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Flexible PCB - メーカー・企業23社の製品一覧とランキング

更新日: 集計期間:Aug 27, 2025~Sep 23, 2025
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Flexible PCBのメーカー・企業ランキング

更新日: 集計期間:Aug 27, 2025~Sep 23, 2025
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  1. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  2. ステイ電子機器 本社 Kanagawa//Electronic Components and Semiconductors
  3. サーテック フレキ基板(FPC)ソフトウェア ハードウェア 成膜加工 基板設計 Shizuoka//Electronic Components and Semiconductors
  4. 4 スコットデザインシステム Osaka//Electronic Components and Semiconductors
  5. 5 沖電気工業 産業営業本部 産業営業統括室 Tokyo//Information and Communications

Flexible PCBの製品ランキング

更新日: 集計期間:Aug 27, 2025~Sep 23, 2025
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  1. All LCP Flexible Printed Circuit Board (FPC) 山下マテリアル
  2. Business Introduction: "Design, Development, Manufacturing, and Sales of Flexible Printed Circuits (FPC)" ステイ電子機器 本社
  3. Flying lead flexible printed circuit board (FPC/flexible circuit board) サーテック フレキ基板(FPC)ソフトウェア ハードウェア 成膜加工 基板設計
  4. Slit flexible substrate" *can also accommodate "twisting" and "torsion. 山下マテリアル
  5. 5 Multilayer flexible printed circuit board (multilayer FPC) スコットデザインシステム

Flexible PCBの製品一覧

46~60 件を表示 / 全 61 件

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[Production Example] Superconducting Device (Flexible for Superconducting Circuit Evaluation)

Examples of superconducting devices (for superconducting circuit evaluation) operating at ultra-low temperatures of -269℃. *Source: Yokohama National University

We would like to introduce a case study of the fabrication of a superconducting device flex that operates at an ultra-low temperature of -269°C. Using flex materials that operate in a superconducting environment, we produced flex for superconducting devices, including single flux quantum circuits (SFQ circuits) and adiabatic quantum flux parametron (AQFP), for the purpose of verifying the operation of superconducting circuits. Laser processing was applied due to the tolerances required for the device electrode parts. [Case Overview] ■ Materials Used - 2-layer materials (2 types) - 3-layer materials (2 types) *Materials were determined after verification experiments. ■ Laser processing was applied due to the tolerances required for the device electrode parts. *For more details, please refer to the PDF document or feel free to contact us.

  • Piezoelectric Devices

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[Design and Production Example] Coil_FPC for Motor Field Windings

A circuit is formed considering the thickness of the flexible printed circuit (adjusting the L/S pitch). For the motor's field winding (for generating a high electromagnetic field) flexible printed circuit. *Source: Gunma University

We would like to introduce a case study of the design and production of field winding using flexible substrates that we conducted. To wind around the main pole piece, a circuit was formed considering the thickness of the flexible substrate so that the coil wiring overlaps at the same position (L/S pitch was corrected and adjusted). Due to the long structure, we implemented correction processing considering the shrinkage characteristics of the flexible material and the etching factor of the conductor, utilizing ultra-thin copper foil material. 【Case Overview】 ■L/S=100μ/100μ ■Specifications: Double-sided structure ■Base PI thickness: 25μ (no adhesive material) ■Cu thickness: 2μ (excluding Cu plating thickness) *For more details, please refer to the PDF document or feel free to contact us.

  • Contract manufacturing

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[Case] Flexibility case for substrate + wire products

Improved integrated flex! There are application examples for dental examination table devices and EEG measurement sensor devices.

We would like to introduce a case of flexing our substrate and wire products. We improved a product that was composed of a rigid substrate and wire into an integrated flex design. There are application examples for dental examination tables and EEG measurement sensor devices. 【Application Examples】 ■ Dental Examination Table ■ EEG Measurement Sensor Device *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Other contract services

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Ultra-small, high-precision flexible substrate

Custom-made support for narrow pitch high-definition and ultra-high-definition substrates! Leave flexible substrates (high-definition FPC) to us!

Our company is a specialized manufacturer of circuit boards, celebrating approximately 50 years this year. With our extensive experience and track record in solving various challenges in flexible circuit boards, we can produce high-resolution FPC prototypes in a short lead time, covering everything from cost considerations to prototype manufacturing and mass production. We utilize advanced techniques such as micro-hole processing using chemical etching, BVH connections, and polyimide micro-hole processing technology that allows for simultaneous hole drilling to meet our customers' needs. Please feel free to contact us with your requests. 【Features】 ■ Custom-made high-resolution and ultra-high-resolution boards with narrow pitch ■ Micro-hole processing and BVH connections using chemical etching ■ Introduction of polyimide micro-hole processing technology that allows for simultaneous hole drilling *For more details, please download the PDF or contact us.

  • Board to FPC connector

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[Example of Printed Circuit Board Manufacturing] Rigid-Flexible Board

Effective even in cases where component mounting is limited! Here are examples of rigid-flexible circuit board manufacturing.

We would like to introduce an example of our "Rigid-Flexible Printed Circuit Board" manufacturing. This board integrates rigid and flexible substrates. It is effective for use in compact spaces, such as small modules, or in cases where component placement is limited. Please feel free to contact us when you need assistance. 【Overview】 ■ 6-layer IVH structure (FPC layers L4-5) ■ 4-layer 1-2-1 build-up structure (FPC layers L2-3) *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Rigid-flexible substrate

The flexible parts can be multilayered, and there are also specifications for the rigid parts that are multilayered or have a build-up structure!

We would like to introduce the "Rigid Flexible Circuit Board" handled by Matsuwa Sangyo Co., Ltd. This board integrates rigid and flexible circuit boards and is also referred to as rigid flex or rigid FPC. Our product not only combines the features of rigid and flexible circuit boards but also eliminates the need for connectors in the interconnection between boards, making it effective for lightweight, compact, and three-dimensional assembly and wiring. 【Example Specifications for Flexible Circuit Board Manufacturing (Excerpt)】 ■ Base Material Thickness: 25μm, 50μm ■ Copper Foil Thickness: 18μm, 35μm ■ Copper Foil Types: Rolled Copper Foil, Special Electrolytic Copper Foil ■ Coverlay Color: Amber ■ Resist Color: Amber, Green, Black, White *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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What is SPET?

Tightly laminated resist, copper foil, adhesive layer, and PET! Introducing our transparent substrate.

"SPET" is a single-sided substrate made by laminating copper foil onto a PET base material. The base material thickness is 100μm/188μm, and the copper foil thickness is 12μm/18μm. It is a product that is tightly laminated with resist, copper foil, adhesive layer, and PET. Additionally, we also offer "SPET-MM," which has wiring that is nearly invisible. Please feel free to contact us when you need assistance. 【Features】 ■ High transparency flexible substrate ■ Low-resistance conductor due to copper foil lamination ■ Compatible with low-temperature soldering (180°C) *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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All LCP Flexible Printed Circuit Board (FPC)

Next-generation flexible substrate with high heat resistance, low loss, and chemical resistance, all made of LCP!

All LCP is a high-performance flexible printed circuit board (FPC) made entirely of liquid crystal polymer (LCP) without the use of adhesives. Compared to conventional polyimide FPCs, it features high heat resistance, low moisture absorption, low loss characteristics, chemical resistance, and low outgassing properties, providing stable performance even in harsh environments. It is particularly suitable for applications that require reduced transmission loss of high-frequency signals and improved durability in environments where oils and chemicals are used.

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board

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[Research Material] Global Market for Flexible Printed Circuit Boards

Global Market for Flexible Substrates: Plastic, Glass, Metal, Home Appliances, Solar Energy, Medical & Healthcare, Aerospace & Defense

This research report (Global Flexible Substrate Market) investigates and analyzes the current state of the global flexible substrate market and its outlook for the next five years. It includes information on the overview of the global flexible substrate market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments of the flexible substrate market by type include plastics, glass, and metals, while the segments by application cover home appliances, solar energy, medical and healthcare, and aerospace and defense. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of flexible substrates. It also includes the market share of major companies in the flexible substrate market, product and business overviews, and sales performance.

  • Other services

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Trends in the development of high-functionality, compact, and lightweight materials for automotive control devices, components, and electrical materials.

~Technologies for ensuring high reliability, wiring, and miniaturization of inverters centered around metal substitute resin components~

★Development status of new plastic materials for electrification and weight reduction! Development of PBT resin with high reliability! ★What characteristics are required for automotive FPC (Flexible Printed Circuit)? Which components can contribute to weight reduction? ★What are the needs for thermal conductivity and material strength? Are there parts that cannot be replaced by metals? ★What technological innovations are most important for achieving miniaturization of inverters and automotive electronic products? 【Speakers】 Part 1: Representative from Japan Mectron Co., Ltd. AI Business Division, Automotive FPC Planning Department Part 2: Representative from Polyplastics Co., Ltd. Technical Solution Center Part 3: Mr. Hideo Shikano, Director of Lintec Engineering Office Part 4: Mr. Yoshihiro Kamiya, Hardware Development Department, Electrical and Electronic Technology Development Division, Denso Corporation 【Venue】 Tekuno Kawasaki, 4th Floor Conference Room [Kanagawa, Kawasaki] 【Date and Time】November 26, 2013 (Tuesday) 10:30-16:35

  • 企業:AndTech
  • 価格:10,000 yen-100,000 yen
  • Technical Seminar

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Rigid-flexible substrate

A "trump card" for miniaturization and low profile! Applicable to digital cameras, robots, and more.

We would like to introduce our "Rigid Flexible Circuit Boards." Traditionally, connections were made using B to B connectors, but with the rigid-flex design, both the area and height have been reduced to less than half. These can be applied in fields such as automotive, tablet devices, smartphones, and medical equipment. 【Board Specifications】 ■ 8-layer through-hole board (Rigid Flexible Circuit Board) ■ Board thickness t = 0.7mm ■ Flexible part thickness t = 0.28mm ■ Minimum L/S: 0.1/0.1mm ■ Minimum Via: hole diameter 0.25mm ■ Land diameter surface layer 0.45mm, inner layer 0.5mm *For more details, please download the PDF or feel free to contact us.

  • リジットフレキシブル基板2.png
  • Circuit board design and manufacturing

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Transparent flexible substrate

Ideal for wearable devices! Applicable to medical and smartphones, etc.

We provide transparent FPC with excellent transparency in a short delivery time. We can use low-cost PET material "Polyethylene Terephthalate," and we also adopt PEN material "Polyethylene Naphthalate" for the insulation layer, enabling low-temperature reflow mounting. Additionally, we support the transparency of the resist. 【Features】 ■ Achieving short delivery times from order to delivery, possible only with our company ■ Use of low-cost PET material "Polyethylene Terephthalate" ■ Adoption of PEN material "Polyethylene Naphthalate" for the insulation layer, enabling low-temperature reflow mounting ■ Support for the transparency of the resist *For more details, please download the PDF or feel free to contact us.

  • Circuit board design and manufacturing

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Are you facing any issues with the production of transparent substrates or films?

Solve your problems with transparent flexible substrates, transparent antennas, transparent heaters, and insert molded substrates!

We offer a transparent substrate called "SPET." We address concerns such as, "I want to request production, but I'm worried about the price and would like to know the market rate before placing an order," and "There are different types of transparent substrates, and I don't quite understand the differences, so I want to know the advantages and disadvantages of each method." As experts in transparent substrates, we solve issues related to the production of transparent flexible substrates, transparent antennas, transparent heaters, and insert-molded substrates. 【We solve the following concerns】 ■ I don't know the market rate for substrates ■ How should I choose? ■ I'm busy and it's a hassle *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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Flexible printed circuit board (FPC) short delivery time

Impedance control of flexible substrates and UL certification can be achieved with short lead times and small lot production.

We will respond to circuit board manufacturing and component assembly in just one working day at the shortest. Additionally, we will manufacture high-performance flexible circuit boards with impedance control during artwork design. We can also accommodate small lot production. Please feel free to consult with us.

  • others

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[Use Case] Supporting IoT integration through wiring wearable devices into clothing.

The conductor resistance value is low, and the change in conductor resistance during expansion and contraction is small! Suitable for applications that were difficult to apply in the past!

We would like to introduce a case where our EMS (design and manufacturing contract services) supported the IoT integration of clothing through the wiring of wearable devices. The customer's challenge was to improve the performance and quality of their own wearable devices. By using copper foil for the circuit conductors, we achieve low conductor resistance and minimal changes in resistance during stretching. This feature allows for wide application in areas that were previously difficult to implement. [Challenges] ■ Desire to improve the performance and quality of their own wearable devices ■ Traditional flexible substrates have issues with lack of elasticity ■ Unable to realize the desired wearable device *For more details, please refer to the PDF document or feel free to contact us.

  • Piezoelectric Devices

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