大宮工業 List of Products and Services

Unbalance can be broadly divided into two types: "static unbalance," which occurs even when not rotating, and "dynamic unbalance," which occurs when rotating. The calculation methods for dynamic unbalance and static unbalance are different. The equipment capable of measuring dynamic unbalance is called a "field balancer." Our company offers a measurement device called "Myself-1 type TII," which accurately calculates the unbalance weight and phase angle necessary for balance correction by measuring the balance state. **[Method for correcting dynamic unbalance (dynamic imbalance)]** 1. Vibration value when rotating in the initial state (untouched state). 2. Vibration value when rotating in a state where the unbalance amount is intentionally changed using a trial weight. 3. Calculate the balance correction weight from the trial weight and the vibration change from (1) to (2). *For more details, please refer to the PDF document or feel free to contact us.*

• Other measurement, recording and measuring instruments

As long as there is rotation, if there is an imbalance, vibrations will occur. Therefore, to use rotating bodies for a long time and efficiently, balance correction is necessary. For low rotational speeds, even if there is an imbalance, the centrifugal force is also low, and there may be cases where significant vibrations do not occur. However, for rotating bodies with high rotational speeds, the centrifugal force increases, leading to larger vibrations. Specific examples include pumps, components of vehicles and trains (hubs, flywheels, brake drums, brake discs, etc.), shafts, rollers, and many other products that require balance correction. [Examples of rotating bodies that require balance correction (partial list)] ■ Pumps ■ Components of vehicles and trains (hubs, flywheels, brake drums, brake discs, etc.) ■ Shafts ■ Rollers *For more details, please refer to the PDF document or feel free to contact us.

• Other measurement, recording and measuring instruments

This explains how to eliminate vibrations caused by imbalance. By bringing the center of gravity to the center of the rotation axis, vibrations caused by imbalance can be resolved. For example, by adding weights of the same amount at positions symmetrical to the imbalance with respect to the rotation axis, the center of gravity shifts onto the rotation axis, thereby eliminating vibrations caused by imbalance. *For more details, please refer to the PDF document or feel free to contact us.

• Other measurement, recording and measuring instruments

When an imbalance occurs, centrifugal force is generated, the rotation axis bends, and the rotating body describes an eccentric path, resulting in significant vibrations throughout the equipment. The occurrence of vibrations leads to the following phenomena: Due to the vibrations, the tool does not make uniform contact with the work surface, causing chatter marks and deteriorating machining accuracy, which increases the number of dressing cycles for the grinding wheel and increases the load on end mills and inserts, thereby shortening their lifespan. Primarily, the bearings are subjected to load, and it may become necessary to replace the bearings. **Effects of Imbalance:** - Deterioration of machining accuracy - Shortened tool lifespan - Damage to equipment *For more details, please refer to the PDF document or feel free to contact us.*

• Other measurement, recording and measuring instruments

"Unbalance" refers to a state where the center of gravity of a rotating body is not aligned with the axis of rotation. When a rotating body is spun in this state, centrifugal force is generated. The main causes of unbalance include "uneven mass distribution within the material of the rotating body." During the manufacturing process, grinding wheels and cast products can experience uneven distribution of abrasive particles or the formation of internal voids, leading to variations in the mass distribution of the rotating body. [Main Causes of Unbalance] ■ Uneven mass distribution within the material of the rotating body - Grinding wheels and cast products can develop uneven distribution of abrasive particles or internal voids during manufacturing, resulting in variations in the mass distribution of the rotating body. ■ Misalignment during the fitting of the rotating body onto the shaft - The hole diameter for fitting the rotating body onto the shaft is not perfectly equal to the shaft diameter, which can cause misalignment from the center of the shaft during the fitting process. *For more details, please refer to the PDF document or feel free to contact us.

• Other measurement, recording and measuring instruments

The "local heating device" is a machine used for soldering surface mount components such as small BGAs and CSPs using halogen heaters and hot air. It is easy to protect components that should not be overheated, can accommodate complex temperature profiles, and is also compatible with double-sided mounted boards with encapsulants. We have a track record of over 500,000 reworks. 【Features】 ■ Compact and energy-efficient ■ Capable of handling complex temperature profiles ■ Easy to protect components that should not be overheated ■ Compatible with double-sided mounted boards with encapsulants ■ Flexible in accommodating various types of boards and components for development and repair ■ Designed to reduce profile selection errors *For more details, please refer to the PDF materials or feel free to contact us.

• Soldering Equipment
• Other processing machines

The "ACF Bonding Device" is a tabletop device used for thermal bonding of anisotropic conductive films (ACF) for connecting FPC/PCBs in automotive, industrial, and consumer equipment. It specializes in the small-lot production of various small components, making it suitable for development, research, and repair applications. By focusing on small PCBs, it is smaller and lighter compared to general devices. Additionally, by using an optional multi-fixing jig, experimental bonding operations can be immediately executed for PCBs measuring 144mm x 77mm or smaller. 【Features】 - Smaller and lighter compared to general devices by specializing in small PCBs - Capable of accommodating ACF bonding lengths from 14mm to 64mm - The temporary bonding device is equipped with ACF half-cut and automatic feeding mechanisms - Customization options are available to match the workpieces used - Easy setup and switching, making it suitable for small-lot production, development, research, and repair applications *For more details, please refer to the PDF document or feel free to contact us.

• Welding Machine
• Other processing machines

Currently, mass production of precision electronic devices is progressing overseas, but our company handles everything from development to mass production for products that are difficult to mass-produce overseas, such as "high-quality production requirements," "small lot production of various types," and "high-precision production requiring new technologies." We possess our own equipment, such as ACF devices and vacuum lamination devices, and we accept mass production tasks tailored to our customers' requests and specifications. Please feel free to contact us when you need assistance. 【Features】 ■ Comprehensive support from development to mass production for products that are difficult to mass-produce overseas ■ Ownership of our own equipment, such as ACF devices and vacuum lamination devices ■ Acceptance of mass production tasks according to customer requests and specifications *For more details, please refer to the PDF materials or feel free to contact us.

• Other contract services
• Bonding Equipment
• Soldering Equipment

Omiya Engineering provides support for product development, such as modularizing devices developed by our customers. We have our own original vacuum lamination equipment and ACF bonding equipment, which can be customized. We are capable of one-stop solutions not only for development but also for mass production processes. Utilizing the unique technology and expertise of a semiconductor equipment manufacturer, we achieve high quality and productivity. Please feel free to contact us when needed. 【Features】 ■ We have our own original ACF bonding equipment and can accommodate customization. ■ We manufacture the jigs necessary for prototype development. ■ We offer detailed development and proposals tailored to customer requests. ■ We can provide one-stop solutions not only for development but also for mass production processes. *For more details, please refer to the PDF materials or feel free to contact us.

• Other contract services
• Bonding Equipment
• Soldering Equipment

Omiya Industrial provides services to overseas customers based on its achievements in display rework cultivated in Japan. We handle rework contracts for defective products sent from our customers' overseas locations to our company (Japan), as well as rework contracts by establishing rework sites near our customers' overseas locations. We can rescue expensive curved glass, starting with rework of adhesive failure products, as well as repair operations such as circuit board analysis and component replacement, and adhesive cleaning/removal rework. If you have any issues with production yield beyond display products, please feel free to consult us. 【Features】 ■ Rework of adhesive failure products (separation, re-adhesion) ■ Rework of defective OLED module and housing assembly (separation, re-assembly) ■ Rework of defective optical lens assembly ■ Repair operations such as circuit board analysis and component replacement ■ Adhesive cleaning/removal rework ■ Other consultations and considerations for rework of production defects *For more details, please refer to the PDF materials or feel free to contact us.

• Calibration and repair
• others

Omiya Industrial not only repairs mobile phones and smartphones but also conducts repairs on vehicle-mounted circuit boards, FA equipment, and circuit boards used in robots. In addition to general measuring instruments, we perform analysis using our own developed measuring jigs and devices. After identifying defective components, we use our in-house developed equipment to remove and replace the components. Moreover, we can design and manufacture all the necessary jigs, devices, and software for repairs in-house, allowing us to provide suitable circuit board repairs and inspections that capture the characteristics of our customers' repair target products. Furthermore, we can replace all components mounted on circuit boards, regardless of size, including BGA/CSP. 【Features】 ■ Over 10 million units repaired for many manufacturers ■ Despite the ongoing miniaturization and integration of components, we can deliver with a high recovery rate and short lead times ■ We conduct analysis (identification of defective areas) using our own developed measuring jigs and devices ■ We can provide suitable circuit board repairs and inspections that capture the characteristics of our customers' repair target products *For more details, please refer to the PDF document or feel free to contact us.

• Calibration and repair
• others

In recent years, many products have used OLED/LCD and touch sensors (touch panels/touch films). To improve visibility and achieve thinner designs, direct bonding, which uses optical adhesive sheets (OCA) and adhesives (OCR) to eliminate air layers between the cover glass, has become mainstream. The adhesion is very strong to maintain the strength of the products, and once bonded, it cannot be removed, resulting in many OLED/LCDs being discarded. In response, our company separates and resets the bonded and assembled modules, achieving "zero loss cost" for defective products. 【Recycling Achievements】 ■ Number of recycled units: Over 300,000 pcs ■ Yield rate: Over 96% for new products / Over 93% for market returns *For more details, please refer to the PDF document or feel free to contact us.

• Calibration and repair
• others

MyTENTA-1/PB is a high-precision touch detection system that instantly detects work touch and dress touch for ultra-fine processing and ultra-precision processing on grinding machines and machining centers using AE sensor technology, without the need for skilled techniques or experience. It can output signals to machine tools and communicate with operators through light. The contact detection position accuracy is an astonishing ±0.1μm. We offer two models: MyTENTA-1, which is controlled via I/O for NC machine tools, and MyTENTA-1 PB, which notifies contact through light for general-purpose machine tools. From now on, there is no need to bring your face close to confirm contact between the grinding wheel and the workpiece or dressing tool. *For more details, please download the PDF or feel free to contact us.

• Sensors

This machine is a "Fully Automatic Vacuum Tape Mounting System" that can attach wafers inside a vacuum chamber. It comes standard with OKK's unique pre-cut unit, allowing for easy and high-quality attachment at low running costs simply by setting the dicing frame and wafer. 【Features】 ■ Non-contact attachment (patented) with no damage ■ Waste width "0" (patented) ■ Abundant options *For more details, please download the PDF or feel free to contact us.

• Mounter
• Other processing machines

The "Full Auto BG Tape Laminator" is an automatic device that allows for peripheral cutting after applying tape for back grinding, aimed at surface protection. By adopting a unique roller structure for the application, it has achieved tape application with almost no tension. It is effective in reducing warpage of thin wafers after back grinding. 【Features】 ■ Peripheral cutting possible while controlling tension ■ Reduces warpage of thin wafers after back grinding ■ Low tension application ■ High precision peripheral cutting ■ Compatible with high bump tape *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment

- By specializing in compact circuit boards, it is smaller and lighter compared to conventional devices. - Setup and switching are easy, allowing for support of a wide variety of types and models. - By using the optional adjustable circuit board fixture, easy crimping operations can be immediately performed on circuit boards measuring 90mm x 110mm or smaller.

• Circuit board processing machine
• Other mounting machines

- It has a compact design that allows for installation on a tabletop. - Since it uses partial heating, it minimizes thermal load on surrounding components that should not be heated. - It can flexibly accommodate a variety of circuit boards. - It can handle complex temperature profiles.

• Soldering Equipment

- It is possible to remove the IC while minimizing the effects of heat. - It is a tabletop-sized milling machine. - Teaching is simply specifying the two diagonal points of the IC and the depth (in automatic creation mode). It can be easily created with dedicated software and a controller. Height is automatically adjusted, so teaching is not necessary. It is also easier to prevent excessive cutting. - Switching cutting patterns is also simple. Positioning and warping correction jigs are required for each circuit board.

• Special Processing Machinery
• Soldering Equipment

The manual tape peeling machine is a manual type tape peeling machine that removes protective tapes such as BG (back grind) tape attached to wafers and substrates.

• Other semiconductor manufacturing equipment

The balance correction device Dynarector performs balance correction processing by transferring measurement data to the processing unit after measuring the balance of the workpiece in its assembled state. To achieve balance correction close to the actual operating speed, the correction accuracy is significantly improved. Customization to meet specific needs is available.

• Other measurement, recording and measuring instruments

Omiya Industrial's precision cleaning removes deposits adhered to equipment parts that cause particles in the manufacturing processes of semiconductor and LCD production factories, regenerating various components to ensure smooth production. In addition to precision cleaning of vacuum equipment parts, we also offer degreasing cleaning of precision machined parts, cleaning of exhaust piping, and removal of byproducts from piping, silencers, and traps.

• Other semiconductor manufacturing equipment
• Surface treatment contract service

The vibration monitor (VM-1-DNP) is a vibration measuring device that monitors vibrations occurring in equipment. It is capable of detecting vibrations from all types of devices and allows for continuous monitoring. ● Measurement error is minimized to nearly zero With a fixed-type accelerometer, external factors that could affect measurements have been eliminated as much as possible. There are no errors due to measurement conditions, and vibration displacements ranging from 0.1 to 999.9 μm can be measured.

• Other measurement, recording and measuring instruments

● Industry's smallest Compact space-saving design that doesn't require a specific placement. ● Industry's fastest Achieves a sticking speed of 25 seconds per sheet. ● Compatible with pre-cut tape Waste tape width is reduced to 1/4 of the conventional size! Significant cost savings can be achieved. ● One-touch operation Quickly and neatly affixes using only the work set.

• Mounter
• Other semiconductor manufacturing equipment

The blacklight specification full-auto UV irradiation machine automatically retrieves wafer frames supplied by cassettes and performs UV irradiation and storage. After dicing, UV irradiation is applied to reduce the adhesive strength of the tape for easier pickup. It supports automatic setup for 8-inch and 12-inch wafer frames.

• Other semiconductor manufacturing equipment

The manual tape mount is a manual type of mount that attaches various tapes, such as dicing tape and BG (back grind) tape, to frames and workpieces. With a calculated table design, it minimizes the waste width of the tape to the utmost limit, while also considering running costs in its design.

• Mounter
• Other semiconductor manufacturing equipment

- By minimizing the contact surface between the wafer and the chuck, stress and contamination on the wafer are prevented. - Particle generation is prevented by motor drive. - The unique wafer chuck structure suppresses shaking during wafer transport, ensuring reliable transfer to quartz boards, and allows for accurate and safe transfer of heavy items such as compound wafers. - An electrostatic discharge device is also available as an option.

• Other semiconductor manufacturing equipment

● Anti-double-pick feature! Enables stacking of workpieces, achieving smooth workpiece supply. ● Tact adjustment feature! Recipe settings can be adjusted according to the workpiece. ● One-touch setup change! Automatically performs setup changes suited to the workpiece with just one switch. ● Smooth transportation between processes! The use of dedicated carts for supplying and removing workpieces ensures smooth transport between processes.

• Other semiconductor manufacturing equipment

Myself-1 type T2 is a field balancer that allows for high-precision dynamic balancing (balance correction and adjustment) to be performed easily without requiring advanced skills or experience, and in a short amount of time. It enables ultra-precise balance correction for various rotating machinery (devices and equipment) such as impellers (fans), pumps, blowers, grinding wheels, shafts, and spindles. With an interface that uses an icon display for interactive communication and a variety of auxiliary functions to navigate and support operations, even first-time users can easily perform balance correction tasks. 【Product Features】 ◆ Ultra-high-performance balance measurement and correction with a resolution of ±0.001μm. ◆ Easy operation with an interactive input method using icon selection. The two-way operation with a touch panel and hard keys significantly improves usability. ◆ Equipped with rotor balance, grinding wheel balance, and single/double surface balance correction modes. Simultaneous vibration monitoring on two channels is also possible. ◆ Excellent visibility with a bright, easy-to-read LCD monitor and tilt stand. ◆ A wide range of options allows for necessary functions at minimal cost. ◆ Lightweight and compact, making it easy to carry with a dedicated carrying case.

• Image Processing Equipment
• Balancer

● Thorough elimination of dust generation factors ● Achieving safe and clean short-time drying ● Our unique balancing technology enables quiet rotational performance ● Standard equipment includes ionizers and ULPA filters ● Optional features include automatic balance correction mechanisms and wafer breakage detection devices ● Spin dryers for materials other than silicon wafers are also available. Please consult with us.

• Other semiconductor manufacturing equipment

The tape peeling machine is a device that removes protective films adhered to wafers. Wafers supplied in cassettes are positioned using an aligner, and after tape peeling, they are discharged into the same cassette. ■ Thin Workpiece Compatibility ■ By adopting a unique peeling mechanism and a full-suction table, stress on the wafer is minimized, making it compatible with thin wafers. ■ Retry Function ■ After the peeling operation, a sensor checks for peeling confirmation. If it fails, the peeling operation is reinitiated to prevent any residue. (Number of retries can be set) ■ Alignment Function ■ Before peeling, alignment is performed on the alignment table to match the angle position of the orifice and notch, and to center the wafer, preventing peeling defects due to positional misalignment. ■ Tact Adjustment Function ■ Peeling speed, transport speed, and other parameters can be set via a touch panel, allowing adjustments to suit the workpiece. ■ Tape Empty Detection ■ The remaining amount of peeling tape is detected by a sensor. When the remaining amount reaches 5 meters (modifiable), an alarm notifies the user, eliminating unnecessary machine stops. ■ Static Electricity Countermeasures ■ Equipped with an ionizer (static electricity eliminator) as standard.

• Other semiconductor manufacturing equipment

■ The intake volume is large, so the drying efficiency is approximately doubled (compared to our company) compared to the N2 replacement method. Furthermore, there is a significant cost reduction. ■ The ionizer for the intake air is vastly more efficient than that of N2! It prevents contamination of the wafers. ■ The main cause of particle generation, the bearing section, adopts a unique structure from Omiya Industry that has a proven track record with a rotary type. It always maintains a clean state. ■ An automatic balance adjustment device can also be installed as an option. It cancels out vibrations caused by differences in the number of sheets and weight differences in the carrier.

• Other semiconductor manufacturing equipment

■ High-precision balance measurement can be performed in a short time without rotating the workpiece (static balance). This is especially suitable for large workpieces. ■ Setup changes are simply done by exchanging the tip attachment and inputting via the touch panel. ■ Input is done through an easy-to-use interactive touch panel. The display screen outputs the workpiece's outer diameter, weight, reference unbalance weight, unbalance position (angle), and also provides pass/fail judgment results. (Standard)

• Other measurement, recording and measuring instruments

■ The non-contact communication method supports balance correction at high rotation speeds (up to 9000 RPM). The non-contact gap is 2.0mm ± 0.5mm (Max 3mm). ■ With the gap monitor function, the non-contact gap can be displayed on the controller via an indicator, making gap monitoring easy. ■ Operation is one-touch! The numerical display allows for standardization of work, enabling anyone to maintain high precision balance. Balance correction can always be monitored numerically. ■ Not only can it balance grinding wheels, but it also allows for integrated balancing including mechanical components, extending the lifespan of grinding wheels and reducing the burden on mechanical and shaft systems.

• Other process controls

We handle everything from parts repair to in-house assembly and balance adjustments.

• Other semiconductor manufacturing equipment
• Processing Contract

■On-site Correction (Field Balance) Using our self-developed balance measurement equipment at the site where rotating equipment is installed, we provide advice on the equipment and balance correction. ■Balance Correction Contract (Work Custody) For rotating items entrusted to us by customers, such as assemblies like centrifugal fans, rotors, and fan motors (fans and stators), we will perform balance correction and evaluation in the specified rotational range. ■Equipment Installation For the introduction of balance correction equipment, our specialized staff in mechanics, electronics, and control will assist from the consideration of equipment installation.

• Other services
• Processing Contract

We propose, design, and manufacture products tailored to our customers' needs.

• Contract manufacturing

■ High power, low cost ■ Selectable irradiation patterns ■ N2 purge function ■ Monitoring function included ■ Compact design ■ Safe design

• Other semiconductor manufacturing equipment