HGTECH Multifunctional Laser Welding Machine for Semiconductor Packaging
For precision welding and surface treatment in semiconductor packaging. 2000W laser.
In the field of semiconductor packaging, precise bonding of fine components and reliable connections between dissimilar materials are required. Particularly, to ensure high reliability and long-term durability, precise welding techniques and surface treatment before bonding are crucial. Improper welding or surface treatment can lead to decreased product performance or failures. The HGTECH multifunctional laser welder can not only perform high-precision metal welding but also, depending on specifications and settings, can handle rust removal and cleaning of surfaces, making it capable of meeting diverse needs in semiconductor packaging. 【Application Scenarios】 - Precision welding of fine metal components - Surface cleaning before joining dissimilar metals - Improved bonding reliability through oxide film removal - Surface preparation before and after welding 【Benefits of Implementation】 - Increased reliability through high-precision welding - Improved work efficiency - Compatibility with various metal materials - Consideration at a relatively easy-to-implement price range
- Company:サキノ精機
- Price:1 million yen-5 million yen