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Non-contact transport device - List of Manufacturers, Suppliers, Companies and Products

Non-contact transport device Product List

16～27 item / All 27 items

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Cleanroom-compatible "Bernoulli Chuck WAS Type"

Cleanroom-compatible "Bernoulli Chuck WAS Type"

Clean room compatible Bernoulli chuck that does not scatter debris.

The cleanroom-compatible "Bernoulli Chuck WAS type" efficiently suspends and transports workpieces in a non-contact state by ejecting gas. The "Bernoulli Chuck WAS type" is equipped with an exhaust recovery mechanism that captures the exhaust emitted from the nozzle, preventing the exhaust from leaking into the cleanroom. Therefore, it can be used for non-contact transport of wafers, glass substrates, and other items within the cleanroom.

  • Actuator
  • Wafer

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50μm thick ultra-thin glass non-contact transport device LNAS type

50μm thick ultra-thin glass non-contact transport device LNAS type

Non-contact transport of ultra-thin glass substrates with a thickness of 50μm - Non-contact transport device "50μm Thick Ultra-Thin Glass Non-Contact Transport Device LNAS Type"

The non-contact suction mechanism of the "50μm thick ultra-thin glass non-contact transport device LNAS type" is equipped with a gas deflector directly below the air jet nozzle. The gas deflector redirects the high-pressure air flow ejected from the nozzle at a right angle, causing it to collide directly with the ultra-thin glass without damaging it. Therefore, as shown in the pressure distribution diagram, there is no localized stress applied to the ultra-thin glass by the high-pressure ejected air (it is in a negative pressure state). As a result, thin workpieces and fragile ultra-thin glass will not be damaged.

  • Stepper

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Heat-resistant specification: Non-contact transport device "Float Chuck SAH type"

Heat-resistant specification: Non-contact transport device "Float Chuck SAH type"

Bernoulli chuck for non-contact transfer of high-temperature workpieces.

This product is manufactured according to the usage environment temperature and chemical specifications. The quartz glass used in ultra-high temperature applications possesses numerous characteristics, such as high purity, resistance to heat and acid, and high mechanical strength. It has become possible to transport wafers non-contact in cleaning tanks, oxidation diffusion furnaces, etching devices, CVD devices, etc., in the semiconductor manufacturing process, as well as non-contact transport of glass molding lenses. Additionally, products are made to suit various environments, including aluminum, SUS, PEEK, and others. ◎ Features 1. Heat resistance up to 1000°C 2. Materials are selected based on the usage temperature environment. PTFE, PEEK, aluminum, SUS316, quartz, considering acidic, alkaline, and corrosive gases. ◎ Target Work 1. High-temperature wafers 2. Glass molded lenses and preforms 3. Compound semiconductor wafers 4. Glass substrates

  • Evaporation Equipment
  • Wafer
  • Other industrial robots

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Concave/Convex Lens Universal Bernoulli Chuck Type W

Concave/Convex Lens Universal Bernoulli Chuck Type W

Both convex and concave lenses are transported non-contact using the same Bernoulli chuck type W.

The non-contact transport device "Convex/Concave Lens Shared Bernoulli Chuck Type W" can maintain and transport items in a suspended state without contact by ejecting gas towards the lens. This is made possible by forming two types of curved surfaces, convex and concave lenses, on the operating surface opposing the lens (patent pending). When the gap between the operating surface and the lens is large, the gas ejection nozzle, cushion chamber, and the gap between the operating surface and the lens function as the nozzle, vacuum chamber, and diffuser of an ejector, respectively. As a result, a negative pressure is generated in the cushion chamber, pulling the lens closer. When the lens is drawn in and the gap with the operating surface decreases, the cushion chamber functions as a pressure chamber type air cushion (hovercraft), causing the pressure in the cushion chamber to rise sharply, which separates the lens. This maintains the lens in a non-contact suspended state in the air at a distance that automatically keeps the balanced pressure of the cushion chamber between the operating surface and the lens.

  • Other semiconductors
  • Other semiconductor manufacturing equipment
  • Other physicochemical equipment

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Ultra-thin wafer non-contact transport device

Ultra-thin wafer non-contact transport device

Transport ultra-thin wafers with a thickness of 20μm by bending, warping, and without damage in a non-contact manner.

TAIKO wafers, ultra-thin wafers with a thickness of 20μm, and compound semiconductor wafers can be suspended and transported non-contact without damage. It does not cause stress on the wafers. Wafers with warping can also be suspended and transported non-contact without damage. The air consumption is very low, making it economical.

  • Other semiconductor manufacturing equipment
  • Wafer
  • Semiconductor inspection/test equipment

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Wafer chip non-contact transport device

Wafer chip non-contact transport device

Transporting micro wafer chips and micro lenses non-contact.

It is non-contact. It is possible to transport small workpieces non-contact. There are no scratches or dirt attached. There is no damage.

  • Other semiconductor manufacturing equipment
  • Other physicochemical equipment

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Amorphous solar cells, film transport device

Amorphous solar cells, film transport device

Transport, stack, and send the film non-contact.

A device that non-contact feeds, transports, and laminates amorphous solar cells, polarizing plates, light guide plates, films, paper, and sheets. It employs a non-contact transport device called "Float Chuck" (patented), which transports films non-contact by blowing air. It does not allow scratches or dirt to adhere to the workpiece. It is also suitable for weak and fragile films.

  • Other industrial robots
  • Semiconductor inspection/test equipment
  • Other machine elements

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10G glass substrate non-contact transport device

10G glass substrate non-contact transport device

10G glass substrate non-contact transport device

A non-contact transport device that holds and conveys workpieces in a suspended manner by ejecting gas. It employs a new mechanism for the gas ejection system, with the air ejection outlet positioned at a small angle relative to the workpiece. There is no deceleration of airflow velocity caused by friction losses due to wall contact of the airflow. The amount of negative pressure generated increases, and the efficiency of load generation improves. Compared to conventional technology, the suspension capability has significantly increased, and gas consumption has nearly halved. Therefore, it is adopted for the non-contact transport of large workpieces with high loads, particularly for the eighth generation large glass substrates (2200mm x 2200mm) used in LCDs, which had previously been avoided due to air consumption issues.

  • Other semiconductor manufacturing equipment
  • Other conveying machines
  • Transport and handling robots

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Non-contact transfer device "Float Chuck WLNA Type"

Non-contact transfer device "Float Chuck WLNA Type"

Grip and transport FPC, through-hole boards, films, and breathable non-woven fabrics without causing damage.

It grips, chucks, and transports flexible materials such as film, amorphous solar cells, paper, green sheets, non-woven fabrics, breathable materials, foams, and soft bodies. By blowing air towards the workpiece, it generates negative pressure through the Bernoulli effect, allowing it to chuck, grip, transport, stack, and handle the workpiece in a non-contact state.

  • Other conveying machines
  • Other semiconductor manufacturing equipment
  • Other packaging machines

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VGFS Non-contact Transport Device "Float Chuck SAC Type"

VGFS Non-contact Transport Device "Float Chuck SAC Type"

Adopting the gas vertical jet flow method (VGFS), the Bernoulli chuck "Float Chuck SAC type" series reduces friction loss in the gas flow.

The "Float Chuck SAC Type" series, which adopts the gas vertical jet flow system (VGFS) and reduces friction loss in the gas flow, has newly implemented this gas vertical jet flow method. The gas vertical jet flow method vertically jets the gas flow ejected from the nozzle into the cushion chamber, reducing friction loss in the gas flow within the cushion chamber, enhancing the effect of negative pressure generation, and significantly increasing the suspension capacity compared to conventional types. This results in improved holding stability, increased resistance to impact, and nearly halved gas consumption.

  • Other semiconductor manufacturing equipment
  • Other machine elements
  • Transport and handling robots

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Non-contact chuck "Float Chuck SA Type"

Non-contact chuck "Float Chuck SA Type"

Bernoulli chuck with air consumption reduced to one-third of the conventional amount.

Transport the workpiece non-contact. The air consumption is one-third of the conventional amount. The holding force is strong. It has excellent holding stability.

  • Other semiconductor manufacturing equipment
  • Chuck
  • Plasma Generator

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Non-contact transport device for green sheets "Float Chuck SAG type"

Non-contact transport device for green sheets "Float Chuck SAG type"

Transporting green sheets by air.

The non-contact transport device for ceramic green sheets, "Float Chuck SAG Type," holds and transports ceramic green sheets in a non-contact manner by blowing air through gas. The "Float Chuck SAG Type" is equipped with a nozzle that prevents high-speed air flow from directly colliding with the green sheet, thereby protecting the thin and fragile green sheets, which are 120μm thick, from damage and breakage due to the high-speed air flow. Additionally, the "Float Chuck SAG Type" uses a small amount of air, making it efficient. ◎ Features 1. Transports and handles ceramic green sheets without contact. 2. Capable of transporting through-hole and perforated sheets. 3. Does not damage or break thin ceramic green sheets of 120μm thickness. 4. Can transport ceramic green sheets without bending them. 5. Low air consumption. 6. Does not pollute the environment.

  • Other conveying machines
  • Circuit board processing machine
  • Pneumatic Equipment

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