ムサシノ電子 List of Products and Services

By selecting a suitable sample holder for the sample, various shapes and processing purposes for polishing can be achieved. This is a tabletop precision polishing device that is optimal for sample preparation for TEM and SEM observation. Additionally, by replacing the polishing disc and polishing agents, it can handle everything from rough polishing to mirror finishing and CMP (Chemical Mechanical Polishing) with just one unit. 【Examples of materials with processing achievements】 - Semiconductor materials: Si / SiC / GaN / GaAs / InP / Ga2O3 … - Optical materials: Glass / Sapphire / CLBO / YiG / GGG … - Ceramic materials: Alumina / Silicon Nitride … Furthermore, we have numerous achievements with other materials such as metals, minerals, and biological samples.

• Wafer processing/polishing equipment

The "MA-600e RECT" is ideal for surface polishing of large panel-type samples (such as glass or sapphire). The flexible pad of the upper oscillation unit allows for uniform polishing of the sample surface. 【Features】 ● Optimal for polishing large diameter samples By securing the sample on a Φ600mm stage, it is possible to polish the entire surface of large diameter samples. The sample is fixed by adhering it to a Φ600mm SUS plate with thermal wax and vacuum chucking the plate. ● Complex polishing possible with program settings The rotation speed and pressure of the spindle and pressure axis, as well as the oscillation width, can be set. ● Realization of safe polishing operations Emergency stop switches, leakage breakers, and interlock covers ensure safe and secure polishing operations. *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment

We would like to introduce our "Simple 2-Axis Goniometer Sample Holder." By using an attachment that can be mounted on the rail of an X-ray Laue camera, it is possible to perform polishing work while correcting the orientation in two axes. By utilizing guide rings, we have achieved high parallelism accuracy in polishing operations. Please feel free to contact us if you have any inquiries. Examples of materials we have experience processing: Semiconductor materials (silicon, germanium, silicon carbide, strontium silicate, gallium arsenide, indium gallium arsenide, indium phosphide, indium gallium zinc oxide, gallium nitride, gallium oxide, cadmium telluride, etc.) Optical materials (quartz glass, sapphire, fluorite lenses, spinel, phosphate glass, lithium borate, acrylic resin, CLBO, YiG, GGG, etc.) Ceramic materials (alumina, zirconia, silicon nitride, ferrite, etc.) Metal materials (iron and steel materials, stainless steel, copper, gold, silver, platinum, aluminum, titanium, molybdenum, etc.) [Internal Structure of the Holder] ■ 2-Axis Goniometer ■ Outer Wall of the Holder ■ Adhesive Plate *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements
• Processing Jig

The "Koro-style Forced Drive Oscillation Holding Unit" is a product that can be installed on e-type polishing devices (MA-200e, MA-300e, MA-400e). By forcibly rotating the sample holder, it is possible to quantitatively manage the polishing process. Additionally, by oscillating the sample holder, the entire surface of the polishing disk is used uniformly, maintaining flatness and improving the flatness of the sample processing surface itself. 【Features】 ■ Can be installed on e-type polishing devices (MA-200e, MA-300e, MA-400e) ■ Enables quantitative management of the polishing process ■ Improves the flatness of the sample processing surface itself ■ Two types of polishing methods ・ "Free Lap Method" following the flatness of the polishing disk ・ "Guide Ring Method" with high parallel accuracy * For more details, please refer to the PDF document or feel free to contact us.

• Processing Jig

We would like to introduce our "Guide Ring Type Clamping Holder." This product allows for the polishing of the end face while the sample is securely clamped in a vice. Additionally, we manufacture the fit tolerance between the guide ring and the guide shaft with high precision. The guide shaft (sample) descends parallel to the inner wall of the guide ring onto the polishing disk, ensuring that it is polished perpendicularly and accurately against the inner wall of the guide ring. 【List of Accessories】 ■ Clamping Holder (W58mm × D8mm) ■ Guide Shaft ■ Guide Ring ■ Weight Rod ■ Gauge Block 1mm *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements
• Processing Jig

This document is the instruction manual for the "TEM Holder," which is suitable for sample preparation for transmission electron microscopy. It includes a "List of Accessories," as well as information on the "Structure of the TEM Holder" and the "Mechanism for Controlling Grinding Amount." Additionally, there are notes on "Usage and Cleaning," so please take a moment to read through it. 【Contents (partial)】 ■ List of Accessories ■ Structure of the TEM Holder ■ Mechanism for Controlling Grinding Amount ■ Sample Attachment (Fixing with Thermal Wax) ■ Sample Attachment (Fixing with Double-Sided Adhesive Sheets) *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements
• Processing Jig

The "Embedding Sample Holder" allows for the chucking of 3 to 6 samples embedded in resin within the holder, which is then inserted into a rotating auxiliary ring for polishing. A brass rod can be attached to the center of the holder, allowing for the addition of any desired weight. Additionally, by attaching a bearing instead of the brass rod, polishing can also be performed using a pantograph-type sample holding unit. 【List of Embedding Holder Accessories】 ■ Embedding Holder ■ Height Adjustment Ring ■ Rotating Auxiliary Ring ■ Embedded Samples *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements
• Processing Jig

The "1-piece embedded sample holder" is manufactured with precise fit tolerances between the guide ring and the holder. The sample, embedded in resin, is chucked within the holder and inserted into the guide ring for polishing. As the holder (sample) descends parallel to the inner wall of the guide ring onto the polishing plate, it is polished with high precision at a right angle to the inner wall of the guide ring. 【List of Accessories】 ■ Embedded sample holder ■ Brass rod ■ Guide ring ■ Weight ■ Height adjustment ring (2mm) *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements
• Processing Jig

The "Single Attachment Holder" fixes the sample to the attachment plate using hot wax or double-sided adhesive sheets, and inserts the attachment plate with the adhered sample into the guide ring connected to the guide axis for polishing. This holder is manufactured with high precision to ensure the fit tolerance between the guide ring and the guide axis. As the guide axis (sample) descends parallel to the inner wall of the guide ring onto the polishing plate, it is designed to be polished at a right angle to the inner wall of the guide ring. 【List of Accessories】 ■ Attachment Holder ■ Guide Ring ■ Weight *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements
• Processing Jig

The "TEM Holder" is a polishing tool suitable for sample preparation for transmission electron microscopy (TEM). It allows for the setting of the polishing amount and can automatically perform the necessary polishing work. It can also be used for polishing resin-embedded samples and cylindrical samples. The precision of the polishing amount setting is adjustable to within ±5μm (with a dial gauge that has a minimum reading of 1μm). 【Features】 ■ Allows for the setting of the polishing amount and can automatically perform the necessary polishing work ■ Usable for polishing resin-embedded samples and cylindrical samples ■ The precision of the polishing amount setting is adjustable to within ±5μm ■ Can achieve parallelism accuracy of within ±2μm after polishing ■ A no-load type using springs is also available *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements

The "High Precision Holder" is a sample holder capable of automatic polishing based on a set polishing amount. The accuracy of the polishing amount setting can be adjusted to within ±3μm, and it is possible to achieve parallelism accuracy within ±1μm after polishing. Additionally, there is a "Load Reduction Type" equipped with a spring. We also offer an optional "Two-Axis Goniometer for Fine Tilt Adjustment." 【Features】 ■ Capable of automatic polishing based on the set polishing amount ■ Polishing amount setting accuracy adjustable to within ±3μm ■ Achieves parallelism accuracy within ±1μm after polishing ■ Equipped with a backlash-free stopper ■ Stroke width is 5mm *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements

The "Vacuum Chuck Holder" is a sample holder that allows for automatic precision grinding up to a set amount of grinding. The grinding amount can be set with a precision of ±3μm or less (with a minimum reading of 1μm dial gauge included), and the stroke width is 5mm. It is suitable for sample preparation for transmission electron microscopy and for thinning of compound semiconductors such as Si wafers and InP. 【Features】 ■ Ideal for sample preparation for transmission electron microscopy ■ Capable of automatic precision grinding up to the set amount ■ Grinding amount can be set with a precision of ±3μm or less ■ Comes with a zero-backlash stopper ■ Stroke width is 5mm *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements

The "Diamond Grinding Disc" is a grinding wheel that offers higher durability compared to waterproof grinding paper and can be used until the diamond layer is worn away. You can choose from particle sizes ranging from #80 to #4000 according to your application. It is also suitable for leveling the height of processing surfaces when grinding multiple samples simultaneously, and it is effective for polishing sapphire and ceramics. 【Features】 ■ High grinding power due to diamond abrasives ■ Available in particle sizes from #80 to #4000 ■ Higher durability compared to waterproof grinding paper ■ Usable until the diamond layer is worn away ■ Effective for polishing sapphire and ceramics *For more details, please refer to the PDF document or feel free to contact us.

• Other abrasives

"CMP Cross" is a cloth for CMP made by bonding polyurethane to a non-woven fabric composed of special polyester fibers. It achieves high flatness on the processing surface and high durability of the cloth, making it possible to perform polishing based on the backside of the substrate for mirror finishing of compound semiconductors and removal of oxide films. It is also suitable for the final process in polishing and for mirror finishing of edges. 【Features】 ■ Non-woven fabric made from special polyester fibers bonded with polyurethane ■ Achieves high flatness on the processing surface and high durability of the cloth ■ Suitable for use in the final process of polishing ■ Enables polishing based on the backside of the substrate ■ Removes fine scratches that cannot be eliminated in the polishing process of polishing cloths *For more details, please refer to the PDF document or feel free to contact us.

• Other abrasives

The "Hand Polishing Dedicated Holder" is a sample holder that can be used with the hand polishing device "MM-200." It allows for the setting of polishing amounts, enabling controlled processing during hand polishing. We also offer "Shift Wax," "Futarik Glue," and "Waterproof Sandpaper," among other items. 【Features】 ■ Usable with the hand polishing device "MM-200" ■ Adjustable polishing amount ■ Enables controlled processing during hand polishing ■ Designed for easy handling by hand *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements

This catalog features products handled by Musashino Electronics Co., Ltd., such as "ultra-precision grinding machines" and "experimental precision scribers." Our grinding machines possess high flatness accuracy on the rotating reference plate due to their structural characteristics, guaranteeing flatness of 5μm or less. In addition to a diverse range of grinding machines, we also introduce various "automatic grinding (sample holding) units" and "flatness correction tools" that respond to the diversifying applications. [Featured Products] ■ Ultra-precision grinding machines ■ Automatic grinding (sample holding) units ■ Flatness correction tools and various auxiliary devices ■ Various sample holders ■ Grinding discs *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment

The CS-203 is a diamond wire cutting machine capable of both wet and dry cutting. It allows for adjustment of the cutting position, image storage, and real-time display using a CCD camera, and it can perform cutting with minimal impact on various materials, from thin-walled tubes to semiconductors and gemstones, resulting in reduced burrs and chipping. We propose various fixtures for securing samples tailored to our customers' needs. 【Features】 ■ Capable of both wet and dry cutting ■ Adjustment of cutting position, image storage, and real-time display using a CCD camera ■ Cutting with minimal burrs and chipping on various materials ■ Can cut large samples up to 125mm x 125mm (maximum) ■ Proposals for various sample fixtures tailored to customer needs *For more details, please refer to the PDF document or feel free to contact us.

• Plastic processing machines (cutting and rolling)

The "SC-100/SC-150" is a precision scriber for experimental use with line LED specifications. There is no misalignment of the scribed lines due to the number of scribing passes, and there is no need to directly touch or hold the sample with your hands. Additionally, the angle setting of the sample can be done with a single touch, making operation simple. It is suitable for development experiments and quality control. 【Features】 ■ No misalignment of scribed lines due to the number of scribing passes ■ No need to directly touch or hold the sample with your hands ■ Can scribe with a constant pressure using the force of the spring without relying on input ■ Sample angle setting can be done with a single touch, making operation easy ■ Cross-sectional observation samples can be created precisely and easily ■ Ideal for development experiments and quality control *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Other processing machines

The "MA-150" is a personal-type polishing machine designed to be installed next to SEM, EPMA, TEM, etc., allowing one machine to be used for one specific purpose. Its compact size does not take up much space, making it suitable for polishing small samples, and it can polish materials such as semiconductor wafers, sapphire, SiC, glass, and ceramics. By using polishing discs and abrasives tailored to the sample, better polished surfaces can be achieved. 【Features】 ■ Personal-type polishing machine ■ Designed and developed to allow one machine to be used for one specific purpose ■ Better polished surfaces can be obtained by using polishing discs and abrasives suited to the sample ■ Compact size does not occupy much space, making it ideal for polishing small samples ■ Capable of polishing semiconductor wafers, sapphire, SiC, glass, ceramics, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• CMP Equipment
• Other processing machines

The "MA-200" is a precision polishing device that offers high accuracy and is suitable for sample preparation in research and development. By using polishing discs and abrasives tailored to the samples, better polished surfaces can be achieved, with polishing accuracy of flatness λ/10 or less and surface roughness of 0.01μm or less. It is also suitable for polishing cross-sections of ICs, inclined polishing, and end faces of optical crystals such as LN. 【Features】 ■ High accuracy, suitable for sample preparation in research and development ■ Better polished surfaces can be achieved by using polishing discs and abrasives tailored to the samples ■ Polishing accuracy of flatness λ/10 or less and surface roughness of 0.01μm or less ■ No edge rounding and no detachment of inclusions, making it suitable for evaluation with EPMA and similar techniques ■ Also suitable for polishing cross-sections of ICs, inclined polishing, and end faces of optical crystals such as LN *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Other processing machines

The "MA-200e" is a precision grinding device that is highly accurate and suitable for sample preparation in research and development. With the emergency stop button, leakage breaker, and interlock cover (optional), it enables grinding operations with a focus on safety and security. Additionally, it is now possible to manage a wide variety of grinding processes and recipes collectively via a touch panel. 【Features】 ■ Highly accurate and suitable for sample preparation in research and development ■ Improved drive system and rigidity successfully reduce vibration and noise significantly ■ Comfortable operation with digital control using an LCD touch panel ■ Ability to collectively manage a wide variety of grinding processes and recipes via the touch panel ■ Enables grinding operations with a focus on safety and security *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Other processing machines

The "MA-300e" is a precision polishing device suitable for polishing large samples such as 3-inch and 4-inch specimens. By installing automatic sample holding units in three locations, it achieves further efficiency in polishing operations. Additionally, by equipping a shaking device, it is expected to improve polishing accuracy and maintain the flatness of the polishing disc. It adopts a sequence control program, allowing for centralized management of the polishing process recipes. 【Features】 - Suitable for polishing large samples such as 3-inch and 4-inch specimens - Three automatic sample holding units installed for further efficiency in polishing operations - Adopts a sequence control program for centralized management of polishing process recipes - Equipped with a leakage breaker and emergency stop button for safe and secure polishing operations - Interlock cover also available *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Other processing machines

The "MA-400e" is a precision grinding device with a spindle directly mounted on a surface plate that has been ground and finished with high precision. The brushless DC motor allows for high-precision grinding as there is no change in rotational speed due to load fluctuations. By combining the automatic grinding mechanism's roller holding unit, roller-type swinging holding unit, and various sample holders, we have achieved high-precision automatic grinding for electronic materials, electronic components, ceramics, metal materials, as well as for the pretreatment of TEM, SEM, SIMS samples, and orientation using X-rays. 【Features】 - The spindle is directly mounted on a surface plate that has been ground and finished with high precision. - High-precision angular bearings are used in the spindle. - Achieves flatness accuracy within ±10μm on the reference table. - The brushless DC motor allows for high-precision grinding as there is no change in rotational speed due to load fluctuations. *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Other processing machines

The MS-2 is an automatic spraying device that achieves efficient polishing operations by automatically spraying diamond slurry at regular intervals. The amount sprayed at one time is approximately 0.1cc, making it more economical than manually spraying diamond liquid onto the polishing disc. It is possible to operate multiple spraying devices with just one compressor. 【Features】 - Achieves efficient polishing operations by automatically spraying diamond slurry at regular intervals. - More economical than manually spraying diamond liquid onto the polishing disc. - Can operate multiple spraying devices with just one compressor. - Requires an air source of about 2 bar (a compressor is available as an option). *For more details, please refer to the PDF materials or feel free to contact us.

• Wafer processing/polishing equipment
• Other processing machines
• Other physicochemical equipment

When performing automatic polishing using a precision grinding device, the selection of the sample holder is very important. Considering the shape of the sample and the target finishing accuracy, we will propose suitable sample holders. For samples with special shapes or requiring higher precision, we also accept requests for custom sample holders. 【Product Lineup】 <Holder with Polishing Amount Adjustment Mechanism> ■ Vacuum Chuck Holder ■ High-Precision Holder ■ TEM Holder ■ Thickness Adjustment Holder *For more details, please refer to the PDF materials or feel free to contact us.

• Wafer processing/polishing equipment
• Other processing machines
• Other machine elements

When performing precise polishing work, the selection of the polishing disk is crucial. Considering the materials contained in the sample and the desired finish, we will propose the optimal polishing disk.

• CMP Equipment
• Wafer processing/polishing equipment
• Other processing machines

Introducing Musashino Electronics' "Abrasives." They can be selected to match various samples, including polycrystalline and single crystal, water-soluble and oil-based, and amphoteric types. Please feel free to contact us when you need assistance. 【Product Lineup】 ■ Diamond slurry ■ GC abrasives (green silicon carbide) ■ WA abrasives (white alumina) ■ Cerium oxide abrasives ■ Colloidal silica abrasives ■ CMP abrasives 【Examples of Materials with Processing Achievements】 ■ Semiconductor materials (silicon, germanium, silicon carbide, strontium silicate, gallium arsenide, indium gallium arsenide, indium phosphide, indium gallium zinc oxide, gallium nitride, gallium oxide, etc.) ■ Optical materials (quartz glass, sapphire, fluorite lenses, spinel, phosphate glass, lithium borate, acrylic resin, etc.) ■ Ceramic materials (alumina, zirconia, ferrite, etc.) ■ Metal materials (steel materials, stainless steel, copper, gold, silver, platinum, aluminum, titanium, molybdenum, etc.) *For more details, please refer to the PDF document or feel free to contact us.

• Other abrasives
• Other consumables

The "MPC-200e" is a precision blade cutting machine that employs a motor drive for the work table feed mechanism. It allows for stepless feed speed settings within the range of 0 to 100 mm/min. Cutting conditions can be easily set using a touch panel. Additionally, an optional goniometer is available that allows for cutting immediately after determining crystal orientation using X-ray diffraction. 【Features】 ■ Capable of performing parallel cuts with a minimum precision of 100 μm ■ Cutting positions can be determined in increments of 10 μm ■ The work table feed can be selected to be automatic or manual at will ■ Easier cutting of samples such as iron-based materials, which tend to bind with grinding wheels *For more details, please download the PDF or feel free to contact us.

• Plastic processing machines (cutting and rolling)

The "MPC-130" is a compact and safe precision blade cutting machine that is small, lightweight, and equipped with an interlock function. With a movement mechanism utilizing a micrometer, the cutting position of the sample can be adjusted in increments of 10μm. It is suitable for development experiments and quality control. 【Features】 ■ Gentle cutting on samples with a low-speed rotating balance weight system ■ Compact and lightweight, space-saving ■ Easy to operate ■ Safe operation with cover and interlock *For more details, please download the PDF or feel free to contact us.

• Plastic processing machines (cutting and rolling)
• Other physicochemical equipment
• Other processing machines