佐用精機製作所 List of Products and Services

This document introduces cap seals and He leak tests. It includes images of the operation of cap seals, as well as images related to the He leak test. Additionally, the significance of gross leak tests is also discussed. Please take a moment to read it. 【Contents】 ■ Cap seal operation images ■ Discharge images and melting ■ He leak test images ■ Conditions for He leak tests *For more details, please refer to the PDF document or feel free to contact us.

• others

We would like to introduce a case where resin potting issues occurred with low-viscosity resin. When a very small amount of resin potting is needed for LED junction coating, the resin does not adhere to the substrate side and is drawn to the needle tip, resulting in defects due to lack of resin potting. By cutting the needle tip at an angle, we were able to spread the resin towards the substrate side, resulting in a consistent amount of resin at the needle tip, allowing for stable potting even with low-viscosity resin. 【Case Summary】 ■ Issues - Resin does not adhere to the substrate side - Defects occur due to lack of resin potting as it is drawn to the needle tip ■ Results - By cutting the needle tip at an angle, we were able to spread the resin towards the substrate side - Achieved stable potting even with low-viscosity resin *For more details, please refer to the PDF document or feel free to contact us.

• Resin processing machine

There is a lack of explanations that connect the problems and their causes commonly encountered in the fields of design and quality management as images. When one can grasp the concepts in the fields of design and quality management, it becomes valuable knowledge when considering material design or when hypothesizing the causes of issues within semiconductors. Our company has experienced a large volume of wire bonding under major manufacturers since the early wire bonding days of the 1980s. We have encountered many issues, including complaints. *For detailed content of the column, please refer to the PDF document. For more information, feel free to contact us.*

• glue

The content I am about to reveal is based on our company's past experiences. Many of these experiences were gained during the mass production of LDs at Sanyo Electric. Additionally, regarding LEDs, we have gained significant experience while assisting with problem-solving during the implementation of CREE chip flip chips, which are based on AuSn bonding. The main purpose of this column is to help you recognize the quality considerations that should be taken into account when designing AuSn bonded products. *For detailed content of the column, please refer to the PDF document. For more information, feel free to contact us.*

• LED Module
• diode
• Other semiconductors

This time, I will explain the operating principle of LEDs and the troubles that can be seen from that principle through imagery. LEDs vary widely in shape and issues depending on their individual wavelengths and applications. It becomes difficult to grasp the operating principle from the physical phenomena of optical semiconductors. If you can understand it intuitively, you will see that there are many similarities among the various shapes and issues. *For detailed content of the column, you can view it in the PDF materials. Please feel free to contact us for more information.

• LED Module
• diode
• Other semiconductors

Our company offers analysis support services (ultrasonic testing) that are useful for confirming the state of semiconductor device packaging and analyzing defective products. Ultrasonic testing is one method of analysis that detects delamination and other issues based on the propagation time and strength of ultrasonic waves. It can not only determine the presence of delamination but also estimate its location and size. Additionally, in investigating the locations of defects in semiconductor module products, we can conduct non-destructive evaluations of joints and non-destructive internal analyses of modules, including tracking investigations of delamination at the interface between circuit boards and plating layers. 【Service Overview (Excerpt)】 ■ Non-destructive evaluation of joints - Investigation of delamination and voids at semiconductor chip joints - Investigation of voids occurring within encapsulating resin *For more details, please refer to the PDF document or feel free to contact us.

• Analysis Services
• Sensors
• LED Module

Our company offers a "Condition Setting Support Service (WB)" to assist with wire bonding condition settings in the manufacturing process from prototyping to mass production. We help with the selection of wire bonding tools based on the structure of the assembled products, confirmation of wire bonding conditions (such as I/B diameter and bonding parameters), and achieving the required wire bonding state. Setting production conditions involves a large work volume and many design and verification elements, so we often receive inquiries about these challenges. Please feel free to consult with us. 【Case Overview】 ■ Assistance with wire bonding tool selection ■ Assistance with confirmation of wire bonding conditions ■ Assistance with achieving the required wire bonding state *For more details, please refer to the PDF document or feel free to contact us.

• Prototype Services
• LED Module
• Other semiconductors

Our company offers a "Design Support Service" to assist with material design and jig/equipment design for various purposes such as implementation, testing, and analysis. We support tasks such as creating image diagrams for confirming requirements and envisioning finished products, as well as drawing creation using CAD. Design work, including conceptualization, drafting, and verification, is very time-consuming, and we believe you may be facing challenges in this area as well. Please feel free to consult with us. 【Service Overview】 ■ Image diagram creation for confirming requirements and envisioning finished products ■ Drawing creation using CAD *For more details, please refer to the PDF document or feel free to contact us.

• Other CAD
• Analysis Services
• Prototype Services

Our company offers "evaluation testing services" for assessing the thermal characteristics of semiconductor-related products. We would like to introduce a case where the thermal characteristics of three types of samples (with different bonding materials) were confirmed and compared through transient thermal resistance measurements. When comparing each sample, the area where the difference in thermal resistance was most pronounced was the "bonding material" domain, confirming that the selection of bonding materials has a significant impact on thermal characteristics. 【Service Overview】 ■ Thermal characteristics of products ■ Thermal resistance and thermal capacity for each material ■ Bonding area of semiconductor devices (based on thermal resistance) *For more details, please refer to the PDF document or feel free to contact us.

• Semiconductor inspection/test equipment
• Circuit board design and manufacturing
• LED Module

We offer "Analysis Support Services (Cross-Section Analysis)" that assist in confirming the state of semiconductor device mounting and analyzing defective products. We cater to a wide range of needs, including evaluation of junctions in semiconductor devices, internal inspection of encapsulated products, and confirmation of product structures. Additionally, by combining this service with our other offerings, we can perform comparative analysis of electrical characteristics between good and defective products, as well as evaluation of mounting (junction) conditions and created items. 【Service Overview】 ■ Evaluation of junctions in semiconductor devices ■ Internal inspection of encapsulated products ■ Confirmation of product structures *For more details, please refer to the PDF document or feel free to contact us.

• Semiconductor inspection/test equipment
• Analysis Services
• LED Module

Our company offers an "Open Information Research Support Service" that assists in the collection of publicly available information in the market and the compilation of that information. This service supports our clients by reducing their research time and the time spent on document preparation, thereby helping them make effective use of their "limited time." Past examples include market research on trends in backlight methods for LCD displays and display sizes of smartphones. [Past Examples] ■ Display Market Research - Trends in backlight methods for LCD displays - Commercial products equipped with QD displays - Display sizes of smartphones - Display sizes of tablets *For more details, please refer to the PDF document or feel free to contact us.

• Other services

We offer a sample production service. As an overview of the service, we produce prototypes for the development of LED materials for lighting, prototypes for the development of LED devices, prototypes for the development of functional elements and devices such as MEMS sensors, and prototypes for the development of functional elements and devices such as optical sensors for communication control. Please feel free to contact us if you have any requests. 【Past Specific Examples (Excerpt)】 ■ Chip Bonding Technology - Support for various bonding materials such as solder, gold-tin, and silver paste ■ Wire Bonding Technology - Use of gold, silver, and copper wire *For more details, please refer to the PDF materials or feel free to contact us.

• LED lighting
• LED Module
• Prototype Services

Our company provides support services for the evaluation of materials related to light-emitting diodes (LEDs). When developing or evaluating LED-related materials such as coating resins, die bonding agents, and LED elements, we assist with the challenges of having only an image of the samples and tests, which can lead to delays in preparation for manufacturing requests. We hold discussions starting from a comic level or conceptual level and create samples. 【Service Features】 ■ Sample creation from an image ■ Production starting from one piece ■ Reduction of material procurement time ■ Support for evaluation tests *For more details, please refer to the PDF document or feel free to contact us.

• Analysis Services
• Chip type LED
• Other polymer materials

We handle several types of resins, including epoxy, silicone, acrylic, and urethane, for resin encapsulation. We will prepare the encapsulating resin according to your preferences. Using coating equipment, we provide high-quality resin encapsulation (molding) services. 【Features】 ■ Prototyping for resin encapsulation is possible with small quantities. ■ Short lead times and low-cost options are available using simple molding techniques. ■ Encapsulation with phosphors and additives is possible. ■ We can perform not only the resin encapsulation process but also the preceding and subsequent process work consistently in-house.

• Lamps and light emitting devices
• Printed Circuit Board
• Sensors

We provide wire bond services tailored to customer needs, from prototyping to mass production. We can offer design and fabrication of fixtures related to wire bonding. 【Features】 ■ We can accommodate wire bond repairs (restoration and strength reinforcement). ■ Our company has a wide variety of equipment fixtures, allowing us to address delays in delivery due to waiting for fixture production and to reduce costs. ■ We also provide assistance with condition setting and advice on fixture proposals. Please feel free to consult with us.

• High frequency/microwave parts
• LED Module
• Lamps and light emitting devices

We offer a "Simple Optical Sheet Creation Experiment Service" to create sheets that are optimal for evaluating phosphors and additives. We can produce optical sheets of thin films on glass substrates with a very small amount of sample material. This service is particularly effective in the early stages of material development when multi-level evaluations are necessary. It is mainly used for the evaluation of phosphors and additives. No experimental fixtures such as mold materials or calendar rolls are required. By coordinating effectively, you can shorten experimental time and achieve efficient development through comparative experiments with minimal material usage. Please consider using this service in the early stages of development.

• plastic
• Other polymer materials
• LED Module

We offer a "simple molding type molding experiment service." This is a simple molding experiment service to evaluate the shape and lens accuracy when designing light-emitting and light-receiving elements as optical components. We manufacture a 3D machined mold using Teflon resin to create a mold for lens formation.

• Bullet-shaped LED
• Chip type LED
• Lamps and light emitting devices

We offer "Transfer Molding Experiment Services." This is an experimental service using transfer molding machines that primarily mold semiconductors with epoxy resin. In collaboration with mold manufacturers, we conduct everything from mold creation to transfer molding experiments. We can maintain high design accuracy for items such as lenses and also provide support for mold design. Joint experiments with resin manufacturers, mold manufacturers, substrate manufacturers, and end customers are possible, allowing for efficient molding experiments. It is possible to create products with high design accuracy intended for mass production. 【Examples】 - Infrared photo sensors using lead frames - Photo sensors and infrared light-emitting units on substrates - Green LED mounting samples for optical communication It is also possible to conduct preliminary experiments using simple molding molds before mold production. Please take advantage of our experimental services using materials such as silicone and epoxy resin.

• Other contract services
• Other semiconductors

We offer a "Simple ACF (Anisotropic Conductive Film) Implementation Experiment Service." ACF is a material in which metal particles or tiny resin beads are metallized and dispersed within a resin film as a conductive material. It is a bonding material that achieves electrical connections with narrow pitch by applying pressure and heat. It is necessary to place the ACF between the substrate and the bonding target, applying horizontal pressure while simultaneously heating. Although it is a jig-level device, we are conducting experiments.

• Other electronic parts
• LED Module

We will conduct a comparative measurement of the bonding strength at the junctions of wire bonds, die bonds, and materials. This is effective for addressing variations in bonding strength that may arise as a result of material development, element development, and substrate development. It is possible to evaluate issues related to the bonding strength of wire bonds, such as reliability and problems after heat treatment. We will compare the bonding strength itself in the state of the materials and assess the quality of strength among multiple samples. It is also possible to evaluate the effects of heat treatment. We also offer services to evaluate cases where the strength varies at the bonding surface. This can be utilized for material testing evaluations during mass production development. When the structure, material structure, or molecular structure between materials can be determined, it is possible to measure the bonding strength of the materials themselves. 【Examples】 - Comparative experiments on bonding strength when variations occur during the development of materials, elements, and substrates. - Evaluation when issues with bonding strength are found after heat treatment. - Comparative experiments on bonding strength to conduct multiple material testing evaluations during mass production development. - Measurement of the strength of the resin itself that has been bonded. *For more details, please refer to the PDF document or feel free to contact us.

• LED Module
• Contract Analysis

We offer "Can Seal Experiment Services." We perform electric resistance welding of metal stems with metal caps or metal caps with window glass. We have two types of equipment: one for welding in a glove box and another for cap entry and exit in an air environment. We can handle everything from electrode design to welding evaluation. We also accommodate items other than general TO cans. *Please feel free to consult with us.

• Other electronic parts
• LED Module
• Lamps and light emitting devices

We offer a "Resin Coating Experiment Service." We provide the creation of evaluation samples for material development, operational experiment samples, and optical lens bonding. The purpose of the experiments is for the production of electronic components and the development of coatings and adhesives for electronic materials. Samples are produced and evaluated, and they are used for comparative studies such as strength and degradation tests.

• Sensors
• Bullet-shaped LED
• LED Module

The Argon Plasma (Ar Plasma) cleaning service uses argon plasma to sputter the surfaces of substrates and devices, removing a few molecules from the surface. It is used to stabilize joints and is primarily utilized before performing wire bonding. 【Service Overview】 ■ It can be used to prevent surface contamination when measuring the bonding strength with new equipment or resin materials. ■ It can also be effectively utilized for evaluating the bonding strength of various materials. ■ Some customers may use only the argon plasma cleaning service, so please feel free to consult with us.

• LED Module
• Other semiconductors
• IC tag

We offer a "Gas Conversion Cap Seal Experiment Service." This service changes the gas inside the cap package from one gas to another, different from the atmosphere. For special experimental applications such as gas sensors, it is possible to convert the gas inside the cap to inert gases and seal it. Since the gas inside the cap can be selected, it is possible to improve the reliability and accuracy of experiments. It is necessary to design and manufacture the electrodes and their surrounding structures as fixtures. Individual designs are required for each customer. 【Examples】 ■ We accommodate the production of experimental samples where the gas inside the cap is an issue, such as for gas sensors or special wavelengths. There are limitations on the sizes and types of gases we can handle, so please consult us separately before implementation. We also accommodate special requirements for each customer.

• Other contract services
• Other semiconductors

We offer a "Vacuum Cap Seal Experiment Service." This service involves removing the gas (usually air or nitrogen) inside the cap during the cap sealing process. You can confirm the impact of the gas inside the cap on sensor functionality. It is useful for experiments with special purposes such as verifying the operation of MEMS and gas sensors. Since we can accommodate from a single item, it can also be used for individual tests. It is necessary to individually design electrodes and surrounding structures that can handle vacuum conditions. 【Examples】 - Experimental samples to confirm whether the operation of MEMS changes at reduced pressure levels. - Investigation of the impact of gas inside the cap on sensor output. Depending on the shape and size of the stem and cap, we may not be able to accommodate certain requests. Please consult us when using the service.

• Other contract services
• Other semiconductors

We offer a "Vacuum Reflow Experiment Service." By creating a vacuum (reduced pressure) environment during solder reflow, we adjust the reflow conditions. In reflow processes using flux, partially removing flux gas helps suppress the occurrence of voids (bubbles), enabling high-quality solder connections. We can accommodate not only lead-free SAC solder but also low-melting-point tin-bismuth solder and high-melting-point gold-tin solder. We will provide the most suitable solder for your products. It is also possible to choose nitrogen or hydrogen-added nitrogen for the melting environment. 【Service Features】 ■ High-quality connections can be achieved while suppressing void formation in the manufacturing of flip chips using gold-tin solder. ■ Stable solder connections are realized even in high-power ED manufacturing experiments. ■ This service is also utilized in the production of multi-chips and UV LEDs, allowing for assembly with SAC solder. *Due to constraints such as substrate size, individual consultations will be conducted to propose the optimal solutions.

• Reflow Equipment
• Other contract services
• Other semiconductors

We offer "IV characteristic measurement services." The IV characteristics of semiconductors are measured for various purposes as fundamental electrical measurements. They are utilized not only for regular product evaluations but also for failure analysis and simple assessments of thermal resistance. At a preliminary experimental level, relative comparisons among many samples can be made. We measure the change in VF characteristics at thermal saturation to evaluate the quality of thermal shrinkage. In addition to standalone IV measurements, simple inspections regarding the electrical-optical relationship and simple relative evaluations concerning the electrical-thermal relationship are also possible. You can consult us for various applications, including initial checks for anomaly analysis.

• Other electronic parts
• LED Module
• Other semiconductors

We offer a "Simple Sulfide Discoloration Comparison Experiment Service" for evaluating the sulfide discoloration of silver-plated materials. In the case of LED lighting, the degradation of brightness due to factors such as the inner surface of the package, particularly the silver-plated surface, becomes a concern. This issue is unavoidable for outdoor lighting applications where the impact of sulfide on the silver-plated surface cannot be ignored. Similar problems may also arise in infrared centers depending on the application. It is possible to evaluate the discoloration of silver plating on packaged materials and to easily assess the gas barrier properties of the materials used. 【Service Examples】 ■ Storing reference and evaluation samples together in a wide-mouth bottle to observe changes over time ■ Evaluating gas barrier properties through comparison of discoloration on the silver-plated surface

• LED Module
• Other electronic parts
• Analysis Services

We offer a "High Temperature and High Humidity Reflow Experiment Service." This service conducts reflow experiments for SMD packages, evaluating durability under high temperature and high humidity conditions. We provide moisture reflow tests in accordance with standards such as JEDEC. This test involves subjecting samples to continuous exposure to high temperature and high humidity, followed by multiple thermal history cycles using an air reflow device to check for issues such as resin delamination and deformation. It is necessary to confirm the conditions of the test flow to ensure they meet the intended objectives. We will conduct experiments based on customer needs regarding the experimental materials for the products. We can also prepare the necessary materials for the experiments. Please feel free to consult with us. 【Track Record】 ■ Assistance in the testing and development phase of nylon-based and alternative materials for SMD packages used in LEDs.

• Analysis Services
• Other semiconductors
• LED Module

We offer a "Sales Demo Equipment Production Service." You can also use it to share the image of the application of development materials within your company. We have extensive experience, so we can assist you from the proposal of the image onward. 【Examples of Requests】 - Production of samples that allow visibility of fluorescent light as sales samples related to QD and phosphors. - Production of samples for sharing functional confirmation within the customer's internal project. - Production of samples with the customer's logo illuminated for self-developed product promotion to end customers. - Production of demo samples to express the flexibility of sheets in optical sheet material development. - Production of portable demo devices to compare the heat absorption effects of radiation heat-absorbing materials with general materials, etc. We will provide ingenuity and assistance tailored to your requests and applications.

• LED Module
• LED lighting
• Prototype Services

We offer a "Phosphor Evaluation Service." This service provides a comprehensive process from phosphor sample creation to the evaluation of thermal and photothermal degradation. We accommodate a wide range of materials, from standard phosphors to specialized ones, and we have stock of packaging materials that include phosphors, allowing us to start preliminary experiments immediately. We can set evaluation conditions based on customer requests and provide specific data that is useful for product development. For inorganic, organic, and quantum dot-related phosphor materials, we can prepare excitation light using packaging and handle sample creation. Additionally, we conduct evaluations of thermal and photodegradation characteristics. Depending on your requirements, we can also provide evaluation systems that include continuous power supply fixtures, constant current power supplies, and simple light output measurement fixtures. 【Track Record】 ■ When using evaluation systems in-house, from material procurement for experimental samples to evaluation system setup: - Requests for individual samples - Design support for power supplies, substrates, etc., as experimental fixtures ■ Evaluation fixtures equipped with multiple high-power LEDs, etc.

• LED Module
• Other semiconductors
• Analysis Services

We offer a "Simple Transient Thermal Comparison Service" to compare the bonding state of materials and the bonding materials themselves. By measuring the time variation of Vf using the VF temperature characteristics of semiconductors, we evaluate the condition of each structure or joint. This service allows for measurements that typically require expensive equipment to be easily conducted using a system developed in-house. The service is aimed at comparative measurements, and it is also possible to evaluate and compare bonding materials using lasers or power LEDs. 【Service Overview】 ■ Evaluation of heat dissipation characteristics ■ Comparative evaluation of materials, process work conditions, etc. ■ Comparative evaluation of bonding materials for power LEDs ■ Comparative evaluation of other power-related bonding materials

• LED Module
• Other semiconductors
• Contract measurement

We offer a "junction temperature measurement service" primarily to evaluate heat dissipation characteristics for components such as LEDs and power devices. This measurement is a crucial factor in structural design, material evaluation, and package development during the development phase, serving as a standard for the overall reliability of product quality. Based on the measurement results of the temperature-VF relationship, it is possible to directly measure the junction temperature by measuring the VF after current flow. 【Service Examples】 ■ When conducting structural design during development ■ When developing materials or wanting to evaluate their characteristics ■ When wanting to assess the thermal light effects on resin in LEDs, etc. ■ When wanting to evaluate degradation characteristics in package development ■ When investigation of reliability issues is needed during mass production 　　　　　　　　　　　　　　　　　　　　　　　　　　　　　etc. We will tailor the entire service to suit the conditions of your usage environment. Please feel free to contact us.

• Other electronic parts
• Contract measurement
• LED Module

Soldering with AuSn is used for joining electronic components that require high reliability. It has many advantages, such as utilizing its high melting temperature characteristics and being usable as an initial joining material when attempting to join materials. However, there are some difficulties compared to conventional soldering, such as: - Processing in areas exceeding 300°C - Need for atmosphere management during solder melting, such as in an N2 environment - The surface condition of the joined objects is influenced by the composition of the plating - Difficulty in positioning the workpiece during connection, etc. Our company has experience in mass production for optical pickups and communication LDs for major manufacturers. Through this experience, we have addressed many customer issues through prototyping. 【Service Features】 - Support including substrate design and joining jig design - For LED flicker chips, we can perform joining not only with non-flux but also with flux - We also have AIN submounts, LEDs, and packages in stock as experimental materials Please feel free to consult us if you have urgent experimental needs or any other concerns.

• Other electronic parts
• LED Module
• Capacitor

Our company offers "MiniLED implementation services" used for high-definition applications in backlighting. There are various implementation needs depending on the dimensions of the backlight. We mainly use APC for implementation. 【Features】 ■ Compatible with thin materials such as FPC. ■ Assistance with design changes to accommodate sizes suitable for large substrates. ■ We accept orders starting from a single piece. *For more details, a separate meeting is required, but please feel free to contact us.

• LED Module
• diode
• Other electronic parts

We provide implementation services for substrates and components that are difficult to implement and operate using standard manufacturing equipment and methods. We accommodate 3D structures, large substrates, and materials that are difficult to heat. We can also work with new materials, not just existing ones. By using manual labor and original jigs for implementation, we respond to various requests. We can handle even small quantities, which is useful for experiments and prototype production. 【Service Examples】 - Design of sample substrates for functional evaluation that display characters in a dot matrix format using LEDs on glass-like substrates. - Production of temporary functional evaluation substrates in cases of defective substrate designs or errors in metallization and plating specifications. - Design and implementation of large ceramic substrates and 3D structure substrates. *For more details, please refer to the PDF materials or feel free to contact us.

• LED Module
• Prototype Services
• Other polymer materials

Our company provides detailed failure analysis services for various defects, including product samples from other companies. We conduct thorough investigations into the causes of defects using a wide range of analytical methods. By utilizing specialized material analysis techniques such as FTIR (Fourier Transform Infrared Spectroscopy), we can identify issues and defects related to the materials themselves. Additionally, we can utilize external facilities such as industrial testing laboratories as needed, allowing us to perform specialized analyses that cannot be handled by our in-house equipment. After discussing the details of your request and the condition of the product, we will focus our analysis on the areas where defects are most likely to occur. 【Service Examples】 ■ LED Product Analysis ■ Wire Bond Joint Analysis *For more details, please refer to the PDF document or feel free to contact us.

• Analysis Services
• Contract Analysis
• Other analyses

Are you facing any of the following issues? - You have evaluated the temperature characteristics of MEMS, but the effects of the package and adhesive are significant and difficult to assess. - You want to evaluate the optical-electrical response characteristics of high-speed photodetectors, but the C component between the device and ground is significant and difficult to assess. - You want to measure the thermal characteristics of the device itself, but the effects of the package and adhesive are significant and difficult to assess. - You want to improve the rise time characteristics. It is possible to operate the chip in a suspended state with gold wire. The photo shows a wire bond on the back surface of a power LED.

• Sensors
• Optical Experimental Parts
• Other contract services

Our service achieves high positional accuracy and speedy PCB assembly using the Daibonder DM60M-H. Even difficult-to-handle chips are optimally managed by our experienced staff. 【Features】 ■ Achieves high positional accuracy with chips ranging from one to six varieties. This service is advantageous when it is necessary to align optical centers. ■ High productivity is realized due to single transport. Simultaneous assembly of up to six varieties with one PCB recognition. ■ Investment can be minimized during small-scale production. We have a manufacturing line that specializes in small-scale production. You can use only the necessary amount of materials we have in-house. ■ We provide design know-how to achieve the above. For example, know-how for designing production jigs and bonding conditions for equipment, etc. We also accept inquiries related to optical characteristics.

• Circuit board design and manufacturing
• LED Module
• Other optical parts

In general, integrating spheres are expensive, and additional processing or partial modifications to measurement software are not possible. This integrating sphere was manufactured in-house, along with the spectrometer, radiative flux, and light flux conversion. Calibration is performed using the integrating sphere and standard light source from the Kobe Institute of Industrial Technology. Since we can grasp the entire measurement results and their processing for both hardware and software, it can be used with a high degree of freedom. 1) It can be used for experimental purposes such as the following: - General spectral sensitivity measurements - Initial spectral characteristics during resin and phosphor development - Changes in light output characteristics during aging - Development testing of simple measuring devices based on comparisons of light output degradation modes 2) Optical measurement of irregular samples - A dedicated electrical connection fixture is set up inside the integrating sphere for use.

• LED Module
• Other polymer materials
• Contract Analysis

We have been assisting SANYO Electric for many years, from prototyping to mass production of LED-related implementations. Currently, we are also helping major electronics manufacturers with prototyping to mass production of bare chip implementations. In particular, UV LEDs often present challenges in design and manufacturing in the following areas: ◆ Deterioration due to light and heat, and material selection Introduction of engineers from material manufacturers and information on related materials from the past ◆ Structural selection for light countermeasures Heat shrink structures, heat dissipation structures, etc. ◆ Determining the LED mounting position, lens position, and mounting standards How to establish mounting standards ◆ Simultaneous multi-chip mounting methods with different wavelengths Simultaneous mounting of multiple chips (multi-chip bonder) ◆ Circuit design Ideas for averaging circuits to reduce the impact of heat on Vf ◆ Other preliminary experiments Proposals based on nearly 10,000 experimental cases centered around LED-related topics We can assist in resolving your issues for problem-solving.

• LED Module

Sayo Seiki Manufacturing Co., Ltd. is a supporter of semiconductor processing. By assisting in the launch of development products for major companies, we have been fortunate to gain experience in the assembly of various genres, including not only LEDs but also LDs, microwaves, Hall elements, MEMS, and related modules. Leveraging our past experiences, we are here to assist with "production from a single item" and "turning just an image into a tangible product." If you encounter any difficulties, please do not hesitate to reach out to us. Our experienced staff is confident that we can be of service to your company. 【Sales Items】 ■ Semiconductor processing and assembly services from prototypes to mass production ■ Design and manufacturing of tools and jigs necessary for processing and assembly *For more details, please refer to the PDF materials or feel free to contact us.

• Contract manufacturing

This product is an LED unit designed for simple light resistance testing, achieving high output with high-power LEDs. It has a compact size that can be placed on a desk. The required space is equivalent to two keyboards. Additionally, it can easily perform thermal acceleration tests up to 120°C by simply placing it on a heater plate. 【Features】 ■ Required space is equivalent to two keyboards ■ Compact size that can be placed on a desk ■ Achieves high output with high-power LEDs ■ Wavelength customizable from blue to ultraviolet ■ Simply place it on a heater plate *For more details, please refer to the PDF document or feel free to contact us.

• Testing Equipment and Devices

From small-scale prototypes to medium-scale.

• Processing Contract

Assembly and processing of display LEDs and functional elements as LDEs. We can accept orders from prototypes.

• Other electronic parts
• Other semiconductors
• Other optical parts