奥野製薬工業 List of Products and Services

Our company will be exhibiting at the JPCA Show 2025, which will be held at Tokyo Big Sight from June 4 (Wednesday) to June 6 (Friday), 2025. We will showcase surface treatment chemicals and process technologies that contribute to the high performance and multifunctionality of printed circuit boards and semiconductor package substrates, including the plating process for glass, which is expected to be the next-generation package substrate. As a comprehensive manufacturer of surface treatment chemicals, we will provide total solutions for plating chemicals, plating equipment, and surface treatment processes specifically for the back-end of semiconductor manufacturing. We invite you to visit our booth in East Hall 7, [7D-01]. Additionally, during the NPI presentation, we will give a talk on "High Aspect Ratio Through-Hole Filling Copper Sulfate Plating Additive Topluchina GCS for Glass Core Substrates" on June 5, 2025, from 10:30 to 10:50 at the NPI Presentation Venue D in East Hall 6. Okuno Pharmaceutical Industry will continue to solve any issues related to surface treatment in the electronics field. You can view the overview of our exhibited products below. *For more details, please refer to the related links or feel free to contact us.

• Chemicals
• Plating Equipment

Okuno Pharmaceutical Industry will exhibit at the 26th Semiconductor and Sensor Packaging Exhibition / Specialized Exhibition for Semiconductor Backend Processes (ISP), which will be held at Tokyo Big Sight from January 22 (Wednesday) to January 24 (Friday), 2025. Under the theme of "OKUNO," which contributes to the development of printed circuit boards and semiconductor package substrates, we will showcase a variety of products including plating chemicals and plating equipment for semiconductor backend processes, semiconductor package substrates, flexible substrates, plating chemicals and processes for glass substrates, and surface treatment for power devices. We invite you to visit our booth at Tokyo Big Sight, East Hall 7, E63-62. You can view an overview of the exhibited products from the related link. 【Exhibition Information】 ■ Dates: January 22 (Wednesday) to 24 (Friday), 2025 ■ Location: Tokyo Big Sight (East Hall) ■ Booth Number: E63-62 *For more details, please refer to the related link or download the catalog of related products.

• Printed Circuit Board

Coatings that use fluorine compounds are utilized in many food-related utensils due to their excellent properties such as water and oil repellency, stain resistance, non-stickiness, chemical resistance, and heat resistance. In recent years, concerns have been raised about the harmful effects of organic fluorine compounds (PFAS) on human health, and there is a possibility that all organic fluorine compounds will be subject to usage regulations under the European PFAS restriction proposal in the future. As a result, the demand for fluororesin alternatives that comply with PFAS regulations is expanding. We have recently developed a fluorine compound-free, non-stick, and stain-resistant silica-based coating that complies with the positive list system of the Food Sanitation Act.

• Chemicals

Power semiconductors that can operate in high-load environments are used in various fields such as industrial equipment, solar power generation, electric vehicles, communication devices, and energy conversion devices. In recent years, as high voltage and high current capabilities have advanced, there has been a growing need for packaging technologies with higher connection reliability. If the lead frame, which connects the semiconductor device and the circuit, experiences delamination at the interface of the substrate resin under thermal load, it can lead to short circuits or disconnections. Our company has newly developed an additive for plating granular copper that achieves high adhesion between the frame, coating, and mold resin.

• Chemicals

Glass, being an inorganic material, possesses both plasticity and robustness, and is also excellent in chemical durability and light resistance. Therefore, in recent years, it has been used as a sintering aid for ceramic and metal powders, as well as for sealing and encapsulating materials in electronic components such as capacitors, sensors, and resistors, making it an indispensable presence in electronic devices like smartphones and computers. Our company offers a variety of products tailored to the thermal expansion coefficient of the target object, working temperature, and usage environment, and provides comprehensive support from glass design, melting and grinding processing, to paste formulation and mass production.

• Chemicals

Our company has newly developed an antibacterial and virus removal coating agent called "TOP NOBAC LB," made from 100% food-grade raw materials, for paper tableware, food paper cases, and cardboard. It is composed of ε-polylysine, which is widely used as a food additive, and enzymes, making it a coating agent that is safe for ingestion. By applying it to the surfaces of pulp paper, inkjet paper, and synthetic paper using a roll coater, it is possible to create antibacterial and virus removal paper. In addition to suppressing bacterial growth, it can also remove non-enveloped viruses that are resistant to alcohol, and the antibacterial and virus removal effects last for a long time after coating (it does not eliminate all bacteria and viruses).

• Chemicals

We have developed a silica-based coating agent "Protector PW-S" that imparts excellent insulation and corrosion resistance to core materials (magnetic powders such as iron and ferrite) used in motors, inductors, and alternators. It is possible to form a thin film of 10 to 100 nm on magnetic powders sized 1 to 300 μm through a liquid-phase reaction. By adjusting the amount of the main agent, uniform control of film thickness can be achieved.

• Chemicals

Typically, aluminum anodizing treatment achieves a hard coating by lowering the temperature of the electrolyte, and it is utilized in applications where not only corrosion resistance but also wear resistance and strength are required, such as in automotive and aerospace components. On the other hand, obtaining a hard anodized coating requires high voltage, and the heat generated during the electrolysis must be continuously cooled. Therefore, there has been a challenge of needing a considerable amount of electrical energy compared to standard anodizing treatment. In response, our company has newly developed an environmentally friendly aluminum hard anodizing additive, "Top Hardener AL," which can achieve a hard anodized coating with a hardness of Hv400 or more and good heat crack resistance even at a bath temperature of 20°C. The treated coating has a low moisture content, and the reduction in coating shrinkage due to heat treatment results in high heat crack resistance above 200°C.

• Chemicals

Aluminum anodizing treatment forms a colorless and transparent oxide film that excels in corrosion resistance and wear resistance, making it useful in various fields such as automotive and aircraft parts, as well as construction materials. Additionally, by allowing dyes to penetrate and adsorb into the fine pores formed on the surface, aluminum can be colored to enhance its decorative, design, and aesthetic qualities. "TAC dye" is a water-soluble dye developed for coloring aluminum anodized films. Not only does it offer 35 basic colors, but it also allows for custom-made colors by combining several different hues. Furthermore, when selecting dyes, we consider mass production to choose colors and processes that are likely to maintain color stability during large-scale manufacturing.

• Chemicals

Many black inorganic pigments contain chromium oxide in terms of heat resistance, chemical resistance, and blackness. In recent years, hexavalent chromium, which poses an environmental burden, has become subject to regulation, and black inorganic pigments using trivalent chromium have been developed. However, there were concerns about the possibility of it converting to hexavalent chromium under certain usage conditions. Our company has newly developed a black pigment called "CFP-6010BK2" that does not contain chromium or cobalt, which is likely to be regulated. It achieves blackness, acid resistance, and hiding power comparable to chromium-containing pigments.

• Chemicals

Fluorine compound-free non-stick and anti-fouling coating agent Top Cerarelease IG-1, when applied by spray and subjected to heat treatment at 150°C, results in a transparent silica-based coating film. It not only provides non-stick properties, anti-fouling properties, and water and oil repellency equivalent to those of conventional fluorine coatings, but the resulting film also exhibits excellent corrosion resistance. It consists of three components: a main agent, a curing agent, and a non-stick agent, and since it does not contain fluorine compounds, it complies with PFAS regulations.

• Chemicals

In recent years, the demand for higher heat resistance temperatures has increased due to the miniaturization and high density of components, leading to a growing need for materials that can withstand high temperatures. Our silica-based thin film coating series "Protector," which imparts high insulation and high corrosion resistance, has a heat resistance of 200°C, and there has been a demand for further improvement in heat resistance. We have newly developed a silica-based thin film coating "Protector HB-HR1" with a heat resistance of 300°C. The coating, which also excels in bend resistance, enhances the corrosion resistance of metal materials.

• Chemicals

We offer the "Protector" series of silica-based thin film coatings that provide high insulation and high corrosion resistance, as well as the Protector BK series, which achieves a highly decorative black appearance. The pigment dispersants allow for clear color tinting while maintaining the texture of the base, enabling a rich variety of color combinations.

• Chemicals

Lightweight aluminum, which is easy to process, and magnesium, which is lightweight and has excellent specific strength, are used in various applications such as automobiles, medical devices, and building materials, and there is a demand for further improvement in corrosion resistance. Our company has newly developed the "Protector" series of silica-based thin film coatings that provide high insulation and high corrosion resistance to metal materials such as aluminum and magnesium. We offer two types: inorganic and organic-inorganic hybrid, each providing hardness levels of 5H and 3H, respectively. By adopting the sol-gel method, which allows for the application of inorganic oxides at low temperatures, it is possible to treat them with low-temperature curing (80°C and above).

• Chemicals

Image sensors that convert light into electrical signals and facilitate data transfer are utilized not only for imaging purposes in digital cameras and smartphones but also for distance measurement in ADAS (Advanced Driver Assistance Systems) and for sensing to ensure proper operation of industrial robots. The light-receiving part of the image sensor uses low-reflective black materials to prevent light scattering and eliminate stray light. Traditionally, when blackening aluminum materials, methods such as black chrome plating, black electroless nickel plating, and black dyeing of anodized aluminum have been employed; however, these methods have faced challenges related to environmental impact and difficulty in achieving corrosion resistance. In response, our company has newly developed a low-reflective process for aluminum, called the "Top Alcloy Process," which demonstrates a lower L value than conventional black anodizing and allows for direct application.

• Chemicals

Utilizing the know-how gained as a surface treatment and plating chemical manufacturer, we designed and developed the electroless plating equipment "TORYZA EL SYSTEM" for UBM formation in collaboration with equipment manufacturers. Along with the plating process "TORYZA EL PROCESS" for UBM formation on aluminum electrodes on wafers, we offer a comprehensive proposal for plating chemicals, surface treatment processes, and equipment for semiconductor back-end processes.

• Chemicals

UBM (Under Barrier Metal) employs electroless Ni/Au plating and electroless Ni/Pd/Au plating; however, conventional processes have faced challenges such as localized corrosion of aluminum electrodes, poor plating appearance, and adhesion issues. Additionally, in recent years, as power semiconductors have advanced towards higher voltage and higher current, there is an increasing demand for enhanced heat resistance in electroless plating films. In response, we have newly developed the "TORYZA EL PROCESS," a plating process for forming UBM on aluminum electrodes that suppresses film reduction and localized corrosion while exhibiting excellent uniform deposition, smoothness, and adhesion of electroless Ni plating. Along with the electroless plating equipment "TORYZA EL SYSTEM" for UBM formation, we offer a comprehensive proposal for plating chemicals, surface treatment processes, and equipment for semiconductor back-end processes.

• Chemicals

Electroless nickel plating, which has a uniform coating thickness, high dimensional accuracy, high hardness, and excellent corrosion resistance, has seen increasing demand in various fields in recent years. Generally, electroless nickel-phosphorus plating experiences a decrease in deposition rate due to the aging of the plating bath. Because changes in the deposition rate can lead to fluctuations in the phosphorus content of the plating film, the plating solution has been regularly updated and discarded. Our company has newly developed an environmentally friendly electroless nickel plating solution that maintains excellent bath stability, showing minimal decrease in deposition rate even after processing for over 10 turns, allowing for continuous use.

• Chemicals

Decorative chrome plating is widely used in automobiles, bicycles, motorcycles, and faucets due to its excellent corrosion and wear resistance. Decorative chrome plating using hexavalent chromium is subject to regulations such as the RoHS directive and wastewater regulations, and currently, trivalent chromium decorative chrome plating is becoming more common. However, conventional trivalent chromium plating tends to have a blackish tint on the coating, which poses challenges in appearance. Our company has newly developed a trivalent chromium plating solution that achieves a beautiful bluish-white appearance comparable to hexavalent chromium plating, with excellent uniform electrodeposition and adherence.

• Chemicals

Metallic and luxurious plastic plating is a surface treatment technology widely adopted to enhance the design of automobiles, motorcycles, home appliances, and interior products such as kitchen and bathroom items. Our company has newly developed the "Top Zechrom PLUS Process," a hexavalent chromium-free pretreatment process that does not use hexavalent chromium, which is restricted under REACH regulations, nor expensive palladium. The "Top Zechrom PLUS Process," a decorative plating process for plastics that does not use environmentally harmful substances, achieves high etching power and adhesion. By simultaneously performing etching and catalyst application, it significantly shortens the process compared to conventional methods.

• Chemicals

Currently, not only electric vehicles (EVs) and eEVs but also gasoline vehicles are equipped with various electronic devices such as car navigation systems, ETC systems, and drive recorders. These electronic devices can experience malfunctions or failures due to electromagnetic noise generated by various electrical products and electronic devices. Low-frequency electromagnetic waves, which are easily generated by motors, pose a challenge as they are difficult to shield with electromagnetic wave shielding materials like copper and aluminum. Our company has newly developed an electroplating additive that excels in bath stability and achieves a stable alloy ratio over a wide current density for use in shielding layers against low-frequency electromagnetic waves, as well as an electroless plating solution that provides a uniform film thickness with a stable coating composition.

• Chemicals

In recent years, SiC and GaN devices have garnered attention as next-generation power semiconductors (power modules) capable of high-temperature operation, with these next-generation power modules expected to operate continuously at temperatures above 200°C. Our company has developed a sulfur-free, low-phosphorus electroless nickel plating solution, "ICP Nicoron LPW-LFN," which minimizes nickel diffusion into solder even in high-temperature environments, thereby maintaining joint reliability. Additionally, sintering bonding using silver particle paste is gaining attention as a high-heat-resistant bonding method to replace traditional solder joints. We have newly developed an electroless silver plating solution, "Top Silver ACC / Top Silver AG," which helps suppress corrosion of the base metal and contributes to improved bonding strength.

• Chemicals

Okuno Pharmaceutical Industry will exhibit at "Chemical Material Japan 2024," which will be held at Tokyo Big Sight from November 21 (Thursday) to November 22 (Friday). We will showcase a variety of new products related to different industries from our three divisions: the UBM formation process for aluminum electrodes on wafers, glass materials for electronic devices, and 100% food-grade antibacterial and virus removal coatings. Additionally, we will introduce new technologies such as bio-template technology using microalgae with microcoils and coatings for food utensils that comply with the positive list system and are free of fluorinated compounds. We invite you to visit our booth C-11 in Hall 1 and 2 of the South Exhibition Hall at Tokyo Big Sight. *For more details, please download the PDF or feel free to contact us.

• Other surface treatment equipment

Fluorine compound-free non-stick and anti-fouling coating agent Top Cerarelease FG-1, when applied by spray and subjected to heat treatment at 150°C, results in a transparent silica-based coating film. It has non-stick properties equivalent to those of conventional fluorine coatings and also excels in oil resistance and corrosion resistance. Composed of three components: a main agent, a curing agent, and a non-stick agent, it does not contain fluorine compounds, making it compliant with PFAS regulations. It is a highly safe product that also meets the positive list system established for food contact materials and packaging.

• Chemicals

Fluorine compound-free non-stick and anti-fouling coating agent Top Cerarelease IG-1, when applied by spray and subjected to heat treatment at 150°C, results in a transparent silica-based coating film. It not only provides non-stick properties, anti-fouling properties, and water and oil repellency equivalent to those of conventional fluorine coatings, but the resulting film also exhibits excellent corrosion resistance. It consists of three components: a main agent, a curing agent, and a non-stick additive, and since it does not contain fluorine compounds, it complies with PFAS regulations.

• Chemicals

We have developed a new electroless copper plating process called "OPC FLET process" to meet the demands for fine wiring and contribute to the densification of semiconductor package substrates. In addition to the OPC FLET copper, which excels in uniform deposition within via holes, we have also developed a new electroless copper plating solution that achieves low film thickness and high reliability for through holes in printed circuit boards. We offer a range of products that can meet various customer needs.

• Chemicals

We have newly developed the "TORYZA EL PROCESS," an electroless plating process for forming UBM for power semiconductors that suppresses aluminum electrode delamination and localized corrosion, making it suitable for high-temperature applications. Additionally, leveraging the know-how gained as a surface treatment and plating chemical manufacturer, we have designed and developed the "TORYZA EL SYSTEM," an electroless plating equipment for UBM formation in collaboration with equipment manufacturers. We offer a comprehensive proposal that includes plating chemicals, surface treatment processes, and equipment.

• Chemicals

Okuno Pharmaceutical Industry has newly developed the "TORYZA LCN" series of copper sulfate plating additives, which are optimal for semiconductor wafer re-wiring and copper pillar formation. TORYZA LCN FRV is an electro-copper plating additive that excels in film thickness uniformity and is ideal for pattern formation in re-wiring. TORYZA LCN SP is an electro-copper plating additive that is optimal for forming copper posts and copper pillars on semiconductor wafers and package substrates. TORYZA LCN SV is best suited for micro bumps and trench filling for silicon interposers. TORYZA LCN SD is an electroplating additive for semiconductors that excels in the embedding of blind via holes and trenches. Okuno Pharmaceutical Industry offers numerous plating process proposals tailored to your needs for wafers.

• Chemicals

Okuno Pharmaceutical Industry will exhibit at the 7th Coating and Painting Equipment Exhibition (COATING JAPAN), which will be held at Makuhari Messe from October 29 (Tuesday) to October 31 (Thursday), 2024. We will propose silica-based coatings that impart various functions, including high corrosion resistance and electrical insulation, to aluminum and other metal materials, as well as glass materials for electronic components and treatment chemicals for aluminum. Additionally, we will introduce new technologies such as fluoropolymer alternative technologies, which are in growing demand, and antibacterial and virus removal coatings for the food industry. Please visit our booth at Makuhari Messe, Hall 2, 6-32. You can view an overview of our exhibited products below. *For more details, please download the PDF or contact us directly.

• Surface treatment contract service

Power semiconductors that can operate in high-load environments are used in various fields such as industrial equipment, solar power generation, electric vehicles, communication devices, and energy conversion equipment. In recent years, as high voltage and high current capabilities have advanced, there is a growing need for packaging technologies that offer higher connection reliability. If the lead frame, which connects the semiconductor device and circuit, experiences delamination at the interface of the substrate resin under thermal load, it can lead to short circuits or disconnections. Our company has newly developed an additive that forms a granular copper plating to achieve high adhesion between the frame, coating, and mold resin.

• Chemicals

In recent years, SiC and GaN devices have attracted attention as next-generation power semiconductors capable of high-temperature operation, and next-generation power modules equipped with these devices are expected to operate continuously at temperatures above 200°C. Therefore, coatings that have low nickel diffusion into solder even in high-temperature environments are in demand. Additionally, sintering bonding using silver particle paste is gaining attention as a high-heat-resistant bonding method to replace conventional solder joints, and silver plating is being sought to improve bonding strength. In response, our company has newly developed an electroless plating process for insulating circuit boards for power modules.

• Chemicals

As electronic devices become lighter, thinner, smaller, and more functional, there is a demand for finer patterns on semiconductor package substrates that incorporate semiconductor components. Our company has developed a new electroless nickel/gold plating process that supports fine patterns, reducing the occurrence of voids and pinholes while ensuring high connection reliability.

• Chemicals

Optical communication module components and package components are advancing in fine wiring, and the required pattern quality for electroless nickel plating is becoming increasingly demanding. Our company has newly developed an electroless nickel-boron plating process on metal ink paste for sintered substrates that excels in pattern quality compared to conventional methods.

• Chemicals

We have developed two new products, "Topluchina NSV ADV" and "Topluchina NSV LV," as plating additives for via filling with high current density fine patterns. Topluchina NSV ADV maintains excellent via filling performance while achieving high film thickness uniformity in fine wiring. Topluchina NSV LV is a copper sulfate plating additive compatible with fine patterns and large-diameter vias, enabling through-hole filling by plating copper inside the through holes.

• Chemicals

In recent years, with the miniaturization and high performance of electronic devices, semiconductor devices have also become more refined and functional. There is a growing demand for further miniaturization of wiring and reduction of via diameters in semiconductor package substrates that connect semiconductor devices to the main substrate. Okuno Pharmaceutical Industry has newly developed products to meet the demands for fine wiring. Highest via connection reliability: Electroless copper plating solution: OPC FLET Copper - Achieves crystal continuity at the bottom of the via - Conventional baths see a significant increase in resistance due to a decrease in the thickness of the electroless copper plating film OPC FLET Copper shows good conductivity even at low film thickness - Controls the plating deposition rate - The deposition rate becomes gradual over time, suppressing deposition on copper - Conventional baths tend to have excessive surface film thickness OPC FLET Copper achieves sufficient coverage at low film thickness - Excellent connection reliability for small-diameter vias

• Chemicals

Leveraging the know-how acquired as a surface treatment and plating chemicals manufacturer, we designed and developed the electroless plating system "TORYZA EL SYSTEM" for UBM formation in collaboration with equipment manufacturers. Along with the plating process "TORYZA EL PROCESS" for UBM formation on aluminum electrodes on wafers, we offer a comprehensive proposal for plating chemicals, surface treatment processes, and equipment for semiconductor back-end processes.

• Chemicals

UBM (Under Barrier Metal) employs processes such as electroless Ni/Au plating and electroless Ni/Pd/Au plating. However, conventional processes have faced challenges such as localized corrosion of aluminum electrodes, poor appearance of plating, and poor adhesion. Additionally, in recent years, as power semiconductors have progressed towards higher voltage and higher current, there has been a demand for further heat resistance in electroless plating films. In response, we have developed a new UBM formation plating process called "TORYZA EL PROCESS," which suppresses film reduction and localized corrosion of aluminum electrodes while providing excellent uniform deposition, smoothness, and adhesion of electroless Ni plating. Along with the electroless plating equipment for UBM formation, "TORYZA EL SYSTEM," we offer a comprehensive proposal for plating chemicals, surface treatment processes, and equipment for semiconductor back-end processes.

• Chemicals

As the functionality, performance, and miniaturization of semiconductors continue to evolve, new technologies related to three-dimensional integration of semiconductors are being developed one after another. Consequently, addressing the miniaturization of wiring (narrow pitch) and heat dissipation measures has become increasingly important. To meet various demands, our company has newly developed sulfuric acid copper plating chemicals, the TORYZA LCN series, for semiconductor wafer wiring.

• Chemicals

Okuno Pharmaceutical Industry will exhibit at the JPCA Show 2024, which will be held at Tokyo Big Sight (Tokyo International Exhibition Center) from June 12 (Wednesday) to June 14 (Friday), 2024. With the widespread use of electronic devices, printed circuit boards and semiconductor package substrates are rapidly evolving. We propose surface treatment chemicals and processes that contribute to their high performance and multifunctionality. We will also introduce other new technologies, such as high-reliability granular copper plating with high adhesion to encapsulation resins, lithium dendrite growth suppressants, and plating technologies using recycled materials. Please visit our booth at Tokyo Big Sight, East Hall 6, 6H-08. Only Okuno can do that. To listen to your voices and to be the key to opening up the future, we have continued our journey for 120 years. In the future, Okuno Pharmaceutical Industry will solve any issues related to surface treatment in the electronics field.

• Other surface treatment equipment

Okuno Pharmaceutical Industry will be exhibiting at 'SURTECH2024', which will be held at Tokyo Big Sight from January 31 (Wednesday) to February 2 (Friday), 2024. At the exhibition, we will introduce products and technologies themed around "semiconductors and electronics," "antibacterial plating," "high corrosion resistance," and "reduction of environmental impact"! 【Exhibition Information】 ■ Name: 'SURTECH2024 (Surface Technology Elements Exhibition)' ■ Venue: Tokyo Big Sight (Tokyo International Exhibition Center) East Hall ■ Booth Number: 3U-16 For an overview of the exhibited products, please see "Details about the exhibition" below. https://www.okuno.co.jp/news/20231225.html

• Other surface treatment equipment

■Exhibiting at SEMICON JAPAN 2023■ Okuno Pharmaceutical Industry will be exhibiting at SEMICON JAPAN 2023, which will be held at Tokyo Big Sight from December 13 (Wednesday) to December 15 (Friday), 2023. We will showcase a variety of new products, including plating technologies for wafers and semiconductor package substrates, as well as plating processes for power modules that contribute to device connection reliability. Please visit our booth at Tokyo Big Sight, East Hall 1, [1131]. Latest information about the exhibition and more can be found on our company website. Please check the related links. All of our employees look forward to your visit. *For more details, please download the PDF or contact us directly.

• Surface treatment contract service
• Other contract services

With the advancement of semiconductor performance and functionality, packaging technologies related to chiplets that implement multiple chips with different functions on a single substrate and three-dimensional integration are gaining attention. Among these, silicon interposers with wiring formed on silicon are attracting interest because they can miniaturize the length and width of the wiring, thereby enhancing the transmission capability of high-frequency signals. Our company has developed TORYZA LCN SV as an additive for silicon interposers that supports high aspect ratio filling. TORYZA LCN SV excels in embedability into TSVs, achieving void-free and low film thickness high aspect ratio filling.

• Chemicals

In recent years, semiconductor packaging technology has gained attention with FOWLP and FOPLP, which allow for an increase in the number of terminals relative to chip area by forming a redistribution layer on the wafer and expanding the terminals to the outside of the chip (Fan Out), in contrast to the conventional FC-BGA that is disadvantageous for thinness and cost reduction. Our company has developed a new copper sulfate plating additive for the formation of the redistribution layer in FOWLP and FOPLP. This product excels in film thickness uniformity and rectangularity of pattern shape, and it also accommodates filling of small-diameter vias. Additionally, to support the increase in the number of terminals on the chip side, the formation of ultra-fine wiring layers on the build-up layer of conventional FC-BGA is also being considered. This product is optimal for the formation of ultra-fine wiring in next-generation semiconductor package substrates.

• Chemicals

■JPCA Show 2023 / Exhibition of Semiconductor Packaging and Embedded Component Technologies■ Okuno Pharmaceutical Industry will be exhibiting at the Semiconductor Packaging Exhibition within JPCA Show 2023, which will be held at Tokyo Big Sight from May 31 (Wednesday) to June 2 (Friday), 2023. We will showcase a variety of new products, including plating technologies for wafers, package substrates, printed circuit boards, and FPCs, as well as plating processes for power modules and glass materials for electronic components. Please visit our booth at Tokyo Big Sight, East Hall 6, 6C-05. ■Introducing Products for Printed Circuit Boards / Semiconductor Package Substrates■ To help you learn more about us, we will introduce our products for printed circuit boards and semiconductor package substrates. If you have any questions regarding surface treatment, please feel free to contact us. *For more details, please download the PDF or contact us directly.*

• Surface treatment contract service
• Other contract services

SED (Solid Phase Electrodeposition) is a plating process developed by Toyota Motor Corporation that significantly reduces environmental impact. By forming a film like stamping through a solid electrolyte membrane, it allows plating only on the desired areas, greatly reducing the amount of plating solution used. When plating through a solid electrolyte with a typical nickel plating brightener, there was a challenge of very weak gloss and a tendency to cause appearance defects. Therefore, we developed an electric nickel plating solution that achieves a glossy appearance and excellent uniform electrodeposition. 【Top Sedona BN】 - Good leveling properties, providing a uniform coating even at high current densities - Excellent glossy appearance - Easy to use with original solution and one-component replenishment for simple bath maintenance and replenishment Please feel free to contact us for anything other than the above. We are available through the inquiry form below.

• Chemicals