Flexible PCBのメーカーや取扱い企業、製品情報、参考価格、ランキングをまとめています。
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Flexible PCB - メーカー・企業23社の製品一覧とランキング

更新日: 集計期間:Oct 15, 2025~Nov 11, 2025
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Flexible PCBのメーカー・企業ランキング

更新日: 集計期間:Oct 15, 2025~Nov 11, 2025
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  1. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  2. サーテック フレキ基板(FPC)ソフトウェア ハードウェア 成膜加工 基板設計 Shizuoka//Electronic Components and Semiconductors
  3. スコットデザインシステム Osaka//Electronic Components and Semiconductors
  4. ステイ電子機器 本社 Kanagawa//Electronic Components and Semiconductors
  5. 5 沖電気工業 産業営業本部 産業営業統括室 Tokyo//Information and Communications

Flexible PCBの製品ランキング

更新日: 集計期間:Oct 15, 2025~Nov 11, 2025
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  1. All LCP Flexible Printed Circuit Board (FPC) 山下マテリアル
  2. Button-plated flexible printed circuit board (FPC) 山下マテリアル
  3. High Current Compatible Flexible Circuit Board BigElec 山下マテリアル
  4. 4 Flying lead flexible printed circuit board (FPC/flexible circuit board) サーテック フレキ基板(FPC)ソフトウェア ハードウェア 成膜加工 基板設計
  5. 4 Slit flexible substrate" *can also accommodate "twisting" and "torsion. 山下マテリアル

Flexible PCBの製品一覧

46~60 件を表示 / 全 61 件

表示件数

Shielded Flexible Printed Circuit Board (Shielded FPC)

Noise countermeasure structure

This is an FPC with a shield structure that is effective for noise countermeasures.

  • Printed Circuit Board

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Impedance control flexible substrate

Achieving high-frequency and high-speed transmission by matching the characteristic impedance.

This is an FPC that matches characteristic impedance and achieves high-frequency, high-speed transmission.

  • Printed Circuit Board

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Flexible circuit board

Impedance accuracy is within standard ±10% and high precision ±5%! Available for small quantities.

"Flexible printed circuit boards" are printed circuit boards formed on an insulating film that is flexible and can be significantly deformed, such as being bent. Impedance control is also available, and we can provide small quantities. They are used in a wide variety of electronic and precision devices, including mobile devices, wearable devices, and medical equipment. 【Specifications】 ■ Number of layers: Single-sided / Double-sided ■ Board thickness: Base thickness 25μm / 50μm ■ Surface treatment: Heat-resistant preflux, electrolytic and electroless gold plating ■ Impedance accuracy: Standard ±10% or less, high precision ±5% or less *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Image Analysis Using a Microscope / Flexible Substrate Mock Production

It is possible to create a simple mock-up of the base for those who want to analyze the internal structure of FPC products, troubleshoot issues, or pre-verify complex product shapes.

We would like to introduce the services provided by Stay Electronics Co., Ltd. The "Flexible Circuit Board Mock Production using a High-Performance Cutting Plotter" is a service that creates simple mock-ups of flexible circuit boards using polyimide film for those who have never handled flexible circuit boards before or wish to pre-validate complex product shapes. Additionally, the "Image Analysis using a Super Depth Multi-Angle Lens Microscope" can be utilized for internal structure analysis and defect analysis of FPC products. *For questions or inquiries, please call us or contact us at the email address below. 042-774-4555 stay-4555@staydenshi.jp Contact Person: Kumada, Kikuchi [Service Operations] ■ Image Analysis using a Super Depth Multi-Angle Lens Microscope ■ Flexible Circuit Board Mock Production using a High-Performance Cutting Plotter *For more details, please refer to the PDF document or feel free to contact us.

  • Microscope

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[Production Example] Superconducting Device (Flexible for Superconducting Circuit Evaluation)

Examples of superconducting devices (for superconducting circuit evaluation) operating at ultra-low temperatures of -269℃. *Source: Yokohama National University

We would like to introduce a case study of the fabrication of a superconducting device flex that operates at an ultra-low temperature of -269°C. Using flex materials that operate in a superconducting environment, we produced flex for superconducting devices, including single flux quantum circuits (SFQ circuits) and adiabatic quantum flux parametron (AQFP), for the purpose of verifying the operation of superconducting circuits. Laser processing was applied due to the tolerances required for the device electrode parts. [Case Overview] ■ Materials Used - 2-layer materials (2 types) - 3-layer materials (2 types) *Materials were determined after verification experiments. ■ Laser processing was applied due to the tolerances required for the device electrode parts. *For more details, please refer to the PDF document or feel free to contact us.

  • Piezoelectric Devices

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[Design and Production Example] Coil_FPC for Motor Field Windings

A circuit is formed considering the thickness of the flexible printed circuit (adjusting the L/S pitch). For the motor's field winding (for generating a high electromagnetic field) flexible printed circuit. *Source: Gunma University

We would like to introduce a case study of the design and production of field winding using flexible substrates that we conducted. To wind around the main pole piece, a circuit was formed considering the thickness of the flexible substrate so that the coil wiring overlaps at the same position (L/S pitch was corrected and adjusted). Due to the long structure, we implemented correction processing considering the shrinkage characteristics of the flexible material and the etching factor of the conductor, utilizing ultra-thin copper foil material. 【Case Overview】 ■L/S=100μ/100μ ■Specifications: Double-sided structure ■Base PI thickness: 25μ (no adhesive material) ■Cu thickness: 2μ (excluding Cu plating thickness) *For more details, please refer to the PDF document or feel free to contact us.

  • Contract manufacturing

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[Case] Flexibility case for substrate + wire products

Improved integrated flex! There are application examples for dental examination table devices and EEG measurement sensor devices.

We would like to introduce a case of flexing our substrate and wire products. We improved a product that was composed of a rigid substrate and wire into an integrated flex design. There are application examples for dental examination tables and EEG measurement sensor devices. 【Application Examples】 ■ Dental Examination Table ■ EEG Measurement Sensor Device *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Other contract services

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Ultra-small, high-precision flexible substrate

Custom-made support for narrow pitch high-definition and ultra-high-definition substrates! Leave flexible substrates (high-definition FPC) to us!

Our company is a specialized manufacturer of circuit boards, celebrating approximately 50 years this year. With our extensive experience and track record in solving various challenges in flexible circuit boards, we can produce high-resolution FPC prototypes in a short lead time, covering everything from cost considerations to prototype manufacturing and mass production. We utilize advanced techniques such as micro-hole processing using chemical etching, BVH connections, and polyimide micro-hole processing technology that allows for simultaneous hole drilling to meet our customers' needs. Please feel free to contact us with your requests. 【Features】 ■ Custom-made high-resolution and ultra-high-resolution boards with narrow pitch ■ Micro-hole processing and BVH connections using chemical etching ■ Introduction of polyimide micro-hole processing technology that allows for simultaneous hole drilling *For more details, please download the PDF or contact us.

  • Board to FPC connector

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[Example of Printed Circuit Board Manufacturing] Rigid-Flexible Board

Effective even in cases where component mounting is limited! Here are examples of rigid-flexible circuit board manufacturing.

We would like to introduce an example of our "Rigid-Flexible Printed Circuit Board" manufacturing. This board integrates rigid and flexible substrates. It is effective for use in compact spaces, such as small modules, or in cases where component placement is limited. Please feel free to contact us when you need assistance. 【Overview】 ■ 6-layer IVH structure (FPC layers L4-5) ■ 4-layer 1-2-1 build-up structure (FPC layers L2-3) *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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[Use Case] Supporting IoT integration through wiring wearable devices into clothing.

The conductor resistance value is low, and the change in conductor resistance during expansion and contraction is small! Suitable for applications that were difficult to apply in the past!

We would like to introduce a case where our EMS (design and manufacturing contract services) supported the IoT integration of clothing through the wiring of wearable devices. The customer's challenge was to improve the performance and quality of their own wearable devices. By using copper foil for the circuit conductors, we achieve low conductor resistance and minimal changes in resistance during stretching. This feature allows for wide application in areas that were previously difficult to implement. [Challenges] ■ Desire to improve the performance and quality of their own wearable devices ■ Traditional flexible substrates have issues with lack of elasticity ■ Unable to realize the desired wearable device *For more details, please refer to the PDF document or feel free to contact us.

  • Piezoelectric Devices

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Flexible Printed Circuit (FPC) Comprehensive Catalog

A large number of flexible circuit boards that are thin and lightweight, making them excellent for space-saving solutions!

This catalog features a wide range of "Flexible Printed Circuits (FPC)" that our company handles. We offer products such as "High-Flex FPC," which demonstrates excellent bending performance even in narrow spaces, "Self-Supporting Sliding FPC," which can slide and bend while remaining upright in the air, and "Power FPC," which can handle high currents. 【Contents】 ■ FPC Product Concepts ■ Areas of Achievement ■ Process Overview ■ What is a Flexible Printed Circuit (FPC)? ■ Product Introduction *For more details, please refer to the PDF document or feel free to contact us.

  • cable

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What is SPET?

Tightly laminated resist, copper foil, adhesive layer, and PET! Introducing our transparent substrate.

"SPET" is a single-sided substrate made by laminating copper foil onto a PET base material. The base material thickness is 100μm/188μm, and the copper foil thickness is 12μm/18μm. It is a product that is tightly laminated with resist, copper foil, adhesive layer, and PET. Additionally, we also offer "SPET-MM," which has wiring that is nearly invisible. Please feel free to contact us when you need assistance. 【Features】 ■ High transparency flexible substrate ■ Low-resistance conductor due to copper foil lamination ■ Compatible with low-temperature soldering (180°C) *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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[Research Material] Global Market for Flexible Printed Circuit Boards

Global Market for Flexible Substrates: Plastic, Glass, Metal, Home Appliances, Solar Energy, Medical & Healthcare, Aerospace & Defense

This research report (Global Flexible Substrate Market) investigates and analyzes the current state of the global flexible substrate market and its outlook for the next five years. It includes information on the overview of the global flexible substrate market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments of the flexible substrate market by type include plastics, glass, and metals, while the segments by application cover home appliances, solar energy, medical and healthcare, and aerospace and defense. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of flexible substrates. It also includes the market share of major companies in the flexible substrate market, product and business overviews, and sales performance.

  • Other services

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Trends in the development of high-functionality, compact, and lightweight materials for automotive control devices, components, and electrical materials.

~Technologies for ensuring high reliability, wiring, and miniaturization of inverters centered around metal substitute resin components~

★Development status of new plastic materials for electrification and weight reduction! Development of PBT resin with high reliability! ★What characteristics are required for automotive FPC (Flexible Printed Circuit)? Which components can contribute to weight reduction? ★What are the needs for thermal conductivity and material strength? Are there parts that cannot be replaced by metals? ★What technological innovations are most important for achieving miniaturization of inverters and automotive electronic products? 【Speakers】 Part 1: Representative from Japan Mectron Co., Ltd. AI Business Division, Automotive FPC Planning Department Part 2: Representative from Polyplastics Co., Ltd. Technical Solution Center Part 3: Mr. Hideo Shikano, Director of Lintec Engineering Office Part 4: Mr. Yoshihiro Kamiya, Hardware Development Department, Electrical and Electronic Technology Development Division, Denso Corporation 【Venue】 Tekuno Kawasaki, 4th Floor Conference Room [Kanagawa, Kawasaki] 【Date and Time】November 26, 2013 (Tuesday) 10:30-16:35

  • 企業:AndTech
  • 価格:10,000 yen-100,000 yen
  • Technical Seminar

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Flexible printed circuit board (FPC) short delivery time

Impedance control of flexible substrates and UL certification can be achieved with short lead times and small lot production.

We will respond to circuit board manufacturing and component assembly in just one working day at the shortest. Additionally, we will manufacture high-performance flexible circuit boards with impedance control during artwork design. We can also accommodate small lot production. Please feel free to consult with us.

  • others

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