寺田 List of Products and Services

"TRU-0260K2" is a one-component UV-curable epoxy resin developed for use in small motor balancers. It can be cured in a short time under UV irradiation (3,000 mJ/cm²) from a metal halide lamp, making it suitable for efficient mass production processes. This product possesses high heat resistance and high humidity resistance, ensuring long-term reliability even in harsh environments. Additionally, its high thixotropy (thixotropic index of 1.6) enhances separation prevention performance, allowing for stable application and molding. The cured material features a high specific gravity design of 2.8, stabilizing balance performance, along with excellent physical properties such as Shore D hardness of 90, glass transition temperature of 128°C, and linear expansion coefficient of 23 ppm/K. Furthermore, it has a low curing shrinkage rate of 0.7%, making it suitable for parts that require precision. 【Features】 - One-component UV-curable epoxy resin - High specific gravity (2.8) with stable balance performance, ideal for small motor balancer applications - High heat resistance (Tg 128°C) and high humidity design *For more details, the product's specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

• Other polymer materials

The 『TRU-0500K2』 is a one-component UV-curable urethane acrylate resin developed for moisture-proof coating applications on electronic circuit boards. Its one-component design, which requires no mixing, makes it easy to handle, and it allows for rapid curing through UV irradiation (1,500mJ/cm²), making it suitable for energy-efficient and effective mass production processes. This product features a low viscosity design of 550mPa·s (25°C), providing excellent workability and making it easy to coat complex part shapes and narrow areas. The cured material has a Shore D hardness of 58, balancing flexibility and strength. Additionally, it boasts excellent insulation properties with a dielectric breakdown strength of 30kV/mm and a volume resistivity of 2×10^15Ω·cm, supporting the long-term reliability of electronic devices. The appearance is transparent, allowing for use without compromising the aesthetics of circuit boards and electronic components. 【Features】 ■ One-component UV-curable urethane acrylate resin ■ Low viscosity (550mPa·s) for good workability ■ High moisture resistance (water absorption rate of 0.3%), ensuring long-term reliability *For more details, a product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

• Other polymer materials

"TRU-0153K" is a one-component UV-curable urethane acrylate resin developed for the coating of electronic components. It can be cured in a short time using metal halide lamp irradiation (1,500 mJ/cm²), demonstrating high productivity even in mass production processes. This product has a low viscosity of 1,300 mPa·s and low hardness (Shore A35), providing flexible properties that relieve stress and prevent crack formation. Furthermore, it shows no change in hardness even after high-temperature testing at 150°C for 1,000 hours and 1,000 cycles of thermal cycling between -40°C and 150°C, exhibiting excellent moisture and heat resistance and durability. It balances high insulation and flexibility. 【Features】 ■ One-component UV-curable urethane acrylate resin ■ Short curing time (UV: 1,500 mJ/cm²) ■ Low viscosity and low hardness (Shore A35) with flexibility, effective for stress relief ■ No change in hardness after 150°C for 1,000 hours and -40°C to 150°C for 1,000 cycles *For more details, the product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please contact us if needed.

• Other polymer materials

"TRU-0251FR" is a one-component UV-curable epoxy resin suitable for coating and sealing applications of electronic components. It requires no mixing process, making it easy to handle, and allows for rapid curing through metal halide lamp irradiation (3,000mJ/cm²), significantly contributing to productivity improvements in mass production processes. This product has a low viscosity of 1,300 mPa·s, providing excellent workability and making it easy to apply to narrow spaces and complex-shaped parts. The cured material exhibits excellent mechanical properties with a Shore D hardness of 85, a bending strength of 50 MPa, and a bending modulus of elasticity of 1,400 MPa, along with a glass transition temperature of 91°C, demonstrating stable thermal characteristics. Its flame retardancy and low water absorption rate of 0.5% also ensure excellent moisture and heat resistance and safety. [Features] - One-component UV-curable epoxy resin - Rapid curing with UV irradiation (3,000mJ/cm²), suitable for mass production processes - Good workability with low viscosity (1,300 mPa·s) *For more details, a product specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please reach out if needed.

• Other polymer materials

"TRU-0220FR" is a one-component UV-curable epoxy acrylate resin developed for the coating of electronic components. It allows for rapid curing under UV irradiation from a metal halide lamp (1,500mJ/cm²), contributing to improved productivity in mass production processes. This product features low viscosity (2,100mPa·s), making it easy to work with and suitable for filling and coating complex part shapes. It is flame-retardant (equivalent to UL94 V-0 at 5mm thickness) and can be adapted for use in fields where safety is a concern. It balances transparency and high hardness, with a low water absorption rate of 0.3%, providing excellent moisture and heat resistance. Suitable applications include electronic component coatings, transparent protective materials, and areas requiring heat resistance and flame retardancy. 【Features】 ■ One-component UV-curable epoxy acrylate resin ■ High reactivity with rapid curing (UV: 1,500mJ/cm²) ■ Excellent workability due to low viscosity *For more details, the product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

• Other polymer materials

The TE-1006-2 is a two-component, room temperature curing epoxy resin developed for preventing liquid leakage in small motors and sensor components. It can cure without the need for heating, at 25°C for 24 hours or at 100°C for 30 minutes, contributing to improved work efficiency and energy savings on-site. This product exhibits a shear adhesive strength of 21 MPa (SUS/SUS, 25°C), ensuring high adhesive reliability. Furthermore, it is designed to have high heat and humidity resistance, maintaining performance even in harsh environments. With its high thixotropic properties, it excels in workability, making it easy to apply and build up in targeted areas, thus accommodating a wide range of applications such as sealing small motors, sensors, and electronic components. **Features** - Two-component, room temperature curing epoxy resin (mixing ratio 100:12) - High adhesion with a shear adhesive strength of 21 MPa - High heat and humidity resistance design ensures long-term reliability *For more details, the product's specification sheet is available for download as a PDF below, or you can contact us for more information.* *Samples are also available, so please contact us if needed.*

• Other polymer materials

The "TE-5014K4" is a one-component, heat-curing epoxy resin developed for applications that require prevention of liquid dripping. It is easy to handle as no mixing is required. This product exhibits a shear adhesive strength of 24 MPa (SUS/SUS, 25°C). It shows a Shore D hardness of 85 and a volume resistivity of 1×10^15 Ω·cm or higher, designed to combine strength and insulation properties. The curing conditions are simple at 120°C for 2 hours, making it suitable for mass production processes. 【Features】 ■ One-component heat-curing epoxy resin ■ High heat resistance with Tg of 130°C ■ High strength adhesion (shear adhesive strength of 24 MPa) ■ High thixotropy for good workability ■ High hardness (Shore D 85), high insulation (volume resistivity > 1×10^15 Ω·cm) *For more details, the product's characteristic table is available, and you can download the PDF from below or contact us. *Samples are also available, so please contact us if needed.

• Other polymer materials

TE-5018 is a one-component, heat-curing epoxy resin developed for bonding and insulating encapsulation applications of electronic and electrical components. While ensuring stability with refrigerated storage, it accommodates low-temperature curing at 80°C for 1 hour, making it suitable for heat-sensitive components and processes with temperature constraints. The cured material exhibits high mechanical strength with a bending strength of 95 MPa, a bending modulus of 3,300 MPa, and a Shore D hardness of 87. Additionally, it possesses excellent electrical properties with an insulation breakdown strength of 20 kV/mm and a volume resistivity of 5×10^15 Ω·cm, supporting the long-term reliability of electronic devices. Furthermore, it has balanced physical properties with a linear expansion coefficient of 61 ppm/K, a curing shrinkage rate of 2.5%, and a water absorption rate of 0.3%, reducing the risk of cracks and performance degradation. It also excels in workability and can be widely used for insulating encapsulation of electronic components, structural bonding, and ensuring reliability in heat and humidity-resistant environments. 【Features】 ■ One-component heat-curing epoxy resin (no mixing required) *For more details, the product's specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please inquire if needed.

• Other polymer materials

"TE-6408FRK" is a room temperature curing two-component epoxy resin, suitable for coating and adhesive applications. It can cure at 25°C, eliminating the need for heating equipment, allowing for energy-efficient and effective work. A major feature of this product is its flexible cured material. It demonstrates over 90% transparency (420-600nm transmission), making it suitable for applications that require high aesthetic quality. Additionally, it possesses flame retardancy (equivalent to UL94 V-0 at 5mm thickness), contributing to safety assurance. It can be widely used for coating electronic components, bonding plastics and metals, and clear applications that require aesthetic appeal. [Features] - Two-component room temperature curing epoxy resin (mixing ratio 100:30) - Flexible cured material (tensile elongation of 230%, crack prevention effect) - High transparency (over 90% transmission at 420-600nm) - Low viscosity and good workability *For more details, the product specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please reach out if you need them.

• Other polymer materials

The "TE-7170K" is a two-component, room temperature curing epoxy resin developed for heat dissipation insulation applications in electronic and electrical equipment. It cures at 25°C without the need for heating equipment, making it energy-efficient and easy to handle on-site. This product has a thermal conductivity of 0.9 W/m·K, making it effective for heat dissipation measures for heat-generating components. Additionally, the resin design incorporates flexibility to absorb and alleviate stress, helping to suppress the occurrence of cracks in substrates and components. It is suitable for applications that require high reliability. With a low viscosity design of 3,500 mPa·s (25°C), it excels in filling details and provides a sufficient working time of approximately 3 hours. 【Features】 ■ Two-component, room temperature curing epoxy resin (mixing ratio 100:20) ■ Effective for heat dissipation measures with a thermal conductivity of 0.9 W/m·K ■ Flexible design that effectively alleviates stress and prevents cracking ■ Good workability with low viscosity and approximately 3 hours of usable time *For more details, the product's specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please contact us if needed.

• Other polymer materials

"TE-6409FR" is a two-component transparent epoxy resin suitable for electronic component encapsulation and craft applications where transparency is required. The mixing ratio of the base agent to the hardener is 100:50, and the mixed viscosity is only 500 mPa·s, making it a low-viscosity design that allows for easy filling of details and uniform coating. It demonstrates over 90% transparency (420-600nm transmission) and is suitable for applications where appearance quality is important. Furthermore, it achieves excellent yellowing resistance, showing no discoloration even after a heat resistance test at 120°C for 1,000 hours, combining aesthetics with reliability. Additionally, it is flame-retardant, contributing to safety assurance. Applications include electronic component encapsulation, transparent panels, clear photo panels, and art crafts, making it versatile across various fields. 【Features】 ■ Two-component transparent epoxy resin (mixing ratio 100:50) ■ High transparency (over 90% transmission at 420-600nm) ■ Excellent workability with low viscosity of 500 mPa·s *For more details, the product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

• Other polymer materials

"TE-6420FR" is a two-component, room temperature curing epoxy resin developed for the encapsulation of electrical and electronic components. It does not require heating equipment and can cure at 25°C, achieving an energy-efficient and effective working environment. This product features a low viscosity design with a mixing viscosity of approximately 2,000 mPa·s (25°C), allowing excellent filling capability for intricate details and accommodating complex component shapes and filler-less encapsulation. The curing conditions can be flexibly selected as 25°C for 6 hours, 40°C for 3 hours, or 50°C for 1 hour. 【Features】 - Room temperature curing type (no heating operation required, caution with heat generation), efficient short curing time - Low viscosity design suitable for precise filling - High heat resistance: Tg 126°C - Flame retardant: UL94 V-0 equivalent (5mm thickness) - High insulation: Volume resistivity > 1×10^15 Ω·cm *For more details, the product's specification sheet is available for download as a PDF from the link below, or you can contact us for more information. *Samples are also available, so please contact us if needed.

• Other polymer materials

The "TE-6000" is a low-viscosity, high-strength epoxy resin suitable for encapsulating electronic and electrical components. It is a two-component system with a mixing ratio of 100:30, making it easy to handle, and it has low-temperature curing properties, allowing it to cure at 70°C for 3 hours or at room temperature. Additionally, it enhances flexibility in the production process and contributes to energy savings. 【Features】 ■ Two-component heat-curing epoxy resin (mixing ratio 100:30) ■ Low viscosity with excellent filling properties and workability ■ Low-temperature curing (70°C for 3 hours, room temperature curing also possible) ■ High strength (flexural strength 110 MPa, elastic modulus 3,000 MPa) ■ High insulation properties (dielectric breakdown strength 30 kV/mm, volume resistivity 1×10^16 Ω·cm) *For more details, the product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please contact us if needed.

• Other polymer materials

The "TE-7000" is a two-component, heat-curing epoxy resin suitable for sealing applications in electrical and electronic components. Its low viscosity design allows for excellent filling of details and can accommodate complex part shapes. This product has a long pot life of 24 hours (at 60°C), ensuring stable sealing operations while providing ample time for work processes. Additionally, it has a proven track record of passing high-temperature tests at 180 degrees and thermal tests at -40°C and 180°C. 【Features】 ■ Two-component heat-curing epoxy resin (mixing ratio 100:60) ■ Excellent filling properties and workability due to low viscosity ■ Long pot life of 24 hours (at 60°C) ■ High insulation properties (dielectric breakdown strength over 25kV/mm, volume resistivity > 1×10^16Ω·cm) ■ Flexural strength of 81MPa and flexural modulus of 2,400MPa ■ Low water absorption rate of 0.3% for improved reliability *For more details, the product's specification sheet is available for download as a PDF from the link below, or you can contact us for more information. *Samples are also available, so please contact us if needed.

• Other polymer materials

"TE-7130" is a general-purpose, two-component, heat-curing epoxy resin for the encapsulation of electrical and electronic components. With a mixing ratio of 100:20, it is easy to handle, and after curing, it becomes an encapsulant that combines high strength and high insulation properties. Its greatest feature is the realization of a low coefficient of linear expansion of 27 ppm/K. This reduces expansion and contraction due to temperature changes, thereby lowering the risk of crack formation. It is resistant to thermal cycling, ensuring long-term reliability for power devices and electronic components. [Features] - Two-component heat-curing epoxy resin (mixing ratio 100/20) - Low coefficient of linear expansion: 27 ppm/K → strong against thermal cycling, crack suppression - High insulation properties (dielectric breakdown strength 33 kV/mm, volume resistivity 1×10^16 Ω·cm) - High strength (flexural strength 141 MPa, flexural modulus 10,000 MPa) - Low water absorption rate of 0.1% ensures long-term stability *For more details, the product specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please contact us if needed.

• Other polymer materials

The "TE-7820FR3" is a two-component, heat-curing epoxy resin developed for power device encapsulation applications. With an easy-to-handle mixing ratio of 100/100, it achieves excellent filling properties due to its low viscosity and high workability. It features high heat resistance with a glass transition temperature of 174°C and flame retardancy equivalent to UL94 V-0 (2mm thickness). Additionally, it has been designed to improve adhesion to copper, enhancing the reliability of bonding with copper substrates and conductors. This makes it suitable for applications requiring thermal, electrical, and mechanical performance, such as semiconductor packages and power modules. 【Features】 ■ Two-component heat-curing epoxy resin (mixing ratio 100/100) ■ High strength and high heat resistance (Tg = 174°C) ■ Excellent thermal cycle resistance with a low coefficient of thermal expansion (20ppm/K) ■ Flame retardancy: UL94 V-0 equivalent (2mm thickness) ■ High insulation properties (dielectric breakdown strength over 25kV/mm, volume resistivity 4.0×10^16Ω·cm) *For more details, the product's specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please contact us if needed.

• Other polymer materials

"TE-7814V" is a two-component, heat-curing epoxy resin suitable for heat dissipation sealing applications in electronic and electrical equipment. Its low viscosity design allows it to accommodate complex component shapes, significantly improving workability and production efficiency. This product has a thermal conductivity of 2.5 W/m·K, making it effective for heat dissipation measures in electronic components that generate heat. It can be widely used in fields that require high performance, such as electronic devices and power modules. 【Features】 - Two-component heat-curing epoxy resin (mixing ratio 100/100) - Suitable for complex component shapes due to low viscosity - High thermal conductivity: 2.5 W/m·K - High heat resistance: high Tg 185℃ - Flame retardant: equivalent to UL94 V-0 - High insulation properties ensure long-term reliability of electronic devices *For details, the product's specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please contact us if needed.

• Other polymer materials

"TE-6430" is a two-component, room-temperature curing epoxy resin (hard type) developed as an insulating material for heat dissipation in electronic and electrical equipment. It excels in workability due to its ability to cure at room temperature, and it remains low in viscosity after mixing, making it easy to handle. This product has a thermal conductivity of 2.4 W/m·K, making it effective for heat dissipation measures for electronic components that generate heat. Additionally, it possesses flame retardancy equivalent to UL94 V-0 (5mm thickness), allowing for safe use in applications where safety is a concern. 【Features】 ■ Two-component, room-temperature curing epoxy resin (hard type) ■ High thermal conductivity: 2.4 W/m·K ■ Flame retardancy: UL94 V-0 equivalent (5mm thickness) ■ Good workability with low viscosity after mixing ■ High insulation and low water absorption improve the reliability of electronic devices *For more details, we have published the product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if needed.

• Other polymer materials

TE-7901K is a one-component, heat-curing epoxy resin developed as an insulating material for heat dissipation in electronic and electrical equipment. It excels in workability due to the absence of a mixing process, allowing for stable quality during use. This product boasts a thermal conductivity of 6.5 W/m·K, making it suitable for heat dissipation measures in electronic components that generate heat, such as motors, coils, and power devices. Additionally, it has flame retardancy equivalent to UL94 V-0, making it a reliable choice for applications that require high reliability. 【Features】 - One-component, heat-curing epoxy resin (no mixing required, high workability) - High thermal conductivity: 6.5 W/m·K - Flame retardancy: UL94 V-0 equivalent (5mm thickness) - High insulation and high heat resistance (Tg 110℃) - Suitable for heat dissipation and insulation sealing applications in electronic devices *For more details, the product's specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

• Resin container

TE-7172K2 is an epoxy resin with high thermal conductivity (3W/m·K) and flexibility. It can be used as a heat dissipation insulating material and gap filler for electronic and electrical equipment where stress relief is required. While there are similar products in silicone and urethane, you can also expect the unique chemical resistance, solvent resistance, and water resistance of epoxy.

• Other polymer materials
• Other electronic parts

TE-5111K is an epoxy resin with a low curing shrinkage rate, fast curing time, and a relatively high glass transition temperature of 153°C. It can cure using either heat or UV light, providing flexibility in work options. It can be used for sealing electrical and electronic components. One-component heat-curing, UV-curing white epoxy resin Features: low coefficient of thermal expansion, low shrinkage, high workability (relatively low viscosity), high heat resistance, short curing time *For details, we have published a product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if needed.

• Other polymer materials
• Other electronic parts
• glue

TE-5111K is an epoxy resin with a low curing shrinkage rate, fast curing time, and a relatively high glass transition temperature of 168°C. It can be used for encapsulation of electrical and electronic components. Single-component heat-curing black epoxy resin Features: low coefficient of thermal expansion, low shrinkage, high workability (relatively low viscosity), high heat resistance, short curing time *For more details, we have published a product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if you need them.

• Other polymer materials
• glue
• Other electronic parts

TE-1002FR is an epoxy-based adhesive with flame retardancy equivalent to UL94 V-0 (5mm thick). It can be used for bonding, fixing, and sealing in areas where flame retardancy is required. Two-component room temperature curing epoxy resin Features: Room temperature curing, high adhesion strength, flame retardancy *Samples are available upon request. Please contact us for more details. *For more information about this product, please download the specification sheet from below. *For other products, please download the catalog and epoxy & acrylic resin "TERADITE" from below.

• Other polymer materials
• glue
• Other consumables

TE-6420 is an epoxy resin with high toughness (crack resistance) and high heat resistance. It can be used for bonding, fixing, and sealing in areas where crack resistance is required. Being filler-free, it has low viscosity and excellent workability. Two-component, room temperature curing epoxy resin Features: Room temperature short curing time, high heat resistance, high toughness (crack resistance: high bending strength and high bending modulus), low viscosity *For details, we have published the product characteristics table, so please download the PDF from the link below or contact us. *Samples are also available, so if you need a sample, please contact us.

• Other polymer materials
• glue
• Other electronic parts

The Huntsman-made Urethane 160 series is a coating material that enhances the reliability of printed circuit boards with moisture-proof, waterproof, insulating, and dust-proof properties. It is easy to handle and features room temperature curing. Among the series, Urethane 160FL is transparent and compatible with fluorescent emission, using toluene as a diluent solvent.

• Other polymer materials
• Other electronic parts
• Coating Agent

The Huntsman-made Urethane 160 series is a coating material that enhances the reliability of printed circuit boards with moisture-proof, waterproof, insulating, and dust-proof properties. It is easy to handle and features room temperature curing. Among the series, Urethane 160BP-TF is blue and transparent, using IPA as a diluent solvent, and is a toluene-free type. For more details, please refer to the documentation or contact us.

• Other polymer materials
• Other electronic parts
• Coating Agent

The Huntsman-made Urethane 160 series is a coating material that enhances the reliability of printed circuit boards with moisture-proof, waterproof, insulating, and dust-proof properties. It is easy to handle and features room temperature curing. Among the series, Urethane 160TF is transparent and uses IPA as a diluent solvent, and it is a toluene-free type. For more details, please refer to the documentation or contact us.

• Other polymer materials
• Other electronic parts
• Coating Agent

The Huntsman-made Urethane 160 series is a coating material that enhances the reliability of printed circuit boards with moisture-proof, waterproof, insulating, and dust-proof properties. It is easy to handle and features room temperature curing. Among the series, Urethane 160B-N is transparent blue and uses toluene as a diluent solvent. For more details, please refer to the documentation or contact us.

• Other polymer materials
• Other electronic parts
• Coating Agent

Araldite is an epoxy-based adhesive manufactured by Huntsman, used in advanced technology fields such as electronics, automotive, and aerospace around the world, earning high reliability. Araldite 420AB excels in shear and peel strength and can bond to a variety of materials. In addition to metals, it demonstrates high adhesion to CFRP and GFRP. *This is a stock item. *For details, please check the documentation or contact us. *The TDS is available in English.

• Composite Materials
• Other polymer materials
• glue

Araldite is an epoxy adhesive manufactured by Huntsman, which is used in advanced technology fields such as electronics, automotive, and aerospace around the world, earning high reliability. Rapid is an epoxy adhesive that is filled in a tube for ease of use, featuring the same high reliability. It can bond a wide range of materials including metal, ceramics, rubber, and rigid plastics. *For more details, please check the materials or contact us. *RAPID and 2012 contain the same contents.

• Composite Materials
• Other polymer materials
• glue

The Huntsman-made Urethane 160 series is a coating material that enhances the reliability of printed circuit boards with moisture-proof, waterproof, insulating, and dust-proof properties. It is easy to handle and features room temperature curing. Among the series, Urethane 160 is transparent and uses toluene as a diluent solvent. For more details, please refer to the documentation or contact us.

• Other polymer materials
• Other electronic parts
• Coating Agent

This is a two-component epoxy-based fast-curing adhesive from the global chemical manufacturer Huntsman. It features a usable time of 4 to 8 minutes and rapid curing at room temperature. Although it is in paste form, it has thixotropic properties, allowing for gap filling. While it is not as fast-curing as RAPID (2012), it has high heat resistance. It exhibits adhesion to various substrates such as metals, ceramics, and rubber. *For more details, please check the property table below or contact us.*

• Other polymer materials
• glue

This is a two-component epoxy adhesive from the global chemical manufacturer Huntsman. It is a low-viscosity transparent adhesive suitable for bonding glass and ceramics, as well as for transparent casting and laminating. It has a refractive index equivalent to that of glass. *Please note that the 2020 Hardener is classified as a hazardous substance. *For details, please check the properties table below or contact us.

• Other polymer materials
• glue
• Coating Agent

This is a two-component epoxy adhesive from the global chemical manufacturer Huntsman. It has excellent chemical resistance and can withstand temperatures up to 140°C. Additionally, it is thixotropic and suitable for gap filling. For more details, please check the properties table below or contact us. *Please note that the hardener HV998-1 is classified as a hazardous substance.

• Other polymer materials
• glue

This is a general-purpose two-component epoxy adhesive from Huntsman, a global chemical manufacturer. It has high toughness and shear and peel adhesion strength, providing a wide range of adhesion to various substrates such as metals, ceramics, rubber, and rigid plastics. It excels in electrical insulation properties and has a proven track record in the electrical field. For more details, please check the specifications table below or contact us. *Please note that the hardener HV953U J CI is classified as a hazardous substance.

• Other polymer materials
• glue

This is a general-purpose two-component epoxy adhesive from the global chemical manufacturer Huntsman. It is a tough paste that can bond GRP, SMC, and dissimilar materials, and can fill gaps. It does not sag even when applied thickly. For details, please check the properties table below or contact us. It is a non-hazardous substance, making it easy to manage and handle.

• Other polymer materials
• glue

This is a fast-curing epoxy putty from the global chemical manufacturer HUNTSMAN. Araldite AV/HV1580GB is in putty form, and by tearing off the required amounts of the base and hardener and mixing them together, it can achieve strong adhesion to various materials, making it suitable for gap filling and sealing applications. It is a fast-curing type, reaching initial strength in 1 hour at 25°C. The hardness is very high at Shore D 95, becoming as hard as metal. Base: AV1580GB Hardener: HV1580GB *For more details, please refer to the documentation or contact us.*

• Composite Materials
• Other polymer materials
• glue

The H-2715 is a glass cloth with a thickness of 0.14mm, coated with a heat-resistant and chemical-resistant acrylic adhesive, resulting in a total thickness of 0.19mm for this glass cloth adhesive tape. The combination of glass fiber and acrylic adhesive allows for heat resistance without any change in physical properties. 【Features】 ■ Total thickness is 0.18mm ■ Heat resistance without change in physical properties ■ UL certified (UL510FR, UL temperature rating: 155℃) ■ Effective insulation and heat resistance ■ Coated with heat-resistant and chemical-resistant acrylic adhesive on 0.14mm thick glass cloth *For more details, please refer to the PDF document or feel free to contact us. *There is also a product number S-2115, which is coated with silicone adhesive and has a heat resistance of 200℃. https://www.ipros.jp/product/detail/2000607760 *The tape in the image has a plastic core, but our stock items have a paper core.

• Inductor Coil
• Transformers
• Adhesive tape

This is a two-component epoxy adhesive from the global chemical manufacturer Huntsman. It has a heat resistance of up to 140°C and particularly high chemical and water resistance, making it suitable for bonding various materials such as metals, electronic components, and glass. Due to its high heat resistance, it can also be used in relatively high-temperature environments. For more details, please check the documentation or contact us. *Please note that the 2014-2 hardener is classified as a hazardous substance.

• Other polymer materials
• glue

This is a two-component epoxy adhesive from the global chemical manufacturer Huntsman. It has good weather resistance and chemical resistance, and it comes in a paste form with a metallic color that can be applied to vertical surfaces. This is a general-purpose grade paste adhesive. If you prefer a low-viscosity product, please consider 2011 or 2012 (RAPID). For more details, please check the documentation or contact us. *Please note that 2013-1 has a hardener that is classified as a toxic substance.

• Other polymer materials
• glue

This is a two-component epoxy fast-curing adhesive from the global chemical manufacturer Huntsman. It cures rapidly at room temperature, has high shear and peel adhesion strength, and offers a wide range of adhesion to various substrates. *For more details, please refer to the materials or contact us.*

• Other polymer materials
• glue

This is a general-purpose two-component epoxy adhesive from the global chemical manufacturer Huntsman. It has high toughness and shear and peel adhesion strength, providing a wide range of adhesion to various substrates such as metal, ceramics, rubber, and rigid plastics. *For details, please check the property table below or contact us. *Please note that the 2011 Hardener is classified as a hazardous substance.

• Other polymer materials
• glue

This is a potting and casting polyurethane resin from the global chemical manufacturer HUNTSMAN. The 96S is characterized by its high hardness and flame retardancy. There is also a 96SB with a black main agent color (no change in properties other than color). For details, please check the property table below or contact us. 96S (Main agent color: light yellow) Main agent: Polyol 3002S Hardener: Isocyanate 2025-1 96SB (Main agent color: black) Main agent: Polyol 3002SB Hardener: Isocyanate 2025-1 *In 2024, due to a change in raw materials, Isocyanate 2025 was changed to Isocyanate 2025-1.

• Other polymer materials
• Other electronic parts

This is a potting and casting polyurethane resin from the global chemical manufacturer HUNTSMAN. 3002SB/2056 is characterized by its balanced performance. For details, please check the properties table below or contact us. Main agent: Polyol 3022SB Hardener: Isocyanate 2056

• Other polymer materials
• Other electronic parts

This is a potting and casting polyurethane resin from the global chemical manufacturer HUNTSMAN. 94S is characterized by its low hardness and flame retardancy. There is also a 94SB with a black main agent color (no change in properties other than color). For details, please check the property table below or contact us. 94S (Main agent color: light yellow) Main agent: Polyol 3006S Hardener: Isocyanate 2025-1 94SB (Main agent color: black) Main agent: Polyol 3006SB Hardener: Isocyanate 2025-1 *In 2024, due to a change in raw materials, Isocyanate 2025 was changed to Isocyanate 2025-1.

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