豊和産業 List of Products and Services

When implementing chips onto a base substrate, we will first respond to customers considering joining with solder bumps through prototypes. We have previously provided prototypes using plating processes, but this time we will introduce ball bump mounting methods and printing methods. Our main focus is on prototype processing, so we can accommodate small lots. There are some constraints regarding work size and bump diameter, but we welcome any inquiries you may have.

• Wafer
• Circuit board design and manufacturing

Utilizing the properties of fluororesin, it is widely used in various fields that require transparency, electrical properties, water repellency, release properties, chemical resistance, moisture resistance, and more. A special liquid-type coating agent is used to apply a coating to the surface of the substrate. Additionally, it may be possible to process the fluororesin itself, so please feel free to consult us.

• Wafer
• Other electronic parts
• Processing Contract

This is a groundbreaking technology that projects images into the air and allows for interaction. It adopts the principle of a two-sided orthogonal reflector. We would like to propose the development of units tailored to your needs, so please feel free to consult us.

• Touch Panel
• Surveillance Camera System
• Other FPD related

MEMS, centered around photofabrication and micromachine technology, is expected to thrive in various application fields. We are pleased to announce the comprehensive release of a "Technical Data Collection" that includes numerous processing and application technologies. This collection is filled with information on essential technologies such as "photoetching," which is a fundamental technology in MEMS and display device substrates; "dicing processing," a technique for accurately cutting out circuits formed on silicon wafers into chips; and "bump formation," which is indispensable for various mounting technologies such as CSP, BGA, and flip chips. For more details, please contact us or refer to the catalog.

• Processing Contract
• Wafer processing/polishing equipment

FPC (Flexible Printed Circuit) boards are circuit boards that use polyimide film as the base material and have copper electrodes patterned on them. Since the base substrate does not use organic materials such as adhesives, it can be used in high-temperature environments. Additionally, Howa Sangyo Co., Ltd. has achieved fine pattern processing that was not possible with conventional FPC boards by using methods such as etching and additive processes. Fine patterning of less than 50μm is possible. Depending on the specifications, connection bumps can be formed on the pattern or the back side. Furthermore, by combining laser processing and plating technology, through-hole conduction treatment on both sides is possible. For more details, please contact us or refer to the catalog.

• Circuit board design and manufacturing
• Contract manufacturing
• Processing Contract

Bumps are essential for various mounting technologies such as CSP, BGA, and flip chip. At Howa Sangyo Co., Ltd., we can accommodate various bump processing from just one piece, tailored to your specifications and budget. In the stud method (for chip applications only), we offer Au stud bumps in two wire diameters of 18μm and 25μm (which can be selected based on bump height and diameter), and we can also handle 2-layer and 3-layer bump processing. In the plating method, we support electroplating with Au, Ni, Cu, Ag, Pt, as well as solder (eutectic and high melting point) and lead-free solder (Sn-Ag, Au-Sn), along with various electroless plating options. Furthermore, we can accommodate substrates made of glass, Si (silicon), film, etc. For more details, please contact us or refer to our catalog.

• Other electronic parts
• Processing Contract

At Toyowa Sangyo Co., Ltd., we create TEG chips for implementation evaluation using technologies such as film formation, photo-etching, and plating. We offer options for standard and custom products tailored to our customers' budgets and specifications. We can also accommodate small quantities. Please feel free to consult with us. Additionally, we provide back grinding processing for wafers and can handle processing for evaluation implementation boards. For more details, please contact us or refer to our catalog.

• Other electronic parts
• Contract manufacturing

In 3D microfabrication for MEMS, fine cutting can be performed by spraying ultrafine particles such as alumina. Fine patterns are formed on glass substrates or silicon substrates using dedicated dry film resist, and grooves and hole processing are carried out using sandblasting. Measurement and evaluation with a 3D measuring machine are also possible. We can accommodate prototypes starting from a single piece. High aspect ratio patterning has been achieved. Processing of grooves and holes on the micron and nanometer scale is possible, and depth control is also available. We can also handle chemical treatment of blasted surfaces and conductive treatment for through-holes. For more details, please contact us or refer to the catalog.

• Surface treatment contract service
• Processing Contract

To accurately cut and chip the circuits formed on Si wafers, a technique called dicing is used. It is common to use a dicing device equipped with a rotating blade. At Toyowa Industry Co., Ltd., we handle processing not only for Si wafers but also for glass, ceramics, single crystal materials, resins, and more. Cutting water can be compatible with pure water. We support everything from prototype processing to mass production. Additionally, we can accommodate cutting methods tailored to your needs (such as scribing). For more details, please contact us or refer to our catalog.

• Surface treatment contract service
• Processing Contract

As elements of grinding processing technology, there are "surface accuracy," "transmitted wavefront accuracy," "surface roughness," "angle accuracy," and "spectral characteristics." In particular, optical components that require high flatness and angle accuracy, as well as other products, are handled by Hohwa Industry Co., Ltd. based on high-precision processing technology and know-how, providing a consistent production process from material procurement to completion, along with quality control and quality assurance. For more details, please contact us or refer to our catalog.

• Surface treatment contract service
• Processing Contract

Thin film formation technology can be categorized into physical vapor deposition (PVD), chemical vapor deposition (CVD), and liquid phase methods. The thin film formation technologies available at Hohwa Industrial Co., Ltd. include resistance heating, electron beam (EB) evaporation, sputtering, and ion plating for vapor growth methods applied to base materials such as glass, silicon wafers, ceramics, and films. In liquid phase growth methods, we can accommodate processing using electroplating, electroless plating, and sol-gel methods. These technologies are applied when manufacturing optical and electronic components, and we also provide film selection and design tailored to the intended use and methods. For more details, please contact us or refer to our catalog.

• Surface treatment contract service
• Processing Contract

Now, as one of the microfabrication technologies, processing using laser beams has become common, and the related equipment has made remarkable progress. Until now, Hohwa Industrial Co., Ltd. has supplied optical products as components for such equipment. In particular, laser masks with patterned processing on reflective mirrors are widely used for applications such as marking on packages and fine hole drilling. Since these products utilize photofabrication, they are characterized by their ability to form fine patterns. For more details, please contact us or refer to our catalog.

• Photomask
• mirror
• Other contract services

We manufacture inorganic interference filters primarily for liquid crystal display elements in any pattern to meet customer needs. Inorganic membrane color filters can be produced using methods such as vacuum deposition, allowing for the formation of light-blocking membrane patterns as well as RGB pattern formation using dielectric multilayers that utilize light interference. They can be applied to liquid crystal displays (LCD), organic LEDs (OLED), color sensors, and more. Additionally, inorganic color filters are particularly excellent in weather resistance, and their spectral characteristics can be customized through multilayer design. We offer substrate polishing, mask production, color pattern formation using photolithography, and simulations based on membrane design according to your requirements. For more details, please contact us or refer to our catalog.

• filter
• Other filters
• Other contract services

We have achieved direct electroless plating without the need for a base film such as vapor deposition or sputtering on film substrates, resulting in high adhesion, reduced lead times, and cost savings. Additionally, we can form patterns through etching after plating upon request. Hōwa Sangyō is prepared to assist in research and development for industries with such applications, accommodating even single prototype requests, so please consult us for prototype development. For more details, please contact us or refer to our catalog.

• Processing Contract

We accept small-scale prototypes using photolithography and precision photography technology, which are essential technologies in MEMS and display devices. We form thin films on substrates such as glass substrates, silicon wafers, films, and ceramics, and create fine patterns through a consistent photolithography process. We can accommodate prototypes starting from a single piece. We also support prototypes for dicing and bump formation. Additionally, we can pattern dielectric films and multilayer films using lift-off processing. Substrate sizes can be customized as needed. Etching of silicon wafers and glass substrates is also possible. We can respond with short lead times (consultation required) and can accommodate rigid and FPC substrates. For more details, please contact us or refer to our catalog.

• Processing Contract

Toyowa Sangyo Co., Ltd. has cherished the fundamental principle of "From Imagination to Creation," which is also our corporate motto, since our founding. We have always aimed to stay one step ahead in collaboration with the electronics and optics industries, playing our part in this endeavor. Given this environment, we believe that communication skills and simulation capabilities are particularly important. We see it as our mission to accurately assess what our customers are "currently seeking" and to utilize our proud human and technical networks to provide prompt responses. There is no doubt that in the future, not only in the electronics and optics industries but also in MEMS, telecommunications, biotechnology, and healthcare, the fusion of technologies across different industries will become increasingly active. We are committed to daily self-improvement to become a company worthy of our customers' trust, satisfaction, and peace of mind. For more details, please contact us or refer to our catalog.

• Processing Contract
• Wafer processing/polishing equipment

Our company handles processing not only of Si wafers but also of glass, ceramics, single crystal materials, and resins. Cutting water can be compatible with pure water. We can accommodate everything from prototype processing to mass production. Additionally, we can support cutting methods tailored to your applications (such as scribing), so please feel free to consult with us.

• Other semiconductors
• Processing Contract
• others

Glass etching does not have the directionality of Si wafers, but the range of material and work dimensions is very broad, and it is used in various fields. For more details, please feel free to "contact us."

• others

Anisotropic etching of Si is a technique that utilizes the crystal axis orientation of Si to create half-holes and through-holes. For example, when a Si wafer (type #100) is anisotropically etched, sharp and high-precision patterning is possible at an angle of 54.7 degrees to the crystal axis direction. For more details, please feel free to "Contact Us."

• others

- Capable of a consistent process from thin film formation to patterning and plating. - Support for multilayer film configurations. - Film application is possible on Si wafers, glass substrates, and resin film substrates. - Substrate sizes can be accommodated as needed.

• Evaporation Equipment
• Other electronic parts
• Surface treatment contract service

We can offer standard and custom options to fit your budget. We also accommodate various bump processing. We will respond to your specifications for wiring materials, insulation materials, etc. Additionally, we can create from just one piece, so please feel free to consult with us.

• Bonding Equipment
• Other semiconductors
• Processing Contract

- Prototyping is possible from a single piece. - High aspect ratio patterning is achievable. - Patterns can be formed using photolithography, allowing for arbitrary designs. - Machining of grooves and holes in the micron and nanometer range is possible. - Depth control is also available. - Chemical treatment of blasted surfaces is possible. - Conductive processing for through-holes is also supported.

• Printed Circuit Board
• Glass
• Processing Contract

【Features】 1. Fine patterning with a pitch of 30μm (L&S = 15/15μm) is possible. 2. Depending on specifications, connection bumps can be formed on the pattern or the backside. 3. By combining laser processing and plating technology, through-hole conduction treatment on both sides is possible.

• Printed Circuit Board
• Processing Contract
• Other processing machines

Based on our ultra-high precision processing technology and achievements, we provide essential optical components in the field of optoelectronics, including cameras and binoculars, and have received high acclaim for our work.

• Printed Circuit Board
• Contract manufacturing
• lens

Substrate polishing, mask production, color pattern formation using photolithography, and simulation based on film design according to your requirements.

• LED Module
• Printed Circuit Board
• Processing Contract

We can accommodate various specifications and uses. Additionally, we can handle various substrate materials such as glass, silicon wafers, and films. Not only can we perform bump processing, but we also support processing of wiring patterns and more, so please feel free to consult with us.

• Other semiconductors
• Processing Contract
• Other processing machines

◎ Prototyping available from a single piece ◎ Consistent process from thin film formation ◎ Prototyping for dicing, bump formation, etc. also available ◎ Patterning of dielectric films and multilayer films possible with lift-off processing ◎ Substrate size can be customized ◎ Etching of Si wafers and glass substrates is also possible ◎ Short delivery times available (consultation required) ◎ Supports rigid and FPC substrates as well

• Printed Circuit Board
• Processing Contract
• others

By setting a substrate with a patterned reflective film in a laser marking device or laser processing machine and irradiating it, it is possible to perform patterned processing on the target object. Utilizing advanced photo printing technology allows for fine patterning. Since the specifications of the reflective film vary depending on the laser wavelength used, it is also possible to design according to the required specifications.

• Marking machine
• Laser Components
• Optical Experimental Parts

We are pleased to announce that Toyowa Industries Co., Ltd. has started electrode patterning and various prototype processing using transparent polyimide film. This news may be a welcome development for those who have had to abandon research and development due to constraints related to heat resistance and transparency. While this is a groundbreaking development, we are still unsure of the various fields it can be applied to, so we look forward to receiving various suggestions from our customers.

• Other Connectors
• Printed Circuit Board
• Processing Contract

The minimum line width that can be produced varies depending on the pattern, substrate shape, and material, so please consult us separately. We can accommodate substrate materials such as resin, glass, ceramics, and silicon according to your specified requirements.

• Printed Circuit Board
• Sensors
• Other electronic parts