300mm wafer-compatible clean oven 'SO2-12-F'

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last updated：Jun 04, 2025

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Clean oven for semiconductor manufacturing compatible with 300mm (12-inch) wafers.

The "SO2-12-F" is a clean oven for semiconductor manufacturing that incorporates the technology of the best-selling sheet-type clean oven used in FPD manufacturing equipment. It supports 300mm (12-inch) FOUP and can operate fully automatically. It can process up to 50 wafers per chamber and can be expanded to two chambers. It achieves high throughput and short cycle times with low-temperature processes such as polyimide curing. 【Features】 ■ Fully automatic clean oven compatible with FOUP ■ Up to 50 wafers per chamber ■ One robot can handle two chambers ■ Operates with 2 FOUPs per chamber ■ High-efficiency wafer transport with a dual-plate transport robot *For more details, please refer to the PDF document or feel free to contact us.

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【Specifications (Excerpt)】 ■ Main body dimensions (mm): 3300(W) × 3105(D) × 2200(H) (2-chamber specification) ■ Heating method: Hot air circulation method ■ Heater: Sheath heater ■ Operating temperature range: 70–450℃ ■ Heat uniformity length (mm): 500 ■ Wafer size (mm): 300 ■ Number of wafers processed: 50 wafers/batch ■ I/O ports: 2 or 4 *For more details, please refer to the PDF document or feel free to contact us.