Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
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Central Semiconductor Schottky Diode CMOSH-4E
The following four products from Centra Semiconductor are optimal devices for the "LiDAR" in autonomous driving systems and have been adopted by overseas LiDAR manufacturers.
It is possible to perform non-destructive testing from fault location identification to internal observation! High-precision identification of heat generation areas can be achieved.
Thermal analysis is a method for identifying defective areas by detecting heat generated at leak points due to applied voltage using a high-sensitivity InSb camera. By detecting the weak heat generated from shorts and leaks with a high-sensitivity InSb camera, it is possible to non-destructively identify the failure points of electronic components such as semiconductors. Furthermore, non-destructive observation can also be performed using X-ray inspection equipment. 【Features】 ■ Identifying defective areas by detecting heat generated at leak points with a high-sensitivity InSb camera ■ Analyzing samples in a non-destructive state, and also capable of analyzing electronic components that are difficult to analyze with OBIRCH or emission methods ■ Using the lock-in function to acquire phase information allows for high-precision identification of heat generation points *For more details, please refer to the PDF document or feel free to contact us.
Central Semiconductor Schottky Diode CMSSH-3SE
The following four products from Centra Semiconductor are optimal devices for the "LiDAR" in autonomous driving systems and are adopted by overseas LiDAR manufacturers.
We will contribute to speeding up your product development and improving product quality.
Our company provides one-stop services for reliability testing, failure analysis, and material analysis in the fields of electronics, particularly semiconductors, automotive, life sciences, and materials, tailored to meet our customers' needs. Our Nagoya lab is equipped with advanced observation instruments such as the Talos and Titan transmission electron microscopes and the high-performance NEOARM electron microscope. Utilizing these state-of-the-art facilities, our engineers, who have acquired exceptional skills, conduct analyses to deliver results to our customers promptly. Please feel free to contact us if you have any inquiries. 【Technical Advantages】 ■ Expertise in ICs, light-emitting devices, and flat displays ■ Fully equipped lab with various analytical instruments ■ Solutions available in RA, FA, MA, SA, and CA fields ■ High productivity with cutting-edge equipment and specialized knowledge to operate it *For more details, please download the PDF or feel free to contact us.
An online vibration meter that accurately detects equipment abnormalities. It uses a digital meter, improving visibility as well.
【Features】 - Adopts an easy-to-read digital meter display. Signal levels are easily identifiable at a glance. - Alarms can be easily set digitally. You can easily set any value in 1% increments using the digital setting switch. - Equipped with level signal and alarm output functions. It includes level signals (DC 4-20mA) and alarm output (relay output). - Allows for precise diagnostics when connected to a portable diagnostic device. By connecting to portable vibration meters MK-220, MK-220HG, or MK-210HE II, precise diagnostics, frequency analysis, and report output are possible. - Power supply is compatible with worldwide voltage. It can use AC 85-264V power supply, making it suitable for worldwide use.
For constant vibration monitoring of motors, pumps, fans, etc., and equipment diagnostics! It features a digital meter display that is easy to understand at a glance. It supports all modes of acceleration, velocity, and displacement.
■□■Features■□■ ■Adopts an easy-to-read digital meter display Specifications that allow signal levels to be understood at a glance ■Alarms can be easily set digitally With the digital setting switch, any value can be easily set in 1% increments ■Equipped with level signal and alarm output functions Includes level signal (DC 4-20mA) and alarm output (relay output) ■Precise diagnostics possible when connected to a portable diagnostic device When connected to the MK-210HEII vibration data management system, precise diagnostics, frequency analysis, and report output are possible ■Power supply compatible with worldwide voltage Can use AC 85-264V power supply, suitable for worldwide use ■For other features and details, please download the catalog. Alternatively, we can provide detailed specifications! Please contact us.
It is also possible to output as a PDF file as a report. Introducing the features of PowerDMARC!
We would like to introduce the features of the email security service 'PowerDMARC' under MENAInfoSec in the United States. "What is the current configuration of our own domain's SPF/DKIM/DMARC/BIMI and MTA-STS?" and "What policies are applied when sending emails from each system?" can be understood through various analysis tools. Please feel free to contact us when needed. 【Features】 ■PowerAnalyzer ■MailAuth Analyzer ■PowerToolBox *For more details, please refer to the PDF materials or feel free to contact us.
It is possible to estimate the curing time of epoxy resin from the DSC measurement results. We will simulate using the Kamal model.
In semiconductor packaging, it is important to understand the curing time of epoxy resin. The Kamal model is widely used as the reaction rate equation for the curing of epoxy resin. The coefficients of the Kamal model can be determined from the non-isothermal curing behavior measured by DSC (Differential Scanning Calorimetry). In this case, we will introduce "Analysis of Curing Characteristics of Epoxy Resin by Thermal Analysis using DSC." Please take a moment to read the PDF materials. In addition to DSC, our company also specializes in various thermal analyses such as TG/DTA and TMA. ● DSC: It can be used for analyzing sample melting, glass transition, thermal history, crystallization, curing, Curie point, and measuring specific heat. ● TG/DTA: It can be used for analyzing moisture content, ash content, decomposition, oxidation, and evaluating thermal resistance. ● TMA: It can be used for measuring sample expansion rate, glass transition, and softening point. Please see the following for various examples of thermal analysis: https://www.seiko-sfc.co.jp/case/index.html *Other materials are also available. If you request through the inquiry button, we will send them to you.
The results of DMA measurements can predict the long-term deformation (creep measurement) of materials. This can be utilized in evaluations that typically take a long time.
At our company, by applying the WLF rule (the time-temperature superposition principle) to the results of DMA measurements, we can estimate properties such as elasticity in frequency regions that have not actually been measured (creating master curves). Would you like to utilize this technology to understand material properties? In this case, we introduce an example of this technology: "Prediction of long-term deformation of rubber (creep test)". Please refer to the PDF document for details. In addition to DSC, our company also specializes in various thermal analyses such as TG-DTA and TMA. https://www.seiko-sfc.co.jp/service/thermal.html ●DSC (Differential Scanning Calorimetry): Used for analyzing melting, glass transition, thermal history, crystallization, curing, Curie point, etc., and for measuring specific heat. ●TG-DTA (Thermogravimetric and Differential Thermal Analysis): Used for analyzing moisture content, ash content, decomposition, oxidation, and evaluating heat resistance. ●TMA (Thermomechanical Analysis): Used for measuring expansion rate, glass transition, softening point, etc. Please see below for other examples as well. https://www.seiko-sfc.co.jp/case/index.html
Estimate bonding states by comparing with standard spectra! Introducing state analysis using EPMA.
In the state analysis using EPMA, changes (shifts and shapes) in the characteristic X-ray peak wavelengths due to differences in the chemical bonding states (ionic valence, crystal structure, coordination number) of oxides and silicates are utilized to estimate the bonding states by comparing with standard spectra. In the identification of two types of copper oxides, when distinguishing between black CuO and red Cu2O by color is difficult, especially for microscopic objects that require an electron microscope, it is possible to grasp the oxidation state using EPMA. Additionally, while XPS is effective for measuring thin oxide layers on aluminum surfaces, EPMA can be used to understand the oxidation state of small foreign particles, bulk materials, and composites. 【Device Specifications】 ■ Manufacturer: JEOL Ltd. Jeol-8200 ■ Analysis Method: Wavelength Dispersive X-ray Analysis (WDX) ■ Analyzable Elements: B to U ■ Energy Resolution: 20 eV (EDX is approximately 130 eV) ■ Detection Limit: 0.01% and above ■ Maximum Sample Size: 100x100 mm *For more details, please refer to the PDF document or feel free to contact us.
The deformation and fracture of plastic washers, gaskets, etc., due to localized compressive stress can be estimated using a TMA and stress-strain measurement device.
●Sample: Estimation of deformation and fracture due to localized compressive stress on plastic washers, gaskets, etc. ●Method: Compression creep measurement and stress-strain measurement using TMA (Thermomechanical Analysis) and stress-strain measurement equipment. ●Results: The deformation of the sample due to compression was understood from the creep curve and stress-strain curve. Please take a moment to read the PDF materials. In addition to TMA, our company also specializes in various thermal analyses such as DSC and TG/DTA. ●DSC: Can be used for analysis of sample melting, glass transition, thermal history, crystallization, curing, Curie point, etc., as well as measuring specific heat. ●TG/DTA: Can be used for analysis of moisture content, ash content, decomposition, oxidation, and evaluation of heat resistance. ●TMA: Can be used for measuring sample expansion rate, glass transition, softening point, etc. We would be happy to discuss this case and thermal analysis with you at any time. https://www.seiko-sfc.co.jp/service/thermal.html Case introduction https://www.seiko-sfc.co.jp/case/index.html *Other materials are also available. Please request them through the inquiry button, and we will send them to you.
A new proposal that is the first in the industry! A Raman detector has been added to the FE-SEM!
Traditionally, elemental analysis using an EDS detector during FE-SEM observation was common. Our company has transformed the conventional EDS detector into a windowless EDS, allowing for high-sensitivity analysis from Li to U. Additionally, with the inclusion of a Raman detector, it has become possible to obtain information on different compound forms from organic to inorganic.
Measurement of glass transition temperature, thermal expansion coefficient, and linear expansion coefficient.
TMA (Thermomechanical Analysis) is a technique that measures the deformation of a material as a function of temperature by applying a non-oscillatory load while changing the temperature according to a controlled program. The following measurements can be performed with TMA: - Measurement of linear expansion coefficient and expansion rate - Measurement of glass transition temperature - Measurement of softening temperature Additionally, probes for tensile mode and penetration are available, allowing for the measurement of samples in film and sheet forms.
Information on thermal expansion, thermal contraction, and glass transition temperature can be obtained in multiple measurement modes!
TMA (Thermomechanical Analysis) is a method that measures the dimensional changes of a sample while applying a constant load and varying the sample temperature. It provides information on thermal expansion, thermal contraction, glass transition temperature, and more. The temperature range is from -150 to 1000°C, with a maximum size of Φ10×25mm (compression mode, needle insertion mode) and a maximum size of 0.7mm×5mm×20mm (tensile mode) as measurable conditions. This document includes case studies of TMA analysis for semiconductor encapsulants. 【Features】 ■ Thermomechanical measurement ■ Applying a constant load to the sample while varying the sample temperature ■ Measuring the dimensional changes of the sample ■ Obtaining information on thermal expansion, thermal contraction, glass transition temperature, etc. ■ Multiple measurement modes *For more details, please refer to the PDF document or feel free to contact us.
![Attachment-type micro Raman sensor [World's smallest, portable type]](https://image.mono.ipros.com/public/product/image/d61/2001504894/IPROS595832949898700248.png?w=280&h=280)
World's smallest class micro Raman spectroscopy sensor
We would like to introduce the "Attachable Raman Sensor" that we handle. Instead of expensive and large Raman microscope systems, it can be easily attached to your existing microscope in just one minute, achieving overwhelming cost performance. As one of the world's smallest plug-in mini Raman devices, it instantly transforms your microscope into a Raman device. You can immediately perform Raman spectroscopic measurements using your smartphone or tablet. 【Features】 ■ One-fifth the price of conventional products ■ Highly sensitive micro Raman spectroscopic sensor ■ Micro Raman spectroscopic sensor that fits in the palm of your hand ■ Remote measurement capability (check measurement results anywhere using a tablet or smartphone) *For more details, please download the PDF or feel free to contact us.
