立山電化工業 List of Products and Services

We would like to introduce a case where we reviewed the plating process design and conducted prototype production for our customer, resulting in a reduction of variation in Sn plating. 【Challenges faced by the customer】 Regarding the automotive connectors that the customer was developing, they required Sn plating on a certain component, but we were unable to meet the specified range of plating thickness that the customer desired, making it difficult to satisfy the functionality of the connector. For the solution, its effects, and results, please download the case study from the catalog below or feel free to contact us.

• Prototype Services
• jig

We are introducing a case where we addressed the issues faced by our client company by reviewing the spot Au plating fixtures, which led to a reduction in Au usage for Au plated components and an improvement in the Ni barrier function. 【Challenges Faced by the Client】 The existing client was troubled by the rising procurement costs of Au plated components for connectors due to the recent surge in Au market prices. Additionally, they were also struggling with solder wetting on unnecessary areas during the board assembly of the connectors, which prompted them to consult with us. For details on the solution, its effects, and results, please download the case study from the catalog below or feel free to contact us.

• jig
• Other contract services

"Hoop Au plating" is a plating method suitable for connector components that connect electronic circuits. It realizes advanced technology that applies a "nickel barrier" to prevent solder wicking during assembly. When looking inside mobile phones and smartphones, ultra-low-profile narrow-pitch connectors are used, and these connector terminals are partially gold-plated. 【Features】 ■ In the partial plating reel-to-reel line, stripe Au plating and spot Au plating are possible. ■ Sn plating and Sn reflow are also possible for soldering areas. ■ Our unique special drum and inline laser stripping enable precise partial plating. ■ In the full plating reel-to-reel line, finishing Sn plating is performed, and it supports both underlying Ni plating and underlying Cu plating. ■ Reflow processing is possible for both underlying specifications, and it is compatible with SUS materials. * For more details, please refer to the PDF materials or feel free to contact us.

• Plating Equipment

Our barrel plating line, with various specifications, accommodates a wide range of fine products. Depending on the shape and quantity of the products, we offer several barrel sizes, and for small quantities, we can accommodate by adding a medium that facilitates electrical conduction. Thanks to our unique medium shapes and quantities, plating of fine products is made possible. 【Features】 ■ Innovations in lead wires - We adapt the hardness and shape of the contact part of the lead wires according to the shape and quantity of the products. ■ Selection of barrels based on product shape and quantity - We have several barrel sizes available to accommodate the shape and quantity of the products. - For small quantities, we add a medium that facilitates electrical conduction. - Plating of fine products is possible due to our unique medium shapes and quantities. *For more details, please refer to the PDF document or feel free to contact us.

• Plating Equipment

Our company offers manual plating lines using racks for various substrates, as well as fully automated plating lines utilizing our unique belt conveyor system. For IC lead frames, we utilize a fully automated rackless plating line. The fully automated plating line with our unique belt conveyor system aims to reduce labor by automating the loading and unloading of substrates and IC lead frames. Additionally, our fully automated plating process with the unique belt conveyor system has very minimal variation in plating thickness between substrates. 【Features】 ■ Manual plating lines using racks and our unique fully automated plating lines with belt conveyors for various substrates ■ Fully automated rackless plating line for IC lead frames *For more details, please refer to the PDF document or feel free to contact us.

• Plating Equipment

【Challenges faced by the customer in the case study】 ■Au Plating The existing customer was troubled by the rising procurement costs of Au-plated components for connectors due to the recent surge in Au market prices. Additionally, they were also struggling with solder wetting on unnecessary parts during the mounting of connectors on the circuit board, and sought our consultation. ■Sn Plating For a vehicle-mounted connector that the customer was developing, they required Sn plating on a certain component. However, they were unable to meet the specified thickness range for the plating that the customer desired, making it difficult to satisfy the functionality of the connector. *For details on the solutions and effects, please refer to the PDF document or feel free to contact us.

• Prototype Services
• jig

We would like to introduce a case where we reviewed the process design and conducted prototype production for a customer company, successfully reducing the variation in Sn plating. In this company, the customer was developing an automotive connector and required Sn plating on a certain component. However, they were unable to meet the specified range of plating thickness required by the customer, making it difficult to fulfill the connector's functionality. By reviewing our plating process design and developing a dedicated jig, we repeatedly went through trial and error in the prototype production, which allowed us to reduce the variation in plating thickness. Ultimately, we were able to achieve the process capability that the customer was looking for. 【Case Overview】 ■ Background - Sn plating thickness could not meet the specified range, making functionality difficult. ■ Effect - The customer's product development was successfully advanced, allowing for the product to be launched in mass production, thereby gaining the customer's trust. *For more details, please download the PDF or feel free to contact us.

• Prototype Services
• jig

We are introducing a case study where we reviewed the spot Au plating jig for our customer company, resulting in a reduction of Au usage in Au-plated components and an improvement in the Ni barrier function, thereby solving their issues. 【Challenges faced by the customer】 The existing customer was troubled by the rising procurement costs of Au-plated components for connectors due to the recent surge in Au market prices. Additionally, they were also struggling with unnecessary solder wetting on certain areas during the PCB assembly of the connectors, which led them to consult with us. For details on the solution, its effects, and results, please download the case study from the catalog below or feel free to contact us.

• jig
• Other contract services

"Electroless plating" is a method that causes a chemical reduction reaction in a solution, resulting in the deposition of plating metal onto materials or components. It has advantages such as no restrictions on the shape of the plating target and good uniformity, and the corrosion resistance of electroless nickel is superior to that of electrolytic nickel. Electroless copper plating is used for reduction plating, replacement plating, and conductive treatment of insulating resin (plastic) surfaces. [Components] ■ Main components: Metal salts, reducing agents ■ Auxiliary components: pH adjusters, buffers, complexing agents, accelerators, stabilizers, modifiers *For more details, please download the PDF or feel free to contact us.

• Other metal materials

This document provides an explanation of metals. It introduces the classification of metals and crystal structures, as well as the characteristics of representative metals such as copper, aluminum, and nickel. Additionally, it includes explanations about metals and non-metals, as well as ferrous (iron and steel) and non-ferrous metals. We encourage you to read it. 【Contents (partial)】 ■ What is metal ■ Metals and non-metals ■ Classification of metals ■ Ferrous (iron and steel) and non-ferrous metals ■ Light metals and heavy metals *For more details, please download the PDF or feel free to contact us.

• Other metal materials

We will introduce the testing methods for plating films. The inspection items required for our plating include appearance, plating thickness, adhesion, solderability, and corrosion resistance. There are various testing methods, such as visual inspection to check for defects on the plating surface and barrel polishing tests, where samples are placed in a barrel with steel balls and rotated to examine adhesion. For more details, please refer to the catalog. 【Testing Methods (Partial)】 ■ Appearance Test ■ Plating Thickness Measurement ■ Adhesion Test ■ Barrel Polishing Test ■ Peel Test (Tape Test) *For more information, please download the PDF or feel free to contact us.

• Other metal materials

The "ICP Emission Spectroscopy Analyzer" is a device that allows for qualitative and quantitative analysis of inorganic elements by introducing a mist of liquid samples into plasma and measuring the emitted light and ionized ions. It mainly consists of a sample introduction section, an emission section (plasma excitation source), a spectroscopic section, a detection section, and a signal processing section (device control and computation). It can be broadly categorized into two types: a sequential type with high resolution and sensitivity, and a multi-type with high speed and good reproducibility. 【Features】 ■ Simultaneous analysis of multiple elements and sequential analysis are possible ■ Wide linear range of calibration curves ■ Minimal scientific and ionization interference, enabling analysis of high matrix samples ■ High sensitivity (detection limit below 10 ppb) ■ Capable of measuring many elements (including Zr, Ta, rare earths, P, B, etc.) ■ Good stability *For more details, please download the PDF or feel free to contact us.

• Spectroscopic Analysis Equipment

"Copper plating" has a reddish-brown hue and features excellent electrical and thermal conductivity. It is soft, highly ductile, and has excellent workability. Beyond plating applications, it is widely used in everyday items such as electrical wires and coins. It is also used in applications like decorative items, printed circuit boards, anti-replacement plating, and chip components. Additionally, our product offers copper sulfate plating baths, cyanide copper plating baths, and copper pyrophosphate plating baths. [Features] - Excellent electrical and thermal conductivity - Soft, highly ductile, and excellent workability - Widely used in everyday items such as electrical wires and coins beyond plating applications *For more details, please download the PDF or feel free to contact us.

• Other metal materials

Introducing "Plating for Electromagnetic Wave Shielding." As electronic devices become smaller and lighter, it is common for their outer casings to be made of non-conductive materials such as plastics. These materials allow electromagnetic waves to pass through, making shielding necessary. To address this, a method of covering the inner surface of the casing or areas close to components that generate electromagnetic waves with a plating film is employed, using electroless copper plating and electroless nickel plating. **Features** - Plating is used to prevent (shield) the generation of electromagnetic wave noise. - Electroless copper plating and electroless nickel plating are primarily adopted. *For more details, please download the PDF or feel free to contact us.*

• Plating Equipment

We would like to introduce "plating that provides electrical conductivity," which we handle. The main reason for plating electronic components is to impart or enhance the property of conducting electricity. Among metals, silver has the best electrical conductivity, followed by copper and gold. Among these, gold plating is primarily used for contact components (such as connectors) because it not only has good conductivity but also does not form an oxide film, resulting in stable low contact resistance. 【Functional Plating】 ■ Electrical properties: electrical conductivity, wiring formability, electromagnetic wave shielding ■ Mechanical properties: wear resistance, lubricity ■ Physical properties: solder wettability, bonding ability *For more details, please download the PDF or feel free to contact us.

• Plating Equipment

We would like to introduce the "plating with bonding properties" that we handle. In plating with bonding properties, gold and silver plating are used. In particular, neutral bath pure gold plating is used for gold plating. Plating is applied to the parts where bonding occurs, specifically on the electrode parts of semiconductor devices and package leads, to enhance joint compatibility. Please feel free to contact us if you have any requests. 【Typical composition of neutral bath (partial)】 ■ Gold compound (metal salt): Potassium cyanide ■ Gold concentration: 8–10 ■ Conductive salt/acid: Citrate/phosphate ■ pH: 6–7 ■ Added metals: As or Ta *For more details, please download the PDF or feel free to contact us.

• Plating Equipment

We would like to introduce the "plating that provides solderability" that we handle. Soldering is an essential technology in the production of electronic devices. The purpose of soldering is to join metals together to allow electrical conduction and to maintain the position through the joint. In printed circuit boards, soldering is used to connect circuits and electronic components to enable electrical conduction, while also fixing the components in place to prevent movement, and solderability is achieved through plating. 【Functional Plating】 ■ Electrical properties: electrical conductivity, wiring formation, electromagnetic wave shielding ■ Mechanical properties: wear resistance, lubricity ■ Physical properties: solder wetting, bonding ability *For more details, please download the PDF or feel free to contact us.

• Plating Equipment

Our company specializes in metal surface treatment through electroplating. The plating process is positioned in the middle of our customers' processes, where we take in products (materials) from our customers, add "value through plating," and return them to our customers. Representative categories of ordered products include electronic components, flat-type chip resistors (electrode parts), crystal devices, automotive LED components, and connectors that connect electronic circuits. Please feel free to contact us if you have any inquiries. [Business Description] ■ Metal surface treatment through electroplating *For more details, please download the PDF or feel free to contact us.

• Plating Equipment

We are conducting plating processes aimed at providing functionality for solder mounting on electrode parts ranging from size 1005 (L×W = 1.0mm×0.5mm) to size 6330 (L×W = 6.3mm×3.2mm). This is controlled by fully automatic barrel plating equipment based on plating conditions (master data) determined by size and resistance values, responding to customer requirements. The sorting after plating is constructed using our self-developed process that utilizes shape differences. 【Product Overview】 ■ Plating Types ・ Finish Plating: Tin Plating ・ Under Plating: Nickel Plating ■ Plating Method: Automatic Barrel Plating Method ■ Supported Products: Various Surface Mount Resistors *For more details, please refer to the PDF document or feel free to contact us.

• Plating Equipment

We have developed in-house a rack-type automatic transport plating equipment to uniformly apply gold plating to the contact areas of substrates for LED backlights in LCD TVs and ceramic substrates for LEDs. Despite being rack-type, there is almost no variation in quality within and between substrates, leading to reduced material costs and enabling cost-effective plating processes. Additionally, we have achieved labor savings by fully automating the loading and unloading processes. 【Product Overview】 ■ Plating Types - Finish Plating: Pure Gold Plating - Base Plating: Nickel Plating ■ Plating Method: Rack-type automatic transport plating method (manual line also available) *For more details, please refer to the PDF document or feel free to contact us.

• Plating Equipment

We have established Ni barrier technology through our specially manufactured drums and an inline laser stripping process, which allows us to accommodate low-profile, narrow-pitch products. Additionally, we have introduced image dimension measuring devices and video microscopes in both the manufacturing site and the quality control department to ensure a system that meets our customers' requirements. The nickel barrier prevents solder wicking during assembly and can accommodate widths as small as 0.08mm. 【Production Overview】 ■ Plating Types - Finish Plating: Hard Gold Plating - Base Plating: Nickel Plating ■ Plating Method: Hoop Plating (Inline Laser Method) ■ Specifications and materials will be addressed upon consultation. *For more details, please refer to the PDF document or feel free to contact us.

• Plating Equipment

"PC-oriented pin plating" is designed to minimize plating thickness variation within and between lots for CPU (PGA) lead pins used in computers and servers. We have developed a barrel structure suitable for ultra-fine products, enabling us to meet high customer demands. We perform plating on the pins used in CPUs (Central Processing Units), which function as the brain of computers. 【Production Overview】 ■ Plating Types - Finish Plating: Pure Gold Plating - Under Plating: Nickel Plating ■ Plating Method: Manual Barrel Plating *For more details, please refer to the PDF document or feel free to contact us.

• Plating Equipment

We would like to introduce the inspection equipment used at Tateyama Denka Kogyo Co., Ltd. We possess inspection equipment related to film thickness and film properties, as well as surface analysis, dimensional inspection equipment, and liquid analysis-related inspection equipment. For film thickness and film properties inspection equipment, we conduct inspections and measurements using non-destructive methods such as "X-ray fluorescence thickness gauges" and "solder wettability testers" to accurately measure plating films. 【Inspection and Measurement Equipment Lineup】 ■ X-ray fluorescence thickness gauge ■ Destructive thickness measuring device ■ Product cross-section thickness measuring device ■ Solder wettability tester *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices

When you look inside mobile phones and smartphones, you will find ultra-low-profile narrow-pitch connectors that have partial gold plating on their terminals. "Hoop plating" is a plating method suitable for connector components that connect electronic circuits. It realizes advanced technology that applies a "nickel barrier" to prevent solder wicking during assembly. 【Features】 ■ In the partial plating reel-to-reel line, stripe Au plating and spot Au plating are possible. ■ It supports specifications that combine two types of plating, such as partial Sn plating and partial Au plating, and can propose cost reductions by changing specifications from partial Au plating to partial Sn plating. ■ Our unique special drum and inline laser stripping technology enable the formation of a more precise "nickel barrier" through partial plating. ■ In the reel-to-reel line for full plating, base Ni plating followed by Sn plating is possible. ■ Both Au plating and Sn plating lines can accommodate SUS materials. ■ Supports reflow processing for Sn plating. *Some specifications may have restrictions. *For more details, please refer to the PDF document or feel free to contact us.

• Plating Equipment

Our barrel plating line, with various specifications, accommodates a wide range of fine products. Depending on the shape and quantity of the products, we offer several barrel sizes, and for small quantities, we can accommodate by adding a medium that facilitates electrical conduction. Thanks to the unique shape and amount of our media, plating on fine products is made possible. 【Features】 ■ Innovations in lead wires - The hardness of the lead wires and the shape of the contact parts are adjusted according to the shape and quantity of the products. ■ Selection of barrels based on product shape and quantity - We provide several barrel sizes to match the shape and quantity of the products. - For small quantities, we add a medium that facilitates electrical conduction. - Plating on fine products is possible due to the unique shape and amount of our media. *For more details, please refer to the PDF document or feel free to contact us.

• Plating Equipment

Our company offers manual plating lines using racks for various types of substrates, as well as fully automated plating lines with our unique belt conveyor system. For IC lead frames, we utilize a fully automated rackless plating line. Our fully automated plating line with a unique belt conveyor system aims to reduce labor by automating the loading and unloading of substrates and IC lead frames. Additionally, our fully automated plating process with the unique belt conveyor system has very minimal variation in plating thickness between substrates. 【Features】 ■ We provide manual plating lines using racks and our unique fully automated plating lines with belt conveyors for various types of substrates. ■ For IC lead frames, we utilize a fully automated rackless plating line. *For more details, please refer to the PDF document or feel free to contact us.

• Plating Equipment