LaserMax Corporation
As a customer's laser factory
Wide range of steel types. Support for small lots and short delivery times.
- Company:岡山県 産業労働部産業振興課
- Price:Other
Last Updated: Aggregation Period:Apr 29, 2026~May 26, 2026
This ranking is based on the number of page views on our site.
Last Updated: Aggregation Period:Apr 29, 2026~May 26, 2026
This ranking is based on the number of page views on our site.
Last Updated: Aggregation Period:Apr 29, 2026~May 26, 2026
This ranking is based on the number of page views on our site.
361~390 item / All 797 items
As a customer's laser factory
Wide range of steel types. Support for small lots and short delivery times.
Excellent maintainability and long lifespan reduce running costs!
The "fiber laser processing machine" is a machine that uses solid lasers with optical fibers as the medium to cut and process metals and other materials with high precision. Compared to CO2 laser processing machines, it has higher energy efficiency and allows for finer and sharper processing. This technology is widely used in the manufacturing of precision instruments, automotive parts, electronic components, and is particularly adopted in fields where high-speed and high-precision cutting is required. 【Features】 ■ Fast processing speed ■ Low electricity costs ■ No laser gas required ■ No mirrors needed ■ Generally cheaper than CO2 laser processing machines when made in China *For more details, please refer to the related links or feel free to contact us.
Next-gen drilling for ABF and BT substrates. Achieve 5μm vias with ±5μm precision. Ideal for high-density AI chip packaging.
The micromachining by Photonics Systems Group (PSG) is a cutting-edge laser drilling solution designed for the next generation of high-density interconnects (HDI) and advanced semiconductor packaging. As AI and high-performance computing (HPC) drive the need for extreme miniaturization, this system delivers the capability to drill ultra-fine microvias as small as 5μm in diameter. Optimized for advanced dielectric materials such as ABF (Ajinomoto Build-up Film), BT resins, and specialized glass substrates, it ensures clean, high-aspect-ratio holes with zero debris and minimal thermal impact. Equipped with a high-resolution vision system and ultra-fast galvanometer scanners, the system maintains a positioning accuracy of ±5μm. This level of precision is essential for the reliable fabrication of multi-layer substrates used in advanced IC packaging, where alignment between layers is critical for yield and performance.
Achieves a minimum hole diameter of 30μm and a machining accuracy of ±5μm. Suppresses thermal effects on DCB and AMB substrates with a picosecond laser. For cutting, drilling, and pattern formation.
【The Definitive Solution for Heat Dissipation Substrate Processing for Next-Generation Power Semiconductors】 The CR20x0 series is the latest laser system from German company PSG, specialized in the precision processing of DCB (Direct Copper Bonding) and AMB (Active Metal Brazing) substrates, which are essential for power electronics. ■ Pico-Second Laser Processing Pursuing "Zero Thermal Damage" By employing ultra-short pulse lasers, thermal effects on ceramic and copper composite materials are minimized to the extreme. It prevents "cracks," "burrs," and "delamination" that could not be avoided with physical cutting tools or long-pulse lasers, ensuring a high-quality finish. ■ Overwhelming Processing Specifications Minimum Hole Diameter 30μm: Capable of processing extremely small vias with high circularity. Processing Accuracy ±5μm: Maintains extremely high positional accuracy over a wide range due to all-axis linear motor drive and high-resolution glass scales. Compatible with a Variety of Materials: Proven high performance with various ceramic materials such as Al2O3, AlN, and Si3N4.
Deburring that was difficult to achieve with conventional methods like brushes and rotary bars can now be completed in a single treatment!
The "LDM (Laser Deburring Machine)" can remove burrs by irradiating the burr generation area with a laser to melt them away. It is effective for a variety of work materials, including metals such as carbon steel and cast iron, non-ferrous metals like aluminum, as well as resins like PP and PE, glass, ceramics, and stone. The deburring speed can reach an astonishing maximum of 60 meters per minute. Since it can process without contact, there is no need for a strong work clamp as required by conventional methods, allowing for the processing of many areas in a single position. 【Features】 ■ Capable of processing at an astonishing speed of up to 60 meters per minute ■ Can process without contact ■ Able to handle many areas in a single position without the need for a strong work clamp ■ Burrs that would typically require multiple processes to remove, such as secondary burrs (e.g., edge burrs), can be completed in one treatment *For more details, please refer to the PDF document or feel free to contact us.
Achieving low cost and short delivery times! We operate laser processing machines with 24-hour automation.
Toyotomo Industry Co., Ltd. operates a 24-hour automatic laser processing machine to achieve low costs and short delivery times. To improve the appearance quality of large products, we have newly installed a large degreasing surface treatment (iron phosphate coating) system and painting equipment. We can perform baked painting on both small and large workpieces, up to 3000×3000×6000 (mm). Additionally, we own bending machines with capacities of 80t, 100t, and 200t, allowing for bending processing up to 2500–3340 [mm]. Furthermore, our cationic electrodeposition painting can accommodate sizes up to 1000×2250×1400. For more details, please contact us or refer to our catalog.
Are you struggling with programming that is useful in the manufacturing field? Let us introduce you to the basics of programming that are important for manufacturing!
The programming educational material "MSEP" is a foundational programming resource created for a wide range of individuals, from new employees to mid-level engineers and management, that is useful in the manufacturing field. The content covers various topics, including: - Basic and practical editions of the programming language "LabVIEW" - A guide to semiconductor test programs using "LabVIEW" and AC measurement - Methods to connect UML and LabVIEW programming This text invites you to create programs that are useful in the field based on design documents written in UML. It is a must-check for those in a position to nurture programmers who develop in teams and aspire to become designers! *For more details, please download the materials or contact us.
A fiber laser processing machine capable of thin plate micro welding, high-speed welding, and thick plate welding with high output! It is suitable not only for welding but also for surface processing and cutting!
Leave stainless steel, aluminum, copper, and other metals to us! An excellent tool that handles both welding and cutting! 【Features】 - Achieves deep penetration with a minimum core diameter of 25μm and high energy density - Capable of welding high-reflective materials like aluminum and copper - Allows for welding with minimal thermal impact, preventing burns and warping - Enables airtight welding - Long-lasting with no maintenance required Hand torches, galvanoscanners, emission units, and more The possibilities are endless depending on the combination! ★ If you wish to conduct a prototype or visit our actual machines, please feel free to contact us using the button below. We also accept sample test processing.
This is a fiber laser processing machine that achieves high peak power! If you would like to request a test processing of a work sample, please feel free to contact us!
☆Features of the QCW Mode 'THFI-QCW' Series☆ A maintenance-free fiber laser processing machine of the QCW (quasi-continuous wave) type that achieves high peak power! Capable of both fine processing of thin plates and high-output processing of thick plates! By intermittently irradiating laser light with a higher peak than CW (continuous wave) lasers, it enables welding with minimal distortion! It easily achieves high energy density, which was difficult with YAG and CO2 lasers, resulting in deep penetration! The oscillation modes of the fiber laser processing machine can be selected between QCW (quasi-continuous wave) mode and CW (continuous wave) mode, allowing for processing with reduced thermal impact or superior airtightness, depending on the application! 【Features of the Fiber Laser Processing Machine】 ■ Easy operation with a wide range of welding conditions ■ Resistant to reflected light and less prone to damage ■ Adopts high beam oscillation design ■ High processability ■ No exposed optical components, thus maintenance-free ★If you wish to conduct a prototype or visit our actual machine, please feel free to contact us using the button below. We also accept sample test processing.
Increased design freedom with fewer constraints on shape and dimensions! It can also be used for products with sensitive internal components.
We will introduce "resin welding processing" using lasers. Semiconductor lasers have a high transmittance for transparent resins, and by applying this characteristic, it is possible to weld resins together. This technology is widely adopted in the automotive industry, reducing the number of parts such as bolts, achieving weight reduction and a decrease in man-hours. 【Features of Laser Welding】 ■ High-speed processing with high energy ■ Localization of heat-affected zones and bonding areas ■ Assemblies can be made before bonding, making construction easy ■ Few constraints due to shape and dimensions, improving design flexibility ■ Usable for products with sensitive internal components, such as electronic parts *For more details, please refer to the PDF materials or feel free to contact us.
Aluminum treated with alumite can be processed into any shape! We accept prototypes even in small quantities.
At Laserx Co., Ltd., we offer the "DLAMP processing sample processing," which is a joining process for metals and dissimilar materials. We can process various types of metals, as well as surface-treated metals. Please consult us regarding tantalum, magnesium, zinc-based materials, and more. We also accept small-scale prototypes. We look forward to your inquiries. 【Applicable Metals (Excerpt)】 ■ Aluminum-based: A1050, A5052, A6061, ADC12, anodized products also available ■ Stainless steel: SUS304, SUS316, etc. ■ Iron-based: SPCC, SS400, chromated steel, galvanized steel, electrodeposited coated steel ■ Copper-based: pure copper, brass (C2801), nickel silver (C7501), tin-plated copper ■ Titanium-based: pure titanium (TP340), 64 titanium (TP340), etc. *For more details, please refer to the PDF document or feel free to contact us.
We offer femtosecond laser processing contract services at affordable prices. We can accommodate a wide range of needs, from "product processing" to "surface modification"!
We offer contract processing with femtosecond lasers that enables ultra-fine machining at an affordable price! In addition to the catalog listed, we can accommodate various other laser contract processing needs. We can support everything from the development of a single project to mass production. We assist in solving challenges and themes for customers that could not be addressed with conventional methods or were deemed too costly.
This is an introduction to examples of through-hole processing for LCP (liquid crystal polymer).
A through hole with a diameter of 0.15 mm was processed in LCP (liquid crystal polymer) with a thickness of 0.05 mm. Compared to conventional laser processing, we achieved fine processing with less thermal impact.
We performed multi-hole processing in a staggered grid pattern on a 50μm thick PI (polyimide) with an entrance diameter of Φ17μm, an exit diameter of Φ6μm, and a pitch of 25μm.
Holes were processed in a staggered lattice pattern on a 50μm thick PI (polyimide) with an inlet diameter of Φ17μm, an outlet diameter of Φ6μm, and a pitch of 25μm.
We performed groove processing on carbon steel with a groove width of 23μm and a depth of 130μm using a picosecond laser.
A deep groove machining with an aspect ratio of 5.6 times was performed on carbon steel using a ultrashort pulse laser.
We have compiled a list of examples of nano-periodic structure (LIPSS) processing conducted with femtosecond lasers.
Using a femtosecond laser, we have created fine periodic structures at the nanometer scale. Please confirm that fine grooves have been formed on various metal surfaces such as SUS, Ni, and Ti.
We have successfully created a multi-stage taper in quartz glass with a thickness of 700μm!
Using the taper control characteristic of the laser processing machine manufactured and used by our company, we implemented multiple taper controls within a single hole. By using transparent material such as quartz glass, we are processing while confirming the shape of the hole.
A dimple processing with a diameter of 20μm and a depth of 2μm was performed on an ultra-thin SUS pipe with an outer diameter of 700μm.
You can see the dimpled shape arranged at equal intervals on the curved outer surface of the pipe.
A dot shape was processed on SUS430J1L with a size of approximately 300nm.
During the experiment on nano-periodic structure (LIPSS) processing using femtosecond lasers, a lattice-shaped LIPSS structure appeared instead of the previously introduced linear LIPSS shape!
A Φ100μm straight hole penetrates a 2mm thick workpiece! Take a look at the ultra-fine high-precision machining with an aspect ratio of 20 times.
Using a ultrashort pulse laser, we are processing a straight hole with an aspect ratio of 20 times in 2mm thick natural rubber.
Please take a look at the fine picosecond laser processing that distinguishes between shallow grooves, deep grooves, and cutting in three stages by changing the conditions.
Graphite, which has high heat resistance and also possesses lubricating and conductive properties, is widely used in applications ranging from engines and laptops to airplanes and food-related industries. This time, we used an ultra-short pulse laser on a 25μm thick graphite paper to perform cutting, engraving, and various groove processing. Please take a look at the fine picosecond laser processing that distinguishes three stages: shallow engraving, deep engraving, and cutting by changing the conditions!
We performed shallow engraving on the surface of a 150μm thick ultra-thin cover glass using a femtosecond laser.
On the WEB page, you can see that the edges of the recessed areas and the unprocessed areas, which were processed in circular and cross shapes, are cleanly finished without cracks or melting. Unlike conventional lasers, where light can pass through and processing cannot be achieved, or contact processing, where the workpiece may crack, this method avoids those issues.
An easy-to-use entry model that can be operated like a printer.
The VLS Desktop Laser Series is a laser processing machine designed for use in various situations. With an affordable initial price and low running costs, it is an ideal system for those using a laser processing machine for the first time. All models are equipped with a common driver, "Laser Interface+." Improvements in operability and additional features have been implemented. For more details, please contact us or refer to the catalog.
Universal flagship model designed for industrial applications.
The Industrial Series is designed for specialized applications such as industrial use. The expansive work area and removable panels accommodate long materials, while the interface with external systems allows for integration into production lines. The newly designed mechanism offers excellent usability and maintainability, ensuring smooth operation from installation to operation. All models are equipped with a common driver, "Laser Interface+," which delivers outstanding performance in terms of operability and functionality. For more details, please contact us or refer to the catalog.
Commitment to manufacturing! Utilizing excellent production technology to meet customer needs.
PC Electronics Co., Ltd. is a company that designs and manufactures printed circuit boards, develops software and hardware, inspects electrical components, and sells harnesses, electronic components, and cables. At our company, we utilize excellent German production technology, such as laser processing machines, punch presses, and 3D measuring instruments, to create products that meet customer needs. 【Equipment Introduction】 ■ Laser Processing Machine - Trumpf - High-speed processing + high quality, flexible in material and plate thickness ■ Punch Press Machine - Trumpf - High-speed processing + flexibility, capable of complex shaping processes - Quality: Achieves high product precision ■ 3D Measuring Machine - Carl Zeiss - High-precision quality assurance - Automatic determination of measurement results *For more details, please refer to the PDF materials or feel free to contact us.
Laser Ring Light Source Unit ALT-4300
This is an introduction to the ring light source unit "Laser Ring Light Source Unit ALT-4300" with a wavelength of 635 nm. 【Features】 - Ring light source unit with a wavelength of 635 nm - Laser is emitted in all circumferential directions, suitable for measurement and image processing applications such as internal inspections - Excellent for mass production, using a newly developed conical mirror with high precision to create high-performance ring light 【Specifications】 - Line width: 0.2 mm (13.5%) - Line length: All circumferential directions (360 degrees) - Operating distance: 100 mm (adjustable) - Laser wavelength: 635 nm - Laser output: 2 mW - Laser class: Class 1M - Output stability: ±3% or less - Angular error: ±10 seconds or less - Conical mirror: Ceramic with aluminum coating *For other functions and details, please download the catalog or contact us.