共立エレックス List of Products and Services

Notice from Kyoritsu Elex - - - - - - - - - - - - - - - - - - - - - - - - - JPCA Show 2025 (Printed Circuit Board Technology Exhibition) Location: (Tokyo Big Sight) June 4 (Wednesday) to June 6 (Friday), 2025, for 3 days - - - - - - - - - - - - - - - - - - - - - - - - - We look forward to seeing you. Our company offers circuit formation for electronic component applications using the technology of printed circuit formation on ceramics substrates manufactured in-house, all through a consistent in-house process. By utilizing screen printing methods, we can provide custom solutions with shorter lead times compared to etching methods. Additionally, since the printed materials undergo high-temperature baking (850°C), they achieve stable performance and high reliability. The printed materials are not limited to wiring materials (metal paste) but also include insulating glass materials and ceramics, which can also be printed. Furthermore, we have achieved not only circuit formation but also "through-hole via formation" and "multilayer circuit structures." We are advancing technology development to meet various application possibilities, so we look forward to your inquiries.

• Other electronic parts

The newly developed product "High Flame Retardant and High Thermal Conductivity Resin Sheet" is a non-combustible sheet with high flame resistance rated "5VA" according to UL94 standards. It can also be used as a thermal conductive resin sheet with high thermal conductivity (4.5W/m·K) while maintaining insulation properties. 【Features】 - High flame resistance: UL94 standard "5VA grade" - High thermal conductivity: 4.5W/m·K - Contains no halogen-based flame retardants, thus "no generation of toxic chlorine gas during combustion" - Sample size provided: up to 190mm x 190mm (MAX) 【Applications】 - To prevent flame spread in high-voltage power supply cables - To suppress flame spread during thermal runaway in battery modules - To improve heat dissipation performance in power semiconductor modules *For more details, please contact us.

• others

We have released a video regarding the fire resistance testing of our "5V-A Non-Flammable Sheet." This product is a self-extinguishing non-flammable sheet that has passed the flame retardant grade 5V-A based on the UL94 standard. The content is easy to understand compared to products from other companies and initial development products, so please take a look. *For more details, please refer to the related links or feel free to contact us.

• others

The "5V-A Non-combustible Sheet" is a self-extinguishing non-combustible sheet that has passed the flame retardancy test based on the UL94 standard, achieving the flame retardant grade 5V-A. Sheets can be created to meet specific requirements such as hardness, heat resistance, and strength. We can accommodate small-scale prototypes of about 200mm in width and approximately 10m in length. 【Examples of Use】 ◎ For circuit board design of high-power semiconductors ◎ To prevent ignition and flame spread in battery modules ◎ To prevent flame spread in high-voltage power supply cables *For more details, please contact us.

• others

In the implementation of power devices, where applications are expanding in areas such as home appliances and EV vehicles, expectations for "thermal conductivity performance of the substrate" are rising significantly. Through the mass production achievements of our flagship high-power LED packages, we have developed technologies to improve heat dissipation performance associated with higher power output. In particular, we have received many inquiries regarding "improving thermal conductivity using general-purpose alumina ceramic substrates compared to aluminum nitride substrates, which excel in thermal conductivity" for ceramic circuit boards. We have achieved improvements in thermal conductivity by applying through-hole processing technology (via formation) and printed circuit technology, filling the via sections of alumina ceramic substrates with "metallic materials," while using general-purpose alumina ceramic substrates. For high-power LED package substrates, we have achieved a thermal conductivity of "369 W/mk" with alumina ceramic substrates. If you are facing challenges with "thermal measures" for ceramic substrate implementation of high-power power devices, please consult with us.

• Fine Ceramics
• Circuit board design and manufacturing
• Other electronic parts

"Setter Ceramic Base Plate with Micro-Convex Shape Processing" We often hear requests regarding the production efficiency and manufacturing quality of ceramic base plates used for setters in the firing process. For example, requests include "I want to improve the debinding performance," "I want to suppress sticking against the shrinkage of the fired items (work)," and "The work sticks after firing!" among various others. By using this "Setter Ceramic Base Plate with Micro-Convex Shape Processing," we contribute to improving the production efficiency and manufacturing quality of the firing process. Additionally, we have received feedback from customers who previously used "filling powder" on the setter, stating not only improvements in "workability" but also that "the clogging in the vacuum furnace piping has improved." If you are a user facing such issues in the firing process, please feel free to reach out to us.

• Ceramics

■Background We have developed a ceramic substrate optimized for "firing setters" by leveraging the characteristics of porous ceramics and utilizing our in-house integrated processes, such as printing on fired ceramic substrates, to meet the increasingly diverse needs of customers utilizing firing processes. Recommended for those who want to "fire more at once!" ■Usage Improving production efficiency in "batch vacuum furnaces" used in firing processes is a significant challenge. We often hear requests to "fit as many works as possible into a single firing process." By utilizing the "manufacturing technology for thin ceramic substrates" that we have cultivated, it is possible to increase the number of setter layers. This allows for an increase in the number of works that can be fired in a single process. In cases where there are space constraints in a firing furnace as illustrated, replacing conventional ceramic plates (7mm thick) with "our ceramic substrates for firing setters (1mm thick)" enables an increase in the number of shelf layers from 16 to 18, resulting in a 12% improvement in firing loading efficiency. Additionally, even with the same number of works, "thicker works" can be fired, allowing for a wider range of applications for the firing furnace.

• Ceramics

Improving production efficiency in the "batch-type vacuum sintering furnace" used in the sintering process is a significant challenge. One proposal is to enhance production efficiency through "multi-layer stacking." By replacing the conventional ceramic support plate (7mm thick) with "our ceramic substrate for sintering setters (1mm thick)," it becomes possible to increase the number of shelf layers from 16 to 18, resulting in a 12% improvement in sintering loading efficiency. Additionally, it allows for "thicker workpieces" to be sintered with the same number of workpieces, enabling broader utilization of the sintering furnace. The second proposal is "micro-convex porous ceramic processing." Among the process conditions that affect sintering quality, "debinding performance and characteristics" are crucial, and various porous ceramic materials are being utilized creatively. In addition to these porous ceramic substrate technologies, using ceramic support plates for setters that have undergone "micro-convex porous ceramic processing" allows for space to be secured at the bottom of the sintering workpieces, thereby improving debinding efficiency and performance.

• Ceramics

Utilizing the toughness of "bendable ceramic substrates," we offer them as "next-generation ceramic substrates," enhancing their value as components. Bendable zirconia Ultra-thin zirconia ceramic substrate Zirconia possesses strong toughness (characteristics). By combining it with the manufacturing technology of ultra-thin ceramic substrates from a specialized high-performance ceramic substrate manufacturer, we can achieve bendability while maintaining its ceramic nature. The ultra-thin ceramic substrate (thickness: 50μm) also has transparency, offering possibilities such as achieving thinner substrate layers.

• Fine Ceramics

Flexible Ceramic Substrates Utilizing Toughness" Flexible Zirconia Ultra-thin Zirconia Ceramic Substrates Zirconia possesses strong toughness. By combining this with our thin ceramic substrate manufacturing technology, we have realized "flexible ceramic substrates." The ultra-thin ceramic substrate (thickness: 50μm) is also transparent and has the potential to achieve substrate thinning, positioning it as a "next-generation ceramic substrate.

• Fine Ceramics

Information on Contracted Services Our company, a "ceramics substrate specialized manufacturer" with an in-house integrated processing process from material mixing, sheet coating, firing, to circuit printing, offers contracted processing services utilizing our long-developed foundational technologies for thin ceramic substrate manufacturing, namely "green sheet coating and molding technology" and "high-temperature stable sintering technology." We look forward to your inquiries.

• Printed Circuit Board
• Fine Ceramics

Product Lineup ■ Ceramic Substrates - Alumina Ceramic Substrates - Zirconia Ceramic Substrates ■ Printed Circuit Ceramic Substrates - Thick Film Printed Circuit Ceramic Substrates - Fine Printed Circuit Ceramic Substrates ■ Ceramic Substrate Application Products - Ceramic Materials for LED Packages - Ceramic Materials for All-Solid-State Batteries - Ceramic Materials for Ceramic Tile Crafts ■ Functional Ceramic Materials - High Reflective Ceramic Materials - Porous Alumina Ceramic Substrates (Setters) - Powder Forming Ceramics

• Fine Ceramics
• Printed Circuit Board

Our company has a consistent in-house manufacturing process that includes the formulation of ceramic raw materials, green sheet coating, high-temperature sintering, and the subsequent circuit formation, all managed under our own quality and delivery standards. We have a wealth of experience in providing various ceramic components, primarily for electronic device applications such as LED packages, and we are advancing new technology development to meet the diverse needs of our customers. Here are some of our "strength points" from a technical perspective: 1. Forming technology for ultra-thin ceramic sheets 2. Mold pressing technology with high dimensional accuracy 3. High-temperature stable sintering technology with precise temperature control 4. Fine circuit printing technology and uniform film formation technology within through-holes 5. Leveraging our extensive accumulated technology to meet customer requirements.

• Printed Circuit Board
• Fine Ceramics

"Providing split slits for individualization through mold forming" "1. Removal of the frame part", "2. Barb break (strip shape)", "3. Chip break (individualization)" makes individualization easy.

• Printed Circuit Board
• Fine Ceramics

Printing film materials ■ Silver ■ Silver-platinum ■ Silver-palladium ■ Platinum ■ Copper ■ Gold ■ Ruthenium ■ Glass (insulating) Plating surface treatment for printed circuit boards - Compatible with both electroplating and electroless plating Plating types ■ Nickel ■ Palladium ■ Gold ■ Silver ■ Copper ■ Others

• Printed Circuit Board
• Fine Ceramics

Printing film materials ■Silver ■Silver-platinum ■Silver-palladium ■Platinum ■Copper ■Gold ■Ruthenium ■Glass (insulating)

• Printed Circuit Board
• Fine Ceramics

Laminated processing allows for the thickening of ceramic substrates. The photo above shows a 2mm thick ceramic substrate created by stacking two 1mm thick green sheets that were formed and coated, followed by firing.

• Printed Circuit Board
• Fine Ceramics

With the increase in brightness (high output) of LED elements, the importance of heat resistance in packaging materials has grown significantly, along with the demand for heat dissipation characteristics. We have received many inquiries regarding heat dissipation measures, particularly about "improving heat dissipation using general-purpose alumina ceramic substrates compared to aluminum nitride substrates, which have excellent heat dissipation properties." Our company applies unique printed circuit technology to process through-holes in alumina ceramic substrates and fills the through-hole sections with "special silver-based materials," achieving higher heat dissipation effects than typical alumina ceramic substrates.

• Fine Ceramics

Technology for Forming Printed Circuits on Ceramic Substrates Our company offers a comprehensive in-house process for forming circuits aimed at electronic component applications on ceramic substrates manufactured internally, utilizing advanced printed circuit formation technology. By employing screen printing methods, we can provide custom solutions with shorter lead times compared to etching methods. Additionally, the printed materials undergo high-temperature baking (850°C), ensuring stable performance and high reliability. The printed materials are not limited to wiring materials (metal pastes) but also include insulating glass materials and ceramic materials, which can also be printed. Furthermore, we have achieved not only circuit formation but also the creation of "through vias" and "multilayer circuit structures." We are advancing technology development to meet various application possibilities, and we look forward to your inquiries.

• Fine Ceramics
• Printed Circuit Board

Mold Press Processing for Green Sheets Our ceramic substrate manufacturing involves firing green sheets, which are coated sheets made from blended raw materials. These green sheets are soft and in sheet form before sintering, making processes like slitting and mold processing relatively easy. By applying press processing using high-precision molds for these sheet processes, we can accommodate processing specifications such as "irregular shapes," "through holes," and "split slits" on the ceramic substrates after sintering.

• Printed Circuit Board
• Fine Ceramics

1. Molding Technology for Ultra-Thin Ceramic Sheets Our company employs a doctor blade method for the coating process of green sheets. We mix carefully selected ceramic raw materials and resin materials, and by molding sheets using the doctor blade method, we produce green sheets with stable thickness and strength. With high-precision gap management of the blade, we are able to achieve green sheets as thin as 20 micrometers. (We are also developing coating technology for layers as thin as 5 micrometers.)

• Printed Circuit Board

Information on Contracted Services As a "ceramics substrate specialized manufacturer" with an in-house integrated processing process that includes material mixing, sheet coating, firing, and circuit printing, our company utilizes the "green sheet coating and molding technology" developed over many years as a foundational technology for thin ceramic substrate manufacturing, and we offer these manufacturing technologies as contracted processing services.

• Fine Ceramics
• Printed Circuit Board

Ceramic packaging technology that responds to advances in LED technology LEDs, as light-emitting devices, are increasingly being adopted not only for lighting applications but also in a wide range of fields such as home appliances, information devices, and medical equipment, with rapid advancements in high brightness and short wavelength. Consequently, various demands are being placed on LED package materials. Our company is advancing development to meet the "diverse customer needs for various LED packages" by leveraging our integrated manufacturing process from ceramic substrate production to printed circuit formation. We are preparing a "diverse lineup" for various applications of LED devices and "heat dissipation measures" aimed at the rapidly advancing high-power LEDs. We are progressing with technology development that can respond to various application possibilities, and we look forward to your inquiries.

• Printed Circuit Board
• Fine Ceramics

Technology for Forming Printed Circuits on Ceramic Substrates Our company utilizes technology for forming printed circuits for electronic component applications on ceramic substrates manufactured in-house, all handled through an integrated in-house process. By using screen printing methods, we can offer custom solutions with shorter lead times compared to etching methods. Additionally, since the printed materials undergo high-temperature baking (850°C), they provide stable performance and high reliability. The printed materials are not limited to wiring materials (metal pastes) but also include insulating glass materials and ceramic materials, which can also be printed. Furthermore, we have achieved not only circuit formation but also "through-hole via formation" and "multilayer circuit structures." We are advancing technology development to meet various application possibilities, and we look forward to your inquiries.

• Printed Circuit Board
• Fine Ceramics

Mold Press Processing of Green Sheets Our ceramic substrate manufacturing involves firing green sheets made from blended raw materials that have been coated onto sheets. These green sheets are soft and in sheet form before sintering, making processes such as slitting and mold processing relatively easy. By applying press processing using high-precision molds for these sheet processes, we can accommodate processing specifications such as "non-standard shapes," "through holes," and "split slits" for the ceramic substrates after sintering.

• Ceramics

Our company utilizes over 50 years of experience in manufacturing ceramic products to produce and sell ceramic plaques and monuments used as art crafts. We burn images and illustrations onto ceramic plaques using a special method. Since there is no concern about fading, we create art crafts made from ceramic materials that are suitable for outdoor installation. Ceramic photo plaques (various commemorative photos, pet photos), commemorative ceramic plaques, ceramic guide signs, and ceramic tiles are also ideal for gifts and souvenirs. Please feel free to consult with us.

• Ceramics

Porous ceramics are ceramics that have countless pores (porosity) inside. The presence of porosity reduces thermal conductivity and makes the material lightweight. Due to their extremely high permeability, they are used as setters in the firing process, resulting in excellent firing quality. Our porous ceramic substrates have a proven track record in processes such as "binder removal promotion" and "improvement of firing efficiency through multi-layer stacking" in the firing of ceramic products like ferrite substrates and metal injection molding (MIM) products.

• Printed Circuit Board
• Fine Ceramics

Ceramic substrate with high reflectivity characteristics We can provide high reflectivity ceramic substrates made from alumina ceramics as the base material. Since no special additives or coatings are used in the manufacturing process, there is no concern about contamination in subsequent processes. It is possible to accommodate mass production equivalent to existing products, as equipment for conventional alumina substrates can be shared. Additionally, because it is composed of existing raw material groups, it does not contain any substances regulated by environmental regulations.

• Printed Circuit Board
• Fine Ceramics

Ceramic materials for all-solid-state batteries expected as next-generation energy storage devices All-solid-state batteries are anticipated to be applied in a wide range of fields, from mobile devices to electric vehicles, as next-generation energy storage devices. Our company has commercialized ceramic materials for all-solid-state batteries through joint research with AIST*. *National Institute of Advanced Industrial Science and Technology (Licensed under Patent No. 5907571 and Patent No. 6326699) It is an electrolyte substrate primarily composed of "LATP (Li1.3Al0.3Ti1.7(PO4)3)" with a NASICON-type crystal structure, and the ionic conductivity is approximately 7×10^-4 S/cm.

• Printed Circuit Board
• Fine Ceramics

In particular, with high-brightness LEDs, it has become difficult to implement heat resistance measures with resin package specifications, making alumina ceramics materials indispensable for heat dissipation and heat resistance. Additionally, due to the recent increase in demand for ultraviolet LEDs, interest in ceramic packages has been rising. Our company offers ceramic package substrates with excellent heat resistance characteristics based on our unique technology. Our unique technology for "improving heat dissipation performance" has become increasingly important alongside the high brightness (high output) of LED elements, leading to a significant rise in the demand for heat resistance in packaging materials and heat dissipation characteristics. We have received many inquiries regarding "improving heat dissipation using a general-purpose alumina ceramics substrate compared to a heat-dissipating aluminum nitride substrate." By applying our unique printed circuit technology, we process through-holes in the alumina ceramics substrate and fill the through-hole sections with "special silver-based materials," achieving a higher heat dissipation effect than typical alumina ceramics substrates.

• Printed Circuit Board
• Fine Ceramics

In recent years, as the miniaturization, lightweight design, and high performance of electronic devices have progressed, the demands for high implementation and high density in circuit board packages have been increasing year by year. To meet these demands, our company is leveraging its thick film printed circuit board (through-hole) technology to develop even more delicate pattern printing techniques.

• Printed Circuit Board
• Fine Ceramics

Our alumina double-sided circuit boards can form connections between front and back patterns thanks to our unique through-hole manufacturing technology. Until now, embedding conductors in through-holes has been considered difficult due to the shrinkage of conductors during firing. However, we have independently developed a paste that controls firing shrinkage and an optimal process, enabling the supply of alumina printed circuit boards with a via structure filled with conductive paste in the through-holes. We believe our unique technology is the best solution to meet the demands for miniaturization, high functionality, and improved reliability that could not be achieved with conventional alumina printed circuit boards. Printing film materials: ■ Silver ■ Silver-Palladium ■ Silver-Platinum ■ Platinum ■ Copper ■ Gold ■ Ruthenium ■ Glass (insulating) Plating surface treatment for printed circuit boards: - Compatible with both electroplating and electroless plating. Plating types: ■ Nickel ■ Palladium ■ Gold ■ Silver ■ Copper ■ Others

• Fine Ceramics

■Alumina Ceramic Substrates Born from Our Unique Production System■ In recent years, the electronics industry, which is accelerating the pace of evolution, has developed tiny chip components that can now fit on the tip of a finger, advancing the information society. Among these, chip resistors are essential basic electronic components for constructing electronic circuits. Our alumina ceramics use high-purity alumina raw materials that excel in electrical and thermal properties, achieving excellent dimensional accuracy and divisibility through advanced processing technology. For other alumina ceramic products as well, we use high-purity alumina raw materials tailored to their applications, maintaining stable quality and excellent characteristics while producing under a strict quality control system.

• Fine Ceramics

■Alumina Ceramic Substrates Born from Our Unique Production System■ In recent years, the electronics industry, which is accelerating the pace of evolution, has developed chip components that are now small enough to fit on a fingertip, advancing the information society. Among these, chip resistors are essential basic electronic components that make up electronic circuits. Our alumina ceramics use high-purity alumina raw materials with excellent electrical and thermal properties, and through advanced processing technology, we achieve outstanding dimensional accuracy and divisibility. For other alumina ceramic products as well, we use high-purity alumina raw materials tailored to their applications, maintaining stable quality and excellent characteristics while producing under a strict quality control system.

• Fine Ceramics
• Other electronic parts

This is an alumina ceramic substrate made using high-purity alumina raw materials that excel in electrical and thermal properties, and is produced through advanced processing technology to achieve excellent dimensional accuracy and divisibility. We use high-purity alumina raw materials tailored to specific applications, maintaining stable quality and outstanding characteristics while adhering to a strict quality control system during production. 【Features】 ■ Manufacturing with high precision in thickness and dimensions is possible ■ High-precision through-hole forming and divided groove forming are achievable ■ Can be produced at a relatively low cost compared to other ceramic materials ■ Proposal of "high-reflective ceramics" considering cost-effectiveness ■ Suitable for porous applications with a high porosity rate *For more details, please refer to the catalog or feel free to contact us.

• Printed Circuit Board