Rigid Flexible Circuit Board (Rigid FPC)
Rigid substrates and flexible printed circuit boards are integrated.
It is an FPC that combines a rigid substrate and a flexible printed circuit board.
- Company:スコットデザインシステム
- Price:Other
Last Updated: Aggregation Period:Jul 16, 2025~Aug 12, 2025
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16~30 item / All 96 items
Rigid substrates and flexible printed circuit boards are integrated.
It is an FPC that combines a rigid substrate and a flexible printed circuit board.
The copper foil itself is the base without polyimide.
The copper foil itself is the base material of the FPC.
Double-sided type that allows for complex wiring.
This is an FPC with conductor patterns on both sides, allowing for complex wiring.
High through-hole connectivity
This is an FPC that uses polyimide in all layers with a configuration of three or more layers. It can be manufactured up to 10 layers.
We manufacture, sell, and support medical devices for basic research. FPC
- Research and development in the field of biomedical engineering - Design and manufacturing of customized products for research - Design and manufacturing of wearable sensor components for clothing (monopolar electrodes/ECoG electrodes/EEG electrodes) - Formation of various metal thin film circuits - Parylene coating We design and manufacture sensors and electrodes necessary for physiological experiments on experimental animals, such as ECoG electrodes (for research use). We develop medical devices required in clinical research core hospitals and laboratories. FPC
We propose an extremely thin and highly flexible FPC.
It excels in various characteristics such as thinness, lightness, flexibility, resistance to bending, and resistance to breaking. Due to its excellent properties, it is used in movable parts such as sliding and twisting.
Achieving fine pattern processing that was not possible with conventional FPC boards!
【Features】 1. Fine patterning with a pitch of 30μm (L&S = 15/15μm) is possible. 2. Depending on specifications, connection bumps can be formed on the pattern or the backside. 3. By combining laser processing and plating technology, through-hole conduction treatment on both sides is possible.
Achieving a 40% reduction in thickness! Introducing a flexible, low-rebound, and excellent multilayer flexible substrate.
The "Ultra-thin Flexible Multi-layer FPC" is a multi-layer flexible substrate that achieves a thinner profile while maintaining the same wiring density as standard multi-layer FPCs. It enables bending wiring in narrow spaces, which was previously difficult, contributing to the ongoing lightweight and compact development of digital electronic devices. It can be applied to wearable devices used in various fields, including mobile devices, medical and nursing care, robotics, sports, and healthcare. 【Features】 ■ Achieves a 40% reduction in thickness ■ Uses polyimide as the substrate, ensuring sufficient reliability while being thin ■ Excellent embedability due to its thin, flexible, and low-rebound characteristics *For more details, please refer to the PDF document or feel free to contact us.
Achieving a length of 100m! Introducing a flexible circuit board that can handle long-distance wiring.
The "Long-Length FPC" is a flexible printed circuit board (FPC) that can accommodate lengths of up to 100 meters without seams or folds. In addition to being thin, light, soft, and able to take on various shapes, it achieves wiring lengths comparable to traditional cables. It can be used in large FA equipment and large lighting devices, and is also adopted for wiring in space development equipment such as satellites. 【Features】 ■ Can be used as an alternative to cables ■ Weighs about 1/100th compared to cables, making it lightweight ■ Thickness is approximately 0.1mm at most, allowing for installation in minimal spaces ■ Reduces the likelihood of miswiring compared to cables, improving work efficiency during assembly *For more details, please refer to the PDF document or feel free to contact us.
It is a flexible substrate that allows for a highly reliable connection.
By partially removing the base film, it is possible to form a conductor. By narrowing the pattern width, reliable connections to the opposing circuit or device can be achieved, similar to wire bonding. It is used in areas that require high density and high reliability, such as probes.
From precision component micro-assembly to assembly wiring and electrical testing, leave it all to us!
- SMD mounting, POP mounting - Bare chip mounting (wire bonding, flip chip mounting) - Device resin encapsulation - Cable and housing assembly - Component replacement, modification - Electrical inspection, operational verification
Let's expand the application of products using "Si FPC" in fields that require excellent flexibility and weather resistance, such as IoT, medical devices, smart textiles, and industrial sectors.
FPC has six main features: 1) High-elasticity silver paste that can be printed with silicone 2) Flexible and foldable 3) Excellent weather resistance 4) Excellent electrical insulation 5) High chemical resistance 6) Biocompatibility Additionally, it has passed ROHS, ISO9000, and IECQ080000 certifications.