寺田 Product Lineup

In the industrial robot industry, temperature management of electronic components is crucial for achieving high-precision movements. Particularly for components that generate significant heat, such as high-output motors and control boards, efficient heat dissipation is required. Poor heat dissipation performance can lead to component failure or performance degradation, potentially resulting in a decrease in the overall precision of the robot. TE-7127 addresses these challenges with its high thermal conductivity, contributing to the reliability of industrial robots. 【Application Scenarios】 - Heat dissipation for high-output motors - Sealing of control boards - Protection of precision sensors 【Benefits of Implementation】 - Extended lifespan of components - Improved operational stability of robots - Achievement of high-precision tasks

• Other polymer materials
• Other consumables

In the automotive industry, as the miniaturization and high performance of electronic components progress, thermal management has become an important issue. In particular, for heat-generating components such as engine control units (ECUs) and power semiconductors, efficient cooling is essential. If appropriate thermal measures are not implemented, it can lead to component failure or performance degradation, potentially compromising the reliability and safety of the vehicle. TE-7127 balances high thermal conductivity and ease of use, contributing to the improvement of automotive cooling performance. 【Usage Scenarios】 - Sealing of ECUs - Heat dissipation of power semiconductors - Thermal management of in-vehicle electronic devices 【Benefits of Implementation】 - Extended lifespan of electronic components - Improved reliability of vehicles - Enhanced cooling efficiency

• Other polymer materials
• Other consumables

In the semiconductor industry, effective heat dissipation measures are essential due to the increasing density and performance of devices. Heat can lead to performance degradation and failure of devices, potentially compromising product reliability. TE-7127 achieves both high thermal conductivity and excellent insulation, contributing to improved heat dissipation performance of semiconductor devices and enhancing product reliability. 【Application Scenarios】 - High-performance processors such as CPUs and GPUs - Power semiconductor devices - LED lighting 【Benefits of Implementation】 - Suppression of device temperature rise - Extension of product lifespan - Stabilization of performance

• Other polymer materials
• Other consumables

In the robotics industry, the increase in output power has led to a higher risk of performance degradation and failures due to heat generation. In particular, heat dissipation measures for motors and drive components are critical issues that affect the reliability and lifespan of robots. The TE-7900 addresses these challenges with its high thermal conductivity and low viscosity. 【Application Scenarios】 - Insulation and heat dissipation sealing for high-output motors - Heat dissipation measures for power electronics components - Thermal management for robotic arms and drive units 【Benefits of Implementation】 - Suppression of component overheating and stabilization of performance - Extension of product lifespan - Improvement of robot system reliability

• Other polymer materials
• Other consumables

In the power electronics industry, effective heat dissipation measures are essential due to the increasing density and performance of devices. In particular, improving power conversion efficiency directly contributes to enhancing system reliability and energy saving. Without appropriate heat dissipation design, the risk of performance degradation and failure due to overheating of devices increases. TE-7900 enhances heat dissipation and supports the efficient operation of power electronics equipment due to its high thermal conductivity and low viscosity. 【Application Scenarios】 - Inverters - Converters - Power units - Industrial motors 【Benefits of Implementation】 - Extended device lifespan - Improved system reliability - Achievement of energy savings

• Other polymer materials
• Other consumables

In the automotive industry, as the miniaturization and high performance of electronic devices progress, heat dissipation measures have become an important issue. In particular, electronic components such as Engine Control Units (ECUs) and power semiconductors require reliability under high-temperature conditions. TE-7900 achieves both high thermal conductivity and low viscosity, addressing these challenges. This enhances the heat dissipation of electronic components and contributes to the longevity and performance maintenance of products. 【Application Scenarios】 - ECU (Engine Control Unit) - Power Semiconductors - Onboard Motors 【Benefits of Implementation】 - Improved heat dissipation of electronic components - Enhanced product reliability - Extended product lifespan - Support for miniaturization and high performance

• Other polymer materials
• Other consumables

In the semiconductor industry, effective heat dissipation measures are essential due to the increasing density and performance of devices. The rise in heat generation can lead to performance degradation and a shorter lifespan of devices, making it necessary to efficiently dissipate heat. TE-7900 enhances the heat dissipation of semiconductor devices due to its high thermal conductivity, contributing to improved reliability. 【Usage Scenarios】 - Heat dissipation insulation sealing for CPUs, GPUs, power semiconductors, etc. - Heat dissipation for high-power LEDs - Potting for various electronic components 【Benefits of Implementation】 - Suppression of device temperature rise - Extension of product lifespan - Assurance of high reliability

• Other polymer materials
• Other consumables

In the telecommunications industry, adhesive tape for marking purposes is required for product quality control and efficient process management. In particular, it is important to ensure long-term visibility and usability in high-temperature environments. The use of inappropriate tape can lead to peeling of markings and reduced visibility, potentially resulting in decreased work efficiency and quality issues. Our polyester adhesive tape YT-152GC is highly heat-resistant and is ideal for marking applications in the manufacturing process of communication equipment. 【Usage Scenarios】 - Marking of electronic components - Marking of component placement on circuit boards - Identification of cables 【Benefits of Implementation】 - Maintains visibility of markings even in high-temperature environments - Improves work efficiency - Strengthens quality control

• Other consumables
• Adhesive tape
• Other electronic parts

In the aerospace industry, reducing the weight of aircraft is essential for improving fuel efficiency and performance. In particular, lightweight materials with high heat resistance and adhesive performance are required for component fixation and masking in high-temperature environments. The use of inappropriate tape can lead to peeling and performance degradation, potentially compromising safety. Our polyester adhesive tape YT-152GC utilizes a lightweight polyester substrate and silicone-based adhesive, achieving heat resistance up to 180°C. It balances weight reduction with high reliability, contributing to solving challenges in aerospace applications. 【Usage Scenarios】 * Masking of aircraft components * Component fixation in high-temperature environments * Splicing applications 【Benefits of Implementation】 * Improved fuel efficiency through weight reduction * Increased reliability due to high heat resistance * Streamlined masking processes

• Other consumables
• Adhesive tape
• Other electronic parts

In the electronics industry, as products become smaller and more high-performance, ensuring insulation performance is crucial. In high-temperature environments and when arranging components in tight spaces, insulation failures can lead to product malfunctions or performance degradation. Our polyester adhesive tape YT-152GC has a heat resistance of 180°C, making it ideal for insulation applications in electronic devices. [Usage Scenarios] - Masking of electronic components - Protection of printed circuit boards - Insulation in high-temperature environments [Benefits of Implementation] - Improved product reliability due to high insulation performance - Versatility for a wide range of applications due to heat resistance - Enhanced work efficiency

• Other consumables
• Adhesive tape
• Other electronic parts

In the automotive industry, there is a demand for improved cooling performance due to the increased performance of electronic devices. Particularly for components that tend to generate heat, such as engine control units and motors, effective heat dissipation measures are essential. If proper cooling is not implemented, it may lead to component failure or performance degradation. TE-7163 features high thermal conductivity, rapid curing, and low viscosity, contributing to the reliability of automotive cooling systems. 【Application Scenarios】 - Industrial motors - Coils - Capacitors 【Benefits of Implementation】 - Efficient heat dissipation due to high thermal conductivity - Increased productivity due to rapid curing - Improved workability due to low viscosity

• Other polymer materials
• Other consumables

In the semiconductor industry, effective heat dissipation measures are essential due to the increasing density and performance of devices. Heat can lead to performance degradation and failure of devices, potentially shortening product lifespan. TE-7163 efficiently dissipates heat generated by semiconductor devices to the outside due to its high thermal conductivity, thereby improving device reliability. 【Application Scenarios】 - Heat dissipation insulation sealing for electronic devices such as industrial motors, coils, transformers, and capacitors. 【Benefits of Implementation】 - Prolonged device lifespan - Enhanced product reliability - Stable performance maintenance

• Other polymer materials
• Other consumables

In the automotive industry, reliable adhesion of components is essential to achieve both safety and durability. Particularly for body and electronic parts exposed to vibrations and temperature changes, the performance of adhesives significantly affects the product's lifespan. Improper adhesion can lead to component detachment or malfunction. TERADITE TE-7172K4 offers high adhesion, flexibility, and flame resistance, contributing to the reliability of automotive parts. 【Application Scenarios】 - Adhesion of body parts - Fixing of electronic components - Adhesion of parts requiring heat dissipation measures 【Benefits of Implementation】 - Improved reliability of components due to high adhesion strength - Enhanced safety due to flame resistance - Improved heat dissipation due to increased thermal conductivity

• Other consumables
• Other polymer materials

"TERADITE TE-7172K4" is a two-component, room temperature curing epoxy resin. It has a high thermal conductivity resin (3W/m·K) and is flame retardant equivalent to UL94 3mm V-2. It is a flexible resin that improves upon the flexibility of TE-7172K3. It can be used as an insulating material for heat dissipation in electronic and electrical devices where stress relaxation is required, as well as for gap fillers. 【Cured Material Properties (Partial)】 ■Appearance (Visual): Gray solid ■Specific Gravity (25°C): 3.06 ■Curing Shrinkage Rate (25°C): 0.2% ■Hardness (25°C): 20 Shore D (70 Shore A) ■Glass Transition Temperature (Cooling): -48°C *For more details, please download the PDF or feel free to contact us.

• Other consumables
• Other polymer materials

"TERADITE TRU-0260K3" is a one-component UV-curable epoxy resin. It is a high heat-resistant and high humidity-resistant resin, designed to prevent dripping. Additionally, it is a high-density resin with a specific gravity of 5.0. It can be used as a resin for balancers in small motors (thickness of 2mm or less). 【Liquid Properties】 ■ Component: Acrylate resin ■ Appearance (visual): Gray liquid ■ Specific gravity (25°C): 5.0 ■ Viscosity (25°C, 10rpm): 45,000 mPa·s ■ Thixotropic index (1rpm/10rpm): 1.2 *For more details, please download the PDF or feel free to contact us.

• Other consumables
• Other polymer materials

In the electronics industry, as product miniaturization and high performance progress, ensuring insulation performance while addressing heat dissipation has become an important challenge. In particular, densely mounted electronic components have a high risk of performance degradation and failure due to heat generation, necessitating reliable insulating materials. TE-7172K3 achieves both high insulation and thermal conductivity, addressing these challenges. 【Application Scenarios】 - Insulation of electronic components - Electronic devices requiring heat dissipation measures - Areas where stress relief is needed 【Benefits of Implementation】 - Reduction of failure risk due to insulation defects - Extension of product lifespan through improved heat dissipation performance - Prevention of cracks in substrates and modules

• Other polymer materials
• Other electronic parts

Conventional transparent epoxy required time and heat for the curing process, but TRU-0222K cures instantly with LED light (1,500mJ/cm²). It uses a light initiator that suppresses yellowing, achieving both high transparency and a hard finish. With low viscosity and excellent workability, it demonstrates high performance in a wide range of applications, including CFRP, resin molded products, craft works, and protection of electronic components. Additionally, its high Tg of 124°C allows it to be used in environments where heat resistance is required. *For more details, please download the PDF or feel free to contact us.

• Other polymer materials

"TRU-0260K2" is a one-component UV-curable epoxy resin developed for use in small motor balancers. It can be cured in a short time under UV irradiation (3,000 mJ/cm²) from a metal halide lamp, making it suitable for efficient mass production processes. This product possesses high heat resistance and high humidity resistance, ensuring long-term reliability even in harsh environments. Additionally, its high thixotropy (thixotropic index of 1.6) enhances separation prevention performance, allowing for stable application and molding. The cured material features a high specific gravity design of 2.8, stabilizing balance performance, along with excellent physical properties such as Shore D hardness of 90, glass transition temperature of 128°C, and linear expansion coefficient of 23 ppm/K. Furthermore, it has a low curing shrinkage rate of 0.7%, making it suitable for parts that require precision. 【Features】 - One-component UV-curable epoxy resin - High specific gravity (2.8) with stable balance performance, ideal for small motor balancer applications - High heat resistance (Tg 128°C) and high humidity design *For more details, the product's specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

• Other polymer materials

The 『TRU-0500K2』 is a one-component UV-curable urethane acrylate resin developed for moisture-proof coating applications on electronic circuit boards. Its one-component design, which requires no mixing, makes it easy to handle, and it allows for rapid curing through UV irradiation (1,500mJ/cm²), making it suitable for energy-efficient and effective mass production processes. This product features a low viscosity design of 550mPa·s (25°C), providing excellent workability and making it easy to coat complex part shapes and narrow areas. The cured material has a Shore D hardness of 58, balancing flexibility and strength. Additionally, it boasts excellent insulation properties with a dielectric breakdown strength of 30kV/mm and a volume resistivity of 2×10^15Ω·cm, supporting the long-term reliability of electronic devices. The appearance is transparent, allowing for use without compromising the aesthetics of circuit boards and electronic components. 【Features】 ■ One-component UV-curable urethane acrylate resin ■ Low viscosity (550mPa·s) for good workability ■ High moisture resistance (water absorption rate of 0.3%), ensuring long-term reliability *For more details, a product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

• Other polymer materials

"TRU-0153K" is a one-component UV-curable urethane acrylate resin developed for the coating of electronic components. It can be cured in a short time using metal halide lamp irradiation (1,500 mJ/cm²), demonstrating high productivity even in mass production processes. This product has a low viscosity of 1,300 mPa·s and low hardness (Shore A35), providing flexible properties that relieve stress and prevent crack formation. Furthermore, it shows no change in hardness even after high-temperature testing at 150°C for 1,000 hours and 1,000 cycles of thermal cycling between -40°C and 150°C, exhibiting excellent moisture and heat resistance and durability. It balances high insulation and flexibility. 【Features】 ■ One-component UV-curable urethane acrylate resin ■ Short curing time (UV: 1,500 mJ/cm²) ■ Low viscosity and low hardness (Shore A35) with flexibility, effective for stress relief ■ No change in hardness after 150°C for 1,000 hours and -40°C to 150°C for 1,000 cycles *For more details, the product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please contact us if needed.

• Other polymer materials

"TRU-0251FR" is a one-component UV-curable epoxy resin suitable for coating and sealing applications of electronic components. It requires no mixing process, making it easy to handle, and allows for rapid curing through metal halide lamp irradiation (3,000mJ/cm²), significantly contributing to productivity improvements in mass production processes. This product has a low viscosity of 1,300 mPa·s, providing excellent workability and making it easy to apply to narrow spaces and complex-shaped parts. The cured material exhibits excellent mechanical properties with a Shore D hardness of 85, a bending strength of 50 MPa, and a bending modulus of elasticity of 1,400 MPa, along with a glass transition temperature of 91°C, demonstrating stable thermal characteristics. Its flame retardancy and low water absorption rate of 0.5% also ensure excellent moisture and heat resistance and safety. [Features] - One-component UV-curable epoxy resin - Rapid curing with UV irradiation (3,000mJ/cm²), suitable for mass production processes - Good workability with low viscosity (1,300 mPa·s) *For more details, a product specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please reach out if needed.

• Other polymer materials

"TRU-0220FR" is a one-component UV-curable epoxy acrylate resin developed for the coating of electronic components. It allows for rapid curing under UV irradiation from a metal halide lamp (1,500mJ/cm²), contributing to improved productivity in mass production processes. This product features low viscosity (2,100mPa·s), making it easy to work with and suitable for filling and coating complex part shapes. It is flame-retardant (equivalent to UL94 V-0 at 5mm thickness) and can be adapted for use in fields where safety is a concern. It balances transparency and high hardness, with a low water absorption rate of 0.3%, providing excellent moisture and heat resistance. Suitable applications include electronic component coatings, transparent protective materials, and areas requiring heat resistance and flame retardancy. 【Features】 ■ One-component UV-curable epoxy acrylate resin ■ High reactivity with rapid curing (UV: 1,500mJ/cm²) ■ Excellent workability due to low viscosity *For more details, the product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

• Other polymer materials

The TE-1006-2 is a two-component, room temperature curing epoxy resin developed for preventing liquid leakage in small motors and sensor components. It can cure without the need for heating, at 25°C for 24 hours or at 100°C for 30 minutes, contributing to improved work efficiency and energy savings on-site. This product exhibits a shear adhesive strength of 21 MPa (SUS/SUS, 25°C), ensuring high adhesive reliability. Furthermore, it is designed to have high heat and humidity resistance, maintaining performance even in harsh environments. With its high thixotropic properties, it excels in workability, making it easy to apply and build up in targeted areas, thus accommodating a wide range of applications such as sealing small motors, sensors, and electronic components. **Features** - Two-component, room temperature curing epoxy resin (mixing ratio 100:12) - High adhesion with a shear adhesive strength of 21 MPa - High heat and humidity resistance design ensures long-term reliability *For more details, the product's specification sheet is available for download as a PDF below, or you can contact us for more information.* *Samples are also available, so please contact us if needed.*

• Other polymer materials

The "TE-5014K4" is a one-component, heat-curing epoxy resin developed for applications that require prevention of liquid dripping. It is easy to handle as no mixing is required. This product exhibits a shear adhesive strength of 24 MPa (SUS/SUS, 25°C). It shows a Shore D hardness of 85 and a volume resistivity of 1×10^15 Ω·cm or higher, designed to combine strength and insulation properties. The curing conditions are simple at 120°C for 2 hours, making it suitable for mass production processes. 【Features】 ■ One-component heat-curing epoxy resin ■ High heat resistance with Tg of 130°C ■ High strength adhesion (shear adhesive strength of 24 MPa) ■ High thixotropy for good workability ■ High hardness (Shore D 85), high insulation (volume resistivity > 1×10^15 Ω·cm) *For more details, the product's characteristic table is available, and you can download the PDF from below or contact us. *Samples are also available, so please contact us if needed.

• Other polymer materials

TE-5018 is a one-component, heat-curing epoxy resin developed for bonding and insulating encapsulation applications of electronic and electrical components. While ensuring stability with refrigerated storage, it accommodates low-temperature curing at 80°C for 1 hour, making it suitable for heat-sensitive components and processes with temperature constraints. The cured material exhibits high mechanical strength with a bending strength of 95 MPa, a bending modulus of 3,300 MPa, and a Shore D hardness of 87. Additionally, it possesses excellent electrical properties with an insulation breakdown strength of 20 kV/mm and a volume resistivity of 5×10^15 Ω·cm, supporting the long-term reliability of electronic devices. Furthermore, it has balanced physical properties with a linear expansion coefficient of 61 ppm/K, a curing shrinkage rate of 2.5%, and a water absorption rate of 0.3%, reducing the risk of cracks and performance degradation. It also excels in workability and can be widely used for insulating encapsulation of electronic components, structural bonding, and ensuring reliability in heat and humidity-resistant environments. 【Features】 ■ One-component heat-curing epoxy resin (no mixing required) *For more details, the product's specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please inquire if needed.

• Other polymer materials

"TE-6408FRK" is a room temperature curing two-component epoxy resin, suitable for coating and adhesive applications. It can cure at 25°C, eliminating the need for heating equipment, allowing for energy-efficient and effective work. A major feature of this product is its flexible cured material. It demonstrates over 90% transparency (420-600nm transmission), making it suitable for applications that require high aesthetic quality. Additionally, it possesses flame retardancy (equivalent to UL94 V-0 at 5mm thickness), contributing to safety assurance. It can be widely used for coating electronic components, bonding plastics and metals, and clear applications that require aesthetic appeal. [Features] - Two-component room temperature curing epoxy resin (mixing ratio 100:30) - Flexible cured material (tensile elongation of 230%, crack prevention effect) - High transparency (over 90% transmission at 420-600nm) - Low viscosity and good workability *For more details, the product specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please reach out if you need them.

• Other polymer materials

The "TE-7170K" is a two-component, room temperature curing epoxy resin developed for heat dissipation insulation applications in electronic and electrical equipment. It cures at 25°C without the need for heating equipment, making it energy-efficient and easy to handle on-site. This product has a thermal conductivity of 0.9 W/m·K, making it effective for heat dissipation measures for heat-generating components. Additionally, the resin design incorporates flexibility to absorb and alleviate stress, helping to suppress the occurrence of cracks in substrates and components. It is suitable for applications that require high reliability. With a low viscosity design of 3,500 mPa·s (25°C), it excels in filling details and provides a sufficient working time of approximately 3 hours. 【Features】 ■ Two-component, room temperature curing epoxy resin (mixing ratio 100:20) ■ Effective for heat dissipation measures with a thermal conductivity of 0.9 W/m·K ■ Flexible design that effectively alleviates stress and prevents cracking ■ Good workability with low viscosity and approximately 3 hours of usable time *For more details, the product's specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please contact us if needed.

• Other polymer materials

"TE-6409FR" is a two-component transparent epoxy resin suitable for electronic component encapsulation and craft applications where transparency is required. The mixing ratio of the base agent to the hardener is 100:50, and the mixed viscosity is only 500 mPa·s, making it a low-viscosity design that allows for easy filling of details and uniform coating. It demonstrates over 90% transparency (420-600nm transmission) and is suitable for applications where appearance quality is important. Furthermore, it achieves excellent yellowing resistance, showing no discoloration even after a heat resistance test at 120°C for 1,000 hours, combining aesthetics with reliability. Additionally, it is flame-retardant, contributing to safety assurance. Applications include electronic component encapsulation, transparent panels, clear photo panels, and art crafts, making it versatile across various fields. 【Features】 ■ Two-component transparent epoxy resin (mixing ratio 100:50) ■ High transparency (over 90% transmission at 420-600nm) ■ Excellent workability with low viscosity of 500 mPa·s *For more details, the product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

• Other polymer materials

"TE-6420FR" is a two-component, room temperature curing epoxy resin developed for the encapsulation of electrical and electronic components. It does not require heating equipment and can cure at 25°C, achieving an energy-efficient and effective working environment. This product features a low viscosity design with a mixing viscosity of approximately 2,000 mPa·s (25°C), allowing excellent filling capability for intricate details and accommodating complex component shapes and filler-less encapsulation. The curing conditions can be flexibly selected as 25°C for 6 hours, 40°C for 3 hours, or 50°C for 1 hour. 【Features】 - Room temperature curing type (no heating operation required, caution with heat generation), efficient short curing time - Low viscosity design suitable for precise filling - High heat resistance: Tg 126°C - Flame retardant: UL94 V-0 equivalent (5mm thickness) - High insulation: Volume resistivity > 1×10^15 Ω·cm *For more details, the product's specification sheet is available for download as a PDF from the link below, or you can contact us for more information. *Samples are also available, so please contact us if needed.

• Other polymer materials

The "TE-6000" is a low-viscosity, high-strength epoxy resin suitable for encapsulating electronic and electrical components. It is a two-component system with a mixing ratio of 100:30, making it easy to handle, and it has low-temperature curing properties, allowing it to cure at 70°C for 3 hours or at room temperature. Additionally, it enhances flexibility in the production process and contributes to energy savings. 【Features】 ■ Two-component heat-curing epoxy resin (mixing ratio 100:30) ■ Low viscosity with excellent filling properties and workability ■ Low-temperature curing (70°C for 3 hours, room temperature curing also possible) ■ High strength (flexural strength 110 MPa, elastic modulus 3,000 MPa) ■ High insulation properties (dielectric breakdown strength 30 kV/mm, volume resistivity 1×10^16 Ω·cm) *For more details, the product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please contact us if needed.

• Other polymer materials

The "TE-7000" is a two-component, heat-curing epoxy resin suitable for sealing applications in electrical and electronic components. Its low viscosity design allows for excellent filling of details and can accommodate complex part shapes. This product has a long pot life of 24 hours (at 60°C), ensuring stable sealing operations while providing ample time for work processes. Additionally, it has a proven track record of passing high-temperature tests at 180 degrees and thermal tests at -40°C and 180°C. 【Features】 ■ Two-component heat-curing epoxy resin (mixing ratio 100:60) ■ Excellent filling properties and workability due to low viscosity ■ Long pot life of 24 hours (at 60°C) ■ High insulation properties (dielectric breakdown strength over 25kV/mm, volume resistivity > 1×10^16Ω·cm) ■ Flexural strength of 81MPa and flexural modulus of 2,400MPa ■ Low water absorption rate of 0.3% for improved reliability *For more details, the product's specification sheet is available for download as a PDF from the link below, or you can contact us for more information. *Samples are also available, so please contact us if needed.

• Other polymer materials

"TE-7130" is a general-purpose, two-component, heat-curing epoxy resin for the encapsulation of electrical and electronic components. With a mixing ratio of 100:20, it is easy to handle, and after curing, it becomes an encapsulant that combines high strength and high insulation properties. Its greatest feature is the realization of a low coefficient of linear expansion of 27 ppm/K. This reduces expansion and contraction due to temperature changes, thereby lowering the risk of crack formation. It is resistant to thermal cycling, ensuring long-term reliability for power devices and electronic components. [Features] - Two-component heat-curing epoxy resin (mixing ratio 100/20) - Low coefficient of linear expansion: 27 ppm/K → strong against thermal cycling, crack suppression - High insulation properties (dielectric breakdown strength 33 kV/mm, volume resistivity 1×10^16 Ω·cm) - High strength (flexural strength 141 MPa, flexural modulus 10,000 MPa) - Low water absorption rate of 0.1% ensures long-term stability *For more details, the product specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please contact us if needed.

• Other polymer materials

The "TE-7820FR3" is a two-component, heat-curing epoxy resin developed for power device encapsulation applications. With an easy-to-handle mixing ratio of 100/100, it achieves excellent filling properties due to its low viscosity and high workability. It features high heat resistance with a glass transition temperature of 174°C and flame retardancy equivalent to UL94 V-0 (2mm thickness). Additionally, it has been designed to improve adhesion to copper, enhancing the reliability of bonding with copper substrates and conductors. This makes it suitable for applications requiring thermal, electrical, and mechanical performance, such as semiconductor packages and power modules. 【Features】 ■ Two-component heat-curing epoxy resin (mixing ratio 100/100) ■ High strength and high heat resistance (Tg = 174°C) ■ Excellent thermal cycle resistance with a low coefficient of thermal expansion (20ppm/K) ■ Flame retardancy: UL94 V-0 equivalent (2mm thickness) ■ High insulation properties (dielectric breakdown strength over 25kV/mm, volume resistivity 4.0×10^16Ω·cm) *For more details, the product's specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please contact us if needed.

• Other polymer materials

"TE-7814V" is a two-component, heat-curing epoxy resin suitable for heat dissipation sealing applications in electronic and electrical equipment. Its low viscosity design allows it to accommodate complex component shapes, significantly improving workability and production efficiency. This product has a thermal conductivity of 2.5 W/m·K, making it effective for heat dissipation measures in electronic components that generate heat. It can be widely used in fields that require high performance, such as electronic devices and power modules. 【Features】 - Two-component heat-curing epoxy resin (mixing ratio 100/100) - Suitable for complex component shapes due to low viscosity - High thermal conductivity: 2.5 W/m·K - High heat resistance: high Tg 185℃ - Flame retardant: equivalent to UL94 V-0 - High insulation properties ensure long-term reliability of electronic devices *For details, the product's specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please contact us if needed.

• Other polymer materials

"TE-6430" is a two-component, room-temperature curing epoxy resin (hard type) developed as an insulating material for heat dissipation in electronic and electrical equipment. It excels in workability due to its ability to cure at room temperature, and it remains low in viscosity after mixing, making it easy to handle. This product has a thermal conductivity of 2.4 W/m·K, making it effective for heat dissipation measures for electronic components that generate heat. Additionally, it possesses flame retardancy equivalent to UL94 V-0 (5mm thickness), allowing for safe use in applications where safety is a concern. 【Features】 ■ Two-component, room-temperature curing epoxy resin (hard type) ■ High thermal conductivity: 2.4 W/m·K ■ Flame retardancy: UL94 V-0 equivalent (5mm thickness) ■ Good workability with low viscosity after mixing ■ High insulation and low water absorption improve the reliability of electronic devices *For more details, we have published the product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if needed.

• Other polymer materials

TE-7901K is a one-component, heat-curing epoxy resin developed as an insulating material for heat dissipation in electronic and electrical equipment. It excels in workability due to the absence of a mixing process, allowing for stable quality during use. This product boasts a thermal conductivity of 6.5 W/m·K, making it suitable for heat dissipation measures in electronic components that generate heat, such as motors, coils, and power devices. Additionally, it has flame retardancy equivalent to UL94 V-0, making it a reliable choice for applications that require high reliability. 【Features】 - One-component, heat-curing epoxy resin (no mixing required, high workability) - High thermal conductivity: 6.5 W/m·K - Flame retardancy: UL94 V-0 equivalent (5mm thickness) - High insulation and high heat resistance (Tg 110℃) - Suitable for heat dissipation and insulation sealing applications in electronic devices *For more details, the product's specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

• Resin container

The TE-7172K3 is a two-component, room-temperature curing epoxy resin developed for heat dissipation insulation applications in electronic and electrical equipment. It can cure at 25°C without the need for heating equipment, making it energy-efficient and adaptable to flexible production processes. Its most notable feature is its high thermal conductivity of 3.3 W/m·K, which is effective for heat dissipation measures for heat-generating components. Additionally, the resin design incorporates flexibility to absorb stress and prevent cracking in substrates and modules. The cured material exhibits balanced properties with a glass transition temperature of -20°C, a coefficient of linear expansion of 24 ppm/K, and a Shore D hardness of 45, combining heat resistance and flexibility. Moreover, it has flame retardant properties (equivalent to UL94 V-0 at 5mm thickness), making it safe for use in electronic devices that require safety. This improved version enhances heat resistance and toughness while inheriting the features of the conventional TE-7172K2. Applications include gap fillers, heat dissipation insulation materials, and encapsulation of electronic components where stress relief is required.

• Other polymer materials
• Other electronic parts

TE-7172K2 is an epoxy resin with high thermal conductivity (3W/m·K) and flexibility. It can be used as a heat dissipation insulating material and gap filler for electronic and electrical equipment where stress relief is required. While there are similar products in silicone and urethane, you can also expect the unique chemical resistance, solvent resistance, and water resistance of epoxy.

• Other polymer materials
• Other electronic parts

TE-5111K is an epoxy resin with a low curing shrinkage rate, fast curing time, and a relatively high glass transition temperature of 153°C. It can cure using either heat or UV light, providing flexibility in work options. It can be used for sealing electrical and electronic components. One-component heat-curing, UV-curing white epoxy resin Features: low coefficient of thermal expansion, low shrinkage, high workability (relatively low viscosity), high heat resistance, short curing time *For details, we have published a product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if needed.

• Other polymer materials
• Other electronic parts
• glue

TE-5111K is an epoxy resin with a low curing shrinkage rate, fast curing time, and a relatively high glass transition temperature of 168°C. It can be used for encapsulation of electrical and electronic components. Single-component heat-curing black epoxy resin Features: low coefficient of thermal expansion, low shrinkage, high workability (relatively low viscosity), high heat resistance, short curing time *For more details, we have published a product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if you need them.

• Other polymer materials
• glue
• Other electronic parts

TE-1002FR is an epoxy-based adhesive with flame retardancy equivalent to UL94 V-0 (5mm thick). It can be used for bonding, fixing, and sealing in areas where flame retardancy is required. Two-component room temperature curing epoxy resin Features: Room temperature curing, high adhesion strength, flame retardancy *Samples are available upon request. Please contact us for more details. *For more information about this product, please download the specification sheet from below. *For other products, please download the catalog and epoxy & acrylic resin "TERADITE" from below.

• Other polymer materials
• glue
• Other consumables

TE-6420 is an epoxy resin with high toughness (crack resistance) and high heat resistance. It can be used for bonding, fixing, and sealing in areas where crack resistance is required. Being filler-free, it has low viscosity and excellent workability. Two-component, room temperature curing epoxy resin Features: Room temperature short curing time, high heat resistance, high toughness (crack resistance: high bending strength and high bending modulus), low viscosity *For details, we have published the product characteristics table, so please download the PDF from the link below or contact us. *Samples are also available, so if you need a sample, please contact us.

• Other polymer materials
• glue
• Other electronic parts

The Huntsman-made Urethane 160 series is a coating material that enhances the reliability of printed circuit boards with moisture-proof, waterproof, insulating, and dust-proof properties. It is easy to handle and features room temperature curing. Among the series, Urethane 160FL is transparent and compatible with fluorescent emission, using toluene as a diluent solvent.

• Other polymer materials
• Other electronic parts
• Coating Agent

The Huntsman-made Urethane 160 series is a coating material that enhances the reliability of printed circuit boards with moisture-proof, waterproof, insulating, and dust-proof properties. It is easy to handle and features room temperature curing. Among the series, Urethane 160BP-TF is blue and transparent, using IPA as a diluent solvent, and is a toluene-free type. For more details, please refer to the documentation or contact us.

• Other polymer materials
• Other electronic parts
• Coating Agent

The Huntsman-made Urethane 160 series is a coating material that enhances the reliability of printed circuit boards with moisture-proof, waterproof, insulating, and dust-proof properties. It is easy to handle and features room temperature curing. Among the series, Urethane 160TF is transparent and uses IPA as a diluent solvent, and it is a toluene-free type. For more details, please refer to the documentation or contact us.

• Other polymer materials
• Other electronic parts
• Coating Agent