アイテス Product Lineup

The "Xenon Weather Meter" is an accelerated weathering testing machine that uses a xenon arc lamp as the light source. By combining exposure conditions such as irradiation, temperature and humidity, and rainfall, it artificially reproduces outdoor and indoor environments, allowing for the evaluation of weather resistance and light resistance of test specimens in a shorter time than natural exposure tests. The xenon lamp used as the light source has a spectral distribution that closely approximates the ultraviolet and visible parts of sunlight, with precise control of the appropriate filters and irradiance. This enables tests with good correlation and reproducibility to outdoor exposure. This testing is conducted as a service by our partner companies. 【Features】 - The combination of filters used can reproduce outdoor direct sunlight and indoor sunlight through window glass. - In high-energy testing machines, irradiation is conducted at about three times the intensity of sunlight, allowing for quicker evaluation of light resistance. - It is adopted as a testing method in various fields such as automobiles, paints, construction, plastics, printed materials, and textiles. *For more details, please refer to the PDF materials or feel free to contact us.

Our company conducts evaluations of brightness and color uniformity for emitting surfaces such as OLEDs, titled "Evaluation of Brightness and Color Uniformity of LCD Displays." In brightness measurement (using a two-dimensional photometer to measure the display surface), we compare the digital camera images of the LCD display surface with the results obtained from the brightness measurements conducted with the two-dimensional photometer. While the distribution of uniformity is difficult to discern in the digital camera images, the color scale display of the brightness distribution highlights areas with brightness uniformity issues, making it easier to understand. 【Overview of Measurement Equipment】 ■ Measurement Items: Tristimulus values (X, Y, Z), chromaticity (x, y) ■ Measurement Range: 0.01 cd/m² to 1,000,000 cd/m² ■ Effective Pixel Count: 1376 × 1024 ■ Emitting Surface Size: Approximately 15 to 115 inches ■ Installation Method/Fixtures: Vertical, horizontal, etc., adaptable to shape *For more details, please refer to the PDF document or feel free to contact us.

The "Pressure Repetition Test" involves supplying compressed air at a specified pressure to products that require airtightness, to check for any leaks. It is also possible to conduct a durability test that repeats the pressurization and release states, and it can be performed in a heated state in combination with an environmental test chamber. Additionally, the timing of any leaks can be confirmed from the logged pressure data. 【Device Specifications】 ■ Pressurization Pressure: Max 0.7 MPa (gauge pressure) ■ Maximum Number of Cycles: Max 32,000 cycles ■ Pressure Holding Time: Max 3,000 seconds ■ Monitor: Recording of the pressure sensor values (gauge pressure) during the test ■ Connection with Test Samples: Air tube (connection method can be adapted to the test sample) *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce our "Continuous Power Supply Test for Multilayer Ceramic Capacitors." Assuming the failure mode is a short circuit, we can conduct a continuous power supply test under high temperature and high humidity conditions while continuously measuring the changes in leakage current. We believe this is an effective method for comparing the performance of multiple products by manufacturer, lot, etc. Additionally, we can assist with the design and fabrication of the test boards. 【Features】 ■ Design and implementation of device mounting boards as needed ■ Compatible with sizes such as 0603 and 1005 ■ Monitoring devices connect to samples via a resistance board to calculate leakage current values ■ After testing, capacitance measurements can be conducted to confirm the degree of capacitance degradation *For more details, please refer to the PDF document or feel free to contact us.

Our company conducts thorough evaluations and verifications of FPD from various angles. In structural analysis, we assess FPD products and products incorporating advanced technologies for any potential issues in characteristics or structure, and provide reports. In defect analysis, we approach and investigate the causes of product defects in increasingly sourced overseas products via the shortest route. Additionally, in reliability testing, we propose suitable reliability testing methods and conditions based on our extensive know-how, tailored to the customer's objectives and needs. 【Our Strengths】 ■ Problem-Solving Ability - Proposals for analytical methods well-versed in the liquid crystal manufacturing process ■ Investigative Ability - Deep insights and advanced, sub-micron level fine sample processing techniques ■ Specialized Equipment - Considerations using a combination of diverse analytical instruments *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce the "Strain Measurement of Thermal Shock Testing" conducted by our company. A sample with a strain gauge attached was set up in the thermal shock testing device, and the wiring of the strain gauge was connected to an external data logger to record the strain data in real-time during the test. The strain behavior during the thermal shock test was observed for two types of copper-clad laminates, and it was noted that significant strain occurred with changes in temperature. It was found that FR-1 exhibited greater strain compared to FR-4. [Test Conditions] ■ Temperature Cycle: -30°C to 120°C ■ Exposure Time at Each Temperature: 30 min ■ Test Materials - FR-1 Paper Phenolic (Double-sided board) - FR-4 Glass Epoxy (Double-sided board) ■ Strain Gauge: Foil strain gauge for printed circuit boards *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce the "IOL testing of discrete semiconductors" that we conduct. Under normal temperature conditions, we repeatedly turn the power ON/OFF, applying stress to the device due to temperature changes caused by the device's own heat generation during power ON. During the power OFF (cooling) phase, forced cooling is also performed using a fan. 【Adjustment Conditions】 ■ Temperature Rise: 125℃ ■ Heating Time: 5 minutes ■ Cooling Time: 5 minutes ■ Fan Operating Time: 2 minutes *For more details, please download the PDF or feel free to contact us.

We would like to introduce the results of our investigation into the behavior of strain during moisture absorption and drying using strain gauges. It was observed that the material expands when absorbing moisture and contracts back to its original state when drying, with the strain returning to the condition prior to moisture absorption. Regarding FR-1, it is presumed that it did not return to its original state due to changes in the chemical structure of the material caused by hydrolysis. 【Test Overview】 ■ 85℃ 50% ⇒ 85℃ 85% ⇒ 85℃ 50% ■ Test Materials ・FR-1 Paper Phenolic (single-sided board) ・FR-4 Glass Epoxy (single-sided board) ■ Strain Gauge ■ Foil Strain Gauge for Composite Materials *For more details, please download the PDF or feel free to contact us.

Our company conducts environmental testing using a constant temperature and humidity chamber with a front glass window and a camera, while capturing and monitoring the operational status such as screen displays. During environmental testing using equipment like constant temperature and humidity chambers, monitoring the condition of the test subject using loggers for parameters like voltage, current, resistance, and temperature is widely practiced. For samples where monitoring with loggers is difficult, we combine a constant temperature and humidity chamber equipped with a front glass window option, a camera, and monitoring software to conduct environmental tests while capturing and monitoring the condition of the testing equipment. [Example of monitoring an LCD panel] - Interval shooting at regular intervals - Motion detection shooting that captures changes in condition - Monitoring of indicator lamps is also possible *For more details, please download the PDF or feel free to contact us.

At AITES Co., Ltd., we provide a wide range of technical services for evaluation tests of printed circuit boards (mounted boards) equipped with electronic components. We conduct reliability tests, solder joint observations, whisker observations, and cross-sectional observations. We assist with observations in accordance with international standards, offer consultations, and address various concerns regarding observations. Additionally, we offer services such as X-ray observations, appearance inspections, and shape measurements, so please feel free to contact us when needed. 【Service Contents】 ■ Reliability Testing ■ Solder Joint Observation ■ Whisker Observation ■ Cross-Sectional Observation *For more details, please download the PDF or feel free to contact us.

We would like to present the results of strain measurements conducted by attaching strain gauges and thermometers to the surfaces of power modules, both in a mounted state on a circuit board and in an unmounted state. In the mounted module, it was observed that the temperature change was slightly slower, and correspondingly, the change in strain was also slow. This is believed to be due to the delayed transfer of heat to the module when it is mounted. 【Test Overview】 ■ Strain Gauge Used - Foil strain gauge for composite materials: compatible linear expansion coefficient 1x10^-6, base 15x5mm ■ Test Conditions - Hold at -40℃ for 3 hours → 15℃/min → Hold at 80℃ for 3 hours * 5 cycles * For more details, please download the PDF or feel free to contact us.

At Aites Co., Ltd., we conduct "Poisson's ratio measurement." Poisson's ratio is the ratio of longitudinal strain to lateral strain that occurs when a load is applied to an object, and it is necessary for strength calculations of materials. In the downloadable materials, we introduce the results of attaching strain gauges to test specimens, applying tensile loads using a universal testing machine, and examining the longitudinal and lateral strains obtained from the strain gauges. Please feel free to download and take a look. 【Measurement Examples】 ■ Measurement using strain gauges ■ Measurement using video extensometers *For more details, please download the PDF or feel free to contact us.

Our company conducts consistent analysis from reliability testing to failure analysis. This allows us to confirm whether the samples meet the specifications, as well as to identify and observe the defective areas of failed samples. We propose and implement tests and analyses tailored to our customers' requests and objectives, assisting from cause investigation to problem resolution. Please feel free to contact us when you need our services. 【Analysis Flow】 ■ Specification confirmation of semiconductor devices through reliability testing ■ Identification of defective areas and observation of failure points using TEM ・ Identification of defective areas through EMS/OBIRCH analysis ・ Observation of failure points using TEM *For more details, please download the PDF or feel free to contact us.

We conducted a "moisture and heat resistance test for adhesives" to investigate changes in adhesive strength due to the effects of moisture and heat. The test specimens were placed in a constant temperature and humidity testing machine, and after 500 hours, they were removed to measure the tensile shear adhesive strength. It is presumed that the adhesive strength decreased due to the swelling of the adhesive in a high-temperature and high-humidity environment. We can conduct various environmental tests and strength tests for various materials, not limited to adhesives. Additionally, we also provide chemical analysis to elucidate degradation mechanisms. [Test Results] - The adhesive strength (breaking stress) of the samples placed in a humid heat environment for 500 hours significantly decreased. - From the stress-strain curves of the tensile tests, a decrease in the modulus of elasticity was confirmed for both adhesives A and B. - It is presumed that the adhesive strength decreased due to the swelling of the adhesive in a high-temperature and high-humidity environment. *For more details, please download the PDF or feel free to contact us.

This introduces the evaluation of thermally degraded rubber using dynamic viscoelasticity measurements. A constant temperature bath capable of circulating air within the chamber was used as a suitable device for thermal degradation testing, and NBR rubber and EPDM rubber were heated at 100°C for a specified duration. The changes in viscoelastic behavior due to heating time were investigated. For both types of rubber, as the heating time increased, tanδ (= E"/E') showed a peak that shifted towards higher temperatures, and a decrease in peak value was observed. It is believed that the loss of rubber elasticity and the decrease in elastic modulus resulted in a shift of Tg towards higher temperatures. By measuring dynamic viscoelasticity, it becomes possible to confirm the changes in physical properties associated with material degradation and to gain insights into structural changes. Additionally, conducting other chemical analyses can clarify more specific changes in chemical structure. [Test Overview] ■ A constant temperature bath capable of circulating air within the chamber was used ■ NBR rubber and EPDM rubber were heated at 100°C for a specified duration ■ Changes in viscoelastic behavior due to heating time were investigated *For more details, please download the PDF or feel free to contact us.

Here is a case study of observing the adhesive state through a metal plate using an ultrasonic microscope. The ultrasonic microscope can confirm internal information that cannot be seen from the exterior, as long as the ultrasonic waves can penetrate. After reliability testing, we observed the condition of the adhesive remaining on the metal plate from the metal side in a sample where the chip had come off. Please refer to the PDF document for details on the observations and results. [Case Overview] - Observation of the adhesive layer between the metal and the chip - Observation of the adhesion state between the metal and the adhesive *For more details, please download the PDF or feel free to contact us.

We would like to introduce our ultrasonic microscope observation of semiconductor packages. Due to storage conditions and mounting conditions, delamination can occur between the metal parts (die pad) and the package resin in semiconductor packages. Delamination inside the package is a defect that significantly affects product quality, but it cannot be confirmed visually from the outside. By using an ultrasonic microscope, we can clearly capture the internal structure of the package and contribute to reliability evaluation. 【Features】 ■ Ultrasonic microscope observation from the chip side - By changing the focal position, previously unseen areas of the same sample become visible. ■ Ultrasonic microscope observation from the die pad side - Delamination conditions can be confirmed at various locations even with the same focus. *For more details, please download the PDF or feel free to contact us.