東洋精密工業 List of Products and Services

Table of Contents 01. Overview of Metal Etching This section explains the basics of metal etching. 02. Common Design Mistakes in Metal Etching This section discusses common design mistakes found in metal etching blueprints and their countermeasures. 03. Products to Watch Out For! Products and Shapes Prone to Issues This section explains products and shapes that are prone to issues during metal etching processing. 04. Three Points to Be Aware of During Design This section introduces three points to keep in mind during the design phase. Please use it as a checklist when creating drawings.

• Secondary Cells/Batteries

In recent years, components for solid oxide fuel cells (SOFC), such as "interconnectors" and "separators," have been actively developed. The anode (hydrogen) side and the cathode (oxygen) side are paired, and by stacking multiple layers along with other components, they form the core of the fuel cell, known as the stack. These components are very compatible with etching processes, which can maintain the flatness of the bonding surface while allowing for free layout of grooves within the plane. This is particularly our area of expertise, especially in thick material etching, where we have a lot of experience. The sample in the photo is made of stainless steel, but in practice, there are many cases where special proprietary materials developed by various material manufacturers are used.

• Other surface treatment equipment

This is a manufacturing example of thick film circuit boards processed using screen printing technology. Compared to thin film circuit boards, they are cost-effective and can accommodate large production runs. Based on our past achievements, we will select screens and pastes and propose suitable specifications to meet your requirements. We also challenge ourselves to process irregular materials and special conditions. 【Case Overview】 ■Materials: Alumina, aluminum nitride, glass, metal materials, resin materials, etc. ■Types of paste: Au, Ag, Ag/Pd, Ag/Pt, glass, solder resist, polyimide ink, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts
• Circuit board design and manufacturing

This is a manufacturing example of thin film circuit substrates that combines vacuum film formation through sputtering and deposition with photolithography. We can accommodate a wide range of processing variations, including hole drilling and contour cutting using lasers and dicing, as well as thin film resistor formation, providing high-quality thin film circuit substrates with a high degree of design flexibility. We can also process supplied materials or handle only specific processes. 【Case Overview】 ■Materials: Alumina, Aluminum Nitride, Quartz Glass, etc. ■Thickness: 0.1 to 1.0 mm ■Conductor Films: Ti/Pd/Au, Ti/Pd/Cu/Ni/Au, Ti/Pt/Au, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts
• Circuit board design and manufacturing

This is a manufacturing case where a precise solder resist pattern was formed on the surface of a circuit board to prevent solder adhesion and ensure mounting position accuracy. By using photosensitive solder resist and processing through a combination of screen printing and photolithography, it is possible to achieve high-precision resist pattern formation. Please feel free to consult us when needed. 【Case Overview】 ■ Material: Alumina ■ Metal Film: Ti/Pd/Au ■ Solder Resist: Thickness 18um, Line Width 0.5mm, Aperture Diameter φ0.2mm *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts
• Circuit board design and manufacturing

This is an introduction to a manufacturing case that involves patterning processing on the sides of substrates to enable high-density implementation. It is possible to form circuits on one to four sides of high thermal conductivity ceramic substrates such as alumina and aluminum nitride. Please feel free to consult us when needed. 【Case Overview】 ■ Material: Alumina, Aluminum Nitride ■ Conductor Film: Ti/Pt/Au ■ Chip Size: 1.72mm × 1.1mm × 0.5mm *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts
• Circuit board design and manufacturing

This is an introduction to a manufacturing case where thick copper patterns were formed on ceramic substrates to meet the needs of high current and high heat dissipation. By using a thin film process, it is possible to create copper electrode patterns with a thickness of approximately 100um in fine pitch. Please feel free to consult us when needed. 【Case Overview】 ■Material: Alumina, Aluminum Nitride ■Film Structure: Ti/Cu/Ni/Au ■Copper Thickness: up to 100um ■L/S: 120/120 (Copper thickness 100um) *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts
• Circuit board design and manufacturing

This is an introduction to a manufacturing case where depressions were formed on the substrate surface. By combining photolithography and sandblasting, high-precision, fine-pitch depression formation is possible. Depressions can be formed on both the base material and the metallized areas, accommodating various shapes according to applications such as preventing adhesive flow during assembly and positioning of components. 【Case Overview】 ■ Material: Alumina, Aluminum Nitride, Quartz Glass ■ Product Size: □5.0mm ■ Conductor Film: Ti/Pd/Au ■ Depression Processing: Depth 0.1mm, Width 0.1mm～ *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts
• Circuit board design and manufacturing

This is an introduction to manufacturing examples of thin film metallization processing on the outer peripheral parts of glass lenses and sapphire caps. We form a metallization film to achieve high-density and reliable metal bonding and sealing. By using our metal tray with clamping function, "CCMT," it is also possible to accommodate individual chips. 【Case Overview】 ■ Material: Alumina, Quartz Glass ■ Metal Film: Ti/Pd/Cu/Ni/Au, Ti/Pt/Au ■ Chip Size: □3.3mm, φ2.8mm *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts
• Circuit board design and manufacturing

This is a manufacturing example of high-precision curved surface printing on cylindrical substrate surfaces. Our company utilizes screen printing technology to challenge circuit formation on irregular substrates and special materials, which are difficult to automate and mass-produce. We respond quickly from prototyping to mass production with reliable domestic production, including photo etching, metal etching, circuit boards, and photomasks. 【Case Overview】 ■Material: Glass tube ■Substrate size: φ26mm×150mm ■Film specification: Ag ■Film thickness: 70um *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts
• Circuit board design and manufacturing
• Printing/Publishing

LED lighting and recent electronic devices such as MPUs have been advancing in high integration and high performance, leading to an increasing tendency for heat generation, making cooling increasingly important. In response, our company has started processing heat dissipation layers on metal materials using printing technology, as the demand for TIM (Thermal Interface Material) to be placed between heat dissipation substrates and heat sinks is rising. While other products enhance thermal conductivity through the properties of the materials themselves, our products are characterized by using printing technology to design the thickness of the heat dissipation layer thinner than that of other TIMs, thereby improving thermal conductivity. [Case Overview] - Thickness of the heat dissipation layer: 40μm to 120μm (theoretically possible to be thicker) - Thermal conductivity: 2.0 W/mK - Capable of forming heat dissipation layers on metals such as aluminum and copper - Heat dissipation sheets are also under development *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts
• Circuit board design and manufacturing

We will introduce examples of manufacturing substrates for implementing semiconductor devices such as optical modules for optical devices (DVD/CD recorders, optical communication), semiconductor laser diodes, and semiconductor photodiodes. With the trend towards miniaturization and thinness of devices, the demand for implementing multiple elements in a low area and high density is increasing. Therefore, we have established side patterning technology for substrates. It is possible to form circuits on one to four sides of high heat dissipation ceramic substrates such as alumina and aluminum nitride. 【Case Overview】 ■ Base Material: Alumina, Aluminum Nitride, etc. ■ Conductor Film Composition (Au-based wiring, Cu-based wiring *Pt barrier film compatible) ■ Resistance Film Composition (TaN, NiCr), Solder Flow Prevention Film (Cr, Solder Resist) ■ Implementation Support: Wire/Ribbon Bond, Bump, Various Soldering Specifications Available ■ Testing/Reliability: Compatible with MIL specifications and other customer-specified specifications *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts
• Circuit board design and manufacturing

This is a manufacturing example of metal-based circuit boards that meet the increasing demands for heat dissipation and heat resistance in applications such as high-power LEDs, automotive, and power supply uses. Metal-based circuit boards can be applied as heat dissipation substrates for power semiconductors and as base substrates for LED mounting. Please feel free to consult us when needed. 【Case Overview】 ■ Base materials: Aluminum, copper, etc. ■ High heat dissipation insulating layer: Thermal conductivity 4.4 W/mk, insulation withstand voltage: 4 kV or more ■ Conductor layer: Ag, Ag/Ni/Au, etc. ■ High reflectivity insulating layer (for LEDs): Reflectivity over 90% *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts
• Circuit board design and manufacturing

This is a manufacturing case of internal collaboration between the circuit board business and the photomask business. In normal patterning, photomasks are used for patterning, but this time, we directly patterned on the substrate coated with photoresist using a drawing device that draws the photomask, exposing it to light for patterning. As a result, we were able to create fine patterns at the "L/S=5μm" level, which are impossible to achieve with normal patterning. [Case Overview] ■ L/S: Targeting 5μm → L=4.7μm/S=5.1μm ■ Film Specifications: From the base layer Cu 2μm/Ni 0.5μm/Au 1μm (Total thickness 3.5μm) *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts
• Circuit board design and manufacturing

We would like to introduce a manufacturing case of CCMT where barcodes and QR codes were engraved using a laser marker. There is an increasing number of cases where identification codes are added to trays and other jigs for product lot management, jig identification, and life management. In our company, when engraving letters or other markings on products, we use half-etching for the same letters on identical products, and laser marking for different letters, such as serial numbers, for each product. 【Case Overview】 (CCMT Specifications) ■External Dimensions: 80×80mm ■Compatible Work Sizes: 8×8mm/3.2×2.5mm (Engraving Specifications) ■Equipment Used: Laser Marker ■Engraving Content: Barcode/QR Code *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

This is a manufacturing example of CCMT designed with consideration for the transport system of equipment. Leveraging our strength of being able to handle everything in-house from design to processing, we propose a suitable design and specifications for CCMT that take into account the constraints of using existing equipment. We will proceed in a way that can meet your requests as much as possible regarding external dimensions, shapes, thicknesses, etc., so please feel free to inquire about the feasibility of our response. [Case Overview] ■External Size: 200×47mm Thickness 1.0mm (Pocket Depth 0.6mm) ■Material: Stainless Steel (SUS304, SUS430) ■Compatible Work Size: □3.0mm×0.6mmt～ *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

When using CCMT in the process of work recognition by camera, there was a malfunction where errors occurred in image recognition due to halation. As a countermeasure, we would like to introduce a manufacturing example where surface treatment aimed at preventing halation was applied to CCMT. As a result of trying various surface treatments, we adopted "matte black low-temperature black chrome plating," which had a higher halation prevention effect. In this way, we can flexibly respond to special specifications tailored to the circumstances of your usage process, so please feel free to contact us. 【Case Overview】 ■External dimensions: □80mm, thickness 0.9mm (pocket depth 0.6mm) ■Material: Stainless steel (SUS304, SUS430) ■Surface treatment: Low-temperature black chrome plating (heat resistance temperature 260℃) *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

We would like to introduce a manufacturing example of CCMT corresponding to circular workpieces. While many examples of CCMT production target square chip shapes, we can leverage the high degree of freedom in shape offered by etching processing to accommodate various shapes of workpieces, including circular ones. We will design based on the conditions and requests regarding the shape, size, and clampable positions of the workpiece, so please feel free to contact us for more details. 【Case Overview】 ■Outer dimensions: 100×45mm (thickness 1.0mm) ■Pocket depth: 0.5mm ■Material: Stainless steel (SUS304, SUS430) ■Supported workpiece shapes: Cylindrical, circular shapes ■Supported workpiece sizes: φ10.0 +0.1/-0.5mm thickness 0.50mm or more *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

We would like to introduce a manufacturing example of CCMT for double-sided processing. Unlike conventional CCMT, by eliminating the base plate, it is possible to access both the front and back surfaces of the workpiece simultaneously. Tasks such as printing, film formation, and inspection can be carried out on both sides at the same time. *For more details, please refer to the PDF materials or feel free to contact us.

• Other electronic parts

Due to requests from some customers, we are performing additional processing such as hole drilling and recessing on photomasks. Previously, we used sandblasting for similar processing, but by using ultrasonic drills, the processing shapes have become sharper, and chipping has been reduced. We have the drilling machines in-house, allowing for short lead times through integrated in-house processing. Additionally, the original plates required for sandblasting are no longer necessary, making it cost-effective as well. 【Product Specifications】 ■ Supported materials: Soda-lime glass, synthetic quartz, etc. ■ Processing work dimensions: Maximum □300mm ■ Positioning accuracy: ±5μm for each axis ■ Repetition accuracy: ±2μm for each axis ■ Recess depth accuracy: ±20μm (based on actual values) *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Surface treatment contract service
• Photomask

When requesting a photomask outside of the standard specifications, it is common practice to draw it on a material that is at least one size larger and then cut it down to the desired size. In this case, the scribe cut typically handled in-house involves using a diamond cutter to create a scribe line (a narrow, shallow groove) before breaking it apart, which inevitably results in a taper at the cut edge. Occasionally, this taper is undesirable, and in such cases, we have relied on external vendors with specialized equipment for cutting. This time, to handle it in-house, we introduced a finishing process using a drilling machine to remove the taper. By applying this finishing process, the taper is eliminated, improving both appearance and dimensional accuracy. Additionally, since costs and time previously incurred for outsourcing are reduced, we believe that if the specifications allow for in-house handling, it can provide advantages in terms of cost and delivery time. *For more details, please refer to the PDF document or feel free to contact us.*

• Processing Contract
• Surface treatment contract service
• Photomask

This is an example of a surface heating element (heater pattern) created by etching. The feature of this sample is that there are no bridges (connections) between the patterns. Because there are no bridges, in a typical process, the pattern parts would droop during processing, making it impossible to work on them. However, by using a special process, it is possible to process without bridges. By creating it without bridges, as in this example, we have been able to solve the disadvantages. 【Product Specifications】 ■Material: SUS304-H ■Thickness: 50μm, 100μm ■Pattern Width: 1mm ■Other: Bridge-less (single-sided etching) specification *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Etching Equipment
• Surface treatment contract service

We would like to introduce a processing example of a slit plate for a rotary encoder. After etching a stainless steel plate, it has been treated with a black dyeing process for anti-reflection. The image shows a sample modeled after a typical shape, but it can be manufactured according to your specified shape and specifications. 【Product Specifications】 ■ Material: SUS304 ■ Outer diameter: φ30mm ■ Material thickness: 150μm ■ Surface treatment: Low-temperature black chrome treatment *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Etching Equipment
• Surface treatment contract service

Introducing a copper heat sink with high thermal conductivity. Utilizing the high processing flexibility of etching, we have formed dimples, embossing, slits, and fin shapes to increase the surface area and enhance heat dissipation. 【Product Specifications】 ■Material: Oxygen-free copper ■Thickness: 1.0mm ■Combination of half processing and through processing by etching *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Etching Equipment
• Surface treatment contract service

We would like to introduce a cooling component that utilizes the vaporization of liquid and capillary phenomena. In this sample, a hollow structure is formed on the case side to encapsulate the liquid, and a fin structure is created on the lid side to enhance heat dissipation, using half processing, which is our specialty in etching. 【Product Specifications】 ■Material: Oxygen-free copper ■External dimensions: 80×50mm ■Thickness: 0.5mm×2 layers *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Etching Equipment
• Surface treatment contract service

We would like to introduce a mesh that creates a pattern by arranging holes of different diameters. This is an example of processing that takes advantage of the characteristics of etching, which is skilled in multi-hole processing and allows for freely changing the opening diameter within the same surface. Previously, similar processing was often used for speaker mesh to protect the speaker part of televisions. In this example, there are only two hole diameters, but it is also possible to create a gradient effect by gradually changing the diameter. 【Product Specifications】 ■Material: SUS304 ■Thickness: 0.3mm ■Hole Diameter: φ0.4mm/φ0.8mm *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Etching Equipment
• Surface treatment contract service

We would like to introduce a set of metal masks and work holders used for pattern film formation on workpieces through sputtering and vapor deposition. Depending on the usage, in this sample, the holder and mask are positioned by pins and fixed with magnets. We have extensive experience in responding to designs based on information about the workpiece and patterns. 【Product Specifications】 ■Material: SUS430 ■Lamination Method: Spot Welding *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Etching Equipment
• Surface treatment contract service

Introducing the lid used for sealing ceramic packages. This product is often produced using low thermal expansion Kovar material and features bridge-less etching that does not leave bridge marks. It is also available in a plated specification. 【Product Specifications】 ■Material: Kovar ■Thickness: 0.4mm *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Etching Equipment
• Surface treatment contract service

We would like to introduce shims (spacers) used for thickness adjustment. Etching that does not produce burrs or edges during processing is suitable for shims where thickness precision is emphasized. The initial costs are also low, and we can accommodate a wide range from prototyping to mass production. 【Product Specifications】 ■Material: SUS304 ■Plate thickness: 0.1mm *Various plate thickness options are available. *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Etching Equipment
• Surface treatment contract service

Here is a sample of a carrier used for transporting workpieces. The components created by etching are bonded together using thermal pressing (diffusion bonding), and a taper for guiding the workpiece is added to the pocket entrance through machining. The surface is finished smoothly with electropolishing. Compared to manufacturing everything through machining, this method is often more cost-effective and is characterized by its resistance to warping even under thermal conditions. 【Product Specifications】 ■Material: SUS304 ■Total Thickness: 2mm ■Processing: Etching, Thermal Pressing, Machining, Electropolishing *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Etching Equipment
• Surface treatment contract service

We would like to introduce a sample of a tray that incorporates a flow channel structure by joining parts with grooves etched using half-etching through thermal pressing (diffusion bonding). Imagine vacuuming through the flow channel to adsorb the workpiece. A significant feature of etched laminated products is their ability to reproduce three-dimensional structures that are impossible with machining. 【Product Specifications】 ■Material: SUS304 ■Total Thickness: 1.3mm ■Etching, Thermal Pressing *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Etching Equipment
• Surface treatment contract service

We would like to introduce a decorative processing technique that creates patterns on stainless steel surfaces using half-etching. By combining fine dots and lines, various expressions can be achieved. The use of mirror-finished or hairline materials, as well as additional plating or surface treatment after processing, further expands the range of expressions. There are also proven applications in the housings of mobile phones and laptops, as well as in automotive interior parts. 【Product Specifications】 ■Material: SUS304 ■Thickness: 0.2mm ■Processing: Half-etching *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Etching Equipment
• Surface treatment contract service

Here is a sample of mesh with holes in shapes other than circles. It is possible to express various shapes such as squares, triangles, and honeycombs. One of the major features of etched mesh is the ability to freely change the opening shape and size within the same plane. 【Product Specifications】 ■Material: SUS304 ■Thickness: 0.05mm *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Etching Equipment
• Surface treatment contract service

Here is a sample of a copper bus bar. We specialize in processing thick plates and can accommodate copper plates with a thickness exceeding 1.0mm. The initial costs are also low, and we can handle everything from urgent prototypes to mass production. 【Product Specifications】 ■Material: Oxygen-free copper ■Plate thickness: 1.0mm *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Etching Equipment
• Surface treatment contract service

Toyo Precision Industry Co., Ltd. started in 1971 as a company specializing in photo-etching. Since then, we have provided services that combine photolithography technology as our core with various surrounding technologies, earning your continued support. The various precision processing products we offer are widely used as essential components in various devices, as well as fixtures for efficient production of those devices. Moving forward, we will continue to focus our energy on constant technological innovation in the ever-changing field of advanced technology, responding to our customers' needs, and creating a FRIENDLY and EXCITING company, as we pursue a Rich Life & Rich Mind together with all of you. 【Business Activities】 ■ Metal Etching ■ Photomasks ■ Circuit Boards ■ Metal Crafts *For more details, please refer to the PDF materials or feel free to contact us.

• Processing Contract

This document introduces the circuit boards of Toyo Seimitsu Kogyo. We propose suitable processing by combining a wide range of resources such as sputtering, plating, etching, screen printing, sandblasting, and laser processing. By utilizing our extensive in-house processes, we achieve short delivery times and can accommodate various reliability tests. We provide a stable supply of high-quality, highly reliable products. 【Contents (partial)】 ■ Thin film circuit process image ■ Standard design rules ■ Inspection support ■ Reliability testing support ■ Thick film circuit process image *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

This document introduces the photomasks from Toyo Seimitsu Kogyo. We utilize various resources, including strictly managed clean rooms, high-spec drawing equipment, automated developing and cleaning devices, as well as numerous inspection and measurement devices, to meet these quality requirements. We also focus on delivery times and cost management, achieving both the shortest delivery time of one day and cost performance. [Contents (partial)] ■ Process image diagram ■ Photomask standard specifications ■ Drawing examples ■ Inspection and quality assurance system *For more details, please refer to the PDF document or feel free to contact us.

• Photomask

This document introduces the metal etching services of Toyo Precision Industry. We can accommodate a wide range of production volumes, from prototype levels of a few pieces to mass production levels of tens of thousands, regardless of lot size. We have extensive experience in mass production projects with a tolerance of ±10μm or less. Starting with our original CCMT, we can provide support and proposals for jig design based on our rich experience. [Contents (partial)] ■ Process image diagram ■ Main processing materials ■ Standard processing plate thickness ■ About bridge marks ■ Standard design rules *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

●Is your chip production process okay? □Struggling with handling small chips □There is a process for transferring chip trays in the production process □Currently using resin chip trays □Want to perform vacuum deposition, screen printing, assembly, and inspection while keeping the chip trays If you checked any of the above, please consider introducing CCMT immediately! By incorporating precision spring components through etching processing inside metal trays, it is possible to collectively secure/release chips and substrates.

• Spring
• Inspection fixture
• Processing Jig

1) If you are having trouble with heat generation and dissipation on the substrate due to the integration of heating chips, please consult Toyo Seimitsu Kogyo. 2) We will support you from development design to mass production.

• Other semiconductors
• Printed Circuit Board
• Ceramics

We provide high-precision and high-quality photomasks through a process built by combining high-precision laser drawing equipment, a highly controlled clean environment, and years of accumulated know-how. Our thoroughly streamlined process achieves reduced manufacturing costs and shortened lead times. This allows us to maintain high quality while also offering competitive low prices and the capability for short delivery times, with delivery in as little as one day. Additionally, we are committed to improving quality further by significantly enhancing our equipment, including cleaning and inspection devices, to meet the increasingly sophisticated demands of our customers. We can accommodate a wide range of needs, from inexpensive mass production copy masks to reticles with pellicles. We will provide optimal proposals based on your applications and requirements, so please feel free to contact us for more details.

• Optical Measuring Instruments
• Glass
• lens

Short delivery times and low initial costs with photo-etching processing that does not produce burrs or processing distortion. Leveraging these advantages, we provide a wide range of support from prototyping to mass production, primarily focusing on electronic components such as lead frames, terminals, filters, shims, and spacers. Additionally, our company is dedicated to adding further value to etched products with excellent features by focusing on composite processing, which includes stacking and bonding etched parts as well as various additional machining. We excel in the production of jigs such as trays and carriers, which are often used in processes like chip component processing, assembly, and inspection, as well as metal masks. With an in-house design department, we can respond to customer requests from design and drafting, particularly for jig-related items. We offer flexible and optimal proposals from a variety of items, including our original product, metal trays with chip retention features, helping to improve customer quality and streamline processes.

• Other machine elements
• Other electronic parts
• Processing Contract

●Is your chip production process okay? □ Struggling with handling small chips □ There is a process for transferring chip trays in the production process □ Currently using resin chip trays □ Want to perform vacuum deposition, screen printing, assembly, and inspection while keeping the chip trays If you checked even one box, please consider introducing CCMT immediately!

• Spring
• Inspection fixture
• Processing Jig

We have developed a millimeter-wave and microwave package that combines an MIC substrate with a ceramic cap processed by microblasting.

• High frequency/microwave parts
• Ceramics
• Other network tools

For non-printed circuit boards, please leave it to Toyo Seimitsu Kogyo. We will propose the optimal board according to your specified requirements.

• Printed Circuit Board
• Organic Natural Materials
• Ceramics