八千代マイクロサイエンス Product Lineup

In the final polishing of optical lenses and precision glass substrates, fine scratches and surface defects can affect optical properties, potentially leading to a decrease in product performance and yield. Particularly in the final finishing process, the results can vary significantly depending on the surface characteristics of the polishing pads used, making the maintenance of stable polishing quality extremely important. "Velatrix" is an ultra-precision polishing pad developed for optical materials such as synthetic quartz and blue glass. Its excellent surface characteristics help reduce fine scratches and defects during final polishing and improve high surface quality. Since results can vary depending on processing conditions, we recommend confirming through preliminary testing. As a specialized trading company established in 1937, we provide optimal proposals. Please feel free to download materials or contact us.

• Hand polishing and filing

In the plant construction industry and equipment cleaning sites, proper handling of concrete slurry generated during construction is required. Concrete slurry is a strongly alkaline sludge, and discharging it as is cannot be done from the perspective of environmental protection and compliance with regulations. Therefore, prompt and reliable treatment is essential. Our coagulant provides a method to quickly precipitate fine cement particles dissolved in water, resulting in clean supernatant water. 【Usage Scenarios】 - Equipment cleaning at plant construction sites - Slurry treatment after core drilling and cutting work - Sites where compliance with drainage standards is necessary 【Benefits of Implementation】 - Rapid precipitation treatment of concrete slurry - Acquisition of clean supernatant water - Reduction of environmental impact - Support for regulatory compliance

• others

In dredging operations at ports, concrete slurry is generated and cannot be discharged as is. For environmental protection and compliance with regulations, prompt and reliable processing is required. This is where the treatment method using coagulants comes into focus. We will introduce a technique that allows fine cement particles dissolved in water to settle quickly, resulting in clean supernatant water. 【Application Scenarios】 - Treatment of slurry water generated during dredging operations - Drainage management in port areas 【Benefits of Implementation】 - Rapid drainage processing - Reduction of environmental impact - Support for regulatory compliance

• others

In the final polishing of display panels and precision glass substrates, variations in surface quality, fine scratches, and foreign substances can significantly affect product quality and yield. Especially in the final finishing process, the surface characteristics of the polishing pads used can lead to fluctuations in the finish, making it a challenge to maintain stable polishing quality. "Velatrix" is an ultra-precision polishing pad developed for finishing processes for quartz, glass, and various substrates. Its excellent surface characteristics help reduce fine scratches and defects during final polishing, supporting improvements in high surface quality. It assists in stabilizing quality and improving yield in the final polishing processes of display panels, precision glass, and various substrates. [Usage Scenarios] - Final polishing of display panels - Finishing processes for quartz glass, precision glass, and various substrates - Precision polishing requiring high surface quality Results may vary depending on processing conditions, so pre-testing is recommended. As a specialized trading company for polishing materials established in 1937, we offer optimal proposals. *For more details, please refer to the materials or feel free to contact us. (483 characters)

• Hand polishing and filing

At dam construction sites, proper handling of concrete slurry generated during construction is required. Concrete slurry, which is highly alkaline sludge, cannot be discharged as is, and prompt and reliable treatment is essential from the perspective of environmental protection and legal compliance. Therefore, a treatment method using coagulants has gained attention. We will introduce a technique that quickly precipitates fine cement particles dissolved in water, allowing for the collection of clean supernatant water. 【Application Scenarios】 - Turbid water treatment in dam construction projects - On-site treatment of concrete slurry 【Benefits of Implementation】 - Reduction of environmental impact - Thorough compliance with regulations - Improvement of work efficiency

• others

At dam construction sites, proper handling of concrete slurry generated during construction is required. Concrete slurry, which is a strongly alkaline sludge, cannot be discharged as is, and prompt and reliable treatment is essential from the perspective of environmental protection and legal compliance. Therefore, a treatment method using coagulants is gaining attention. We will introduce a technique that quickly precipitates fine cement particles dissolved in water, allowing for the collection of clean supernatant water. 【Application Scenarios】 - Turbid water treatment in dam construction projects - On-site treatment of concrete slurry 【Benefits of Implementation】 - Reduction of environmental impact - Thorough compliance with regulations - Improvement of work efficiency

• others

In the precision polishing process of semiconductor wafers, issues such as polishing unevenness and fine scratches can arise. These can affect the yield of subsequent processes and the performance of the final product, making the stabilization of processing conditions essential. Our non-woven polishing pads are designed for precision polishing that requires high flatness and surface quality. With features that support uniform polishing, they help reduce polishing unevenness and stabilize processing quality. Additionally, their excellent workability contributes to reducing variations in processing conditions. They can also be considered for polishing various materials that require high flatness, including semiconductor wafers. Since results may vary depending on processing conditions, we recommend confirming through preliminary testing. 【Features】 ■ Supports uniform polishing and contributes to the suppression of polishing unevenness ■ Assists in reducing fine scratches and improving surface quality ■ Excellent workability helps suppress variations in processing conditions ■ Supports the coexistence of high flatness and excellent surface quality ■ Suitable for precision polishing processes, including semiconductor wafers *For more details, please refer to the related links or feel free to contact us.

• Other abrasives

Difficult-to-grind materials containing sapphire and SiC are, as the name suggests, hard and difficult to grind. However, products require flatness, parallelism, and high rates to improve productivity. To enhance flatness and parallelism, it is important to continue cutting at a stable rate. The fixed abrasive tool "Briemur" addresses the challenges of rate and precision in such difficult-to-grind materials, achieving stable processing and contributing to improved productivity for customers. 【Application Scenes】 - LAP processing of sapphire and SiC - Flat processing of ceramic parts - Precision processing of metal parts - Surface finishing of resin materials 【Effects of Introduction】 - Processing with stable precision - Increased productivity through easier precision management - Reduced maintenance due to no need for plate replacement - Significant reduction of waste material - Realization of a clean processing environment

• Grinding Machine

In the semiconductor manufacturing industry, as miniaturization and high integration progress, the demands for the flatness and dimensional accuracy of components are becoming increasingly stringent. In particular, even slight distortions or irregularities in the processing of wafers and substrates can significantly impact the yield and performance of subsequent processes. Traditional grinding processes can face challenges due to variations in abrasive particles and wear of the reference plate, leading to decreased accuracy. Our company, "Briemur," leverages the characteristics of fixed abrasives to address these challenges, achieving stable precision processing and easy precision management, thereby contributing to improved productivity. 【Application Scenarios】 - Flat grinding of wafers and substrates - Improvement of flatness and dimensional accuracy of precision parts - Maintenance of a clean processing environment 【Benefits of Implementation】 - Achievement of stable high-precision processing - Increased productivity - Reduction of the hassle and cost of reference plate replacement - Significant reduction of waste materials and a clean working environment

• Grinding Machine

In the ceramics industry, high wear resistance is required to maintain the durability and performance of products. As a result, they tend to become difficult to machine with conventional processing. In traditional grinding processes, the difficulty of machining can lead to variations in machining accuracy and wear of the reference plate. The fixed abrasive tool BRIEMUR addresses these challenges by achieving stable precision in flat grinding, contributing to the machining of ceramic products. 【Application Scenarios】 - Flat grinding of ceramic components - Machining that requires precise flatness maintenance 【Benefits of Implementation】 - Stable precision and machining rates - Easier management of machining accuracy, leading to increased productivity - Elimination of the need for reference plate replacement, reducing maintenance costs - Significant reduction of waste materials and realization of a clean machining environment

• Grinding Machine

The decrease in grinding rate, grinding scratches, and variation in finish can occur due to clogging of the PAD and deterioration of its surface condition. The DP-equipped correction carrier achieves efficient dressing in a short time due to its lightweight design and high cutting power from diamond abrasives. It uniformly removes clogging and waviness from the PAD surface, restoring it to a stable condition. This contributes to the recovery of the grinding rate, suppression of scratch occurrence, and improvement of processing reproducibility. It also leads to enhanced condition setting and evaluation accuracy. Furthermore, we are currently offering a one-month free loan, allowing you to verify the dressing effects and processing improvement effects in a real machine environment. 【Features of the DP-equipped correction carrier】 - Uniformizes PAD condition with short-time dressing - Recovers grinding rate and suppresses scratches - Achieves highly reproducible processing

• Other services

When selecting a grinding dresser, it is important to make decisions based not only on the unit price of the product but also on the total cost, which includes replacement frequency and maintenance costs. The DP-equipped correction carrier reduces the frequency of replacements due to its long-life design, maintaining stable dressing performance over an extended period. As a result, it contributes to the reduction of consumable costs and the labor associated with replacement work. Additionally, since it is manufactured in Japan, you can use it with peace of mind regarding quality stability, delivery times, and support. A free one-month loan is also available before introduction, allowing you to evaluate performance and durability under actual processing conditions. 【Features of the DP-equipped correction carrier】 ■ Long lifespan reduces replacement frequency ■ Contributes to total cost reduction ■ Reliable domestic manufacturing and support ■ Free one-month loan available

• Other services

Although the losses in the grinding process are not easily visible, they have a significant impact on yield and profit. The DP-equipped correction carrier contributes to improving yield by stabilizing the pad condition and suppressing variations in processing accuracy. Furthermore, it allows one person to handle the correction work that was traditionally done by two, leading to a reduction in labor costs. By reducing reprocessing and improving equipment utilization rates, total cost optimization is achieved. Additionally, we are currently offering a free one-month loan. Before implementation, you can verify the cost-effectiveness on your own production line and confirm the less visible cost reduction effects.

• Other services

Conventional cast iron dressers are heavy and require time and manpower for correction work, which has been a challenge. The DP-equipped correction carrier achieves efficient pad correction in a short time due to its lightweight design and high cutting power from diamond abrasives. It allows for easy handling and stable corrections, enabling one person to perform tasks that previously required two. This contributes to reducing the workload and shortening the working time, thereby enhancing productivity. Additionally, we are currently offering a free one-month rental, allowing you to verify the actual workability and effectiveness on-site before implementation.

• Other services

After dressing, the PAD becomes rough, and while the polishing rate improves, the Ra worsens. This phenomenon is not a defect; it may indicate that the diamond abrasive is functioning properly and that the PAD surface is in an open state. The DP modified carrier offers a lineup of diamond pellets in various grits, allowing for selection based on processing conditions and required quality. Furthermore, by optimizing the protrusion of the diamonds, we can control the balance between the rate and surface roughness. Additionally, we are currently offering a one-month free loan, allowing you to verify the optimal dressing conditions and PAD state in an actual machine environment.

• Other services

Are you looking for suede pads used for final polishing of quartz glass and blue glass? Belatrix is a polishing pad developed for ultra-precision finishing applications. With a rich lineup of part numbers, you can select according to your application. You can check the product composition and applicable uses in the materials provided. Main applications: Quartz glass Synthetic quartz Blue glass Silicon wafers Various substrates

• Hand polishing and filing

Are there any issues with the number of defects or surface quality in the final polishing process? The finishing quality may vary depending on the characteristics of the polishing pad. Belatrix is an ultra-precision polishing pad developed for quartz, glass, and various substrates. We provide information on applications and product lineup in our materials. Main applications: Quartz glass Synthetic quartz Blue glass Silicon wafers Various substrates

• Hand polishing and filing

Are there any issues with surface roughness or flatness with the suede pads you are currently using? The optimal pad varies depending on the work and process. Belatrix produces a wide range of products from non-woven fabric bases in-house. We provide documentation introducing our product lineup by application. Main applications: Quartz glass Synthetic quartz Blue glass Silicon wafers Various substrates

• Hand polishing and filing

Is there any instability in flatness during the polishing of glass substrates? In the final process, not only the equipment and slurry but also the characteristics of the polishing pad affect the finish. Velatrix is a suede pad that has a proven track record in glass and quartz applications. You can check the applications and part number configurations in the materials provided. Main Applications: Quartz glass Synthetic quartz Blue glass Silicon wafers Various substrates

• Hand polishing and filing

Is there a case where the surface roughness does not improve with final polishing of quartz glass? If there is no improvement even after changing the slurry or conditions, the polishing pad may be affecting the results. Velatrix is a suede pad developed for quartz and glass applications. We provide materials that introduce our lineup and product configurations for various applications. Main Applications: Quartz glass Synthetic quartz Blue glass Silicon wafers Various substrates

• Hand polishing and filing

The polishing marks and rate decrease on lap plates and polish plates may be caused by deformation of the reference plate. The "straight gauge" enables the estimation of the overall wear trend and shape changes of the reference plate, supporting the consideration of optimal correction methods and stabilization of processing quality. 【Features】 ■ Supports the estimation of the overall shape of the reference plate: Contributes to visualizing not only partial wear but also the overall deformation trend. ■ Custom-made to fit your equipment: Individually designed and manufactured from the drawing stage to match the size of your reference plate. ■ Proven results in large sizes: Measurement results available for large lap plates and polish plates, including 24B size. ■ Serves as a basis for optimal correction considerations: By accurately understanding the condition of the reference plate, it facilitates the selection of efficient surface correction and fitting methods. ■ Contributes to stabilization of processing quality: Measures and maintenance against processing defects caused by deformation of the reference plate. *Please feel free to contact us for inquiries regarding specifications or sizes. *For more details, please refer to the related links or feel free to contact us.

• Other abrasives

In double-sided lapping and polishing processes, if there are issues such as decreased processing rates, workpiece scratches, or worsening parallelism, it is important to check not only the processing conditions and consumables but also the accuracy of the reference plate. The reference plate and polishing pads can wear and experience uneven wear due to repeated processing, which may affect the contact with the workpiece and the alignment with the upper and lower reference plates. The linked article explains the impact of reference plate accuracy on processing quality and the importance of checking the condition of the reference plate with a straight gauge. This is recommended for those who want to manage reference plate accuracy on a daily basis and identify the causes of processing defects. 【Features】 ■ For managing the accuracy of reference plates in double-sided lapping and polishing ■ To identify the causes of scratches, rate reduction, and worsening parallelism ■ Explains how to assess the condition of the reference plate using a straight gauge ■ For addressing contact defects and uneven wear when changing workpiece sizes ■ Basic knowledge before considering reference plate measurement and correction *For more details, please refer to the related link or feel free to contact us.

• Other abrasives

When issues such as scratches, deterioration of parallelism, and decreased processing rates occur due to double-sided lapping and polishing, it is important to check not only the processing conditions but also the accuracy of the reference plate. The reference plate measurement straight gauge is a measuring tool that allows you to check the shape simply by placing it on the reference plate. The long type is suitable for understanding the shape of the entire reference plate, while the short type is ideal for grasping the shape of the band width, which is more likely to affect the finish of the workpiece. By confirming the shape of the reference plate numerically, it helps determine whether adjustments can be made based on carrier conditions or if truing is necessary. 【Features】 ■ Supports accuracy verification of double-sided lapping and polishing reference plates ■ Assists in identifying the causes of scratches, deterioration of parallelism, and rate reduction ■ Understands the shape of the entire reference plate with the long type ■ Checks the band width shape and the fit of the upper and lower reference plates with the short type ■ Custom design and manufacturing are possible to match the machine used and the size of the reference plate *For more details, please refer to the related links or feel free to contact us.

• Other abrasives

In double-sided lapping and polishing processes, as the machining continues, the reference plate and polishing pad wear down, leading to changes in their shapes. The amount of wear varies due to factors such as workpiece placement, load, and variations in rotation direction and speed, which can result in deformations such as convex shapes, concave shapes, hull shapes, and seagull shapes. If shape changes are left unaddressed, they can lead to scratches, deterioration of parallelism, decreased processing rates, and worsened yield. The linked article explains the causes of shape degradation in reference plates and polishing pads, as well as the concepts of reference plate management for stable polishing processes. 【Features】 ■ Explanation of the causes of shape degradation in reference plates and polishing pads ■ Measures against scratches in double-sided lapping and polishing processes ■ Identification of causes for deterioration of parallelism, decreased rates, and worsened yield ■ Organization of convex shapes, concave shapes, hull shapes, and seagull shapes ■ Basic knowledge before considering reference plate measurement and correction *For more details, please refer to the related links or feel free to contact us.

• Other abrasives

In double-sided lapping and polishing processes, if the shape of the reference plate or polishing pad deteriorates, it can lead to scratches on the workpiece, worsened flatness, and decreased processing rates. The linked article measures a significantly deformed reference plate using a straight gauge and examines how the shape changes with dressing by a correction carrier. It also discusses the differences based on correction conditions and points to consider when applying high loads in a state of poor reference plate accuracy. This is recommended for those who want to confirm the effectiveness of reference plate correction and the importance of management before deterioration occurs. 【Features】 ■ Introduces the correction effects of double-sided lapping and polishing reference plates ■ Provides examples of measuring reference plate shapes with a straight gauge ■ Confirms dressing results using a correction carrier ■ Helps identify causes of scratches, worsened flatness, and decreased rates ■ Useful content for managing before significant shape deterioration occurs *For more details, please refer to the related links or feel free to contact us.

• Other abrasives

In resin processing, issues such as thermal damage, melting, and burr generation due to low melting points are challenges. Briemur maintains the functionality of the abrasive grains consistently through its fixed abrasive grain structure, achieving stable polishing action. By suppressing frictional heat during processing, it can control melting even with low melting point resins, enabling low-damage processing. Additionally, it accommodates large-diameter workpieces and batch processing, contributing to improved production efficiency. It reduces surface roughness and variations in finish, achieving high reproducibility in processing. Furthermore, the wear ratio between the pellets and the workpieces is clear, making it easy to understand the wear state and manage costs. It also allows for predictions of processing time, leading to increased productivity. Before implementation, we conduct evaluation tests with the workpieces entrusted to us. We propose the optimal specifications based on the material and processing conditions, ensuring a worry-free introduction. Briemur selects the optimal specifications from dozens of types of pellets and provides them with a dedicated design, flexibly addressing processing challenges that off-the-shelf products cannot handle. **Features of Briemur:** - Suppresses melting even with low melting point resins - Maintains accuracy even in large-diameter batch processing - Stable finish with low damage - Clear wear ratio = understandable costs

• Grindstone

Briemeur maintains a consistent performance of the abrasive grains and stabilizes the processing condition due to its fixed abrasive grain structure. It preserves the polishing effect even with ductile materials, achieving uniform processing. This contributes to the stabilization of surface roughness and the reduction of processing inconsistencies. Furthermore, the stable polishing rate allows for predictable processing times, leading to improved accuracy in process management. Additionally, the clear wear ratio between the pellets and the workpiece makes it easy to understand the wear condition, facilitating cost visibility. As a result, it simultaneously achieves "uniform finishing," "reproducible processing," and "manageable costs." Before implementation, we conduct evaluation tests with the workpieces entrusted to us. We propose optimal specifications based on the material and processing conditions, ensuring a worry-free introduction. Briemeur selects the most suitable specifications from dozens of types of pellets and provides them with custom designs. We also flexibly address processing challenges that cannot be handled by off-the-shelf products on a case-by-case basis. 【Features of Briemeur】 ■ Reduced processing time and high-efficiency processing ■ Stable rate = predictable timing ■ Clear wear ratio = understandable costs

• Wafer processing/polishing equipment

In ceramics processing, the long processing time due to the influence of hardness and machining resistance is a challenge that affects production efficiency. Additionally, variability in rates can make it difficult to predict processing times, which can also impact production planning. Briemur efficiently removes ceramics with its high polishing power, significantly shortening processing times. The wear ratio between the pellets and the workpiece is clear, making it easy to understand the wear condition and achieving visibility in cost management. As a result, it simultaneously achieves "shorter processing times," "stable rates," and "visibility in costs," contributing to increased productivity. Before implementation, we conduct evaluation tests with the workpieces entrusted to us. We propose optimal specifications based on the material and processing conditions, allowing for a worry-free introduction. Briemur selects the most suitable specifications from dozens of types of pellets and provides them with custom designs. We also flexibly address processing challenges that cannot be handled by off-the-shelf products on a case-by-case basis. 【Features of Briemur】 ■ Shortened processing time and high-efficiency processing ■ Stable rates = predictable timing ■ Clear wear ratio = understandable costs

• Grindstone

In the processing of difficult-to-cut materials like SiC, improving the variability of the rate and the instability of processing accuracy is a challenge. Briemur can efficiently process difficult-to-cut materials like SiC due to its high grinding power. It can reach the specified accuracy in a short time, achieving both processing efficiency and finishing accuracy. Additionally, since the wear ratio of the pellets to the workpiece is clear, it is easy to grasp the wear condition, allowing for cost visualization. It also excels in manageability compared to conventional slurry processing. This enables the simultaneous establishment of "predictable processing times," "visible operational costs," and "accurate processes." Before implementation, we conduct evaluation tests with the workpiece. We propose the optimal specifications based on the material and processing conditions, allowing for a worry-free introduction. Briemur selects the most suitable specifications from dozens of types of pellets and provides them with custom designs. We also flexibly respond to processing challenges that cannot be addressed by off-the-shelf products on a case-by-case basis. 【Features of Briemur】 ■ Stable rate = predictable processing time ■ Clear wear ratio = understandable costs ■ High-efficiency processing of difficult-to-cut materials = ensured accuracy

• Grindstone

In metal surface processing, factors such as machining heat, material properties, and processing conditions can lead to instability in flatness and parallelism. As a result, variations in machining and thickness can occur, increasing the burden of quality maintenance and processing management. Briemur is a fixed abrasive tool designed for surface lapping that addresses these challenges. With stable processing provided by fixed abrasives, it contributes to improved ease of processing management, including thickness control. Additionally, it enhances cooling efficiency during coolant processing, making it easier to proceed with machining while minimizing the effects of heat. It supports improvements in flatness and parallelism, as well as stabilization of machining quality. **Features of Briemur:** - Reduces quality variations through stable processing - Facilitates processing management, including thickness control - Minimizes the effects of heat, contributing to the stabilization of surface processing *For more details, please refer to the related links or feel free to contact us.*

• Wafer processing/polishing equipment

In sapphire flat lapping processing, differences in machinability depending on the surface orientation often lead to challenges with processing time and variations in finish. Buriemur is a fixed abrasive tool designed for flat lapping specifically for sapphire processing. Its robust cutting ability with a fixed abrasive method supports the adjustment of processing conditions according to each surface orientation, helping to achieve both processing efficiency and stable precision. It has a proven track record with both large and small diameter workpieces and can be utilized for a wide range of processing from prototyping to mass production. 【Features】 ■ Compatible with sapphire processing for each surface orientation ■ Supports improved processing rates and stabilized precision through a fixed abrasive method ■ Contributes to reduced variation through condition adjustments for each surface orientation ■ Capable of handling workpieces from large to small diameters ■ Usable for a wide range of processing from prototyping to mass production *For more details, please refer to the related links or feel free to contact us.

• Wafer processing/polishing equipment

Are you struggling with warping, sagging, and variations in finish due to heat during resin processing? Additionally, in processing with free abrasive particles, there are cases where abrasives can enter the workpiece, making cleaning cumbersome. Conventional processing methods tend to generate heat due to high rotation and processing resistance, which can lead to deformation and quality deterioration specific to resin. The fixed abrasive tool BRIEMUR suppresses the generation of processing heat through low-speed processing and water-soluble coolant, preventing warping and sagging of the resin. Furthermore, it prevents the intrusion of abrasives, simplifying the cleaning process. This simultaneously achieves stabilization of processing quality and reduction of burdens in subsequent processes, contributing to improved efficiency in resin processing.

• Grindstone

In ceramic processing, are you removing more material than necessary, leading to increased allowances? Ceramics, being pottery, have significant thickness variations, requiring substantial material removal to achieve uniform dimensions. In conventional free abrasive processing, thinner areas are also processed simultaneously, resulting in unnecessary material being removed and increased allowances. This, in turn, leads to longer processing times and reduced yield. Briemur stabilizes the contact state with fixed abrasives, allowing for efficient processing of the necessary areas while minimizing excessive allowances. This reduces unnecessary processing and enables efficient dimensional adjustments. By optimizing allowances, you can shorten processing times, reduce material waste, and improve overall process efficiency.

• Grindstone

Is there a variation in the finish of each surface due to sapphire processing? The processing conditions differ for surfaces A, C, and R, making it difficult to achieve a stable finish. Sapphire is hard and has poor machinability, so conventional processing can easily lead to differences in finish between surfaces due to wear of the abrasive grains and changes in contact. As a result, variations in surface roughness and precision occur, making it challenging to maintain stable quality. Briemur maintains stable processing conditions for each surface through optimal bond materials and abrasive grain design. It controls the finish of each surface, achieving uniform quality. By stabilizing surface quality, it contributes to improved processing precision and stabilization of the process, enhancing the quality of sapphire processing.

• Grindstone

In SiC processing, are there challenges such as not being able to increase processing speed or tools becoming dull quickly? SiC is very hard and difficult to machine, so traditional processing methods cause abrasives to wear out quickly, leading to a decrease in processing rate, which poses challenges in terms of cost and productivity. Furthermore, due to the increase in the diameter of the workpiece, abrasives may not reach the center, making it difficult to achieve precision, and there may also be occurrences of cracking and chipping, which are characteristic of brittle materials. Briemur achieves stable processing while maintaining cutting performance through optimal bond materials and abrasive design. It enables sustainable processing at a consistent rate while improving processing speed. This contributes to enhanced processing efficiency, improved tool life, and stabilized workpiece precision, addressing the challenges of SiC processing.

• Other abrasives

In resin processing, issues such as thermal damage, melting, and burr formation due to low melting points are challenges. Briemeur maintains the function of the abrasive grains consistently through its fixed abrasive grain structure, achieving stable polishing action. By suppressing frictional heat during processing, it can prevent melting even with low melting point resins, enabling low-damage processing. Additionally, it accommodates large-diameter workpieces and batch processing, contributing to improved production efficiency. It reduces surface roughness and variability in finishing, achieving high reproducibility in processing. Furthermore, the wear ratio between the pellets and the workpieces is clear, making it easy to understand the wear state and manage costs. It also allows for the prediction of processing time, leading to increased productivity. Before implementation, we will hold the workpieces and conduct evaluation tests. We will propose optimal specifications based on the material and processing conditions, ensuring a safe introduction. Briemeur selects the optimal specifications from dozens of types of pellets and provides them with a dedicated design, flexibly addressing processing challenges that cannot be met with off-the-shelf products. **Features of Briemeur:** - Suppresses melting even with low melting point resins - Maintains precision even in large-diameter batch processing - Stable finishing with low damage - Clear wear ratio = understandable costs

• Wafer processing/polishing equipment

Are you struggling with variations in finishing accuracy and warping of workpieces in metal processing? While grinding machines have high processing capabilities, they often process one side at a time, which can lead to increased warping and deterioration of parallelism. Additionally, high-speed processing tends to generate heat, which can cause dimensional changes due to expansion and contraction, affecting finishing accuracy. The Briermeur fixed abrasive tool allows for simultaneous double-sided processing in a batch mode, enabling uniform finishing of the top and bottom surfaces of the workpiece. This helps to reduce warping and achieve stable parallelism in processing. Furthermore, processing at low speeds and cooling with coolant help to suppress the generation of processing heat, minimizing its impact on the material. This contributes to achieving stable dimensional accuracy and high-quality finishes, enhancing precision in metal processing.

• Wafer processing/polishing equipment

In the flat lapping process of AlN (aluminum nitride) and alumina, the length of processing time, variations in flatness and thickness, and considerations for chipping and cracking specific to brittle materials pose significant challenges. The fixed abrasive tool "Briemur" is a diamond tool designed for flat lapping of such ceramics. By adopting a fixed abrasive method that retains the abrasive particles in the tool, it supports the maintenance of processing rates and stabilization of precision compared to free abrasive processing (slurry method). It contributes to reducing quality variations while shortening lead times. This helps improve the yield of expensive ceramic substrates and components and establishes an efficient manufacturing process. **Features** - Compatible with flat lapping of hard and brittle ceramics such as AlN and alumina - Supports improved processing rates and stabilized precision through fixed abrasive method - Contributes to reducing variations in flatness and thickness - Assists in establishing stable processing conditions that consider chipping and cracking - Reduces the burden of slurry management and contributes to maintaining a clean processing environment *For more details, please refer to the related links or feel free to contact us.*

• Wafer processing/polishing equipment

In sapphire processing, the high hardness and brittleness often lead to scratches, chipping, and variations in finish, making stable quality assurance a challenge. Briemeur stabilizes the processing condition through a fixed abrasive grain structure. It achieves uniform processing while suppressing excessive localized loads, thereby reducing the occurrence of scratches and chipping. Furthermore, the stable polishing rate allows for predictable processing times, contributing to improved accuracy in process design. The wear ratio between the pellet and the workpiece is also clear, making it easier to understand and manage processing costs. This enables the simultaneous realization of "high precision, stable quality, and efficiency" in sapphire processing. Before implementation, we conduct evaluation tests with the workpieces entrusted to us. We propose optimal specifications based on the material and processing conditions, allowing for a worry-free introduction. Briemeur selects the most suitable specifications from dozens of types of pellets and provides them with a dedicated design. We also flexibly address processing challenges that cannot be handled by off-the-shelf products on a case-by-case basis. 【Features of Briemeur】 ■ Reduction of scratches and chipping ■ Stable rate = predictable processing time ■ Clear wear ratio = understandable costs

• Wafer processing/polishing equipment

In the flat lapping processing of SiC (silicon carbide), the length of processing time, variation in flatness, and the management burden of processing conditions are significant challenges. The fixed abrasive tool "Briemur" is a diamond tool developed to support the improvement of processing hard and difficult-to-machine materials. Compared to free abrasive processing (slurry method), it is less affected by the condition of the abrasives, making precision management easier and contributing to stable processing. Additionally, by maintaining an efficient processing rate, a reduction in lead time can be expected. It helps in building processes aimed at improving productivity and ensuring quality consistency in SiC processing. 【Features】 ■ Compatible with flat lapping processing for hard ceramics such as SiC ■ Supports the maintenance of processing rate and stabilization of precision through fixed abrasives ■ Reduces the burden of slurry management and contributes to a clean processing environment ■ Contributes to improved yield of expensive materials through stable finishing ■ Numerous processing achievements with hard materials, from small diameters to large workpieces *For more details, please refer to the related links or feel free to contact us.

• Wafer processing/polishing equipment

Despite performing the same tasks, the results do not align. When the person in charge changes, the outcomes also change. This situation may indicate that there is still a degree of individual reliance in the correction process. If the state of the reference plate, the way it contacts, and the approach to corrections depend on the operator's intuition, the contact conditions will not be stable, and reproducibility cannot be ensured. As a result, differences in the progress of removal occur, leading to variations in the final output. YMI's ultra-lightweight correction carrier/pad conditioner improves the reproducibility of shape corrections by stabilizing the contact conditions and states. This allows for consistent results under the same conditions, independent of the operator. What is crucial for stabilizing precision is not the difference in technology, but rather "aligning the conditions." By enhancing the reproducibility of the process, stable processing quality can be achieved. 【Features of the Correction Carrier/Pad Conditioner】 ■ Stabilizes contact conditions and improves reproducibility ■ Enables shape corrections independent of the operator ■ Achieves stable processing results under the same conditions

• Other abrasives

In selecting correction carriers/pad conditioners, are you only comparing based on unit price? Even if you choose options that reduce initial costs, there are cases where the overall costs become unstable due to increased replacement frequency or the occurrence of reprocessing. One of the causes of this is the lack of reproducibility in the correction process. If the condition of the pads after correction or the precision of the correction carriers/pad conditioners themselves is not stable, variations in removal amounts and finishes will occur, leading to defects and rework. This results in accumulating hidden costs. YMI's ultra-lightweight correction carriers/pad conditioners stabilize results by refining precision and ensuring stable contact conditions, thereby reducing occurrences of replacements and rework. This helps to minimize cost fluctuations and enables stable operations. The important factor is not the unit price, but whether "it is possible to stabilize the costs that occur continuously." 【Features of Correction Carriers/Pad Conditioners】 ■ Reduces replacement frequency and rework, stabilizing costs ■ Minimizes variations in results and reduces defect occurrences ■ Achieves excellent operations in total cost

• Other abrasives

Even though we should be processing under the same conditions, aren’t there variations in the finish and delivery times? In such a situation, we have no choice but to rely on the site, making it difficult to predict results in advance. The inability to predict results directly leads to risks. One of the causes of this is the lack of reproducibility in the correction process. If the condition of the reference plate and the way it is applied depend on the operator's sense, the results can vary even with the same operation, disrupting the overall stability of the process. YMI's ultra-lightweight correction carrier/pad conditioner stabilizes the tool itself through high-precision design and aligns the surface condition, improving the reproducibility of correction results. This enables a state where results can be controlled without relying on the operator. As a result, it leads to stabilization of quality, visualization of man-hours, and improved accuracy in delivery time predictions, making it possible to establish a manageable process. 【Features of the Correction Carrier/Pad Conditioner】 ■ Suppresses variations in results and ensures reproducibility of the process ■ Achieves stable corrections that do not depend on the operator ■ Enables management of quality, man-hours, and delivery times

• Other abrasives

Have you ever experienced having to redo the pad correction/pad dress process multiple times? Even if you think you are working in the same way, the results may not be consistent, leading to the need for adjustments. One of the causes of this is the variation in the burden and contact conditions during work. In particular, heavy correction carriers are difficult to handle, making it hard to maintain a stable application of force and contact, which results in differences in the removal process. As a result, inconsistencies in the finish occur, leading to rework. YMI's ultra-lightweight correction carrier reduces the workload due to its ease of handling and stabilizes the contact conditions, ensuring consistent results. This reduces unnecessary rework and contributes to shorter working times. Making work easier is a given; it is important to create a state where everything can be finished in one go. 【Features of the Correction Carrier/Pad Conditioner】 ■ Suppresses variation in results and ensures reproducibility of the process ■ Achieves stable corrections that do not depend on the operator ■ Manages quality, man-hours, and delivery times effectively

• Other abrasives

In the grinding process, the condition of the pad significantly affects the quality of the finish. However, conventional correction work is time-consuming and labor-intensive, leading to increased equipment downtime and burdens on workers. The DP-equipped correction carrier achieves efficient pad correction in a short time due to its high cutting power and uniform contact provided by diamond abrasives. Additionally, its lightweight design improves operability, making it easy for anyone to handle. As a result, it not only shortens correction time but also contributes to extending pad life and improving finish uniformity. It supports stable equipment operation and enhances productivity. 【Features of the DP-equipped correction carrier】 ■ Correction time reduced to 1/4 ■ Number of operators reduced from 2 to 1 ■ Precision of the grinding plate and the pad surface are reliably controlled *For more details, please refer to the related links or feel free to contact us.

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