Button-plated flexible printed circuit board (FPC)
Button-plated FPC that enables high-speed transmission, ultra-thinness, and flexibility in a new dimension.
Button-plated flexible printed circuit boards (FPC) can utilize the original thickness and characteristics of copper foil by applying through-hole plating only to the through-holes and through-hole lands. This allows for uniform maintenance of conductor thickness, enabling the formation of high-precision wiring, which is expected to provide high-accuracy impedance control, making it ideal for high-speed transmission applications. Compared to conventional panel plating methods, button-plated FPCs excel in flexibility and bendability, achieving ultra-thin designs. This enables the lightweight and compact design of products. The new method also allows for button plating on narrow pitch patterns. Product Features: 1. By applying copper plating only to the through-holes, the original characteristics of the copper foil are maximized. 2. High-precision impedance control is possible, demonstrating performance suitable for high-speed transmission. 3. Compared to panel plating methods, it excels in flexibility and bendability while achieving ultra-thin designs. 4. It provides stable quality with technology that has cleared reliability evaluations based on JISC5016. 5. Through-hole plating is possible even for narrow pitch patterns, which were previously difficult to achieve.
- Company：山下マテリアル
- Price：500,000 yen-1 million yen
![Long-length multi-layer flexible substrate [Substrate manufacturing achievements]](https://image.mono.ipros.com/public/product/image/857/2000674579/IPROS01080264647980196626.png?w=280&h=280)
