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A Rough Method for Estimating the Heat Dissipation Copper Foil Area of Printed Circuit Boards!! In cases where there are components or circuit configurations that may generate heat, and new or unknown factors necessitate heat countermeasures, delays or failures in design responses can occur due to a lack of experience in thermal design or the absence of analysis tools. This can lead to problems in actual devices and delays in development schedules. To conduct thermal analysis, tools are typically required, but many do not have the necessary resources, and hiring specialized firms can often be costly. In this webinar, we will introduce heat countermeasure techniques that can be implemented even when there is no time or budget for simulations. ■ Recommended for: - Engineers dealing with components or circuits where heat generation is a concern, such as power circuits, motor control, and LED boards. - AW designers ■ Date: Tuesday, September 9, 2025, 11:00 AM - 12:00 PM ■ Format: Webinar (using Zoom) ■ Organized by: Ryosan Corporation ■ Co-organized by: Priken Corporation ■ Participation Fee: Free *For more details, please refer to the related link URL below or feel free to contact us.

• Printed Circuit Board

"Progress-kun" is a cloud-based system provided by Priken that enables visualization of the circuit board manufacturing process. Upon placing an order, an automatic confirmation email is sent to the representative, along with an ID, password, and access URL, allowing real-time tracking of the progress. The monthly order volume ranges from 1,500 to 2,000 items. The average time from order to delivery is 2 to 3 days. In the fastest cases, delivery can be completed on the same day the order is placed. This is made possible by a one-stop system that allows for consistent in-house production from design to manufacturing. Since all processes can be completed in-house, we can deliver products without any time lag. □ As a comprehensive contact point for PCB companies! Everything and anything! ■ Supports a variety of products ■ Delivery in as little as 1 day ■ Orders accepted from just one circuit board *For more details, please download the PDF or feel free to contact us.

• Process Control System

We would like to introduce "prototypes," which are the main products of Puriken Co., Ltd. These are intended for products that have not yet been released to the market. Some are aimed for release in 2 to 3 years, and together with our development department and customers, we are creating the future of printed circuit boards. In response to demand, we are making them lighter, thinner, shorter, and smaller. To achieve this, we continue to select new materials, pursue production processes, and develop technologies. [Features] - Compatible with various products - Available in as little as 1 day - Orders accepted from just one board *For more details, please refer to the related links or feel free to contact us.

• Printed Circuit Board

Puriken Co., Ltd. strongly supports the completion of projects within the fiscal year with manufacturing speed and problem-solving capabilities. 【Overwhelming Production System】 With a production capacity handling up to 2,000 items per month and a "one-stop system" that completes everything from design to manufacturing in-house, we eliminate time lags to the utmost limit. We achieve an average delivery time of 2 to 3 days, with the shortest being same-day delivery (1-day delivery) for orders. 【Consistent Support System】 We are fully committed to "how quickly we can solve our customers' problems." Especially during busy periods, we propose "evaluation jigs" to reduce ordering hassle and shorten testing work after delivery. We support the elimination of waste throughout the entire development process, ensuring completion within budget and on time. 【Main Features】 ■ Ultra-short delivery times starting from just 1 day to accommodate last-minute requests at the end of the fiscal period ■ Orders can be placed starting from a single circuit board ■ Proposals for evaluation jigs to reduce engineers' workload *For more details, please download the PDF or feel free to contact us.

• Printed Circuit Board

We would like to introduce the production system of Puriken Co., Ltd. The number of orders received in a month ranges from 1,500 to 2,000 items. The average time from order to delivery is 2 to 3 days. In the fastest cases, delivery can be made on the same day the order is received. What makes this possible is our one-stop system, which allows for consistent in-house production from design to manufacturing. Since all processes can be completed in-house, we can deliver products without any time lag. 【Features】 ■ Accommodates a variety of products ■ Delivery in as little as 1 day ■ Orders accepted from a single circuit board *For more details, please refer to the related links or feel free to contact us.

• Printed Circuit Board

At Puriken Co., Ltd., we are committed not only to product development and manufacturing but also to service development and provision. We have implemented our unique traceability system, "Shinchoku-kun," which allows us to track in real-time the stage of the ordered product within 10 to 20 different processes. Additionally, to provide information about our advanced equipment and manufacturing processes, we conduct factory tours both online and offline. 【Features】 ■ Supports a variety of products ■ Delivery in as little as 1 day ■ Orders accepted from just one circuit board *For more details, please refer to the related links or feel free to contact us.

• Production Scheduler

In the EV charger industry, heat generation during rapid charging is a significant issue. Particularly during high-power charging, the heat dissipation performance of the substrate becomes a crucial factor that affects charging efficiency and product lifespan. Inadequate heat dissipation can lead to component degradation or failure, potentially compromising the reliability of the charger. Our "faster heat-dissipating substrate" provides materials that explain the structural comparisons of thermal vias and copper pins, as well as the differences in thermal conductivity due to variations in TH fillers, supporting thermal management for EV chargers. 【Usage Scenarios】 - Rapid chargers - High-power charging - Electronic devices requiring thermal management 【Benefits of Implementation】 - Improved heat dissipation - Extended product lifespan - Enhanced charging efficiency

• Printed Circuit Board

In the gaming console industry, as performance increases, heat dissipation measures for circuit boards have become an important issue. Particularly when performing high-load processing, it is essential to mitigate the risks of performance degradation and failure due to heat. Our "circuit board that dissipates heat faster" provides materials that explain the structural comparisons of thermal vias and copper pins, as well as the effects of changing the filling material within through-holes, supporting the realization of high heat-dissipating circuit boards. This material will help understand the key points in circuit board design aimed at enhancing the performance of gaming consoles. 【Usage Scenarios】 - Development of high-performance gaming consoles - Circuit board design requiring heat management 【Benefits of Implementation】 - Reduces the risk of performance degradation due to heat - Improves product reliability - Streamlines circuit board design

• Printed Circuit Board

In the wearable device industry, miniaturization and lightweight design are important challenges. With the enhancement of device performance, heat dissipation measures for the circuit board are essential, and thermal design significantly affects the reliability and performance of the product. Poor heat dissipation can lead to device malfunctions and reduced lifespan. The materials we provide regarding "circuit boards that dissipate heat faster" explain the structural comparison of thermal vias and copper pins, as well as the effects of changing the filling material in through-holes, contributing to the miniaturization and high performance of wearable devices. 【Usage Scenarios】 - High-density mounted circuit boards - Devices requiring miniaturization - Electronic equipment needing thermal management 【Benefits of Implementation】 - Improved heat dissipation - Enhanced device reliability - Extended product lifespan

• Printed Circuit Board

In the power electronics industry, increasing output power is essential for improving product performance and miniaturization. However, with higher output power, the heat dissipation performance of the substrate becomes a challenge. Inadequate heat dissipation raises the risk of performance degradation and failure due to temperature rise in the device. Our products provide materials that explain the comparison of thermal conductivity between thermal vias and copper pins, as well as the effects of changing the filling material within the thermal vias, supporting the design of substrates with high heat dissipation. This contributes to improved product reliability and longevity. 【Usage Scenarios】 - High-output power devices - High-density mounting substrates - Use in high-temperature environments 【Benefits of Implementation】 - Improved heat dissipation performance - Enhanced product reliability - Increased device longevity

• Printed Circuit Board

In the LED lighting industry, with the increase in brightness, the heat dissipation performance of substrates has become an important issue. To maintain high luminous flux, it is necessary to efficiently dissipate the heat generated by the LED elements. If the heat dissipation performance is low, it may lead to a decrease in the lifespan and degradation of the performance of the LEDs. Our "faster heat-dissipating substrate" addresses this issue. 【Usage Scenarios】 - High-brightness LED lighting - LED products requiring thermal management 【Benefits of Implementation】 - Extended lifespan of LEDs - Improved product reliability - Maintenance of performance

• Printed Circuit Board

In the industrial robot industry, thermal management of circuit boards is crucial for achieving high-precision movements. In particular, densely mounted electronic components tend to generate heat, which poses risks of performance degradation and failure due to heat. If thermal management is insufficient, the accuracy of the robot's movements may decline, negatively impacting product quality and production efficiency. Our "faster heat-dissipating circuit board" provides materials explaining the structural comparison of thermal vias and copper pins, as well as the effects of changing TH fillers, supporting the high precision of industrial robots by offering high thermal conductivity circuit boards. 【Usage Scenarios】 - Robot arms requiring high-precision positioning - Welding robots needing precise control - Conveying robots requiring high-speed operation 【Benefits of Implementation】 - Solving thermal issues of circuit boards to achieve stable robot operation - Improving product quality and yield - Reducing maintenance costs

• Printed Circuit Board

In the home appliance industry, there is a demand for longer product lifespans. In particular, heat is one of the major factors that accelerate the deterioration of electronic components. High heat dissipation performance substrates enhance product reliability and contribute to longevity. Our "faster heat-dissipating substrate" addresses this challenge. 【Usage Scenarios】 * Design of home appliances * Improvement of product reliability * Longevity 【Effects of Implementation】 * Reduced risk of product failure * Improved product durability * Increased customer satisfaction

• Printed Circuit Board

In the telecommunications industry, with the spread of high-speed data communication, the densification and performance enhancement of circuit boards are progressing. As a result, the heat generation of circuit boards is increasing, making thermal management an important issue. If appropriate thermal measures are not implemented, it may lead to a decline in the performance or failure of communication devices. Our "circuit boards that dissipate heat faster" address this challenge. 【Usage Scenarios】 * High-speed communication routers * Base stations * Servers 【Benefits of Implementation】 * Stable operation of devices due to improved thermal conductivity * Extended product lifespan * Achievement of high performance

• Printed Circuit Board

In the field of medical devices, there is a simultaneous demand for miniaturization and high performance. In particular, it is necessary to pack many electronic components into a limited space, making the heat dissipation performance of the circuit board crucial. Inadequate heat dissipation can lead to equipment malfunctions and a decrease in lifespan. Our materials on "circuit boards that dissipate heat faster" address these challenges. 【Application Scenarios】 - Miniature medical devices - Portable medical devices - High-density mounted circuit boards 【Effects of Implementation】 - Improved reliability of devices - Extended product lifespan - Achieving miniaturization

• Printed Circuit Board

In the aerospace industry, it is essential to achieve both product reliability and weight reduction. This is particularly important for electronic devices used in harsh environments, where ensuring heat dissipation is crucial. Insufficient heat dissipation can lead to component failure or performance degradation. Our "faster heat-dissipating substrate" contributes to improving product reliability by enhancing heat dissipation. 【Application Scenarios】 - Electronic devices in aircraft and spacecraft - Electronic devices requiring weight reduction 【Benefits of Implementation】 - Improved heat dissipation - Enhanced product reliability - Contribution to weight reduction

• Printed Circuit Board

We are pleased to present materials introducing "substrates that dissipate heat faster." This document provides a detailed comparison of the structural differences between thermal vias and copper pins, noting that while their cross-sections may appear similar, the filling materials inside the thermal vias differ. It also includes information on "high thermal conductivity substrates" and more. The explanations are supported by graphs, tables, and formulas, making the content easy to reference. We encourage you to download it and read through it. [Contents] ■ Structural comparison of thermal vias and copper pins ■ What are high thermal conductivity substrates? ■ Comparison of thermal conductivity between thermal vias and copper pins ■ Effects of changing the filling material in thermal vias *For more details, please download the PDF or feel free to contact us.

• Printed Circuit Board

In the entertainment industry, accurate operation of electronic devices is essential for pursuing immersion. Particularly in fields such as VR/AR devices and audio equipment, where real-time information processing is required, precise measurement of electrical characteristics becomes crucial. If the measurement of electrical characteristics is inaccurate, it can lead to delays in video and audio, as well as the occurrence of noise, which detracts from the immersive experience. We are offering a document introducing our "Electrical Characteristic Measurement Board." 【Usage Scenarios】 - VR/AR device development - Audio equipment development - Game console development 【Benefits of Implementation】 - Enhanced immersion through accurate measurement of electrical characteristics - Reduced product development time - Improved product quality

• Printed Circuit Board

In experiments conducted in educational institutions, a precise understanding of electrical characteristic measurements is crucial. In particular, the use of measurement boards is essential for students to comprehend the characteristics of electrical circuits and electronic components. However, it is not uncommon to encounter challenges regarding measurement methods and the selection of boards. Our materials on "Measurement Boards for Electrical Characteristics" provide useful information for experiments, including factors causing errors in impedance management and the differences between measurement boards and general boards. This material contributes to improving the efficiency of experiments and enhancing understanding. We encourage you to download and utilize it. 【Usage Scenarios】 - Experiments with electrical circuits - Evaluation of electronic component characteristics - Education for students 【Effects of Implementation】 - Improved understanding of experiments - Increased measurement efficiency - Acquisition of practical knowledge

• Printed Circuit Board

In the defense sector, high durability that can withstand harsh environments is required. For electrical characteristic measurement substrates, impedance management and compatibility with measurement methods are crucial to obtaining reliable measurement results. Inappropriate substrate selection can lead to measurement errors and equipment failures. Our document "Understanding Electrical Characteristic Measurement Substrates in 3 Minutes!" explains the key points for substrate selection to achieve high durability in the defense sector. Please download it and take a look. 【Usage Scenarios】 * Performance evaluation of electronic devices in harsh environments * Characteristic evaluation of communication devices requiring high reliability * Quality control of military electronic equipment 【Benefits of Implementation】 * Acquisition of reliable measurement results * Reduction of equipment failure risks * Improvement of product quality

• Printed Circuit Board

In the IoT industry, as devices become smaller, the accuracy of electrical characteristic measurements is becoming increasingly important. Particularly in environments where high-density implementation is required in limited spaces or where radio wave interference is prevalent, accurate measurements can significantly impact product performance. Measurement errors can lead to device malfunctions or performance degradation. Our materials on electrical characteristic measurement substrates explain the error factors in impedance management and the differences between measurement substrates and general substrates, supporting problem-solving in IoT device development. We encourage you to download and read them. 【Usage Scenarios】 - Electrical characteristic measurement of small IoT devices - Performance evaluation of high-density implementation substrates - Measurements in environments requiring countermeasures against radio wave interference 【Benefits of Implementation】 - Improved measurement accuracy - Reduced product development time - Enhanced product reliability

• Printed Circuit Board

In the energy industry, efficient power supply and stable system operation are essential for cost reduction and minimizing environmental impact. Particularly in the field of renewable energy, such as solar and wind power, optimizing power conversion efficiency has become a critical issue. Measurement substrates for electrical characteristics contribute to solving these challenges by identifying error factors in impedance management and ensuring compatibility with measurement methods. Our materials explain the differences between measurement substrates and general substrates, as well as key points for matching impedance. We encourage you to download and read it. 【Usage Scenarios】 - Performance evaluation of solar power systems - Measurement of power conversion efficiency in wind power equipment - Characteristic evaluation of smart grid-related devices 【Benefits of Implementation】 - Improved efficiency of power systems - Reduced product development time - Cost savings

• Printed Circuit Board

In the field of precise control of robots, high accuracy and reliability are required. In particular, the electrical characteristics of sensors and actuators significantly impact the robot's operational performance. Measurement errors in electrical characteristics can lead to instability in control and malfunction. The materials we provide regarding the measurement boards for electrical characteristics offer useful information for consideration during implementation, such as error factors in impedance management and the differences between measurement boards and general boards. 【Usage Scenarios】 - Evaluation of robot sensors - Performance evaluation of actuators - Development of precision control systems 【Effects of Implementation】 - Improvement in the accuracy of electrical characteristic measurements - Enhancement of the operational stability of robots - Reduction in development time

• Printed Circuit Board

In the home appliance industry, accurate measurement of electronic circuits is essential for improving energy efficiency. Particularly in the evaluation of electronic components that influence power efficiency, precise impedance measurement is crucial. Measurement errors can affect product performance evaluation, potentially leading to delays in development timelines and increased costs. Our document on "Understanding Electrical Characteristic Measurement Boards in 3 Minutes!" explains the sources of error in impedance management and the differences between measurement boards and general boards. We hope it will assist you in improving the efficiency of energy-saving appliance development. 【Usage Scenarios】 - Energy efficiency evaluation - Electronic circuit design - Characteristic evaluation in product development 【Benefits of Implementation】 - Shortened development timelines through accurate measurements - Improved energy efficiency of products - Cost reduction

• Printed Circuit Board

With the advancement of miniaturization in the semiconductor industry, the accuracy of electrical characteristic measurements is becoming increasingly important. In particular, the evaluation of high-frequency characteristics and signal integrity is a crucial factor that influences product performance. To minimize measurement errors and conduct accurate evaluations, the selection of appropriate measurement substrates is essential. Our materials regarding electrical characteristic measurement substrates explain the importance of impedance management and the differences between measurement substrates and general substrates, providing useful information for consideration during implementation. 【Usage Scenarios】 - High-frequency characteristic evaluation - Signal integrity evaluation - Impedance matching 【Benefits of Implementation】 - Improved measurement accuracy - Shortened product development time - Reliable product evaluation

• Printed Circuit Board

To meet the demand for higher speeds in the telecommunications industry, accurate electrical characteristic measurements are essential. Particularly when dealing with high-frequency signals, impedance matching and signal integrity significantly affect performance. Measurement errors can lead to system malfunctions or performance degradation. Our materials on electrical characteristic measurement boards explain the importance of impedance management and how to utilize measurement boards, supporting the development of high-speed communication systems. 【Usage Scenarios】 * Development of high-speed communication devices * High-frequency circuit design * Systems requiring impedance matching 【Benefits of Implementation】 * Improved system performance through accurate electrical characteristic measurements * Ensured signal integrity through optimized impedance management * Enhanced development efficiency through information provided in the materials

• Printed Circuit Board

In the medical device industry, product safety is the top priority. Accurate measurement of electrical characteristics is essential to ensure the reliability of devices and protect patient safety. Measurement errors can lead to incorrect diagnoses or treatments, potentially causing serious issues. Our documentation on electrical characteristic measurement boards provides information to enhance safety, including error factors in impedance management and the differences between measurement boards and standard boards. We encourage you to download and read it. 【Usage Scenarios】 - Electrical characteristic evaluation of medical devices - Confirmation of compliance with safety standards - Quality control in product development 【Benefits of Implementation】 - Improved safety through accurate measurements - Development of reliable medical devices - Compliance with regulations

• Printed Circuit Board

In the aerospace industry, reducing product weight is a critical challenge. The substrate for electrical characteristic measurement supports optimal material selection and design optimization through accurate measurements during the design phase, contributing to weight reduction. Thorough impedance management is a crucial factor that influences product performance in the aerospace field, where high-frequency characteristics are essential. Our materials related to the electrical characteristic measurement substrate will assist in solving these challenges. 【Usage Scenarios】 * Aircraft electronic equipment design * Substrate design for space exploration vehicles * Design of communication devices requiring weight reduction 【Benefits of Implementation】 * Accurate electrical characteristic measurement during the design phase * Achieving weight reduction through optimal material selection * Improved product reliability

• Printed Circuit Board

In the automotive industry, the reliability of electronic components is extremely important. In areas related to vehicle safety, particularly high quality is required. Measurement boards for electrical characteristics are necessary to evaluate important factors for ensuring reliability, such as impedance management and measurement method compatibility. Our materials explain the differences between measurement boards and general boards, as well as key points for matching impedance. This material will help improve the quality and ensure the reliability of automotive electronic components. 【Usage Scenarios】 - Design and development of in-vehicle electronic devices - Inspections in quality control departments - Evaluations at component manufacturers 【Effects of Implementation】 - Increased efficiency in electrical characteristic measurements - Improved accuracy in reliability evaluations - Shortened product development periods

• Printed Circuit Board

We are pleased to present materials introducing our "Measurement Substrates for Electrical Characteristics." This document summarizes the error factors in impedance management, the differences between models and actual products in "Aligning Impedance," and includes information on "Differences Between Measurement Substrates and General Substrates." The content is designed to be easily referenced during your consideration of implementation. Please feel free to download and read it. 【Contents Included】 ■ Aligning Impedance ■ Differences Between Measurement Substrates and General Substrates ■ Compatibility with Measurement Methods *For more details, please download the PDF or feel free to contact us.

• Printed Circuit Board

We are pleased to offer a document introducing "What can be done with the manufacturing simulator." This document provides a detailed explanation of various functions such as product layout functionality, yield prediction functionality, and finishing prediction functionality. It is designed to be a useful reference when considering implementation. We encourage you to take this opportunity to download and review it. 【Featured Functions】 ■ Product Layout Functionality ■ Yield Prediction Functionality ■ Finishing Prediction Functionality ■ Cost Estimation Functionality ■ Impedance Management Optimization Functionality *For more details, please download the PDF or feel free to contact us.

• simulator

In the drone industry, high durability and reliability are required, making the environmental performance of circuit boards crucial. In particular, circuit boards that can withstand harsh environments such as temperature changes, vibrations, and humidity are essential. The proper selection and formation of solder resist contribute to solving these challenges. Our materials on solder resist formation technology are helpful in improving the reliability of drones. 【Usage Scenarios】 - Outdoor flight - Environments with significant temperature fluctuations - Environments with high vibrations 【Benefits of Implementation】 - Improved protection performance of circuit boards - Extended product lifespan - Reduced risk of failure

• Printed Circuit Board

In the telecommunications infrastructure industry, particularly in the field of signal integrity, the reliability of printed circuit boards is crucial. To ensure accurate signal transmission, precision in component placement on the board is required. Proper design and formation of solder resist prevent short circuits and disconnections, contributing to the long-term stability of the product. Our materials on solder resist formation technology are helpful during product selection. 【Usage Scenarios】 - PCB design for communication devices - Protection of signal transmission paths - Shielding of high-frequency circuits 【Benefits of Implementation】 - Improved board reliability - Increased product lifespan - Stabilization of signal quality

• Printed Circuit Board

In the server industry, there is a demand for improved data processing speeds and stability in signal transmission. Particularly, as high-density implementation progresses, the precision of solder resist becomes crucial. Inadequate solder resist can lead to signal interference and short circuits on the substrate, potentially resulting in a decline in server performance. Our materials on solder resist formation technology include specifications such as terminal size, clearance, and solder mask thickness, which are helpful in product selection. 【Usage Scenarios】 - Servers performing high-speed data communication - Servers using high-density implementation substrates - Servers where signal integrity is critical 【Benefits of Implementation】 - Stabilization of signal transmission - Improved reliability of the substrate - Reduction in product selection time

• Printed Circuit Board

In the gaming console industry, as performance increases, heat dissipation measures for circuit boards have become crucial. In particular, to handle high thermal density within limited space, the selection of appropriate solder resist is essential. Inappropriate solder resist can hinder heat conduction, potentially leading to decreased product performance or failure. Our materials on solder resist formation technology include specifications such as terminal size, clearance, solder mask thickness, and surface treatment, which are useful for product selection. 【Application Scenarios】 - Circuit board design for high-performance gaming consoles - Selection of circuit boards requiring heat dissipation measures - Design of compact and high-density mounted circuit boards 【Benefits of Implementation】 - Improved heat dissipation through appropriate solder resist selection - Enhanced product reliability - Reduction in design workload

• Printed Circuit Board

In the wearable device industry, miniaturization and high-density mounting are required, making space-saving in circuit board design an important challenge. Solder resist formation technology enhances the mounting density of components and contributes to the overall miniaturization of devices. Our materials on solder resist formation technology are useful for product selection. [Usage Scenarios] - Miniaturization of wearable devices - High-density mounting - Protection of components [Effects of Implementation] - Miniaturization of devices - Improved reliability - Increased design flexibility

• Printed Circuit Board

In the home appliance industry, as products become smaller and more high-performance, reducing costs in circuit board design has become an important issue. Solder resist formation technology can contribute to improving yield and reducing defect rates in the circuit board manufacturing process, which can ultimately lead to cost reduction. Our materials on solder resist formation technology provide useful information for product selection. 【Application Scenarios】 - Cost reduction in circuit board design for home appliances - Improved yield in circuit board manufacturing - Reduction of defect rates 【Effects of Implementation】 - Increased efficiency in circuit board design - Reduction in manufacturing costs - Improvement in product quality

• Printed Circuit Board

In the IoT device industry, high durability that can withstand harsh environments is required. Especially for devices exposed to temperature changes, vibrations, and humidity, the reliability of printed circuit boards is a crucial factor that influences product lifespan. The proper selection and formation of solder resist are essential to protect the substrate from these external factors and ensure the long-term operation of the device. Our materials on solder resist formation technology will be helpful when selecting products. 【Usage Scenarios】 - Outdoor IoT devices - Industrial IoT equipment - IoT devices used in harsh environments 【Benefits of Implementation】 - Improved substrate protection performance - Enhanced product reliability - Assurance of long-term product lifespan

• Printed Circuit Board

In the smartphone industry, high-density mounting of printed circuit boards is required due to miniaturization and increased functionality. It is particularly important to enhance the component placement density within limited space and ensure the reliability of electrical connections. Proper design of solder resist is essential for solving these challenges. Our materials on solder resist formation technology support the optimization of design for high-density mounting. 【Usage Scenarios】 - Design of high-density mounting boards - Optimization of component placement - Improvement of electrical connection reliability 【Effects of Implementation】 - Increased efficiency in board design - Miniaturization and high performance of products - Improved yield

• Printed Circuit Board

In the aerospace industry, there is a constant demand for lightweight products. In the design of printed circuit boards, solder resist significantly impacts component mounting density and reliability, making proper selection crucial. The selection of solder resist contributes to product miniaturization and weight reduction. Our materials on solder resist formation technology can help address these challenges. 【Application Scenarios】 - Electronics for aircraft and spacecraft - Circuit board designs requiring weight reduction - High-density mounting circuit boards 【Benefits of Implementation】 - Optimization of circuit board design - Weight reduction of products - Improved reliability

• Printed Circuit Board

In the industrial robot industry, the reliability of the circuit board is crucial for achieving high-precision movements. Particularly in circuit boards related to positioning and control, the accuracy of the solder resist significantly impacts the robot's performance. Defects in the solder resist can lead to malfunctions or failures, potentially resulting in decreased production efficiency. Our materials on solder resist formation technology include specifications such as terminal size, clearance, solder mask thickness, and surface treatment, which are helpful in product selection. 【Usage Scenarios】 - Robot arms requiring high-precision positioning - Robot hands performing delicate tasks - Industrial robots used in harsh environments 【Benefits of Implementation】 - Improved robot performance through optimized circuit board design - Reduced risk of failure by achieving reliable circuit boards - Shortened product selection time

• Printed Circuit Board

In the medical device industry, there is a demand for miniaturization of products and high-density mounting. In particular, optimizing circuit board design is crucial for packing many functions into limited space. Solder resist formation technology allows for precise control of terminal sizes and clearances, enabling high-density mounting. Our materials will assist in product selection to address these challenges. 【Usage Scenarios】 - Miniature medical devices - High-density mounting circuit boards - Precise component placement 【Benefits of Implementation】 - Reduction in circuit board size - Improvement in mounting density - Enhanced product reliability

• Printed Circuit Board

In the automotive industry, the reliability of electronic substrates is extremely important. Products that can withstand harsh environments are required, and the proper selection and formation of solder resist are essential for maintaining the long-term performance of the products. Improper design or formation of solder resist can lead to failures caused by vibration and temperature changes. Our materials on solder resist formation technology contribute to improving the reliability of electronic substrates for automotive applications. 【Usage Scenarios】 - In-vehicle electronic devices - ECU (Electronic Control Unit) - Various sensors 【Effects of Implementation】 - Improved substrate quality - Increased product lifespan - Reduced risk of failure

• Printed Circuit Board

We are pleased to present materials introducing our "Solder Resist Formation Technology." This document includes specifications such as terminal size, clearance, solder mask thickness, and surface treatment, along with images. Please make use of it when selecting products. [Featured Products] ■ SMD (Solder Mask Define) ■ NSMD (Non-Solder Mask Define) *For more details, please download the PDF or feel free to contact us.

• Printed Circuit Board

We are pleased to present materials introducing our comprehensive web system "PrikenPlus＋." This system allows you to check the specifications, manufacturing processes, and shipping status of the printed circuit boards you ordered in real-time through our PCB process tracking service "Shinchoku-kun," with detailed explanations of its usage and features. We also provide information on security, such as the information that will be made public and the expected completion diagrams, making it easy to reference when considering implementation. We encourage you to take this opportunity to download and review it. 【Contents】 ■ Introduction to usage and features ■ About security ・Regarding the network ・Regarding public information ・Regarding expected completion diagrams ・Regarding the public period *For more details, please download the PDF or feel free to contact us.

• Printed Circuit Board