八千代マイクロサイエンス Product Lineup

We would like to introduce our "Epoxy Pads." These pads are suitable for precision polishing of glass products such as optical glass and LCD glass, surface polishing of metals like stainless steel, plastics, quartz, and mirror polishing of semiconductor wafers made from silicon and germanium. Additionally, their excellent pad wettability retains slurry, enhancing polishing efficiency, and thorough quality control leads to stable and consistent quality, improving the yield rate. 【Features】 ■ Standard Sizes - Epoxy Pad (mm): □460×460, Φ900, Φ1200 - Epoxy Urethane Pad (mm): □460×460, Φ900 ■ Thickness: Standard thickness (mm): 0.5, 0.8, 1.25, 1.5 ■ Secondary Processing: Also supports tape processing and groove processing *For more details, please feel free to contact us at the information below. 【Contact Information】 Yachiyo Micro Science Co., Ltd. Grinding and Polishing Division, Sales Department TEL: 03-3256-6011 (Tokyo) / 06-6948-6671 (Osaka) E-mail: contact@ymi.co.jp

"Belatrix" is a polishing pad (PAD) designed for ultra-precision polishing processes. To meet the diverse needs of our customers, we offer more than 20 types of suede pads, and we can also provide additional options such as groove processing. If you have any concerns regarding polishing, please feel free to consult us. We will propose suitable solutions tailored to your requirements. [Features] ■ Designed for ultra-precision polishing ■ A lineup of over 20 types of suede pads ■ Additional options such as groove processing are also available *For more details, please refer to the related links or feel free to contact us.

The effects obtained by incorporating "groove processing (pitch)" into the grinding pad are as follows: - It allows the grinding slurry to reach the inner circumference of the grinding machine, achieving uniform grinding. - It leads to an improvement in the grinding rate. - The discharge of grinding debris (such as sludge) becomes smoother. - By changing the pitch width on the upper and lower plates, it reduces the phenomenon of substrate and workpiece adhesion. Regarding the groove specifications, you can specify the groove width, pitch width, depth, and type (concave, U-shaped) according to your preferences. *The basic groove type is "grid grooves," but other embossing processes can be discussed. Additionally, "grit hole drilling" is also possible upon request. This can help with cumbersome tasks on-site and contribute to safety management. *For more details, please feel free to contact us.

In every era, it is natural that the future cannot be predicted, but I have tried to imagine, even just a little, the future of "precision polishing pads." In the first place, "precision polishing pads" play an essential role in advanced industries such as semiconductor manufacturing and LCD production. In this industry, high precision and uniformity are always required, making the evolution of "precision polishing pads" an important challenge. Let’s delve deeper into this world and consider the future possibilities of "precision polishing pads"! *For more details on the column, you can view it through the related links. Please feel free to contact us for more information.*

The polishing pads used in the first grinding process are mainly polyurethane pads, commonly known as urethane pads. However, there are cases where non-woven fabric polishing pads (hereinafter referred to as non-woven pads) are used separately. Non-woven pads refer to polishing cloths made by binding short fibers, known as non-woven fabric, with resin, and they are generally available in white. Since non-woven pads are not made solely of resin, they tend to have a lower grinding rate compared to urethane pads, but they have advantages in terms of surface accuracy and ease of handling. *For more details on the column, please refer to the related links. If you have any questions, feel free to contact us.*

What kind of double-sided tape is good for precision grinding pads? Precision grinding pads are used by adhering them to a grinding plate with double-sided tape. If they are not applied neatly, it can lead to unevenness or contamination. Since we are working in the realm of micrometers and nanometers, the application is very important. What is necessary for this application is double-sided tape. Even if the application is done perfectly, if there is an issue with the double-sided tape, the pad may peel off or shift during grinding. This can lead to a decrease in precision and an increased risk of crashing. *For more details, you can view the related links. Please feel free to contact us for more information.*

"Bellatrix" is a polishing pad designed for ultra-precision polishing processes for silicon wafers, semiconductor materials, hard disks, glass, and more. We offer a wide range of products categorized by type to achieve the ultra-precision finishing surfaces that our customers pursue. We have "N0271," which features a special hardening treatment on a hard non-woven fabric, and "N7512," which forms a soft NAP layer on a soft base, creating an excellent finishing surface in conjunction with fine abrasives. 【Product Lineup】 ■N0271: Pad for stock removal ■K0013: Pad for stock removal ■N7512: Pad for final polishing ■K0034: Pad for final polishing ■NP385: Pad for final polishing *For more details, please refer to the PDF document or feel free to contact us.

Do you have any concerns about yield, work efficiency, safety, etc., that put you between a rock and a hard place...? The "Pad Dresser" is a dedicated carrier used to dress and correct the surfaces of various grinding pads used in double-sided grinders and other equipment. It is shipped in a ready-to-use state, with diamond abrasives protruding. It is compatible with various grinding pads made of urethane, suede, non-woven fabric, and more. Additionally, by using resin as the main material, it achieves lightweight handling compared to conventional products like cast iron carriers. 【Features】 ■ High dressing effect immediately after introduction ■ Sample lending and trial available ■ Compatible with sizes 5B, 9B, 16B, 22B ■ Mesh lineup: #200 to #1000 *For more details, please refer to the PDF document or feel free to contact us.

The polishing pads we propose are used for various materials, including ceramics and glass (for HDDs, LCDs, and optical lenses), as well as compounds and silicon, meeting our customers' needs. The non-woven fabric pads suggested for ceramic polishing are produced in factories that are strictly managed through a rigorous quality control process, ensuring stable quality. We offer three types of non-woven fabric bases (soft, medium, and hard) along with various types. For customers considering non-woven fabric for the first time, we recommend starting with the medium type. 【Non-Woven Fabric Type Lineup】 ■ Soft ■ Medium ■ Hard *For more details, please feel free to contact us.

Would you like to try groove processing on suede pads? I believe suede pads are typically used in the final stages of polishing. Therefore, the finish of the polished surface is important, but depending on the workpiece, there may be differences between the upper and lower polished surfaces. While this is not always the case, there may be instances where the polishing liquid does not fully drain on the lower side. By performing groove processing on the lower pad, the polishing liquid can be evenly distributed. Additionally, if the workpiece is thin and light, there can be a phenomenon where it sticks to the upper side. This can be mitigated by performing groove processing on the upper pad. We offer groove shapes in addition to the standard rectangular shape, including U-shaped grooves. By making the edges of the grooves obtuse, we can reduce surface defects, and since the flow rate of the polishing liquid increases, uniform polishing can be achieved, resulting in improved precision. 【Features】 ■ Groove shapes: rectangular, U-shaped ■ Reduces surface defects ■ Improves precision *For more details, please feel free to contact us.

"BELLATRIX NP385" is a pad that forms a super hard NAP layer on a PET base. By minimizing the aperture diameter to the extreme within a controllable range, we improve waviness. We also accommodate requests for processing in your desired size, double-sided tape processing, groove processing, and abrasive particle hole processing. Please feel free to contact us when you need our services. 【Lineup】 ■N0178 ■NP515 ■NP178 ■NP385 *For more details, please feel free to contact us.

This product is a polishing pad for final polishing manufactured by FILWEL Co., Ltd. (formerly Kanebo). By combining fine cerium oxide abrasives and colloidal silica, it achieves a high-quality surface with fewer defects. Currently, there are a total of four varieties in the series, with "Asker-C hardness" reaching level "53." This product reliably reduces the "surface defect count," which is considered unacceptable in the masking world. 【Lineup】 ■N7512 ■N0012 ■N0092 ■N0192 *For more details, please feel free to contact us.

The surface of the suede pads we handle, including the pads, used for finishing polishing feels really smooth when you run your hand over it. Basically, suede pads for precision polishing have been developed based on synthetic leather used in bags, shoes, car seats, etc. The manufacturing method involves shaving the surface of the synthetic leather to create a suede-like texture, but when you magnify the surface, you can see countless tiny holes measuring several tens of microns, which contribute to the smooth feel. 【Features】 - Made by shaving the surface of synthetic leather to create a suede-like texture - When magnified, the surface has countless tiny holes measuring several tens of microns - The shape of the holes in the pad's structure is triangular - If the amount of surface cutting is small, small holes are created; if it is large, larger holes are formed *For more details, please feel free to contact us.

The suede pads we offer come in two types: non-woven fabric base and PET base. The non-woven fabric base pads have cushioning properties in the base itself, resulting in less damage to the workpiece, good conformity to the shape of the workpiece, and the ability to effectively polish the entire workpiece. Additionally, the PET base pads are very precise due to the quality of the PET itself, making them effective for polishing that requires flatness. 【Features】 <Non-woven Fabric Base Pads> ■ The base itself has cushioning properties ■ Good conformity to the shape of the workpiece ■ Can effectively polish the entire workpiece <PET Base Pads> ■ Very high precision of the PET itself ■ Effective for polishing that requires flatness *For more details, please feel free to contact us.

The size of the grinding pads ranges from 1000 to 1400 mm in width and up to around 2000 mm in length, and they are shipped with double-sided tape attached. For medium-sized grinders, it is possible to use a single pad, while for large grinders, sizes exceeding 1800 mm in diameter require the pads to be joined together. Additionally, the upper side must have more than 30 abrasive holes processed. Our company can also perform processing like the one shown in the image, so please feel free to consult us. 【Features】 ■ The size of the grinding pads is 1000 to 1400 mm in width and up to around 2000 mm in length ■ Shipped with double-sided tape attached ■ Medium-sized grinders can use a single pad ■ Large grinders require the pads to be joined together ■ The upper side requires processing of abrasive holes *For more details, please feel free to contact us.

The occurrence of crashes due to pads peeling off or misaligning during polishing not only leads to damage to the substrate and the need for pad replacement but also requires cleaning of the polishing machine and removal of debris, resulting in a significant decrease in work efficiency. This issue can be resolved by using strong adhesive tape; however, a disadvantage is that it can be difficult to remove the pads. Therefore, the choice of double-sided tape may vary depending on the customer's objectives, applications, and priorities. At FILWEL, we mainly offer tapes from three manufacturers. We can also prepare options beyond these three types according to the customer's needs, so please feel free to consult with us. *For more details, please do not hesitate to contact us.*

In flat grinding, it may be common to perform maintenance on the PAD using a dresser, but surprisingly few places actually measure and manage the values. Due to the characteristics of grinding, there is a tendency for the central area of the reference plate to become more concave, but simply making corrections at regular intervals and for the same amount of time does not truly indicate whether proper maintenance is being performed. By using a straight gauge, it becomes possible to manage the numerical values of the overall shape, making production management very efficient. 【Precision Management Method】 ■1. Establish the reference for the straight gauge (dial gauge) ■2. Measure the reference plate (When measuring the reference plate, use a base set if measuring soft materials) *For more details, please feel free to contact us.

Do you know the suitable particle size for dressers for urethane pads? The way the dresser finishes the PAD surface is crucial for improving quality and yield. In practice, incorporating multiple processes solely into the dresser can be inefficient on the manufacturing floor, leading to increased labor and costs. Therefore, we introduce dressers by selecting a "best of both worlds" particle size. The suitable particle size varies depending on the processing environment, so please feel free to consult us about the appropriate dresser and particle size for your current processing environment. 【Purpose of the dresser】 ■ Elimination of clogging and flattening ■ Accuracy correction ■ Smoothing the PAD surface, etc. *For more details, please feel free to contact us.

When polishing with polyurethane pads using cerium oxide and other materials, it is inevitable that abrasives remain in gaps and holes. The efficiency of the next operation greatly depends on how well the abrasives are removed during the cleaning at the end of the day's work. However, doing this manually can lead to uneven cleaning, and if this accumulates, it poses a risk of shortening the lifespan of the polishing pads. Therefore, we recommend using a brush carrier. Please feel free to inquire whether it can be adapted to your work environment for improved quality and working conditions. 【Benefits of the Brush Carrier】 ■ Other tasks can be performed while cleaning the brush ■ Reduced likelihood of rate decline due to pad clogging ■ Polishing quality has stabilized, leading to improved yield *For more details, please feel free to contact us.

The basics of polishing emphasize the importance of precision management of the polishing pad, and a commonly used tool for maintaining that precision is the DP-equipped correction carrier. Using a correction carrier not only allows for precision adjustments but also plays a crucial role in cleaning the pad. However, depending on the situation, there are significant and dangerous disadvantages when it comes to polishing. 1. Rust 2. Slow polishing speed on the upper side 3. Requires two people for setup (or needs to be set up with a machine) Among these three, the common factor related to "different polishing speeds on the upper and lower sides" and "setup issues" is "weight." When considering setup, it’s easy to imagine that a lighter weight can lead to improved workability and safety, even with larger equipment. On the other hand, what is the relationship between the polishing speeds of the upper and lower sides and weight? Polishing conditions are set in grams. Therefore, the weight of the correction carrier can negatively impact dressing and truing. The heavier the carrier, the greater the pressure applied to the lower side, leading to changes in the surface condition of the upper and lower pads. It is undoubtedly better for the correction carrier to be lighter in order to maintain as similar a condition as possible. Would you like to try an ultra-lightweight correction carrier for free to counteract such disadvantages?

Q: What are the raw materials for the correction carrier? A: The material of the carrier is resin. Typical correction carriers use cast iron, so ultra-lightweight versions cannot be made with the same specifications. Q: Are there any specified machine manufacturers for using the correction carrier? A: There are no specified manufacturers. It can be created to match your equipment. Q: What kind of information (drawings, etc.) is needed for production? A: We are confirming the carrier gear information and the size of the base plate. We will provide additional materials regarding the necessary information. Q: How long does it take from order to delivery? A: It takes about 2 months from the order. Q: Do you have specific improvement data? A: The dressing time has been reduced from 2 hours to 10-30 minutes. Improvement of workpiece edge drooping. There are also improvements in the polishing rate after dressing. Q: How much does it cost? Is there a price list? A: The price varies depending on size and specifications, so please contact us first. Q: Can I try it out? A: If our existing patterns are available, we can lend them out for up to 1 month.

In double-sided lapping and polishing processes, if the shape of the reference plate or polishing pad deteriorates, it can lead to scratches on the workpiece, worsened flatness, and decreased processing rates. The linked article measures a significantly deformed reference plate using a straight gauge and examines how the shape changes with dressing by a correction carrier. It also discusses the differences based on correction conditions and points to consider when applying high loads in a state of poor reference plate accuracy. This is recommended for those who want to confirm the effectiveness of reference plate correction and the importance of management before deterioration occurs. 【Features】 ■ Introduces the correction effects of double-sided lapping and polishing reference plates ■ Provides examples of measuring reference plate shapes with a straight gauge ■ Confirms dressing results using a correction carrier ■ Helps identify causes of scratches, worsened flatness, and decreased rates ■ Useful content for managing before significant shape deterioration occurs *For more details, please refer to the related links or feel free to contact us.

In double-sided lapping and polishing processes, as the machining continues, the reference plate and polishing pad wear down, leading to changes in their shapes. The amount of wear varies due to factors such as workpiece placement, load, and variations in rotation direction and speed, which can result in deformations such as convex shapes, concave shapes, hull shapes, and seagull shapes. If shape changes are left unaddressed, they can lead to scratches, deterioration of parallelism, decreased processing rates, and worsened yield. The linked article explains the causes of shape degradation in reference plates and polishing pads, as well as the concepts of reference plate management for stable polishing processes. 【Features】 ■ Explanation of the causes of shape degradation in reference plates and polishing pads ■ Measures against scratches in double-sided lapping and polishing processes ■ Identification of causes for deterioration of parallelism, decreased rates, and worsened yield ■ Organization of convex shapes, concave shapes, hull shapes, and seagull shapes ■ Basic knowledge before considering reference plate measurement and correction *For more details, please refer to the related links or feel free to contact us.

When issues such as scratches, deterioration of parallelism, and decreased processing rates occur due to double-sided lapping and polishing, it is important to check not only the processing conditions but also the accuracy of the reference plate. The reference plate measurement straight gauge is a measuring tool that allows you to check the shape simply by placing it on the reference plate. The long type is suitable for understanding the shape of the entire reference plate, while the short type is ideal for grasping the shape of the band width, which is more likely to affect the finish of the workpiece. By confirming the shape of the reference plate numerically, it helps determine whether adjustments can be made based on carrier conditions or if truing is necessary. 【Features】 ■ Supports accuracy verification of double-sided lapping and polishing reference plates ■ Assists in identifying the causes of scratches, deterioration of parallelism, and rate reduction ■ Understands the shape of the entire reference plate with the long type ■ Checks the band width shape and the fit of the upper and lower reference plates with the short type ■ Custom design and manufacturing are possible to match the machine used and the size of the reference plate *For more details, please refer to the related links or feel free to contact us.

In double-sided lapping and polishing processes, if there are issues such as decreased processing rates, workpiece scratches, or worsening parallelism, it is important to check not only the processing conditions and consumables but also the accuracy of the reference plate. The reference plate and polishing pads can wear and experience uneven wear due to repeated processing, which may affect the contact with the workpiece and the alignment with the upper and lower reference plates. The linked article explains the impact of reference plate accuracy on processing quality and the importance of checking the condition of the reference plate with a straight gauge. This is recommended for those who want to manage reference plate accuracy on a daily basis and identify the causes of processing defects. 【Features】 ■ For managing the accuracy of reference plates in double-sided lapping and polishing ■ To identify the causes of scratches, rate reduction, and worsening parallelism ■ Explains how to assess the condition of the reference plate using a straight gauge ■ For addressing contact defects and uneven wear when changing workpiece sizes ■ Basic knowledge before considering reference plate measurement and correction *For more details, please refer to the related link or feel free to contact us.

The polishing marks and rate decrease on lap plates and polish plates may be caused by deformation of the reference plate. The "straight gauge" enables the estimation of the overall wear trend and shape changes of the reference plate, supporting the consideration of optimal correction methods and stabilization of processing quality. 【Features】 ■ Supports the estimation of the overall shape of the reference plate: Contributes to visualizing not only partial wear but also the overall deformation trend. ■ Custom-made to fit your equipment: Individually designed and manufactured from the drawing stage to match the size of your reference plate. ■ Proven results in large sizes: Measurement results available for large lap plates and polish plates, including 24B size. ■ Serves as a basis for optimal correction considerations: By accurately understanding the condition of the reference plate, it facilitates the selection of efficient surface correction and fitting methods. ■ Contributes to stabilization of processing quality: Measures and maintenance against processing defects caused by deformation of the reference plate. *Please feel free to contact us for inquiries regarding specifications or sizes. *For more details, please refer to the related links or feel free to contact us.

Is there a case where the surface roughness does not improve with final polishing of quartz glass? If there is no improvement even after changing the slurry or conditions, the polishing pad may be affecting the results. Velatrix is a suede pad developed for quartz and glass applications. We provide materials that introduce our lineup and product configurations for various applications. Main Applications: Quartz glass Synthetic quartz Blue glass Silicon wafers Various substrates

Is there any instability in flatness during the polishing of glass substrates? In the final process, not only the equipment and slurry but also the characteristics of the polishing pad affect the finish. Velatrix is a suede pad that has a proven track record in glass and quartz applications. You can check the applications and part number configurations in the materials provided. Main Applications: Quartz glass Synthetic quartz Blue glass Silicon wafers Various substrates

Are there any issues with surface roughness or flatness with the suede pads you are currently using? The optimal pad varies depending on the work and process. Belatrix produces a wide range of products from non-woven fabric bases in-house. We provide documentation introducing our product lineup by application. Main applications: Quartz glass Synthetic quartz Blue glass Silicon wafers Various substrates

Are there any issues with the number of defects or surface quality in the final polishing process? The finishing quality may vary depending on the characteristics of the polishing pad. Belatrix is an ultra-precision polishing pad developed for quartz, glass, and various substrates. We provide information on applications and product lineup in our materials. Main applications: Quartz glass Synthetic quartz Blue glass Silicon wafers Various substrates

Are you looking for suede pads used for final polishing of quartz glass and blue glass? Belatrix is a polishing pad developed for ultra-precision finishing applications. With a rich lineup of part numbers, you can select according to your application. You can check the product composition and applicable uses in the materials provided. Main applications: Quartz glass Synthetic quartz Blue glass Silicon wafers Various substrates

In the precision polishing process of semiconductor wafers, issues such as polishing unevenness and fine scratches can arise. These can affect the yield of subsequent processes and the performance of the final product, making the stabilization of processing conditions essential. Our non-woven polishing pads are designed for precision polishing that requires high flatness and surface quality. With features that support uniform polishing, they help reduce polishing unevenness and stabilize processing quality. Additionally, their excellent workability contributes to reducing variations in processing conditions. They can also be considered for polishing various materials that require high flatness, including semiconductor wafers. Since results may vary depending on processing conditions, we recommend confirming through preliminary testing. 【Features】 ■ Supports uniform polishing and contributes to the suppression of polishing unevenness ■ Assists in reducing fine scratches and improving surface quality ■ Excellent workability helps suppress variations in processing conditions ■ Supports the coexistence of high flatness and excellent surface quality ■ Suitable for precision polishing processes, including semiconductor wafers *For more details, please refer to the related links or feel free to contact us.

In the final polishing of display panels and precision glass substrates, variations in surface quality, fine scratches, and foreign substances can significantly affect product quality and yield. Especially in the final finishing process, the surface characteristics of the polishing pads used can lead to fluctuations in the finish, making it a challenge to maintain stable polishing quality. "Velatrix" is an ultra-precision polishing pad developed for finishing processes for quartz, glass, and various substrates. Its excellent surface characteristics help reduce fine scratches and defects during final polishing, supporting improvements in high surface quality. It assists in stabilizing quality and improving yield in the final polishing processes of display panels, precision glass, and various substrates. [Usage Scenarios] - Final polishing of display panels - Finishing processes for quartz glass, precision glass, and various substrates - Precision polishing requiring high surface quality Results may vary depending on processing conditions, so pre-testing is recommended. As a specialized trading company for polishing materials established in 1937, we offer optimal proposals. *For more details, please refer to the materials or feel free to contact us. (483 characters)

In the final polishing of optical lenses and precision glass substrates, fine scratches and surface defects can affect optical properties, potentially leading to a decrease in product performance and yield. Particularly in the final finishing process, the results can vary significantly depending on the surface characteristics of the polishing pads used, making the maintenance of stable polishing quality extremely important. "Velatrix" is an ultra-precision polishing pad developed for optical materials such as synthetic quartz and blue glass. Its excellent surface characteristics help reduce fine scratches and defects during final polishing and improve high surface quality. Since results can vary depending on processing conditions, we recommend confirming through preliminary testing. As a specialized trading company established in 1937, we provide optimal proposals. Please feel free to download materials or contact us.

Chamfering is a process that involves grinding and polishing the sharp edges (ends) of glass, lenses, prisms, and other materials to remove them. The typical methods include "C chamfering," "R chamfering," and "thread chamfering." In the grinding and polishing process, chamfering is not only aimed at ensuring the safety of the operator. - C chamfering: Cutting the edge at an angle - R chamfering: Rounding the edge in an arc shape - Thread chamfering: Removing burrs and chipping with a micro chamfer Especially in glass processing, it relates to preventing chipping due to stress concentration at corners, protecting lap plates and polishing pads, and ensuring yield in subsequent processes. For those who want to learn more about technical terms related to grinding and polishing and the basic knowledge of processing, the document "Learn the Basics of Grinding and Polishing through Popular Articles" introduces over 200 technical articles and popular articles published on grinding-polishing.com. It is an information site that can be used when you think, "What was this about?" regarding grinding and polishing. Please download the document and make use of it.

・Introduction When involved in the processing and surface treatment of high-precision parts in manufacturing environments, you may come across English expressions related to grinding and polishing. Lapping, polishing, and grinding are all processes that involve removing material to achieve a finish, and they are often treated as having similar meanings. However, there are significant differences in the principles of processing, objectives, the state of the abrasive particles used, and the precision achieved. In this article, we will clarify the etymological background and technical meanings of these terms and provide an easy-to-understand introduction to the differences between each processing method. Etymology and Technical Meaning of "Lap" and "Lapping" "Lap" is a word in English that means "to cover" or "to envelop." It also includes the concept of "layers," such as in "lap time," which is used in track and field to refer to "laps" or "overlaps." In polishing processes, lapping utilizes the fine abrasive particles that exist between the lap plate and the workpiece to gradually remove material from the surface. For more information, please search for "Grinding and Polishing Dot Com"!