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substrate(fpc) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
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substrate Product List

151～180 item / All 206 items

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Transparent flexible substrate

Transparent flexible substrate

Ideal for wearable devices! Applicable to medical and smartphones, etc.

We provide transparent FPC with excellent transparency in a short delivery time. We can use low-cost PET material "Polyethylene Terephthalate," and we also adopt PEN material "Polyethylene Naphthalate" for the insulation layer, enabling low-temperature reflow mounting. Additionally, we support the transparency of the resist. 【Features】 ■ Achieving short delivery times from order to delivery, possible only with our company ■ Use of low-cost PET material "Polyethylene Terephthalate" ■ Adoption of PEN material "Polyethylene Naphthalate" for the insulation layer, enabling low-temperature reflow mounting ■ Support for the transparency of the resist *For more details, please download the PDF or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Small lot order

Small lot order

We solve problems related to small lots, such as being time-consuming and having a small quantity!

- I wonder if they can handle such a small number of pieces? - The production plan and specifications keep changing a bit. - Since it's a small lot, the quantity doesn't flow, it takes time, and requires manpower. Do you have any concerns like these? Our company can accommodate orders starting from just one piece. We will take the time and effort to produce on your behalf. Please feel free to contact us when you need assistance. *For more details, please refer to the PDF document or feel free to reach out to us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • substrate

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Sanwa Electronics Circuit Co., Ltd. Business Introduction

Sanwa Electronics Circuit Co., Ltd. Business Introduction

We will take on and respond to all kinds of special substrates.

Sanwa Electronic Circuit Co., Ltd. was established in 1955 as Sanwa Electric Manufacturing Co., Ltd. and has consistently engaged in the production of printed circuit boards for over half a century. Currently, with the dramatic evolution of electronic devices, printed circuit boards are required to fulfill new roles beyond their traditional electrical functions, including thermodynamic, optical, and structural roles, necessitating different perspectives and ideas in manufacturing. To swiftly respond to these customer needs, we integrated our group companies involved in printed circuit boards in 2004, marking a new beginning as Sanwa Electronic Circuit Co., Ltd. Through this integration, we have consolidated the development, production, and sales capabilities cultivated over many years by our group companies, establishing a system that can comprehensively meet QCD (Quality, Cost, Delivery) requirements while maintaining and developing a production system that leverages the unique characteristics of each factory. This has allowed us to build a flexible production system capable of accommodating a wide range of product specifications and lot sizes, from small to large. Moving forward, we will focus on strengthening our proposal-based sales capabilities and enhancing the development, production technology, and production management necessary to realize this. For more details, please contact us or download our catalog.

  • Printed Circuit Board
  • substrate

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Low-loss flexible substrate

Low-loss flexible substrate

Combining PTFE base and low dielectric coverlay to produce various low-loss FPCs!

Our company manufactures low-loss flexible substrates (GHz band, Microstrip Line). We would like to introduce a flexible substrate that significantly improves transmission loss compared to the combination of polyimide-based and standard coverlay products. Using a PTFE base with a low-dielectric coverlay, we can expect a 60-70% improvement in transmission loss at the 40GHz band compared to standard products. Additionally, while the performance is slightly lower compared to PTFE-based substrates, a combination of LCP base and LCP coverlay can also expect about a 50% improvement in transmission loss and is suitable for long-term heat resistance and low outgassing applications due to the absence of adhesives. *For more details, please refer to the PDF materials or feel free to contact us. *Abbreviation explanations: PTFE ... Fluoropolymer LCP ... Liquid Crystal Polymer

  • Wiring materials
  • substrate

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It's also okay to use it twisted! "Flexible substrate compatible with high-speed transmission connectors."

It's also okay to use it twisted! "Flexible substrate compatible with high-speed transmission connectors."

Supports high-speed transmission up to 15GHz! We have combined the high-speed transmission connectors from Irisoh Electronics with our flexible substrates.

The "Flexible substrate compatible with high-speed transmission connectors" combines the high-speed transmission connectors from Irisoh Electronics, [IMSA-11600S-30Y900 and IMSA-11501S-30Y900], with our YFC series (LVDS type microstrip line) RFM. By integrating them, it supports high-speed transmission up to 15GHz. 【Features】 ■ The LVDS-compatible FPC has been slotted. ■ It is easy to bend and can also be twisted for use. *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials
  • substrate

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The world's only orthogonal soldering dedicated robot, L-CAT EVO-2.

The world's only orthogonal soldering dedicated robot, L-CAT EVO-2.

Soldering dedicated orthogonal robot

It is a best-selling soldering robot developed specifically for soldering, boasting a delivery record of over 500 units worldwide in the 10 years since its release.

  • Soldering Equipment
  • Circuit board processing machine
  • substrate

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Long-length multi-layer flexible substrate [Substrate manufacturing achievements]

Long-length multi-layer flexible substrate [Substrate manufacturing achievements]

4-layer flexible printed circuit board (FPC) using LCP materials! Introducing our manufacturing achievements for a product size of 1300mm.

We would like to introduce our achievements in circuit board manufacturing. We produced an ultra-long multilayer LCP board with a product size of 1300mm. The features include pattern exposure, drilling, lamination, copper plating, coverlay thermal pressing, and gold plating, all compatible with the 1300mm size. This is a 4-layer flexible board made from LCP material, outputting a 175μ exposure film in the standard size of 1350×250mm. 【Basic Specifications】 ■ Material: LCP/0.1t×3 4-layer Cu outer layer 9/9 (plating 35)μ - inner layer 9/9μ ■ Process: Lamination, drilling, copper plating, etching, coverlay 25/35μ both, electroless Ni2-AuF (0.03)μ, manual processing of outer shape ■ Board size: 1300×59 ■ Others: Minimum L/S=140/130μ Flying checker not available *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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Printed circuit board

Printed circuit board

Reliable, high processing capability, unique processing technology. We continue to challenge new manufacturing technologies.

We handle various prototypes, manufacturing, and mass production of printed circuit boards. With reliable and high-capacity processing, and unique processing technologies, we specialize in flexible circuit boards, acrylic and copper plates, router processing, laser processing, press processing, V-cut processing, and various other services. We strive for reliable and fast processing, so please feel free to contact us for inquiries and quotes, especially if you are in a hurry. 【Business Contents】 ■ Prototyping and manufacturing of flexible circuit boards ■ Processing of special materials such as acrylic and copper plates ■ Creation of molds specifically for aluminum substrates ■ Support for various plating on printed circuit boards ■ Production of dip jigs for soldering, etc. *For more details, please download the PDF or feel free to contact us.

  • Processing Contract
  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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4-layer blind via flexible circuit board

4-layer blind via flexible circuit board

Space-saving is possible! Suitable for high-resolution imaging diagnostic devices that require miniaturization.

The "4-layer blind via filled blind via flexible printed circuit board" is a multilayer FPC that enables high-density wiring while achieving miniaturization, lightweight, and thinness. It applies filled plating to blind vias, allowing for the creation of pads for component mounting on the vias. It possesses bending performance that rigid boards do not have. It is suitable for high-resolution imaging diagnostic devices, including endoscopes and catheters, where miniaturization is required. 【Features】 ■ Blind vias can be filled with plating on a 4-layer flexible board ■ Space-saving is possible as components can be mounted on top of the vias ■ It can be made lighter compared to rigid boards *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials
  • substrate

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Achieved without adhesive! Long-term high-temperature durable flexible substrate.

Achieved without adhesive! Long-term high-temperature durable flexible substrate.

Passed long-term heat resistance test at 200℃ for 1000 hours! High-temperature durable flexible substrate with insulation characteristics exceeding JIS standards.

The "Long-term High-Temperature Durable Flexible Circuit Board" is an FPC that achieves long-term heat resistance without the use of epoxy-based adhesives, making it suitable for harsh conditions in high-temperature environments. Even after undergoing our unique long-term high-temperature test conditions of 200°C for 1000 hours, the insulation resistance, continuity resistance change rate, and dielectric strength meet the JIS passing standards. 【Main Features】 1. Achieves high-temperature durability with a structure that does not use epoxy-based adhesives. 2. Heat resistance suitable for long-term use in high-temperature environments. 3. Insulation properties are maintained even after the long-term high-temperature test of 200°C for 1000 hours. For more details, please refer to the PDF document or feel free to contact us.

  • Wiring materials
  • substrate

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Flexible circuit board / Rigid-flexible circuit board

Flexible circuit board / Rigid-flexible circuit board

Turnkey connector implemented! A thin polymer resin film is used as insulation.

"Flexible substrates / Rigid-flexible substrates" are alternatives to conventional wiring connections using wires or ribbon cables. Flexible printed circuits can reduce space and weight while improving reliability. They are made by etching copper-clad materials and using a thin polymer resin film as insulation between the conductor circuit patterns. In electronic device enclosures, turnkey subassemblies may be utilized, incorporating aerospace-grade connectors at the ends for space-saving and lightweight assembly. 【Features】 ■ Single-sided and double-sided flexible substrates ■ Multi-layer and rigid-flexible substrates ■ Electrical and optical flexible substrates ■ Specialized for IPC 6012/6013 Class 3, Types 1 to 4 *For more details, please refer to the PDF materials or feel free to contact us.

  • Board to Board Connectors
  • Printed Circuit Board
  • substrate

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Ultra-fine circuit high-frequency flexible substrate

Ultra-fine circuit high-frequency flexible substrate

Combining PTFE base and low dielectric coverlay to produce various low-loss FPCs!

The "Ultra-Fine Circuit High-Frequency Flexible Substrate" is a flexible substrate designed for high-frequency applications in the GHz range, compatible with bare chip mounting. By using LCP (Liquid Crystal Polymer) with low dielectric properties as the core material and forming circuits using the SAP (Semi-Additive Process), it is possible to create transmission lines with a differential impedance of 100Ω at wiring pitches below 50μm. To accommodate wire bonding with bare chips, the mounting pads are treated with ENEPIG (Electroless Ni Pd Au plating) for surface treatment. One of the features of SAP is its high precision in circuit formation, with an accuracy of ±5μm, making it suitable for impedance control. *For more details, please download the PDF or contact us.*

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  • Wiring materials
  • substrate

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Foresight Inc. Company Profile

Foresight Inc. Company Profile

We aim to be a trading company focused on realizing customer solutions as our top priority, through development and proposals.

Foresight Co., Ltd. is not just a traditional trading company that sells mere "products" in the flat panel display industry, but aims to be a development and proposal-oriented trading company that prioritizes realizing customer solutions. In the industrial sector, we are forced to undergo structural reforms, and waves of technological innovation are continuously emerging, demanding rapid changes and developments. In this environment, we will leverage the information network we have cultivated over many years to pursue speedy and dynamic business development. 【Sales Items】 ■ Touch panel related components ■ LCD related components ■ OLED related components ■ Equipment related ■ Lamination process related ■ New development *For more details, please refer to the PDF materials or feel free to contact us.

  • Touch Panel
  • LCD display
  • Processing Contract
  • substrate

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OKI-EMS provides comprehensive manufacturing services in the high-end sector.

OKI-EMS provides comprehensive manufacturing services in the high-end sector.

From design and development to manufacturing, evaluation, and certification, we support our customers' challenges with OKI-EMS's "Comprehensive Manufacturing Services."

We provide design and production contract services in high-end fields such as medical devices, aerospace, information and communication, industry, and measurement under the name 'Advanced M&EMS'. We will be exhibiting at the "22nd Printed Circuit Board EXPO" held from January 20 (Wednesday) to 22 (Friday), 2021! 【Overview of the "22nd Printed Circuit Board EXPO"】 Date: January 20 (Wednesday) to 22 (Friday), 2021 Venue: Tokyo Big Sight, West Hall 3 (4th floor of the West Exhibition Building), Booth No. W22-38 * A virtual (online) booth will also be prepared. We will showcase many examples of our technology and applications that contribute to solving manufacturing challenges. Please feel free to visit our booth.

  • EMS
  • substrate

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Surprisingly Unknown! What Are Printed Circuit Boards? <Basic Knowledge>

Surprisingly Unknown! What Are Printed Circuit Boards? <Basic Knowledge>

Used in very familiar items in everyday life! Its main role is to connect electronic components with a path for electricity to flow!

A "printed circuit board" is an electronic component used in everyday items around us. Its main role is to attach electronic components such as resistors, ICs, and capacitors onto a non-conductive material through methods like soldering, connecting the components with conductive paths. By transmitting electricity through the electronic circuits of this product, it enables the convenient use of electrical devices in our surroundings. 【Types of Printed Circuit Boards】 ■ Rigid Board (PWB) = Hard, flat board ■ Flexible Board (FPC) = Bendable ■ Rigid-Flex Board = Rigid board + Flexible board ■ Metal Base Board = Board that enhances heat dissipation *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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High Current Compatible Flexible Circuit Board BigElec

High Current Compatible Flexible Circuit Board BigElec

Suitable for incorporation into curved and narrow spaces. It can form high current circuits with a thin shape and low inductance.

Big Elec is a flexible printed circuit board designed for high current wiring, achieving a flat shape and thin profile as an alternative to busbars and wire harnesses. It boasts three remarkable features. 【Feature 1】 Low Inductance Thanks to its unique structure, it achieves lower inductance compared to conventional wires with the same conductor cross-sectional area. When switching high currents at high frequencies, high inductance can cause significant voltage spikes, potentially damaging high current-compatible electronic components. The low inductance of Big Elec reduces voltage spikes, contributing to the reliability of high current-compatible electronic components. 【Feature 2】 Flat Shape and Flexibility Its unique structure allows for a thin conductor, flat shape, and flexibility. It is flatter than traditional wire harnesses and can handle higher currents than conventional flexible printed circuit boards. 【Feature 3】 High Design Freedom It ensures design freedom and usability similar to printed circuit boards. Pattern wiring and external shapes can be customized according to requirements. It also supports the mounting of electronic components and connectors using paste solder.

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  • Harness
  • substrate

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High-end EMS "Advanced M&EMS" *Exhibited at Nepcon

High-end EMS "Advanced M&EMS" *Exhibited at Nepcon

Presentation of Case Studies for Problem Solving: One-stop support from design to maintenance! We respond to various needs such as entering new markets and multilayering of circuit boards.

Our company offers a design and production outsourcing service called 'Advanced M&EMS' for information and communication equipment, medical devices, industrial equipment, and measuring instruments. We can support everything from design to procurement, implementation, prototyping, equipment assembly, and maintenance. We can meet various needs, including entry into the medical device market, small-batch production of diverse products, and miniaturization of multilayer ceramic capacitors. ★ We will be exhibiting at the "36th NEPCON Japan" held from January 19, 2022! 【Overview of the "36th NEPCON Japan"】 Dates: January 19 (Wednesday) to 21 (Friday), 2022 Venue: Tokyo Big Sight Booth Number: East Hall 1, 9-22 We will showcase many examples of our technology and applications that contribute to solving manufacturing challenges. Please feel free to visit our booth. *We are currently offering a collection of case studies on problem-solving. For more details, please check the "PDF Download."

  • others
  • substrate

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Appearance Inspection Table "Built-in Transmitted Light Illumination" PE Porous Chuck

Appearance Inspection Table "Built-in Transmitted Light Illumination" PE Porous Chuck

A porous chuck that can softly hold large workpieces of 500×500mm! Compatible with transparent light AOI (Automatic Optical Inspection)!

The "Embedded Type Transparent Light Illumination PE Porous Chuck" uses soft polyethylene porous material to gently chuck FPCs, wafers, LF, glass substrates, etc., and performs AOI with embedded transparent light illumination. 【Features】 ■ Uses translucent ultra-high molecular weight polyethylene for the porous material ■ Reduces introduction costs and equipment weight compared to ceramic and metal materials ■ When clogging occurs in the porous material, it can be replaced at a low cost ■ When using porous material with an average air pore diameter of less than 5μm, partial adsorption is possible *For more details, please download the PDF materials from <Download Catalog>.

  • Other lighting equipment
  • substrate

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Substrates, etc. Brain Power [Authorized Dealer]

Substrates, etc. Brain Power [Authorized Dealer]

From memory modules to 5G optical transceivers and rigid-flex. PCB technology that excels in high density and high reliability.

Brain Power (Qing Yuan) Co., Ltd. is a PCB specialized manufacturer and a JEDEC member headquartered in Guangdong, China, with a large-scale factory. The company handles double-sided, multilayer, HDI, FPC, rigid-flex, high-frequency, and optical module compatible boards, with a maximum monthly production capacity of 120,000 square meters and an average of 1,200 employees, developing high-density and high-performance products for the global market. Major customers include memory module, SSD, automotive equipment, and communication equipment manufacturers.

  • Printed Circuit Board
  • substrate

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Can you find hints for improving manufacturing with special substrates? [Materials available for distribution]

Can you find hints for improving manufacturing with special substrates? [Materials available for distribution]

In fact, Sanwa's special substrates are used in such places. We support the resolution of various challenges such as implementation defects, costs, and man-hours with substrate technology.

Our company is a specialized manufacturer of printed circuit boards, actively challenging complex processing and difficult requests, with a wealth of experience and trust. We cater to a wide range of needs, from general circuit boards to special boards aimed at solving challenges related to assembly and product commercialization. Your development concerns, on-site work improvements, and issues related to enhancing product value may be resolved with our printed circuit boards. 【Are you facing any of these issues?】 ■ I want to make the product smaller. ■ I want to use a cavity structure to reduce the height of the product. ■ I am looking for alternatives to FPC. ■ I want to bend FR-4 or aluminum boards for use inside equipment. ■ I want to eliminate copper burrs on side electrodes. ■ I want to eliminate glass cloth or resin debris from the edge of the board. ■ I want to suppress heat generation from components using the board. ■ I want to use boards that are cost-effective and suitable for high-frequency applications. We will work together to address your challenges, supporting your product development with a consistent system from the design stage to prototyping and mass production. No matter how trivial the matter may seem, please feel free to contact us with your ideas or concerns!

  • Printed Circuit Board
  • substrate

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Long-sized printed circuit board ☆ up to 1500mm ☆

Long-sized printed circuit board ☆ up to 1500mm ☆

Leave everything related to printed circuit boards to us! We can handle everything from single-sided to build-up, aluminum core, and rigid-flex, even in small quantities.

Our company provides electronic devices, including printed circuit boards, based on our unique value chain and network with "high quality," "low price," and "short delivery time." ---------------------------- ◆ Quality <Q> We ensure reliable quality by having a QA organization centered around Japanese personnel that works closely with the factory. We can accommodate from AW design, enabling designs that consider manufacturing. ◆ Price <C> Depending on the type and quantity of the circuit boards, we can procure them at prices 30% to over 50% lower than domestic products. ◆ Delivery <D> We have a dedicated organization for delivery management, minimizing delivery issues through detailed management. ---------------------------- Our feature is that we can provide "Chinese-produced products at low prices with Japanese quality." We can flexibly utilize short delivery domestic manufacturing and low-cost overseas manufacturing, accommodating a wide range from single-sided boards to build-up mass production. We have our own factory in China, and we are also equipped to produce special-shaped boards, such as long boards over 1 meter and thin boards of 0.2 mm. *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • substrate

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All LCP Flexible Printed Circuit Board (FPC)

All LCP Flexible Printed Circuit Board (FPC)

Next-generation flexible substrate with high heat resistance, low loss, and chemical resistance, all made of LCP!

All LCP is a high-performance flexible printed circuit board (FPC) made entirely of liquid crystal polymer (LCP) without the use of adhesives. Compared to conventional polyimide FPCs, it features high heat resistance, low moisture absorption, low loss characteristics, chemical resistance, and low outgassing properties, providing stable performance even in harsh environments. It is particularly suitable for applications that require reduced transmission loss of high-frequency signals and improved durability in environments where oils and chemicals are used.

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  • Printed Circuit Board
  • substrate

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Printed circuit boards (wiring boards) for space and defense equipment.

Printed circuit boards (wiring boards) for space and defense equipment.

We supply printed circuit boards for space and defense applications. The printed circuit boards that withstand harsh operating environments are a testament to the high reliability of our products.

OKI Circuit Technology Co., Ltd. is a manufacturer of printed circuit boards that primarily engages in the development, design, and manufacturing of printed wiring boards, electronic devices, and electronic components, and is part of the OKI Group (OKI Electric Industry Co., Ltd.). The company has obtained certification from the Ministry of Defense and the Japan Aerospace Exploration Agency (JAXA), achieving high quality and high reliability in printed circuit boards that can cater to the aerospace industry, earning a high reputation within the industry. Among the products created with our technology, the "flex-rigid board," which combines flexible printed circuits (FPC) with standard rigid boards, eliminates the need for connector space for connecting cables, achieving space-saving and lightweight designs. Furthermore, it provides high reliability by eliminating concerns about connector connections due to vibrations, contributing to the development of the aerospace industry. Please feel free to consult with us. Our article has been published in MONOist. [Reducing a cumulative 480 hours over three years: How we advanced smart manufacturing in a low-volume, high-mix factory] https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html

  • Printed Circuit Board
  • substrate

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3D circuit board (MID wiring) / substrate with embedded electronic components

3D circuit board (MID wiring) / substrate with embedded electronic components

3D circuit board [MID wiring (Molded Interconnect Device)] / substrate with embedded electronic components

Our company provides contract design and development of electronic devices (ODM) as well as contract manufacturing services for electronic devices (EMS). We are involved not only in the design and manufacturing of flexible printed circuits but also in circuit design, structural design, software development, cable and harness production, and we collaborate with product development personnel from the planning stage to bring products to market. Various industries are advancing in miniaturization and weight reduction. To differentiate ourselves from competitors while considering mass production efficiency, we propose a wide range of solutions, not limited to flexible printed circuits, including 3D-MID wiring cases with conductor formation on resin housing surfaces and embedded substrates that incorporate electronic components into printed circuit boards. Etching, plating, vacuum deposition, EB deposition, sputtering, thin film formation, photolithography, ion plating, thermal CVD, plasma CVD, dry etching, film ITO, film metal patterning, fine patterns, WLP, silicon wafers, RDL, bump formation, TEG, dry etching, wet etching, MEMS, organic EL, metallization, glass etching, semi-additive etching, transparent resist, transparency, high heat-resistant resin.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • EMS
  • substrate

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Micro Module Technology Corporation - Business Overview

Micro Module Technology Corporation - Business Overview

One-stop support for miniaturization and modularization of circuit boards using bare chip mounting, from concept to mass production!

We specialize in micro-joining technologies centered on bare chip mounting and inter-board bonding, providing support services that enable miniaturization, thinning, and high-function modularization of circuit boards. We offer one-stop support from concept planning through design, prototyping, evaluation, analysis, and small-to-medium scale production. Utilizing our in-house cleanroom facilities (Class 100–1000), customers can proceed with confidence even without in-house expertise or equipment. 【Benefits of Bare Chip Mounting】 ■Added Value ・Miniaturization and thinning expand product applications and contribute to the creation of new markets. ・Integrating semiconductor back-end processes enhances manufacturing value. ■Improved Cost Competitiveness ・Miniaturization and shared design improve production efficiency and help reduce material costs. ・Compared with SoC-based approaches, development costs can be significantly reduced in some cases. 　Effects vary depending on development conditions and specifications. ■Performance Improvement ・Eliminating secondary wiring shortens interconnections and improves electrical performance. ・Reduced wiring loss contributes to higher-speed operation and improved high-frequency characteristics. ■Environmental Considerations ・Reducing the number of materials used helps decrease waste and environmental impact.

  • Circuit board design and manufacturing
  • substrate

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We can accommodate custom-made and custom products starting from just one piece to meet your company's needs.

We can accommodate custom-made and custom products starting from just one piece to meet your company's needs.

If the standard product doesn't fit, if you would like a different shape, or if there are some processes that cannot be done, please feel free to consult with us! *Q&A materials will be provided.

If you have requests for custom or special products tailored to your company's challenges, please feel free to consult with us. Even in the conceptual stage, you can specify items that resemble hand-drawn sketches or sample products featured on our website. We will ask for necessary information, such as the intended use and the environment in which you want to use the product, and gradually determine the specifications while consulting with you. Even if you are unsure about technical aspects, we will support you in the product manufacturing process. 【Are you facing any of these issues?】 "I just can't make it work with standard products." "I want the shape to be more like this." "There are some processes that can't be done." "I want to reduce costs during the design phase with an eye on mass production," etc. 【Examples of production】 ■ Increased thickness of polyimide material ■ Delivery of 6mm PCB material ■ Large hole drilling processing of 750×500 ■ Thermal press processing of test materials Additionally, if you have requests for materials, we can source them, and we can also look for manufacturer-specified material specifications, inks, or materials that meet your needs, so please consult with us once. *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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With our extensive experience and production technology, we provide timely FPCs that satisfy everyone at any stage of development cooperation, prototyping, and mass production.

Single-sided FPC, double-sided FPC, multi-layer FPC, low-rebound FPC, used in various applications such as space and aerospace equipment, medical devices, industrial equipment and robots, car electronics, mobile devices and computer-related equipment, cameras and movie equipment, and electronic components.

  • Board to FPC connector
  • substrate

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[Research Material] Global Market for FPC (Flexible Printed Circuit Boards)

[Research Material] Global Market for FPC (Flexible Printed Circuit Boards)

World Market for FPC (Flexible Printed Circuit Boards): Single-sided Circuits, Double-sided Circuits, Multi-layer Circuits, Rigid-flex Circuits, Medical, Aerospace & ...

This research report (Global FPC Market) investigates and analyzes the current state of the global market for FPC (Flexible Printed Circuit Boards) and its outlook for the next five years. It includes information on the overview of the global FPC market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments of the FPC market by type include single-sided circuits, double-sided circuits, multilayer circuits, and rigid-flex circuits, while the segments by application cover medical, aerospace & defense/military, consumer electronics, automotive, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of FPC (Flexible Printed Circuit Boards). It also includes the market share of major companies in the FPC (Flexible Printed Circuit Boards) sector, product and business overviews, and sales performance.

  • Other services
  • substrate

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Flexible printed circuit board (FPC) [Solving the issues in the prototype development of flexible printed circuit boards!]

Flexible printed circuit board (FPC) [Solving the issues in the prototype development of flexible printed circuit boards!]

Solving the issues of prototype development for flexible PCBs with many limitations! We manufacture high-performance flexible PCBs!

We can respond to circuit board manufacturing and component mounting in as little as one working day each. Additionally, we manufacture high-performance flexible circuit boards with impedance control during artwork design. We also accommodate small lot production. 【We can also support the following specifications】 ■ Component mounting FPC (double-sided mounting, lead-free mounting, mounter/reflow, bare chip mounting) ■ Bonding processing with other boards using ACF (FPC + FPC, FPC + PBC, FPC + glass substrate, etc.) ■ Multi-layer FPC (supports 3 to 6 layers; double-sided mounting is also possible) ■ Fine pitch FPC (single-sided board... minimum L/S 12/30μm; double-sided board... minimum L/S 25/50μm) *For details, please request materials or view the PDF data from the download.

  • others
  • substrate

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