrate with embedded electronic components

3D circuit board [MID wiring (Molded Interconnect Device)] / substrate with embedded electronic components

Our company provides contract design and development of electronic devices (ODM) as well as contract manufacturing services for electronic devices (EMS). We are involved not only in the design and manufacturing of flexible printed circuits but also in circuit design, structural design, software development, cable and harness production, and we collaborate with product development personnel from the planning stage to bring products to market. Various industries are advancing in miniaturization and weight reduction. To differentiate ourselves from competitors while considering mass production efficiency, we propose a wide range of solutions, not limited to flexible printed circuits, including 3D-MID wiring cases with conductor formation on resin housing surfaces and embedded substrates that incorporate electronic components into printed circuit boards. Etching, plating, vacuum deposition, EB deposition, sputtering, thin film formation, photolithography, ion plating, thermal CVD, plasma CVD, dry etching, film ITO, film metal patterning, fine patterns, WLP, silicon wafers, RDL, bump formation, TEG, dry etching, wet etching, MEMS, organic EL, metallization, glass etching, semi-additive etching, transparent resist, transparency, high heat-resistant resin.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • EMS
  • substrate

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We can accommodate custom-made and custom products starting from just one piece to meet your company's needs.

We can accommodate custom-made and custom products starting from just one piece to meet your company's needs.

If the standard product doesn't fit, if you would like a different shape, or if there are some processes that cannot be done, please feel free to consult with us! *Q&A materials will be provided.

If you have requests for custom or special products tailored to your company's challenges, please feel free to consult with us. Even in the conceptual stage, you can specify items that resemble hand-drawn sketches or sample products featured on our website. We will ask for necessary information, such as the intended use and the environment in which you want to use the product, and gradually determine the specifications while consulting with you. Even if you are unsure about technical aspects, we will support you in the product manufacturing process. 【Are you facing any of these issues?】 "I just can't make it work with standard products." "I want the shape to be more like this." "There are some processes that can't be done." "I want to reduce costs during the design phase with an eye on mass production," etc. 【Examples of production】 ■ Increased thickness of polyimide material ■ Delivery of 6mm PCB material ■ Large hole drilling processing of 750×500 ■ Thermal press processing of test materials Additionally, if you have requests for materials, we can source them, and we can also look for manufacturer-specified material specifications, inks, or materials that meet your needs, so please consult with us once. *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Flexible printed circuit board (FPC) [Solving the issues in the prototype development of flexible printed circuit boards!]

Flexible printed circuit board (FPC) [Solving the issues in the prototype development of flexible printed circuit boards!]

Solving the issues of prototype development for flexible PCBs with many limitations! We manufacture high-performance flexible PCBs!

We can respond to circuit board manufacturing and component mounting in as little as one working day each. Additionally, we manufacture high-performance flexible circuit boards with impedance control during artwork design. We also accommodate small lot production. 【We can also support the following specifications】 ■ Component mounting FPC (double-sided mounting, lead-free mounting, mounter/reflow, bare chip mounting) ■ Bonding processing with other boards using ACF (FPC + FPC, FPC + PBC, FPC + glass substrate, etc.) ■ Multi-layer FPC (supports 3 to 6 layers; double-sided mounting is also possible) ■ Fine pitch FPC (single-sided board... minimum L/S 12/30μm; double-sided board... minimum L/S 25/50μm) *For details, please request materials or view the PDF data from the download.

  • others
  • substrate

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[Hardware Development Achievements] 64ch FPIX Board

[Hardware Development Achievements] 64ch FPIX Board

The created histogram is transferred to the PC via SiTCP! It has a structure with a heat-dissipating aluminum block placed at the bottom.

We assisted with KEK's FPIX project. This is a substrate developed in the measurement instrument development room to collect signals from a Si-APD chip, where the signals are sampled at 0.5 ns by an FPGA and histogrammed within the FPGA. The created histogram is transferred to a PC via SiTCP. To efficiently dissipate heat from components like the FPGA, most of the components are placed on the underside, and a heat-dissipating aluminum block is structured on the bottom. 【Overview of Achievements】 ■ Service: Hardware Development ■ Client: High Energy Accelerator Research Organization ■ Location: KEK PF *For more details, please refer to the related link page or feel free to contact us.

  • Other embedded systems (software and hardware)
  • Embedded system design service
  • substrate

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Printed circuit board manufacturing service, short delivery time.

Printed circuit board manufacturing service, short delivery time.

IVH, resin filling, build-up, impedance, flexible substrate compatible! Unmatched ultra-short delivery time faster than anywhere else!

Our company manufactures all processes of printed circuit board production in-house. Therefore, we can ship a variety of printed circuit boards with reliable and assured short delivery times. We also handle gold flash, lead-free leveling, and terminal gold plating in-house, which is a characteristic of our company that ensures stable delivery times. Additionally, even for repeat orders, we can accommodate the delivery times listed in the schedule without any changes from the initial order. *Examples of short delivery times: - Through-hole boards (2 to 10 layers): Minimum shipping in 1.05 days* (Data submission and orders by 20:00 on business days will ship the next business day) - Build-up boards: Minimum shipping in 3.1 days* (Data submission and orders by 16:00 on business days will ship on the 3rd business day from the next business day) - Flexible (FPC) boards: Minimum shipping available on the 2nd day - Rigid FPC boards: Minimum shipping available on the 5th day ☆ The above is also applicable even if the surface treatment is gold flash finish. [Products Handled] ■ Through-hole resin-filled boards ■ Build-up boards ■ IVH boards ■ Impedance control boards ■ Copper bump boards ■ Various resist colors ■ Flexible (FPC) boards ■ Rigid FPC boards ■ Copper inlay boards ■ Metal boards *For more details, please feel free to contact us.

  • Printed Circuit Board
  • substrate

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Board "SY-KUS-01"

Board "SY-KUS-01"

PCI Express board capable of high-capacity data transmission and reception using high-speed serial communication.

The "SY-KUS-01" is a PCI Express board equipped with a Xilinx Kintex UltraScale FPGA. It enables high-speed serial communication for large-capacity data transmission and reception. It features two channels of DDR4 as external memory. It is equipped with the FPGA XCKU035-2FFVA1156C, and options for 025, 040, and 060 are also available. Additionally, it includes two QSPI (totaling 512Mbit). 256Mbit can be used as user space. 【Features】 ■ PCI Express (supports up to Gen3 x 8) ■ Oscillator ・ Equipped with 100MHz, 200MHz, and 250MHz ■ Two channels of DDR4 (1 channel = 32Gbit 64bit_DataBus) ■ SFP+ 4ch ■ MMCX 2Lane (Tx/Rx) + RefCLK ■ 8-pin PinHeader external interface *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Contract manufacturing
  • substrate

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Artwork design for high-frequency substrates

Artwork design for high-frequency substrates

We accept artwork design for various types of circuit boards, including high-frequency impedance control boards and power supply boards.

We specialize in the design of impedance control PCBs, with proven experience in high-frequency PCBs ranging from 10GHz to 40GHz and high-speed transmission PCBs from 40Gbps to 100Gbps. Additionally, we consider various aspects from PCB manufacturing to component assembly and propose the optimal layout.

  • Image Processing Software
  • substrate

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Circuit board "Arm Frogs BLUE"

Circuit board "Arm Frogs BLUE"

Space-saving, high reliability, high precision! A board that is also optimal for industrial applications and evaluation boards.

Gofeltec's "Arm Frogs BLUE" is a space-saving, highly reliable, and high-precision circuit board that combines a CPU and FPGA into a single chip. It supports ECC, making it ideal for industrial applications. It can also be used as a PCIe card and is perfect as an evaluation board. The SoC part is on a separate board, allowing for direct mass production of the SoC after evaluation. 【Features】 ■ CPU and FPGA in one chip ■ Supports ECC, making it ideal for industrial applications ■ Can be used as a PCIe card, perfect for evaluation boards ■ SoC part on a separate board ■ Space-saving, highly reliable, and high-precision circuit board *For more details, please refer to the PDF materials or feel free to contact us.

  • Evaluation Board
  • Printed Circuit Board
  • Memory
  • substrate

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We will be exhibiting at the Kyushu Semiconductor Industry Exhibition! Printed Circuit Boards [SHOWA]

We will be exhibiting at the Kyushu Semiconductor Industry Exhibition! Printed Circuit Boards [SHOWA]

Anyway, it's fast! Leave the printed circuit boards to 【SHOWA】!

Our company is one of Japan's leading ultra-fast printed circuit board manufacturers. We possess top-level equipment and specialize in the production of high-difficulty circuit boards. With over 30 years of industry experience, we currently have business dealings with more than 2,200 companies in Japan. Of course, in addition to circuit board manufacturing, we can also accommodate customer requests for AW design and component mounting. 【Build-up Boards】⇒ We can handle narrow pitch BGA mounting, multi-layer builds, and any layer configurations. 【Heat Dissipation】⇒ We can accommodate aluminum base boards, high thermal conductivity CEM-3, and copper inlay boards. 【Thick Copper Boards】⇒ We can handle high current boards, thicker plating in through holes, and automotive boards. 【Flexible Boards】⇒ We can accommodate FPC, multi-layer FPC, rigid FPC, and transparent polyimide FPC. 【High Frequency】⇒ We have standard stock of Megtron 6 (manufactured by Panasonic) and have processing experience with many low dielectric constant materials. 【Special Processing】⇒ We can also accommodate bump formation and back drilling. ↓ Please also visit our website https://www.showanet.jp/ We look forward to hearing from you.

  • Printed Circuit Board
  • substrate

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Development Board Example: "High-Speed Optical Data Processing Board"

Development Board Example: "High-Speed Optical Data Processing Board"

Introducing examples of development boards created using advanced embedded technology!

At Toyo Electric Co., Ltd., which engages in engineering business, we handle various development boards. The "High-Speed Optical Data Processing Board" samples large amounts of data from the upper layer at high speed and converts and transmits it into optical data according to requirements. Our company supports everything from circuit design to embedded software development, providing development tailored to customer needs. 【Features】 ■ External Interface - Optical Input/Output SFP (3.125Gbps) × 3 channels - PCI Express Gen1 × 4 ■ Equipped with FPGA *For more details, please refer to the PDF materials or feel free to contact us.

  • others
  • Circuit board design and manufacturing
  • Embedded Board Computers
  • substrate

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Delivery record: Platform substrate

Delivery record: Platform substrate

Systematizing measurement and mechatronics! Introducing the delivery achievements of Applied Electric.

At Applied Electric, we specialize in non-standard small-lot production and are constantly handling and delivering a wide variety of products, numbering in the thousands. In response to customer requests, we develop and design controllers that serve as the core of inspection and control devices, using suitable CPUs and FPGAs. [Development Examples] ■ CPU: H8, SH-2, SH-2A, SH-3, SH-4, SH-4A, RX, i.MX3x, ARM, DSP ■ Communication: USB2.0, USB3.0, 1G/100/10baseT, RocketIO, MIPI ■ Bus: VME, CompactPCI, PCI, PCIExpress *For more details, please refer to the PDF materials or feel free to contact us.

  • Other measurement, recording and measuring instruments
  • Other inspection equipment and devices
  • Circuit board design and manufacturing
  • substrate

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Printed circuit board assembly fine pitch board

Printed circuit board assembly fine pitch board

We provide support for everything from the design and development of various microcontroller controllers to printed circuit board assembly and controller assembly.

We will strive for further "evolution and development" under the theme of "Creative, Evolving, Developing Enterprises."

  • Circuit board design and manufacturing
  • substrate

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[Web Seminar Now Available] Flexible Printed Circuits with Japanese Subtitles

[Web Seminar Now Available] Flexible Printed Circuits with Japanese Subtitles

How flexible printed circuit boards save space in harsh automotive and industrial environments.

We are currently offering a webinar titled "Flexible Printed Circuits (#FPC) with Japanese Subtitles." In today's continuously evolving environment, it is crucial for engineers in both the automotive and industrial sectors to incorporate more functionality into limited spaces. As the emergence of new communication protocols increases complexity, power density and signal integrity are becoming more critical design elements. Significant investments are made in custom designs, making reuse essential. In this webinar, a senior manager from Molex's FPC division will share insights based on 14 years of design expertise, exploring how flexible printed circuits (FPC) address these modern challenges. [Learning Content] ■ Space-saving techniques ■ Addressing protocol complexity ■ Strengthening design metrics ■ Promoting efficient reuse *For more details, please feel free to contact us.

  • Printed Circuit Board
  • substrate

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Foresight glass print wiring board

Foresight glass print wiring board

We will form circuit patterns of thick copper on glass using the subtractive method and semi-additive method.

It has a high transmittance and can be used for substrates of optical passive components. It has a low coefficient of thermal expansion, excellent dimensional stability, and mounting reliability. It has minimal warping, excellent flatness, and is easy to mount.

  • Touch Panel
  • substrate

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Evaluation of the "56G-PAM4 Board" implementation completed.

Evaluation of the "56G-PAM4 Board" implementation completed.

We will support the upcoming high-speed communication standards with PAM4 signal communication boards!

To Matsudo Co., Ltd. and RITA Electronics, the main FPGA board for the '56G-PAM4 communication board' created during the technical study session aimed at solving customer challenges has been completed! After completing the basic checks, we will proceed with waveform verification using this board and continue to verify the operation in combination with the evaluation boards that will be successively completed thereafter. In an increasingly high-speed communication environment, we aim to accumulate high-speed technologies leading to PCIe Gen6.0, DDR, and 400G Ethernet, and provide solutions to our customers.

  • Communications
  • Circuit board design and manufacturing
  • substrate

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Trends in the development of high-functionality, compact, and lightweight materials for automotive control devices, components, and electrical materials.

Trends in the development of high-functionality, compact, and lightweight materials for automotive control devices, components, and electrical materials.

~Technologies for ensuring high reliability, wiring, and miniaturization of inverters centered around metal substitute resin components~

★Development status of new plastic materials for electrification and weight reduction! Development of PBT resin with high reliability! ★What characteristics are required for automotive FPC (Flexible Printed Circuit)? Which components can contribute to weight reduction? ★What are the needs for thermal conductivity and material strength? Are there parts that cannot be replaced by metals? ★What technological innovations are most important for achieving miniaturization of inverters and automotive electronic products? 【Speakers】 Part 1: Representative from Japan Mectron Co., Ltd. AI Business Division, Automotive FPC Planning Department Part 2: Representative from Polyplastics Co., Ltd. Technical Solution Center Part 3: Mr. Hideo Shikano, Director of Lintec Engineering Office Part 4: Mr. Yoshihiro Kamiya, Hardware Development Department, Electrical and Electronic Technology Development Division, Denso Corporation 【Venue】 Tekuno Kawasaki, 4th Floor Conference Room [Kanagawa, Kawasaki] 【Date and Time】November 26, 2013 (Tuesday) 10:30-16:35

  • 企業：AndTech
  • 価格：10,000 yen-100,000 yen
  • Technical Seminar
  • substrate

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Various glass substrates and processing *Capable of handling everything from a single prototype to mass production.

Various glass substrates and processing *Capable of handling everything from a single prototype to mass production.

From procurement of glass materials to film processing! There are also high-performance glass cutting holes that can beautifully cut glass with protective sheets.

At DRS, we perform various glass processing operations, including cutting, beveling, polishing, printing, and AG/AR/AF processing. We handle everything from the procurement of glass materials to film formation processing, providing various manufacturers and types of glass materials. We also accept size reduction cutting processing for photomask substrates, accommodating customer requests from single prototypes to mass production. Additionally, we offer the high-performance glass cutting tool 'FINE SCRATCH', which is suitable for cutting glass for FPD applications. It achieves high-strength cutting that minimizes horizontal cracking. Stable cutting can also be performed on glass substrates with metal deposition films. 【Types of Glass Materials】 ■ Gorilla Glass ■ Dragontrail Glass ■ Soda Lime Glass ■ Non-Alkali Glass *For more details, please refer to the PDF materials or feel free to contact us.

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  • Processing Contract
  • Glass
  • Other contract services
  • substrate

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We will be exhibiting at the 2024 International Aerospace Exhibition!

We will be exhibiting at the 2024 International Aerospace Exhibition!

We will exhibit at the 2024 International Aerospace Exhibition and the 2024 New Technology Creation Exchange Meeting!

Build-up substrates, high-frequency substrates, FPC and rigid FPC substrates... All of these are manufactured in-house at our own factory, with a fully integrated production process! The ultra-short delivery times achieved by eliminating outsourcing are astonishingly fast! Since surface treatment, such as gold flash, is also handled in-house, there are no fluctuations in delivery times! Not only the delivery times but also the wide range of materials we handle is one of the attractions of Matsuwa Sangyo. Even if the material has no processing track record, we are flexible in accommodating your needs! We accept orders for any type of substrate, even in small quantities, so if you have even a slight desire to "want to make a substrate," why not start with a light consultation? - 2024 International Aerospace Exhibition ⇒ 10/16 (Wed) - 10/18 (Fri) @ Tokyo Big Sight Please be sure to stop by the Matsuwa Sangyo booth on the day!

  • Printed Circuit Board
  • substrate

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Flexible printed circuit board (FPC) short delivery time

Flexible printed circuit board (FPC) short delivery time

Impedance control of flexible substrates and UL certification can be achieved with short lead times and small lot production.

We will respond to circuit board manufacturing and component assembly in just one working day at the shortest. Additionally, we will manufacture high-performance flexible circuit boards with impedance control during artwork design. We can also accommodate small lot production. Please feel free to consult with us.

  • others
  • substrate

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Rigid-flexible substrate

Rigid-flexible substrate

The flexible parts can be multilayered, and there are also specifications for the rigid parts that are multilayered or have a build-up structure!

We would like to introduce the "Rigid Flexible Circuit Board" handled by Matsuwa Sangyo Co., Ltd. This board integrates rigid and flexible circuit boards and is also referred to as rigid flex or rigid FPC. Our product not only combines the features of rigid and flexible circuit boards but also eliminates the need for connectors in the interconnection between boards, making it effective for lightweight, compact, and three-dimensional assembly and wiring. 【Example Specifications for Flexible Circuit Board Manufacturing (Excerpt)】 ■ Base Material Thickness: 25μm, 50μm ■ Copper Foil Thickness: 18μm, 35μm ■ Copper Foil Types: Rolled Copper Foil, Special Electrolytic Copper Foil ■ Coverlay Color: Amber ■ Resist Color: Amber, Green, Black, White *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • substrate

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High heat-resistant, low-loss flexible substrate for wearables

High heat-resistant, low-loss flexible substrate for wearables

A flexible substrate that achieves both miniaturization and high performance without the use of adhesives.

As wearable devices continue to shrink in size, the enhancement of circuit board performance is essential. In particular, high-density implementation in limited space and high reliability are required. It is also important to accommodate high-temperature environments and high-frequency signals. Our high heat-resistant, low-loss all-LCP flexible circuit boards meet these challenges. 【Usage Scenarios】 - Smartwatches - VR/AR devices - Healthcare devices - Wearable sensors 【Benefits of Implementation】 - Compatibility of miniaturization and high performance - High reliability - Improvement of high-frequency characteristics

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  • Printed Circuit Board
  • substrate

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