ジェイテクトサーモシステム Product Lineup

The "SO2-12-F" is a clean oven for semiconductor manufacturing that incorporates the technology of the best-selling sheet-type clean oven used in FPD manufacturing equipment. It supports 300mm (12-inch) FOUP and can operate fully automatically. It can process up to 50 wafers per chamber and can be expanded to two chambers. It achieves high throughput and short cycle times with low-temperature processes such as polyimide curing. 【Features】 ■ Fully automatic clean oven compatible with FOUP ■ Up to 50 wafers per chamber ■ One robot can handle two chambers ■ Operates with 2 FOUPs per chamber ■ High-efficiency wafer transport with a dual-plate transport robot *For more details, please refer to the PDF document or feel free to contact us.

• Heating device

The "VF-3000" is a mini-batch vertical furnace that achieves low costs suitable for downstream users. It is capable of processing mini-batches of 50 to 75 wafers and accommodates a wide range of wafer sizes up to Φ200mm. It allows for ultra-high temperature processing, making it suitable for power device manufacturing and VCSEL vertical thermal processing systems. 【Features】 - Capable of selecting mini-batch processing of 50 to 75 wafers, suitable for both R&D and mass production lines - Accommodates a wide range of wafer sizes up to Φ200mm - Maximum of 4 cassette stockers - Equipped with LGO heaters, demonstrating excellent temperature characteristics from low to medium-high temperatures - High-speed wafer transport using a single wafer handling robot *For more details, please refer to the PDF document or feel free to contact us.

• Heating device

The "RLA-3100-V" is a contact annealing lamp annealing (RTP) device that can accommodate a wide range of wafer sizes up to 6 inches. It features a vacuum-designed quartz tube that allows for a clean vacuum (LP) environment and processing in an N2 load lock atmosphere. Additionally, it is equipped with an automatic wafer exchange mechanism, enabling C to C transport. 【Features】 ■ Supports a wide range of wafer sizes up to 6 inches ■ Equipped with an automatic wafer exchange mechanism for C to C transport ■ Improved annealing characteristics due to vacuum compatibility ■ Achieves short TAT with N2 load lock compatibility ■ Capable of processing GaN substrates *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

The "VF-5900" is a flagship model of a large batch vertical furnace equipped with a high-capacity stocker, achieving short takt times. It can process up to 100 pieces of 300mm/12-inch wafers and 16 FOUPs at once. The adoption of LGO heaters provides excellent temperature characteristics from low to medium-high temperatures. It is suitable for thermal processing of materials other than silicon wafers, such as IGBTs, polyimides, and thin wafers. 【Features】 ■ Large batch processing, capable of handling up to 100 pieces at once ■ Stocker for up to 16 FOUPs ■ Excellent temperature characteristics from low to medium-high temperatures due to LGO heater installation ■ High-speed wafer transport with a single wafer + 5-piece batch transport robot ■ Equipped with a user-friendly high-function control system *For more details, please refer to the PDF document or feel free to contact us.

• Heating device

The "VF-3000H" is an activation annealing furnace capable of ultra-high temperature processing, suitable for power device manufacturing. It can process mini-batches of 50 wafers and accommodates a wide range of wafer sizes from 3 inches to 6 inches. We have carefully selected the hardware and control systems, making it suitable for both R&D applications and mass production lines. Additionally, we also offer the "VF-5100," which can remove carbon after activation. 【Features】 - Mini-batch processing of 50 wafers, suitable for R&D and mass production lines - Accommodates a wide range of wafer sizes from 3 to 6 inches - The furnace features our unique metal-free structure - Temperature monitoring near the wafer is possible - Standard equipped with N2 load lock *For more details, please refer to the PDF document or feel free to contact us.

• Annealing furnace

This is a compact vacuum purge furnace that allows for easy heating treatment under various atmospheres. The vacuum purge can shorten the replacement time of the atmosphere inside the furnace. 【Features】 ◆ Capable of heating treatment under various atmospheres ◆ Can also be used as a reduction atmosphere (hydrogen gas) furnace ◆ Easy maintenance of the heater ◆ Equipped with an Inconel muffle ◆ Operating temperature range is 400°C to 1000°C

• Electric furnace

It is a single-wafer IR furnace. 【Features】 ◆ High-level cleanliness With a clean structure that does not generate self-dust, it has high cleanliness performance. It can also handle processing of array substrates that require a stringent clean environment. ◆ High heating efficiency Adopting an infrared (IR) heating method with excellent heating efficiency, it enables high-efficiency processing for various film thicknesses. It is optimal for processing thick films such as orientation films and passivation films. ◆ Excellent temperature uniformity Equipped with IR panel heaters that excel in temperature uniformity, it can provide uniform heating even for large substrates such as 10th generation. ◆ Atmosphere processing capability It is possible to introduce nitrogen gas into the furnace for heating treatment at low oxygen concentrations.

• Electric furnace

This is a vertical diffusion furnace compatible with Φ300mm. 【Features】 ◆ Equipped with a user-friendly, in-house developed new controller ◆ Efficient fully automated transport system ◆ High-performance control system ◆ High-performance LGO heater installed

• Oxidation/Diffusion Device