TECHNICAL INFOMATION INSTITUTE CO.,LTD Product Lineup

Book Title: Control and Measurement/Monitoring of Semiconductor Plasma Process Technology －－－－－－－－－－－－－－－－－－－－－ ◎ How to achieve optimization of film deposition and etching processes? ◎ Detailed explanation of technologies that visualize plasma and connect to the control of electrons and ions! ◎ Thorough explanation of high-precision process technologies for discharge and reactive plasma! －－－－－－－－－－－－－－－－－－－－－ ■ This book contains the following information: - Techniques for controlling electron density, electron temperature, power control, and gas supply points for discharge plasma and reactive plasma. - Systematization of gas characteristics, exhaust system design technology, measurement technology, and troubleshooting for designing vacuum environments. - Measurement techniques for plasma states using optical emission spectroscopy, quadrupole mass spectrometry, and probe methods. - Measurement of active particle counts, abnormal discharge detection, ion energy distribution, measurement of ion species in plasma, and radical measurement and monitoring technologies. - Low-damage, low-temperature, high-speed film deposition technologies for plasma CVD and ALD processes, control of film density and thickness, and improvement of adhesion. - Film thickness control technologies for sputtering deposition, and control of thin film composition, crystallinity, electrical properties, and mechanical properties.

Book Title: Process Design and Scale-Up through Chemical Engineering Calculations －－－－－－－－－－－－－－－－－－－－－ ★ No reliance on experience or intuition! Aiming for fast and accurate 'Equipment Design' and 'Operating Condition Setting' based on calculation results! ★ Covers necessary physical property values, important relationships, modeling, and the latest examples of AI utilization! －－－－－－－－－－－－－－－－－－－－－ ■ Key Points of this Book - Calculation of required power for stirring and mass transfer - Construction of reaction rate equations and calculation of effective catalyst coefficients - Calculation of tower diameter, cross-sectional area, and flooding limits for packed columns - Calculation of tower diameter, height, and pressure loss for absorption columns - Calculation of nucleation and crystal growth rates in crystallization - Calculation of filtrate volume and average filtration resistance in solid-liquid separation - Modeling of drying processes and calculation of drying rates - Simulation of powder grinding, mixing, and shaping

Book Title: Development of Agents for Removal, Prevention, and Inhibition of Biofilm Formation ---------------------------- ■ Key Points of This Book ◆ Implementation and Evaluation of Antibiofilm Testing and Screening Methods - Antibiofilm testing method according to ISO 4768 - Inhibition tests for biofilm formation related to environmental contamination ◆ Development of Antibiofilm Agents from Prevention of Bacterial Adhesion and Inhibition of Biofilm Formation - Materials and surface functional substances that hinder microbial adhesion - Technologies for dealing with adhering microorganisms - Compounds, substances, and components that have biofilm formation inhibition effects? ◆ Control, Removal, and Prevention Measures for Biofilms Occurring in Factories, Machinery, and Piping - Implementation methods of CIP in pharmaceutical manufacturing lines and antibiofilm measures - Biofilms within machinery and their removal/control - Equipment cleaning and biofilm removal in food factories ◆ What agents are currently in use? What are promising removal methods besides agents? - Far ultraviolet irradiation, ultrasound, fine bubbles, electrical effects, photocatalytic materials like titanium, gas pressure, ionic liquids

Book Title: Development of Polymer Materials through Materials Informatics －－－－－－－－－－－－－－－－－－－－－ ■ Key Points of This Book ● Selection of Descriptors and Features! Towards Ensuring Data Quantity and Quality! - Collection of successful and unsuccessful data - Organizing data from internal and external sources such as experimental data, commercial products, and literature information - Preprocessing of noisy image data - Integration of numerical data and language data - Unit conversion, organization of measurement conditions, and documentation by experimenters - Supplementing training data with virtual data - Utilizing transfer learning and enhancing data with limited samples - Points for strengthening and expanding descriptors ● Improving Prediction Accuracy of Learning Models! - Balancing interpretability and reliability - Measures to counteract reduced interpretability due to large data volumes - Optimizing ambiguous variables through dimensionality reduction - Preprocessing explanatory variables and selecting models - Tips for incorporating scale differences into models - Ensuring reproducible data - Building multimodal AI that handles different data types such as molecules, images, and spectra - Adjusting target variables through innovative experimental and evaluation methods ● Ensuring Contradictory Physical Properties through MI, with an Eye on Scale-Up for Material Development! - Securing desired physical properties through inverse analysis

◎What are the key points for integrating materials with different thermal expansion coefficients and elastic moduli? ◎A comprehensive overview of thermal stress countermeasures required in high thermal density environments and composite packaging. －－－－－－－－－－－－－－－－－－－－－ ■Key Points of This Book ◆Design for reduced warping and low thermal expansion of materials ◆Surface treatment and dispersion technology for fillers ◆Reduction of thermal stress using negative thermal expansion materials ◆Evaluation and simulation techniques

Book Title: Development Trends and Reliability Evaluation of Joining Technologies and Materials for Semiconductor Devices －－－－－－－－－－－－－－－－－－－－－ ◎ 3D semiconductors, chiplet integration, SiC power semiconductors, automotive electronic components, microLEDs, etc. This book includes case studies and verification results of new materials and processes aimed at the development of advanced semiconductors! －－－－－－－－－－－－－－－－－－－－－ ■ Key Points of This Book ◎ Joining technologies for miniaturization and heterogeneous integration of advanced semiconductor packages - Application examples of surface-activated bonding in semiconductor device development - Recent development trends and challenges to be addressed in hybrid bonding technology - Surface activation for hybrid bonding and its experimental results - Effectiveness and potential of Cu pillar bonding technology using Ag diffusion bonding - Development of Au-coated Ag bonding wires for the transition to Au-free wire bonding - Principles and mechanisms of ultrasonic bonding and application examples in semiconductor packaging ◎ Joining materials and processes for next-generation power semiconductors to support high-temperature operation - Development of Cu sintering paste and its reliability evaluation - Examination of bonding processes considering the oxidation susceptibility of Cu - Development of new Cu-based solder materials for insulating heat dissipation substrates for power modules