アイテス List of Products and Services

At AITES, we use environmental testing equipment that conforms to standard specifications such as JIS, JEDEC, and MIL, and we accept commissioned testing for reliability evaluation of various electronics products, components, and materials. We offer a range of tests including electrical testing, non-destructive observation, and power cycle testing. 【Environmental Testing】 ■ Highly Accelerated Life Testing ■ Constant Temperature and Humidity Testing ■ Thermal Shock Testing ■ Liquid Bath Thermal Shock Testing ■ Temperature and Humidity Cycle Testing ■ In-Situ Continuous Measurement Reliability Evaluation Testing Service *For more details, please refer to the PDF materials or feel free to contact us.

■High Accelerated Life Test: 5 units ■Thermal Shock Test: 24 units ■Constant Temperature and Humidity Test: 22 units ■Liquid Tank Thermal Shock Test: 3 units ■High Temperature Storage Test ■Hot Oil Resistance Evaluation Test ■Insulation Resistance Continuous Monitoring Evaluation ■Continuity Resistance Continuous Monitoring Evaluation ■Electromigration Continuous Monitoring Evaluation ■Microfocus X-ray Transmission Observation ■Ultrasonic Microscope Observation ■ESD Evaluation Test ■CDM Evaluation Test ■Universal Tensile Evaluation Test ■Cross-section (Polishing) Observation Service (Evaluation before and after environmental testing is also possible) ■Solar Cell (Crystalline Silicon/Amorphous Silicon/Compound/Organic Thin Film, etc.) EL Emission Phenomenon ■Heat Generation Observation

We provide testing services to evaluate the resistance to ESD damage and latch-up damage, which are important for the reliability of semiconductor devices and electronic components that include them. ■ We accommodate products such as IC modules, electronic components, and subsystems with up to 512 pins. ■ We offer tests in accordance with standards such as JEDEC, EIAJ, and ESDA. ■ We propose and conduct tests tailored to your requests and objectives. ■ In the event of any issues with resistance, we assist with failure analysis and problem resolution.

■ We support products such as IC modules, electronic components, and subsystems with up to 512 pins. ■ We provide testing that complies with major domestic and international standards such as ESDA/JEDEC, JEITA, AEC, and IEC. ■ We propose and conduct tests tailored to our customers' requests and objectives. ■ In the event of any issues with reliability, we assist with failure analysis and problem resolution.

■ We will support each standard waveform for JEDEC, JEITA (EIAJ), and AEC through unit replacement. ■ We support both Direct Charge Method (Direct CDM) and Field Induced Method (Field Induced CDM). ■ The contact state confirmation function of the applied pins ensures reliable application. ■ Destruction judgment support is also possible using the diode characteristic judgment method (consultation required).

One of the reliability evaluation methods, the ion migration evaluation test, has become increasingly important as a pre-evaluation due to the transition of products towards being lighter, shorter, and smaller. This document presents an overview of ion migration evaluation and the details of the test implementation using an example of an evaluation test conducted at our company. We will also introduce the usefulness of the continuous measurement (In-Situ) equipment used in the evaluation tests. [Contents] ■ Introduction ■ Ion Migration ■ Ion Migration Evaluation Test ■ Evaluation Method ■ Evaluation Test Case ■ Conclusion ■ References *For more details, please refer to the PDF document or feel free to contact us.

At AITES Co., Ltd., we offer "environmental testing in a high-power constant temperature and humidity chamber." We can achieve a constant temperature change of up to 15°C/min (-45 to ±155°C). Temperature cycle tests can be conducted by controlling the temperature gradient. Additionally, the temperature control range is wider than that of typical constant temperature and humidity chambers, allowing control at 95°C. 【Features】 ■ Two high-power constant temperature and humidity chambers introduced ■ Constant temperature change of up to 15°C/min (-45 to ±155°C) possible ■ Temperature cycle tests can be conducted by controlling the temperature gradient ■ Wider temperature control range than typical constant temperature and humidity chambers ■ Controllable at 95°C *For more details, please refer to the PDF materials or feel free to contact us.

At Aites Co., Ltd., we offer contract power cycle testing using Siemens (Mentor) power cycle testing equipment. We can also handle the creation of various jigs necessary for the tests. Additionally, we accommodate various observations and measurements of power devices. We can capture changes before and after tests such as power cycle testing. 【Features】 ■ We can handle the creation of various jigs necessary for the tests. ■ We accommodate various observations and measurements of power devices. ■ We can capture changes before and after tests such as power cycle testing. *For more details, please refer to the PDF document or feel free to contact us.

At Aites Co., Ltd., we offer "Module Prototyping and Thermal Resistance Evaluation." In the evaluation of power devices and the materials used in power devices, measuring thermal resistance by actually assembling the device is an effective method for understanding performance. We handle everything from prototyping to evaluation. If you are interested, please feel free to consult with us. 【Features】 <Prototyping of Power Modules> ■ We provide a consistent, flexible, and cost-effective service from chip procurement to module assembly. ■ Suitable for evaluating die attach and TIM materials. <Transient Thermal Resistance Measurement> ■ Using T3Ster (power cycle testing device built-in) for power devices, we conduct measurements of transient thermal resistance, obtain structural functions, and perform thermal analysis. ■ Using that data, we can compare materials, calculate thermal resistance, and estimate defective areas. *For more details, please refer to the PDF document or feel free to contact us.

During reliability testing, the samples change continuously. Do you have any questions such as "At what point did the crack occur?", "How does the degradation progress?", or "How much has it changed from the initial state?" By combining this with reliability testing, we will evaluate the subject in a time-series and non-destructive manner. 【Features】 ■ Applicable for observing changes in whiskers, migration, pressure resistance, solder evaluation, chemical erosion tests, and aging products in the market ■ Environmental tests and observation frequency will be conducted according to customer requirements ■ Additional analyses such as electrical characteristics, SEM observation, elemental analysis, and cross-sectional observation are also available *For more details, please refer to the PDF document or feel free to contact us.

■ We support products such as IC modules, electronic components, and subsystems with up to 512 pins. ■ We provide testing that complies with major domestic and international standards such as JEDEC, JEITA, and AEC. ■ We propose and conduct tests tailored to our customers' requests and objectives. ■ In the event of any issues with reliability, we assist with failure analysis and root cause investigation to resolve the problem.

Some overseas manufactured parts and products may initially operate without issues, but can cause malfunctions and lead to failures and breakdowns in a short period of time. Before adopting or using overseas products, please consider AIT's parts and product quality evaluation services. ■ Examples of overseas parts evaluation - Reliability evaluation during the parts procurement and selection stage - Comparative evaluation between parts and product manufacturers - Reliability evaluation when replacing current parts with alternative parts (cost reduction) ■ Examples of applicable parts - Active components (transistors, diodes, thyristors, etc.) - Passive components (capacitors, resistors, etc.) - LCDs - Circuit boards - Power supplies - Etc.

In-situ continuous measurement reliability evaluation tests involve applying stress while measuring characteristics to conduct reliability assessments. ● Accurate understanding of failure time is possible In a read-out method where samples are taken from a stress environment at a fixed time, failure can only be understood at the timing of the read-out, making it impossible to know the exact failure occurrence time. In-situ measurement allows for an accurate understanding of failure time. ● Detection of recoverable failures is possible Recoverable failures can cause significant issues in the market. In most cases, the read-out method makes it nearly impossible to detect these recoverable failures, whereas in-situ measurement enables the detection of recoverable failures, allowing for accurate judgment and assessment. ● Monitoring of stress application conditions on samples is possible The stress application status and measurement data can be confirmed in real-time.

At AITES, we provide total solution services for power devices, including reliability testing, analysis, and evaluation. This includes the "Power Cycle Testing Machine," which can simultaneously conduct transient thermal measurements, as well as "failure analysis of compound semiconductors," "concentration analysis of diffusion layers," and "cross-sectional analysis of modules." We will make proposals based on specific achievements. Keywords: ■General power semiconductors (chips, module TIM materials, etc.) ■Reliability testing/evaluation ■Structural analysis (quality, competitor product RE) ■Failure analysis (identification of failure points, cause investigation, improvement proposals) 【List of Tests】 ■Power Cycle Testing ■Liquid Tank Thermal Shock Testing ■Gate Bias Testing ■Non-destructive observation of semiconductor/package delamination ■Failure analysis of power chips, etc. *For more details, please refer to the PDF materials or feel free to contact us.

Unreliable LCD displays are causing problems in the market. At Aites, we solve our customers' reliability issues through our extensive experience and state-of-the-art equipment, conducting reliability test design and visual inspections before and after testing. Furthermore, we provide support from failure mode classification to failure analysis and material analysis.

【Testing, Evaluation, Analysis】 　●Reliability Testing 　　■Temperature Cycle Testing 　　■Thermal Shock Testing 　　■High-Temperature Storage Testing 　　■Highly Accelerated Life Testing 　　■Preconditioning 　　■Hot Oil Testing 　　■In-situ Continuous Measurement 　　■Ion Migration Testing 　　■Electromigration Testing 　　■Test Consulting 　●Evaluation Testing 　　■Bond Strength Testing: Pull/Shear Testing 　　■Mechanical Strength Testing: Vibration/Shock/Fall Testing/Compression Strength/Shear Strength 　　■ESD/Latch Up/CDM Testing 　　■Electrical Characteristic Measurement 　　■Salt Spray Testing 　●Analysis 　　■X-ray Transmission Observation 　　■Ultrasonic Microscope Observation 　　■Luminescence Analysis (EMS/IR-OBIRCH) 　　■Scanning Electron Microscope (SEM) 　　■Transmission Electron Microscope (TEM) 　　■Surface Contamination Analysis (TOF-SIMS) 　　■Foreign Substance Analysis (FT-IR)

We would like to introduce the features of the YXLON "Cheetah EVO" that we have implemented. The "Reflow Simulator" allows for real-time observation of phenomena such as void behavior during soldering. It can be utilized for setting reflow conditions and selecting solder. 【Features】 ■ Ceramic heater & lamp heating ■ Target size: 40x40x20mm ■ Maximum set temperature: 350 degrees ■ Real-time observation possible ■ Can be used for setting reflow conditions and selecting solder *For more details, please refer to the PDF document or feel free to contact us.

The "Cheetah EVO" is an X-ray inspection and CT scanning device equipped with a reflow simulator, allowing real-time observation of behaviors such as voids during soldering. It can be utilized for setting reflow conditions and selecting solder. Our company has examples of using this product for "observation of inductor coils," as well as "BGA solder crack analysis" and "observation of IC-type coils." 【Device Specifications (Excerpt)】 ■ X-ray Generator: Multi-focus transmission type ■ Tube Voltage: 25–160 kV ■ Tube Current: 0.01–1.0 mA ■ Tube Power: 64 W *For more details, please refer to the PDF materials or feel free to contact us.

● Comprehensive technical services covering the entire product life cycle We provide support throughout the entire product life cycle, including raw material evaluation during development necessary for improving the quality of electronic components, reliability testing and result analysis, timely feedback of failure analysis and results to the development and manufacturing sites after shipment, and consulting for quality problem resolution. ● Prompt analysis and reporting of reliability test results For defects identified in reliability testing, we assist in accurate and timely cause identification and analysis through a rich and efficient analysis menu. ● Use only the services you need, as much as you need You can freely choose from a range of services, including conducting tests and inspections based on a predetermined evaluation plan, developing evaluation and analysis plans for problem resolution, result analysis, cause investigation, and consultation, according to your needs.

■Comprehensive Capability Consistent evaluation resistance from reliability testing to electrical characteristic measurement, optical characteristic measurement, and further analysis. ■Rich Analytical Methods - Forward bias analysis / Reverse bias analysis - Detection from visible to infrared - Emission analysis / OBIRCH analysis ■Special Technology By filtering the visible light range, we can detect weak emissions from abnormal areas without missing them.

■Problem-Solving Ability Consulting that leads to solutions with knowledge and technology Supporting customer schedules with quick responses ■Investigative Ability Skills to pinpoint and visualize malfunctioning areas Deep insight and advanced, delicate sample processing techniques ■Specialized Equipment Liquid tank thermal shock testing at up to 180°C Power cycle testing essential for power semiconductors

At AITES Co., Ltd., we offer "HAST testing for power devices." 【Features】 ■ Capable of conducting unsaturated vapor pressure tests with a maximum voltage of 1000V ■ Evaluation of metal wiring corrosion and migration through current flow under high temperature and high humidity conditions ■ Real-time monitoring during testing to assess sample degradation

We would like to introduce our "High-Temperature Latch-Up Testing." In recent years, there has been an increasing demand for latch-up testing under maximum operating ambient temperature conditions for devices. In particular, for automotive components under AEC standards, the testing conditions are limited to Class II (maximum operating ambient temperature), and for devices that require operation in high-temperature conditions, high-temperature latch-up testing is recommended. 【Main Standards for Latch-Up Testing (Excerpt)】 ■ JEDEC (JESD78E) - Current pulse application method, power supply overvoltage application method - Class I: Room temperature, Class II: Maximum operating ambient temperature ■ JEITA {JEITA ED4701/302 (Test Method 306B)} - Current pulse application method, power supply overvoltage application method - Class I: Room temperature, Class II: Maximum operating temperature *For more details, please refer to the PDF document or feel free to contact us.

This document introduces "Load Removal Mode & Color Filter Measurement Examples Using a Ultra-Micro Hardness Tester" by Aites Co., Ltd. It explains the results obtained from hardness measurements using graphs. Additionally, it includes examples of measuring the hardness of Red, Green, and Blue color resists by extracting color filters from discarded displays, accompanied by photos and graphs. Please feel free to download and take a look. [Contents] ■ Results obtained from hardness measurements ■ Examples of hardness measurement of color filters within displays *For more details, please refer to the PDF document or feel free to contact us.

In the testing environment, whisker observation is an important evaluation, but whiskers are very delicate and sensitive to vibrations and air fluctuations, so care must be taken in handling them during transportation and storage after testing. Our company consolidates the testing chamber, storage, and observation areas on one floor to reduce the risks associated with movement and storage, creating an environment where whiskers do not fall off or disappear. Additionally, we also offer migration observation before and after reliability testing, as well as solder surface observation, so please feel free to contact us. 【Features】 ■ Consistent service from reliability testing to observation ■ Consolidation of testing chamber, storage, and observation areas on one floor ■ Reduced risks associated with movement and storage ■ Whiskers do not fall off or disappear ■ Support for migration observation and solder surface observation before and after reliability testing *For more details, please refer to the PDF document or feel free to contact us.

We will introduce the lamp heating test (infrared irradiation test). In the environmental test chamber, the test sample is placed, and while controlling the ambient temperature in a blown air state, up to seven infrared lamps are used to irradiate light, thereby controlling the temperature of the surface temperature sensor of the sample to be higher than the ambient temperature. For example, it can simulate the stress of being further overheated by sunlight in a car interior that has reached high temperatures during the day. 【Features】 ■ Capable of conducting infrared irradiation tests in a blown air environment within the environmental test chamber. ■ Can recreate an environment where the surface temperature of the sample is higher than the ambient temperature. *For more details, please refer to the PDF document or feel free to contact us.

Reliability testing of materials that make up the product under thermal and humidity loads is essential, but analysis and evaluation after testing is also an indispensable process. Constant temperature and humidity testing is a device that applies temperature and humidity loads to products and materials to check for changes in physical properties, characteristics, appearance, and lifespan. Our company has also devised various methods for setting up a wide range of samples. In this document, we will introduce a case where changes in the molecular structure of materials before and after constant temperature and humidity testing were verified through IR analysis. We encourage you to read it. [Contents] ■ Examples of reliability testing equipment (constant temperature and humidity testing equipment) ■ Innovations in sample setup ■ Comparative evaluation before and after testing through chemical analysis *For more details, please refer to the PDF document or feel free to contact us.

Introducing the "Transmittance Measurement Service Using a Self-Recording Spectrophotometer." The transmittance of transparent materials is an important characteristic item in the specifications of the products used. This characteristic may deteriorate or be lost due to degradation from heat, humidity, ultraviolet light, and other factors. This document includes the principles of the equipment, as well as a comparative evaluation of the changes in transmittance of transparent resins before and after constant temperature and humidity testing, along with discussions. We encourage you to read it. [Contents] ■ Principles and specifications of the self-recording spectrophotometer ■ Changes in transmittance of PET resin (polyethylene terephthalate) ■ Changes in transmittance of PVC resin (polyvinyl chloride) *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce the "Reliability Testing, Haze Measurement, and IR Analysis Set Menu Service." Plastic (resin) materials can discolor and deteriorate depending on the usage environment. Transparent materials have valuable characteristics such as transparency and high transmittance, but these properties can decline due to degradation, resulting in a loss of functionality as a material. This document explains "Examples of Reliability Testing Equipment," "Haze Measurement Results," and "IR Analysis Results" using tables and graphs. We encourage you to read it. [Contents] ■ Examples of Reliability Testing Equipment (Constant Temperature and Humidity Testing Equipment) ■ Haze Measurement Results ■ IR Analysis Results *For more details, please refer to the PDF document or feel free to contact us.

In ICP emission spectroscopic analysis, it is possible to detect multiple metal elements contained in a sample simultaneously. This document introduces examples of the analysis of trace metal elements contained in liquid crystals. It includes the principles and overview of ICP-AES analysis as well as measurement examples. Please feel free to contact us regarding the sample state or the elements to be analyzed. [Contents] ■ Principles and Overview of ICP-AES Analysis ■ Measurement Example: Qualitative Analysis of Metal Elements in Liquid Crystal Panels *For more details, please refer to the PDF document or feel free to contact us.

In the event of a display failure on a liquid crystal panel, it is necessary to clarify the cause in order to prevent recurrence. This document presents a case study comparing panel A, which exhibited display unevenness due to temperature stress, and panel B, which showed no display issues, through chemical analysis. Aites can investigate the cause through chemical analysis of the liquid crystal interior when initial analyses, such as observations, do not reveal any issues. We can also propose analytical methods tailored to the sample and purpose beyond the techniques mentioned here. [Contents] ■ Reliability Testing (80°C/Dry Conditions/1000 Hours) ■ Liquid Crystal GC-MS Analysis ■ Metal Element ICP-AES Analysis in Liquid Crystal ■ Summary *For more details, please refer to the PDF document or feel free to contact us.

Resins are used in many products because they are easy to mold and color. It is also true that they can be prone to discoloration depending on the environment in which they are used, and evaluating the colorimetric system and transmittance before and after reliability testing is essential. This document presents the results of changes in the colorimetric system and transmittance before and after constant temperature and humidity testing of transparent resins. [Contents] ■ About (xyY) and L*a*b* color representation systems ■ Measurements before and after constant temperature and humidity testing (85°C, 85%, 168 hours) *For more details, please refer to the PDF document or feel free to contact us.

Plastic extrusion/injection molding processing is set according to the heat resistance temperature (melting point Tm) of the raw materials, but due to the degradation and alteration of the materials, there are cases where molding becomes difficult at the specified setting temperature. By checking the melt flow rate (MFR) of plastic raw material pellets or powders, it is possible to determine whether there are any changes compared to conventional products. We present a case where untreated (no load), temperature and humidity load (constant temperature and humidity test), and UV-irradiated PP (polypropylene) were injected and evaluated at a temperature of 230°C and a load of 5kg, so please take a look at the PDF download. [Evaluation Case] ■PP: Polypropylene ■8585: 85°C 85% × 336 hours ■UV: UV irradiation 253.7nm × 336 hours ■Injection time: 10 minutes (converted from 3 minutes) *For more details, please refer to the PDF materials or feel free to contact us.

The materials that make up the products are diverse, but the performance of the products often hinges on the characteristics of these materials. At AITES, we provide comprehensive support from reliability testing of materials to observation and physical/chemical analysis. This document presents a case study comparing the molecular structure and thermal property changes of plastic materials before and after exposure to ultraviolet light and constant temperature and humidity conditions. [Contents] ■ Constant temperature and humidity testing, and ultraviolet irradiation (Sample: Polyethylene (PE) pellets) ■ Results of IR, Raman, and EGA analysis *For more details, please refer to the PDF document or feel free to contact us.

At AITES, we conduct "Authenticity Investigations (Comparative Observations)." We compare the item under investigation with genuine or standard products, examining differences in structure and whether any silent changes have occurred. We support various observations, including visual inspections, unboxing observations, electrical property measurements, destructive and non-destructive observations, reliability testing, and material investigations. 【Features】 ■ Comparison of the item under investigation with genuine or standard products ■ Investigation of differences in structure and whether any silent changes have occurred *For more details, please refer to the PDF materials or feel free to contact us.

This document introduces a colorimeter that quantifies the color of objects. When light is irradiated onto an object, optical phenomena occur on the surface and inside the object, allowing for the quantification of the object's color by detecting the scattered light. As an example, we present test results that quantify the color differences between conditions where water-based paint was irradiated with ultraviolet (UV) light and conditions without UV treatment. We encourage you to download and take a look. [Contents] ■ Colorimeter (Device Structure) ■ L*a*b* Color Space ■ Visual Inspection of Water-Based Paint and Conversion to L*a*b* Color Space *For more details, please refer to the PDF document or feel free to contact us.

Our company can perform good product characteristic measurements, defective characteristic measurements, and reliability evaluations for specific TFTs in liquid crystal panels. In the "Electrical characteristic measurement of TFTs at various temperatures," we can disassemble the monitor in display mode and measure the electrical characteristics of the pixel TFTs within the panel. In the "DC bias stress test," we apply an arbitrary DC bias to the Gate and Drain and measure the Vth shift when stress is applied to the TFT, conducting reliability verification. 【Features】 - Electrical characteristic measurements can be performed on the pixel TFTs within the panel. - Measurements can be conducted before and after annealing, under light exposure, heating, or cooling conditions. - From the measurement results, indicators such as Ion, Ioff, Vth, and mobility can be calculated. - Verification of actual values in good product analysis and clarification of causes of defects can be performed. *For more details, please refer to the PDF document or feel free to contact us.

The "ESD (CDM) Testing Contract Service" evaluates the resistance to damage caused by ESD (Electrostatic Discharge) according to device charging models, which are important for the reliability of semiconductor products and electronic components that include them. It supports both the Direct Charge Method (Direct CDM) and the Field Induced Method (Field Induced CDM). Additionally, it is possible to determine damage through diode characteristic evaluation methods and other characteristic assessments (using separate equipment). 【Features】 ■ Compatible with various standard conditions such as JEDEC, JEITA (EIAJ also acceptable), and AEC through unit exchange ■ Supports both the Direct Charge Method (Direct CDM) and the Field Induced Method (Field Induced CDM) ■ Also compatible with the Direct Charge Method and Field Induced Method of AEC-Q100-011 ■ Damage determination is also possible through diode characteristic evaluation methods and other characteristic assessments ■ Ensures reliable application through contact confirmation function of applied pins *For more details, please refer to the PDF document or feel free to contact us.

The "ESD (HBM・MM) Testing Service" evaluates the resistance to damage caused by ESD using the Human Body Model and Machine Model, which are important for the reliability of semiconductor products and electronic components that include them. We accommodate products such as IC modules, semiconductor products, and subsystems with up to 512 pins. We conduct tests in accordance with major domestic and international standards such as ESDA/JEDEC, JEITA, AEC, and IEC. Additionally, if there are issues with resistance, we assist in problem-solving, including failure analysis and root cause investigation. 【Features】 ■ Supports products such as IC modules, semiconductor products, and subsystems with up to 512 pins ■ Partial support for products with more than 512 pins (consultation required) ■ Conducts tests in accordance with major domestic and international standards such as ESDA/JEDEC, JEITA, AEC, and IEC ■ Proposes and conducts tests tailored to customer requests and objectives ■ Assists in problem-solving, including failure analysis and root cause investigation, if there are issues with resistance *For more details, please refer to the PDF document or feel free to contact us.

In our company, we can conduct liquid tank thermal shock tests while keeping the LED continuously powered on. This allows for verification of the lighting status during the test and continuous monitoring of current values for evaluation. The liquid tank applies temperature stress using a liquid medium, resulting in more abrupt temperature changes compared to a gas tank. Since we use a highly insulating liquid, electrical tests are possible, and by monitoring the voltage (current) during the test, we can identify points of characteristic change in the LED's lighting status. 【Features】 ■ Testing can be conducted with the LED continuously powered on ■ The liquid tank applies temperature stress using a liquid medium, resulting in abrupt temperature changes ■ Electrical tests are possible due to the use of a highly insulating liquid ■ Points of characteristic change can be identified *For more details, please refer to the PDF document or feel free to contact us.

In ANSI/ESDA/JEDEC JS-002-2014, it is required that the relative humidity near the device during testing be kept below 30%. The verification method involves installing temperature and humidity sensors in two locations near the sample to continuously monitor temperature and humidity, and the test begins when the relative humidity falls below 30%. The AEC standards also explicitly state in the 2019 revision that they comply with ANSI/ESDA/JEDEC JS-002, and it is expected that the demand for low humidity environments will continue to increase in the future. 【Humidity Requirements for Major CDM Test Standards】 ■ ANSI/ESDA/JEDEC JS-002-2018: Relative humidity below 30% ■ AEC-Q100-011 Rev-D・AEC-Q101-005 Rev-A: Relative humidity below 30% ■ JEITA ED-4701/302A (Test Method 305D): Ambient temperature 25°C ± 5°C *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce our ultrasonic microscope, the SAM (Scanning Acoustic Microscope). It is highly effective in detecting defects in the internal conditions and adhesion states of semiconductor packages, substrates, and electronic components. Observation can be performed non-destructively, and defects such as delamination can be detected from the reflected waves of the ultrasonic waves incident on the sample. 【Specifications (excerpt)】 ■ Pulse Receiver: 500MHz ■ Observation Methods: Compatible with both reflection and transmission methods ■ Acoustic Lenses / Reflection Method: 15, 25, 30, 50, 80, 100, 230MHz ■ Acoustic Lenses / Transmission Method: 15, 25, 30, 50, 100MHz *For more details, please refer to the PDF document or feel free to contact us.

At AITES Co., Ltd., we conduct "Thermal Shock Testing." By repeatedly exposing samples to high and low temperatures, not only does stress occur due to thermal effects, but also due to the expansion and contraction of various parts. Repeated stress also adds to the overall stress. This test is conducted not only for the joints of electronic components but also for evaluating fixed points such as screws. 【Main Specifications of the Thermal Shock Testing Equipment】 ■ Internal dimensions: W650×H460×D370mm, Temperature range: -65 to 0/+60 to 200℃ ■ Internal dimensions: W650×H460×D670mm, Temperature range: -65 to 0/+60 to 200℃ ■ Internal dimensions: W970×H460×D670mm, Temperature range: -65 to 0/+60 to 200℃ *For more details, please refer to the PDF document or feel free to contact us.

At AITES Co., Ltd., we conduct "Liquid Tank Thermal Shock Testing." This testing method applies stress due to temperature changes using a liquid medium, and because the temperature changes are more abrupt than those in chamber-type thermal shock tests, it is an effective method for conducting tests in a short period. Our equipment can accommodate a maximum high temperature of up to 180°C, making it suitable for accelerated testing of high-heat-resistant components and materials. 【Features】 ■ Capable of handling maximum temperatures up to 180°C ■ Effective for testing and evaluating high-heat-resistant components ■ More abrupt temperature changes than chamber-type thermal shock tests ■ Effective for conducting tests in a short period *For more details, please refer to the PDF materials or feel free to contact us.

At AITES Co., Ltd., high-temperature reverse bias testing (HTRB) for evaluating the oxide film and junction of power devices can be applied up to 2000V. By monitoring the leakage current during the test, the degradation status of the device can be grasped in real-time. Since the power supply is independent, if one device fails during the test, it will not affect the other devices. Additionally, it is possible to set a failure criterion (current value) and to cut off the power supply of the device deemed faulty at the time of failure judgment. 【Features】 ■ Real-time monitoring of the leakage current during testing allows for understanding the degradation status of the device. ■ The independent power supply ensures that if one device fails during testing, it does not affect other devices. ■ The power supply of the device deemed faulty can be cut off at the time of failure judgment. *For more details, please refer to the PDF document or feel free to contact us.