ＴＳＳ List of Products and Services

The "Thick Copper Substrate" enables the realization of circuits with copper thicknesses up to 2000μm, making it possible to handle large currents. It is highly effective for miniaturizing devices with high loads. Additionally, due to its excellent thermal characteristics, it can also be used as a substrate that has a GND function while excelling in thermal diffusion. Furthermore, by stacking the conventional external bus bar as an inner layer circuit, EMI control becomes easier, reducing noise interference with peripheral devices. It frees you from three-dimensional wiring, reduces bus bar processing costs and assembly costs, and achieves space-saving. 【Features】 ■ Enables handling of large currents on printed circuit boards with thick copper patterns ■ Achieves a circuit thickness of 2000μm ■ Ideal for mounting power devices ■ Patent obtained *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• others

The "iron-based substrate" is an optimal substrate for preventing solder cracks in ceramic packages and other applications due to its low thermal expansion. Iron-based substrates with low thermal expansion can be manufactured. The metal part features an 8μ high thermal conductivity resin coating on both sides, significantly improving voltage resistance and rust prevention. We can accommodate everything from short lead-time prototypes to mass production, so please feel free to contact us. 【Features】 ■ Iron-based substrates with low thermal expansion can be manufactured ■ Insulation layer: Thermal conductivity 2W/mk ■ Base metal: Iron PCM (pre-coated metal) adopted ■ Ideal for preventing solder cracks in ceramic packages and other applications ■ Support from short lead-time prototypes to mass production *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• others

The "Mirror Surface Cavity Substrate" is a substrate that achieves sulfurization countermeasures and high reflectivity. It eliminates the need for silver plating, preventing the occurrence of reflectivity reduction due to sulfurization. Furthermore, the circuit improves bonding performance through gold plating, achieving a stable reflectivity of 95%. 【Features】 ■ Achieves sulfurization countermeasures and high reflectivity ■ No need for silver plating ■ No occurrence of reflectivity reduction due to sulfurization ■ Improved bonding performance through gold plating in the circuit ■ Stable reflectivity of 95% *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• others

A "metal substrate" is a printed circuit board that enhances thermal diffusion by utilizing the thermal conductivity of metal. Metal materials can be selected from aluminum or copper, and when using a copper core substrate, through-hole conduction with the copper core is also possible, allowing for applications such as ground and thermal conduction through-holes. As a common heat dissipation method, metal base substrates dissipate heat through the base metal on the back via heat sinks or enclosures, while metal core substrates can be mounted on the circuit side of the board or machined to expose the base metal, allowing contact with heat sinks or enclosures for heat dissipation. 【Features】 ■ Enhances thermal diffusion by utilizing the thermal conductivity of metal ■ Two types: metal base substrate and metal core substrate ■ Metal materials can be selected from aluminum or copper ■ Through-hole conduction with the copper core is possible when using a copper core substrate *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• others

The "Aluminum Heat Sink Substrate" is a substrate that layers a high thermal conductivity insulating layer and circuits onto extruded aluminum heat sink material. It features surface roughening effects and weather resistance due to anodizing treatment, securing more than five times the surface area compared to conventional products. By combining with high thermal conductivity resin, it offers heat dissipation specifications that far exceed those of conventional products. There is absolutely no thermal transport loss, unlike retrofitted heat sinks. It also enables cost reduction in assembly due to its integrated structure, leading to a decrease in total costs. 【Features】 ■ Significantly improved heat dissipation characteristics ■ No thermal transport loss ■ Increased design flexibility for fins ■ Increased design flexibility for enclosures ■ Reduction in assembly costs ■ No need for material procurement *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• others

The substrate is a high-current board that allows for the selection of circuit formation methods based on conductor thickness. If the conductor thickness is 300μm or more, half-etching can be accommodated. This method can reduce the top and bottom widths of the pattern compared to conventional etching methods, minimizing current loss relative to design values. 【Features】 ■ Selection of circuit formation methods based on conductor thickness ■ Half-etching can be accommodated with a conductor thickness of 300μm or more ■ Ability to reduce the top and bottom widths of the pattern ■ Minimal current loss relative to design values *For more details, please refer to the catalog or feel free to contact us.

• Printed Circuit Board

The substrate is a metal base substrate made of high heat-resistant and high thermal conductivity resin. It is mainly used for power device circuit substrates and high-brightness LED substrates. The substrate consists of copper foil with a thickness of 18μm to 800μm, an insulating layer, and a base metal. 【Features】 ■ Uses high heat-resistant and high thermal conductivity resin ■ Suitable for power devices *For more details, please refer to the catalog or feel free to contact us.

• Printed Circuit Board

There are two types of printed circuit boards that enhance heat dissipation and heat resistance: a metal base substrate with circuits formed on a metal plate, and a metal core substrate with a metal plate sandwiched inside the substrate. The metal materials can be selected from aluminum, copper, and others.

• Printed Circuit Board

Innovation and commercialization support through close collaboration with various research institutions 【Features】 ○ We contribute to societal development through various engagements, including the embodiment of research theories, development of research equipment, application to social needs, development of dedicated production facilities, and promotion of commercialization. ○ Our field is not limited to electronics; we are also practicing technological integration with the medical field, represented by "biochips," and are engaged in research and development across different fields. ● Similar initiatives can be considered for inter-company collaboration, so please feel free to consult with us first. (We will discuss the details under a mutual non-disclosure agreement.)

• Development support tools (ICE, emulators, debuggers, etc.)
• Contract measurement

Quickly respond to the realization of the idea "It would be great to have such a circuit board!" We support everything from the development of specialized circuit boards for specific applications to mass production. 【Features】 ○ Our manufacturing line specializes in small quantities and short lead times for prototypes, with an independent structure for each process, allowing us to handle circuit boards that require unique processes within the usual process management flow, and we can also accommodate short lead times. ○ We have a proven track record of realizing ideas, with many projects being close to handmade. The primary focus is on "production costs and production systems," and TSS has been dedicated to developing its material sales division for this purpose. ○ By seamlessly automating production technology and know-how, we can reduce manufacturing costs and establish a production system. ○ We can accommodate various business plans, from establishing a dual purchasing system to building your own manufacturing line. ● To quickly release products using special circuit boards, please consult us from the early stages of planning. This will allow us to support you with early project proposals, from achieving target prices to enhancing added value, with the assistance of our team of first-class sales and manufacturing specialists in printed circuit boards.

• Development support tools (ICE, emulators, debuggers, etc.)
• Printed Circuit Board

【Features】 The glass substrate not only has excellent transparency but also exhibits minimal warping and dimensional changes, resulting in superior flatness. It has high stability in material coefficients such as dielectric constant, excellent chemical resistance and heat dissipation, and is a cost-effective and easy-to-handle product that offers high precision and performance compared to ceramic substrates. Additionally, by using thin-film metal formation technology for circuit formation, not only the substrate but also the circuit itself achieves high smoothness, making it optimal for high-frequency signal transmission. For these reasons, our company believes that glass substrates are the leading candidates for next-generation high-performance substrates. 〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓 For more details, please refer to "Contact Us" and "Catalog Download." 〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓

• Printed Circuit Board

Providing detailed support to meet customer needs: 'Research and Development Manufacturing Support' 【Features】 ○ In the research and development department, we handle not only electronic-related technologies but also research and development in fields such as chemistry and biology, with the motto of 'manufacturing that is not confined to electronic circuits,' strongly supporting manufacturing across various fields. ○ Through a network of companies with outstanding technologies in various fields, we turn customer ideas into reality. ○ We flexibly respond not only to mass production of completed prototypes but also to the development of mass production equipment necessary for client companies to conduct their own production, as well as the transfer of production technology to other companies for dual sourcing. ○ In addition to utilizing accumulated know-how and technological seeds, we support manufacturing with shortened development periods and high barriers to entry for other companies by collaborating with universities and research institutions and leveraging technological seeds. ○ Please make use of the TSS Group, which broadly handles everything from basic research to commercialization, as a bridge to overcome the 'gap between needs and seeds' that exists between companies and research institutions in industry-academia-government collaboration. ● If you have any issues, please feel free to consult with us.

• Development support tools (ICE, emulators, debuggers, etc.)
• Printed Circuit Board

By utilizing our accumulated know-how, we support the shortening of research and development periods and the creation of added value. 【Features】 ○ If the challenges you are facing are related to different fields or if you are considering creating added value through the fusion of different fields, please consult with TSS. ○ As the restructuring of businesses in the industrial sector progresses, efforts are being made to balance the review of research and development systems with early releases, including the outsourcing of parts of research and development. ○ By leveraging the know-how that TSS possesses, customers can achieve their goals in a shorter time frame than starting from scratch. ○ We have a track record in various fields such as thin-film displays, electronic paper, automotive devices, transportation vehicles, robots, artificial satellites, and military equipment. ○ TSS Group, which handles a wide range from basic research to commercialization, offers many unique proposals, and we have multiple achievements that have led to joint patent applications. ○ We can also propose solutions utilizing connections with cooperative research institutions and partner companies with excellent technologies, supporting the establishment of a flexible research and development system focused on results, without being constrained by TSS technology. (Details will be discussed under mutual non-disclosure agreements.)

• Development support tools (ICE, emulators, debuggers, etc.)
• Contract measurement

By machining the substrate to expose the metal core and directly mounting heat dissipation components such as heat sinks, it is possible to efficiently release the heat from components that operate at high temperatures to the outside.

• Printed Circuit Board

We support electronic device development with unique manufacturing services specific to the TSS Group. [Features] - Pattern design of printed circuit boards considering manufacturing technology - Mass production support through overseas production routes - Support for mass production at designated factories - Flexible responses tailored to needs - In addition to design and circuit board manufacturing, pattern design that considers productivity as a synergistic effect - Procurement of electronic components as part of material sales - Selection of electronic components considering procurement efficiency - Enhancement of product value by utilizing research and development know-how and special substrate technology - Cost reduction methods that are not bound by general concepts - Proposals for special configuration boards based on needs rather than standard circuit boards - In the first process of [concept design], discussions are conducted by members well-versed in each process and technology, reducing inter-process feedback after project start and incorporating functions to prevent defects and delays. For more details, please contact us.

• Development support tools (ICE, emulators, debuggers, etc.)
• Printed Circuit Board

【Features】 This is a light-emitting display substrate directly formed with inorganic EL elements (Electro Luminescence) on a substrate. The thickness of the display section is formed to be less than 0.1mm, achieving an ultra-thin design by making the printed circuit board thinner. While the brightness is not particularly high, it allows for soft lighting information in dark places. It can convey various messages without disrupting the mood in places like movie theaters and bars. 【Applications】 ● Blinking animations ● Mood clocks ● Dot matrix displays ● 7-segment displays 〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓 For more details, please refer to "Contact Us" and "Catalog Download." 〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓

• Printed Circuit Board

The thickness, height, pitch, and shape of the fins can be ordered freely. Additionally, depending on the specifications of the parts, the type of insulation layer can be selected. 1.8W: 3W: 6.5W: 12W → Please select from four types. (FR-5 is also possible.) Both sides of the circuit section can be multilayered and support high current. (It is also possible to combine with high current boards using our patented method.) We also support mass production and component mounting.

• Printed Circuit Board

Insulreed is applied to the base metal plate during the bath to form an electroplated coating, creating an insulation layer. The 20μ thick Insulreed insulation layer has an insulation performance of over 5kV and is the highest specification resin layer for thin film high insulation. On top of the insulation layer, circuits can be low-temperature fired with a highly conductive paste, allowing all processes to be completed through printing. Since it does not require treatment with strong acids or strong alkalis involved in substrate manufacturing, it is possible to directly print circuits onto die-cast molded products or heat sinks exceeding 200mm in height as an integrated heat dissipation substrate. As everything is manufactured using printing methods, it is also an eco-friendly substrate that is gentle on the environment.

• Printed Circuit Board

Curved lighting substrates, LED lighting, and light source substrates that match the casing and design are optimal. It is possible to bend a single substrate to fit the curves of automotive and scooter turn signals and tail lamps. The basic specifications as a heat dissipation substrate are equivalent to those of standard aluminum substrates, with the added performance of being bendable, making it the latest metal substrate.

• Printed Circuit Board