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Analysis software Product List and Ranking from 296 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.

Analysis software Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. GEベルノバ・ソフトウェア・ジャパン Tokyo//software
  2. インフォコム サイエンスグループ Tokyo//software
  3. ウェーブフロント 本社 Kanagawa//software
  4. 4 日本イーエスアイ Tokyo//software
  5. 5 ミューテック Tokyo//software
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Analysis software Product ranking

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. Multivariate analysis software 'Proficy CSense 2024' GEベルノバ・ソフトウェア・ジャパン
  2. Multivariate analysis software "SIMCA" インフォコム サイエンスグループ
  3. Lighting and optical analysis software "Lighting Simulator CAD" Camerium
  4. 4 NMR metabolome analysis software "cNx SUITE" インフォコム サイエンスグループ
  5. 5 Welding analysis software SYSWELD/VisualAssembly 日本イーエスアイ

Analysis software Product List

61～90 item / All 1310 items

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2D analysis software "DIC Replay"

2D analysis software "DIC Replay"

Streamlined for the materials testing industry! 2D DIC software package equipped with all the necessary components.

"DIC Replay" is analysis software that uses 2D digital image correlation methods. It has been streamlined for the materials testing industry, featuring a clean, simple, and user-friendly interface. It includes a function to synchronize collected test data (such as load data and position data) with DIC images. This product can be easily used by skilled professionals involved in materials testing. 【Features】 ■ Full-field analysis of strain and displacement ■ Simple display options ■ Virtual gauge ■ Saving of test methods ■ Integration with materials testing software ■ Flexible user licensing *For more details, please refer to the PDF document or feel free to contact us.

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  • Other embedded systems (software and hardware)
  • Image analysis software
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[Example] Detecting defects in forged products due to ductile fracture using a "load sensor."

[Example] Detecting defects in forged products due to ductile fracture using a "load sensor."

This is an example of detecting a ductile fracture defect, which is one of the typical issues in cold forged products.

One of the purposes of utilizing sensors in production sites is "defect detection." By using sensors, it becomes possible to visualize the state of forged products and machine movements during the molding process, allowing for the detection of abnormalities such as internal damage and small defects in products that are difficult to confirm using general methods like visual inspection. Furthermore, by implementing appropriate control of the manufacturing line in response to these abnormalities, improvements in productivity and quality management can also be expected. Here, we will introduce a case of detecting ductile fracture defects, which is one of the typical issues in cold forged products. *For more details about the case, please refer to the related link. Feel free to contact us for more information.*

  • Other measurement, recording and measuring instruments
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[Technical Document] Current Status of CAE Prediction Technology for Processing Limits in Bulk Molding

[Technical Document] Current Status of CAE Prediction Technology for Processing Limits in Bulk Molding

Technical support through numerical simulation is essential! We will introduce examples of its application to actual forging.

This document provides an overview of the numerical simulation techniques used in forging process design and examples of their applications. In advancing the design and development of processes utilizing multi-motion to achieve a variety of processing variations, technical support through numerical simulation is essential. It includes application examples related to actual forging, such as deep hole machining of shaft components and closed forging of hollow components with flanges. We encourage you to read it. [Contents] ■ Introduction ■ Prediction methods for cracking using numerical simulation ■ Application examples in actual forging ■ Conclusion ■ References *For more details, please refer to the PDF document or feel free to contact us.

  • Technical and Reference Books
  • Analysis software

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Die casting design and analysis software 'CAST-DESIGNER'

Die casting design and analysis software 'CAST-DESIGNER'

Rapid gate system design and CAE analysis with a single software.

"CAST-DESIGNER" is software equipped with both gate system design CAD functions and analysis functions. It enables the adjustment of appropriate gate systems and processing conditions in a short time. Additionally, it includes the analysis software "GEO-DESIGNER," which allows for rapid initial stage analysis, enabling design concepts that avoid defect risks at an earlier stage than gate design.

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[Example] Model creation and structural analysis in bioengineering.

[Example] Model creation and structural analysis in bioengineering.

"VOXELCON" is a structural analysis software that directly models STL data from CT and CAD for analysis and measurement purposes.

In the field of bioengineering, there is no design data available, so it is necessary to measure the actual object and create an analysis model. By using image-based analysis supported by VOXELCON, modeling can be performed from CT scan images of the actual object, allowing for faithful modeling that eliminates human error and significantly reduces the effort required for modeling. *For more details, please refer to the related links or feel free to contact us.

  • Structural Analysis
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  • Contract Analysis
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[Case Study] Stress Analysis of a Crankshaft through Reverse Engineering

[Case Study] Stress Analysis of a Crankshaft through Reverse Engineering

"VOXELCON" is a structural analysis software that directly models STL data from CT and CAD for analysis and measurement purposes.

Model Creation and Structural Analysis from CT Images We will introduce an example of reverse engineering that measures the shape of a product (physical object) and uses it for direct analysis. Generally, creating a model for analysis from X-ray CT scan images requires a very labor-intensive process of generating a CAD model from the extracted surface. However, at VOXELCON, we can directly create a surface model from the image data of an X-ray CT scanner and apply boundary conditions directly on the surface model, allowing for voxel analysis without additional steps. This significantly reduces the labor involved in reverse engineering. Here, we will present an example of creating a model from artificially generated tomographic images, simulating the tomographic images from an X-ray CT scanner, and performing static stress analysis. *For more details, please refer to the related links or feel free to contact us.*

  • Structural Analysis
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  • Contract Analysis
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[Case Study] Evaluation of Macro Physical Properties Using Actual Data

[Case Study] Evaluation of Macro Physical Properties Using Actual Data

"VOXELCON" is a structural analysis software that directly models STL data from CT and CAD for analysis and measurement purposes.

In materials design, investigating the macroscopic mechanical properties of porous materials such as ceramics and foamed metals, as well as composite materials represented by FRP, is very important. When actual samples are available, it is generally possible to measure them through experiments; however, depending on the properties of the materials and the condition of the samples, experiments may not always be easy. Here, we will introduce an example of calculating the macroscopic physical properties of a sample by analyzing the tomographic images obtained from scanning an actual sample with a micro X-ray CT scanner, using VOXELCON's image-based modeling and homogenization analysis functions. Note: The physical property values of the original materials that make up the porous materials and composite materials are assumed to be obtained in advance. *For more details, please refer to the related links or feel free to contact us.

  • Structural Analysis
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  • Contract Analysis
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[Example] Analysis of Warping in Electronic Circuit Boards

[Example] Analysis of Warping in Electronic Circuit Boards

"VOXELCON" is a structural analysis software that directly models STL data from CT and CAD for analysis and measurement purposes.

At VOXELCON, we perform thermal stress analysis using the temperature distribution from steady-state heat conduction analysis as a thermal load, allowing for easy weakly coupled analysis of steady-state heat conduction and thermal stress. Here, we will introduce an example of warping analysis of an electronic substrate using a simple model. *For more details, please refer to the related links or feel free to contact us.*

  • Structural Analysis
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  • Contract Analysis
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[Example] Calculation of Equivalent Stiffness of Sandwich Structure Panels

[Example] Calculation of Equivalent Stiffness of Sandwich Structure Panels

"VOXELCON" is a structural analysis software that directly models STL data from CT and CAD for analysis and measurement purposes.

The sandwich structure, which consists of a core material sandwiched between surface panels to create a unified structure, is widely used in various fields as it offers a lightweight design with high bending stiffness. However, in cases where the core is not made of a single material but is composed of multiple materials, the equivalent properties of the sandwich structure cannot be determined using simple laminate theory. In this example, we will demonstrate how to calculate the equivalent property values of a core made of composite materials using VOXELCON's homogenization analysis function, and perform bending analysis of the sandwich structure using a simplified model based on the obtained material property values. *For more details, please refer to the related links or feel free to contact us.*

  • Structural Analysis
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[Example] Equivalent permeability coefficient and micro flow velocity distribution of porous media

[Example] Equivalent permeability coefficient and micro flow velocity distribution of porous media

"VOXELCON" is a structural analysis software that directly models STL data from CT and CAD for analysis and measurement purposes.

With the increasing use of composite materials and porous materials, the importance of evaluating the properties of their microstructures is growing. In this example, we will introduce the calculation of the equivalent permeability coefficient and micro velocity distribution of a porous body as an example of evaluating the flow characteristics of microstructures using the homogenization method of VOXELCON. *For more details, please refer to the related links or feel free to contact us.*

  • Structural Analysis
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[Example] Topology optimization of large-scale models

[Example] Topology optimization of large-scale models

"VOXELCON" is a structural analysis software that directly models STL data from CT and CAD for analysis and measurement purposes.

VOXELCON is equipped with topology optimization using the level set method. In this topology optimization, a target volume is set, and a shape is sought that maximizes stiffness (minimizes displacement at load points) under that volume constraint. Since structural optimization involves repeated structural analysis, the computation time can be very long. Additionally, the structural analysis specialized for voxels is characterized by good parallelization efficiency and low memory consumption, allowing for analysis of large-scale problems in a realistic time frame. The topology optimization feature also supports parallel execution on GPUs, so we will also introduce the computation time. *For more details, please refer to the related links or feel free to contact us.*

  • Structural Analysis
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[Case Study] Shape optimization to improve natural frequency ★ Detailed materials available

[Case Study] Shape optimization to improve natural frequency ★ Detailed materials available

Control the natural frequency while considering the MAC value. Utilize parallelization to handle large-scale models in a short time.

By changing the shape, we improve the natural frequency and resonance frequency. Additionally, we have added conditions to allow for die-cutting in accordance with manufacturing requirements. In recent years, the performance of PCs has increased, and the scale of models required for finite element analysis has also grown larger. In such cases, utilizing parallelization allows for significant time reduction. This time, we performed shape optimization of a large-scale model with over one million nodes using parallelization. 【Analysis Model】 ■ Elements: Tetrahedral second-order elements ■ Number of elements: 653,931 ■ Number of nodes: 1,026,428 <Related Keywords> - Rib shape - Matching while considering MAC values - Controlling eigenvalues *For more details, please refer to the PDF document or feel free to contact us.

  • Structural Analysis
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[Case Study] Shape Optimization of Spot Welded Flat Plate Stiffeners ★ Detailed Materials Available

[Case Study] Shape Optimization of Spot Welded Flat Plate Stiffeners ★ Detailed Materials Available

Shape optimization of quadrilateral shell elements! It is also possible to optimize the thickness simultaneously!

As an example of shape optimization analysis for shell elements, we will focus on the reinforcing material of a square plate assumed to be the "center pillar" that constitutes the body of a car. "OPTISHAPE-TS" has a function that maintains the cross-sectional shape, allowing for the avoidance of complex cross-sectional shapes of the member during the shape optimization process. In the shape optimization process, RBE3 elements and their surrounding elements are automatically treated as spot welds, and constraints are set so that only rigid body motion is possible in those areas. In other words, while the position of the spot welds may move, the size and shape of the welds are constrained to remain unchanged. [Analysis Model] ■ Elements: Quadrilateral shell elements ■ Number of nodes: 47,425 ■ Number of elements: 46,440 *For more details, please refer to the PDF document or feel free to contact us.

  • Structural Analysis
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Example: Warpage countermeasures for connectors in injection molding.

Example: Warpage countermeasures for connectors in injection molding.

By collaborating with 3D TIMON, we automatically adjust the thickness of solid element models, thereby suppressing warping deformation.

We will introduce a case where warping was minimized by changing the thickness of solid elements. The analysis was conducted using the "basis vector method," which modifies the shape by moving the nodes of the finite element model without using CAD. Several patterns (basis vectors) of the desired shape were prepared from the initial model and combined. As a result of the optimization, the sum of squares of warping improved by 33% to 4.9480e-004 compared to the initial shape, and the maximum warping amount (mm) improved by 12% to 3.8607e-002. [Case Overview] ■ Optimization Conditions - Design Variables: Thickness A, B - Sampling: Initially LHS 20 points, Approximate optimal solution + 10 recommended points - Approximate Model: CRBF (Convolutional RBF) ■ Analysis: Basis Vector Method *For more details, please refer to the PDF document or feel free to contact us.

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Example: Silent Design of Electromagnetic Field Reactor

Example: Silent Design of Electromagnetic Field Reactor

By integrating various software such as CAD, magnetic field analysis, and acoustic analysis, a wide range of optimization can be achieved!

This example introduces the integration of three software programs to reduce noise without compromising the electrical performance of a reactor. First, the general-purpose parameter optimization software "AMDESS" rewrites the VB script file of the 3D CAD software "SolidWorks" with trial dimensions and modifies the model dimensions. Next, the electromagnetic field analysis software "JMAG" communicates with "SolidWorks" to import the CAD model, performs meshing and analysis, and "AMDESS" extracts responses from the analysis results of "JMAG." As a result, starting from 30 samples using Latin hypercube sampling, a 31% reduction in sound pressure was achieved through six updates of the response surface. 【Optimization Conditions】 ■ Design Variables: Core dimensions D1 to D4 ■ Objective Function: Minimization of reactor sound pressure ■ Constraint Functions: Inductance greater than or equal to the initial value, core volume less than or equal to the initial value ■ Approximation Model: RBF *For more details, please refer to the PDF document or feel free to contact us.

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Example: Injection Molding - Search for Gate Position Considering Warpage Countermeasures and Robust Design

Example: Injection Molding - Search for Gate Position Considering Warpage Countermeasures and Robust Design

We will explore design proposals that balance anti-sledding measures and robustness in collaboration with 3D TIMON.

Robustness represents the strength (small variation) against changes in the environment or situation and is an important evaluation criterion that affects yield in actual production. "AMDESS" can provide a virtual variation to the approximation model, allowing for the evaluation of this robustness. Here, we will introduce a case of gate position optimization where "AMDESS" and "3D TIMON" are linked, and robustness is evaluated after the usual optimization. [Contents] ■ Overview ■ Analysis Model ■ Optimization Conditions ■ Optimization Results ■ Variation Evaluation ■ Discussion *Detailed information about the case can be viewed through the related links. For more information, please feel free to contact us.

  • Structural Analysis
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[Technical Column] The Theory of OPTISHAPE-TS: "What is the Gradient Method?"

[Technical Column] The Theory of OPTISHAPE-TS: "What is the Gradient Method?"

A brief explanation of what gradient methods are, based on the formulation of optimization problems!

In the previous articles, we explained the "H1" in the H1 gradient method. I hope you have deepened your understanding of the concept of function spaces. From this time onward, I would like to explain the remaining "gradient methods" over several articles. To begin with, this article will discuss an overview of gradient methods. Please feel free to download and take a look. [Contents] ■ Episode 14 What is the H1 Gradient Method? Part 7 "What is a Gradient Method?" *For more details, please refer to the PDF materials or feel free to contact us.

  • Structural Analysis
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The theory of OPTISHAPE-TS: The relationship between three functions and H1.

The theory of OPTISHAPE-TS: The relationship between three functions and H1.

A subtle relationship with three functions that often appear in the field of engineering! Introducing in a column.

In the previous discussion, we explained norms and inner products in function spaces. Finally, to help you gain a deeper understanding of the concept of function spaces, we will describe the subtle relationships between three functions that frequently appear in the field of engineering (for example, control engineering and vibration engineering). Please feel free to download and take a look. [Contents] ■ Episode 13: What is the H1 Gradient Method? Part 6 "The Relationship Between Three Functions and H1" *For more details, please refer to the PDF document or feel free to contact us.

  • Structural Analysis
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[Technical Column] The Theory of OPTISHAPE-TS: Infinite Dimensions and Function Spaces

[Technical Column] The Theory of OPTISHAPE-TS: Infinite Dimensions and Function Spaces

To deepen your understanding of H1, we will explain norms and inner products in function spaces!

Last time, I explained the completeness of the space. Since H1 is a function space, this time I will explain the norms and inner products in function spaces to deepen your understanding of H1. Please feel free to download and take a look. 【Contents】 ■ Episode 12: What is the H1 Gradient Method? Part 5 "Infinite Dimensions and Function Spaces" *For more details, please refer to the PDF document or feel free to contact us.

  • Structural Analysis
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Theory of OPTISHAPE-TS Compliance Sensitivity Part 1

Theory of OPTISHAPE-TS Compliance Sensitivity Part 1

About problems with two-dimensional design variables! Introducing the linear elastic problem of a cantilever beam as an example.

In the previous article, we discussed compliance in linear elastic problems. By the way, some of you may have heard that "the sensitivity of compliance is the strain energy," but how is this derived? Therefore, starting from this time, I would like to take a few sessions to look at the derivation of compliance sensitivity. Please feel free to download and take a look. [Contents] ■ Episode 22: Sensitivity of Compliance Part 1 "Problems with Two-Dimensional Design Variables" *For more details, please refer to the PDF document or feel free to contact us.

  • Structural Analysis
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[Column] The Theory of OPTISHAPE-TS: Lagrange Multiplier Method

[Column] The Theory of OPTISHAPE-TS: Lagrange Multiplier Method

An explanation of the general concept of the Lagrange multiplier method through a simple problem! Introduction to a technical column.

The discussion about deriving the sensitivity of compliance began from the previous article. This time, I would like to take a break from the derivation of sensitivity and explain the Lagrange multiplier method itself. Please feel free to download and take a look. [Contents] ■ Episode 24: Lagrange Multiplier Method *For more details, please refer to the PDF document or feel free to contact us.

  • Structural Analysis
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AUTODESK（R）SIMULATION MECHANICAL

AUTODESK（R）SIMULATION MECHANICAL

High analysis capabilities of Autodesk Simulation Mechanical and high-precision analysis achieved with an automatic hexahedral mesher!

Autodesk Simulation Mechanical is a structural analysis package with a wide range of analysis capabilities. It can perform static stress analysis with linear and nonlinear material models, mechanical event simulation (MES: nonlinear dynamic analysis), linear dynamic analysis, steady-state and transient heat conduction, electrostatic analysis, and multiphysics (coupled analysis). As part of the family of CAE software, it includes resin flow analysis Moldflow and thermal-fluid analysis CFD, allowing for coupling between resin flow-structure and fluid-structure. Additionally, the cloud CAE service Sim360 enables cost-effective utilization of Autodesk Simulation family products whenever needed.

  • Structural Analysis
  • Thermo-fluid analysis
  • Magnetic field analysis/electromagnetic wave analysis
  • Analysis software

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PyroSim Fire Simulation

PyroSim Fire Simulation

Wide support for parallel execution formats.

Fire simulation software applicable to fires ranging from stoves to oil storage tanks.

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Injection Molding Simulation Autodesk Moldflow

Injection Molding Simulation Autodesk Moldflow

Deep examination and optimization of plastic products.

Conduct injection molding simulation to perform digital prototyping and evaluate product performance and manufacturing feasibility.

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Abaqus Unified FEA

Abaqus Unified FEA

Solution for realistic simulation

A complete finite element modeling and analysis solution to simulate the real-world behavior of materials, processes, and products.

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General-purpose finite element method analysis Femap

General-purpose finite element method analysis Femap

Top-class FEA solution for Windows environment

Femap is a highly regarded, CAD-independent, Windows-native pre/post-processor for advanced engineering finite element analysis (FEA).

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General-purpose finite element method analysis NX Nastran

General-purpose finite element method analysis NX Nastran

General-purpose finite element method analysis

Nastran is widely used across all major manufacturing sectors and has unique features such as system modeling/substructuring (super elements), dynamic response analysis, and solution customization (DMAP), making it the industry standard for advanced system-level analysis in the automotive, aerospace, defense, heavy machinery, and shipbuilding industries.

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Electromagnetic Field Analysis PHOTO-Series

Electromagnetic Field Analysis PHOTO-Series

The PHOTO series is used in many manufacturing and design environments.

The electromagnetic field analysis software PHOTO is designed for a wide range from low frequency to high frequency, and it analyzes electromagnetic fields, eddy currents, and electromagnetic waves.

  • Magnetic field analysis/electromagnetic wave analysis
  • Analysis software

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