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Defect Inspection Equipment Product List and Ranking from 46 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.

Defect Inspection Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.

  1. 山梨技術工房 Yamanashi//Industrial Machinery
  2. クボタ計装 Osaka//Testing, Analysis and Measurement
  3. 三橋製作所 Kyoto//Industrial Machinery
  4. 4 バイスリープロジェクツ Miyagi//software
  5. 5 東洋機械 Osaka//Industrial Machinery
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Defect Inspection Equipment Product ranking

Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.

  1. Wafer Surface Particle Scanner YPI-MX 山梨技術工房
  2. Surface Defect Inspection Unit "SSMM-1R" バイスリープロジェクツ
  3. [LPC] Ultrasonic Edge Sensor "PSM-46W Series" 三橋製作所
  4. On-off edge sensor 東洋機械
  5. 4 Murabiyuwaa 三明

Defect Inspection Equipment Product List

46～60 item / All 72 items

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ANALYZER3 f

ANALYZER3 f

Detect defects that cannot be captured by camera inspection.

New model "ANALYZER3f" (Model F) ----- High-precision imaging with newly developed laser light source ----- Achieves miniaturization of fiber-coupled laser light sources and stable output. The design of the laser head stage has also been revamped. This enables high-resolution imaging without focus shift, allowing for high-definition results. ----- Technology that supports mass production sites ----- Laser scanning technology detects fine defects quickly and accurately, meeting the demands of tact time. It overcomes issues related to light reflection and resolution that are challenging for camera inspections.

  • Company：ANALYZER
  • Price：1 million yen-5 million yen
  • Visual Inspection Equipment

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Wafer transfer device "TMUJ-05"

Wafer transfer device "TMUJ-05"

Supports 6-inch wafer size! Easy operation allows for wafer transfer!

The TMUJ-05 is a wafer transfer device that allows for the simple operation of transferring wafers from one cassette to another. Since it lifts and transfers the wafers, it can handle thin wafers without causing any damage during the transfer. Additionally, height adjustment is possible by loosening two screws. 【Features】 - Compatible with bottomless types - Easy to operate - Gentle on wafers - Transfers with front and back inversion - Bidirectional transfer of cassettes is possible *For more details, please refer to the catalog or feel free to contact us.

  • Other factory equipment

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Film defect inspection device

Film defect inspection device

Inspection of 300mm wafers can be performed in less than one second for the entire field of view in a single shot.

【Device Overview】 It is capable of inspecting 300mm wafers in less than one second for the entire field of view in a single shot. Due to the short inspection time, it is also adopted in fully automated inspection lines. It starts with a small field optical system and can be applied to internal void inspections by using infrared as an optional light source. In recent years, wafers have been getting thinner, but this is a high-precision wafer crack inspection device that quickly inspects the entire field of view for issues such as the unevenness of BG processing, polishing marks, and chip cracks caused by stress. 【Device Features】 In addition to automatic inspection, a standalone type is also available, allowing for manual inspection. It can set any slice level, enabling inspections tailored to specific needs. Depending on the application, it also has a function for removing so-marks, automatically extracting defect components excluding polishing marks. 【Device Applications】 ● Patterned wafer crack inspection ● Bare wafer crack inspection ● Wafer edge damage inspection ● Evaluation of BG polishing marks ● Evaluation of slurry ● Residual stress in glass substrates ● Evaluation of stress relief ● Tension inspection of BG tape ● Inspection of distortion and scratches on compound wafers

  • Visual Inspection Equipment

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Surface defect detection device (for monofilament, stainless steel wire, and ultra-fine wire)

Surface defect detection device (for monofilament, stainless steel wire, and ultra-fine wire)

Minimum outer diameter Φ10μm and capable of detecting minimum defects from 2μm! An automatic measurement system for continuous monitoring of surface defects and small diameter irregularities in ultra-fine wires such as monofilaments.

The new product from Sensoptic, the "Surface Defect Detection Device," can detect a minimum outer diameter of Φ10μm and a minimum defect size of 2μm. It contributes to quality improvement and reduces manufacturing costs for multiple products. You can rely on us for the inspection of surface defects in monofilaments, stainless steel wires, tungsten wires, magnet wires, catheters, and ultra-fine wires! 【Benefits of Use】 - Leads to quality improvement - Reduces manufacturing costs for multiple products - Detects a minimum outer diameter of Φ10μm and a minimum defect size of 2μm 【Detection Examples】 - Wire 1.59mm with a 40μm scratch - Monofilament Φ80μm with a 15.4μm bump, etc. *For more details, please contact us or refer to the catalog.

  • Other measurement, recording and measuring instruments
  • Resistors
  • Defect Inspection Equipment

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Cylindrical inner surface defect inspection device

Cylindrical inner surface defect inspection device

Hole inspection [Automating nest hole, defects, and visual inspection!] Proposed by Nidec Tosok, a manufacturer of automotive parts and precision measuring instruments.

Automatically inspect the grinding surfaces of cast processed products for voids and scratches non-contactly, allowing for quantitative measurement of the size of the voids.

  • Defect Inspection Equipment

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LPC Infrared Edge Sensor "PSM-75W Series"

LPC Infrared Edge Sensor "PSM-75W Series"

The light source uses infrared, making it suitable for detecting the meandering of non-woven fabric, as well as transparent and opaque films!

The "PSM-75W series" is a sensor for detecting web edges. It performs web skew correction in combination with a dedicated controller and drive unit. It uses infrared light as the light source, making it suitable for detecting skew in both transparent and opaque films, as well as non-woven fabrics. You can choose from two types of shapes: "W" and "WX," and the "PSM-75WX series" is also available in the lineup. 【Features】 ■ Choose from two types of shapes: "W" and "WX" ■ The "DB" type with a dust blower unit is effective in dusty environments ■ The type with a switch panel allows for mode switching and teaching operations directly on the sensor body, making it convenient ■ It is also possible to create a simple system that does not use the PEM type controller with the switch panel version *For more details, please refer to the PDF materials or feel free to contact us.

  • Sensors

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[LPC] Ultrasonic Edge Sensor 'PSM-400'

[LPC] Ultrasonic Edge Sensor 'PSM-400'

Not affected by color, pattern, or transparency! Detecting the edge position of the web by changes in ultrasonic transmission.

The "PSM-400" is an ultrasonic transmission-type web edge sensor. It is used in combination with G-series controllers and drive units for web wander control, and is suitable for edge detection of transparent materials as it is not affected by the web's transparency, color, or pattern. Additionally, the "PSM-400S" with a switch panel allows for mode switching and teaching operations directly on the sensor body, making it convenient. 【Features】 ■ It can accurately detect the edge position of the web without being affected by color, pattern, or transparency, by measuring changes in ultrasonic transmission. ■ The version with a switch panel can also be configured as a simple system (only the drive unit and sensor) without using a PEM-type controller. *For more details, please refer to the related links or feel free to contact us.

  • 01_PSM-400-2.PNG
  • Sensors

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LPC Infrared Edge Sensor "PSM-700"

LPC Infrared Edge Sensor "PSM-700"

Uses infrared light source! Suitable for detecting undulations in non-woven fabric as well as transparent and opaque films.

The "PSM-700" is an infrared transmission web edge sensor. It is used for web wander control in combination with G-series controllers and drivers, and is suitable for edge detection of opaque webs and non-woven fabrics. In addition to the standard model "PSM-700," we also offer models such as "PSM-700S" with a switch panel, "PSM-700-DB" with a dust blow feature, and "PSM-700S-DB" with both a switch panel and dust blow feature. 【Features】 ■ The "DB" type with a dust blow unit is effective in dusty environments. ■ The "700S" with a switch panel allows for mode switching and teaching operations directly on the sensor body. ■ Models with a switch panel can also be configured into a simple system (only the driver and sensor) that does not use a PEM type controller. *For more details, please refer to the related links or feel free to contact us.

  • 08_PSM-700.2.PNG
  • Sensors

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Wafer surface defect inspection device with review function

Wafer surface defect inspection device with review function

Equipped with a review microscope! Defects detected can be observed in real-time with the microscope.

By irradiating a high-power laser onto a wafer on a rotating stage, the entire surface is inspected at high speed, allowing for the detection of minute defects. By combining multiple channels such as scattering, reflection, and phase shift, defect detection suitable for various applications can be achieved, enabling discrimination by defect type such as unevenness. ■ Features of the device - High-speed inspection (approximately 181 seconds/12 inches) - Equipped with a review microscope - The microscope can be selected as either a laser microscope or a differential interference microscope - High-precision scribing using the microscope for analysis with SEM, etc. - Optional edge inspection functionality is available

  • Semiconductor inspection/test equipment

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Microscopic wafer surface defect inspection device

Microscopic wafer surface defect inspection device

High-precision inspection equipment compatible with transparent materials.

This is a surface defect inspection device equipped with a differential interference microscope, applicable to transparent materials. It is capable of outputting defect maps through comprehensive inspections and allows for microscopic observation of detected defects. ■ Features of the device - Defect extraction and discrimination functions using proprietary image processing technology - High-precision marking while observing defects - Enables observation and creation of defect albums based on defect coordinates for wafers inspected by other devices - Development of a crystal defect detection function is underway

  • Semiconductor inspection/test equipment

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Wafer Surface Particle Scanner YPI-MN

Wafer Surface Particle Scanner YPI-MN

A compact and space-saving tabletop particle inspection device ideal for device development and wafer cleaning checks!

It is a non-pattern wafer and substrate surface particle inspection device. It is a manual transport tabletop inspection device that does not take up much space. It is easy to install in labs or next to equipment. It can measure not only silicon but also glass materials.

  • Other inspection equipment and devices

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Wafer Chip Monitor Inspection Machine Model WBM-2000E

Wafer Chip Monitor Inspection Machine Model WBM-2000E

High-quality monitor inspection at optimal magnification is possible with the Takara Leica APO zoom optical system!

This is a visual inspection system for wafer chips that allows operators to reliably identify defective chips while viewing high-quality optical images. It can accurately classify defect locations/categories and image files. The system features an expanding stage that moves in steps, enabling color monitor inspections at optimal magnification suited to chip sizes. For more details, please download and view the catalog.

  • Other microscopes
  • Other inspection equipment and devices

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Chip element defect inspection machine

Chip element defect inspection machine

It is a high-precision XYZ auto stage.

Automatically inspects chip element defects on wafers. The system controls a microscope color camera and auto stage to automatically identify defects at the chip element level. For more details, please download and view the catalog.

  • Other microscopes
  • Other inspection equipment and devices

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Development Case [Image Inspection Device] *Detectable with a simple method!

Development Case [Image Inspection Device] *Detectable with a simple method!

Detectable by simple methods through cylindrical internal image inspection! Automatically inspect internal defects of LCD glass!

Taiyo Acris is engaged in the development of automatic machines that can accurately respond to customer requests. To achieve this, we consistently handle everything in-house, from mechanical design, electrical design, and software design to parts procurement, assembly, and on-site adjustments. We conduct reviews at each development step to ensure a smooth startup for our customers. 【Device Overview】 ○ A device that automatically inspects internal defects in LCD glass 【Features】 ○ Capable of inspecting defects as small as 0.05mm ○ Inspects for bubbles, foreign objects, scratches, craters, etc. ○ Inspection cycle of 20 seconds per sheet (for 730x920mm glass) For more details, please contact us or download the catalog.

  • Other inspection equipment and devices

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Cylindrical inner surface defect inspection device

Cylindrical inner surface defect inspection device

Non-contact inspection of casting processed products for surface defects such as pits and scratches is possible.

This is a device for inspecting grinding processing surface defects and scratches on cast metal products, which automatically conducts non-contact inspections of the entire inner surface of the cylinder and can record the location of defects. It helps improve productivity and quality without damaging the workpiece itself.

  • Recorders

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