アイテス Product Lineup

At Aites, we undertake contract processing of cross-sections of various components and materials, including electronic components, mounted circuit boards, semiconductors, compound semiconductors, power devices, films, resin molded products, solar panels, and LCD glass. We also conduct observation and analysis of the produced cross-sections, providing contract analysis for defect analysis and quality evaluation. 【Service List】 ■Mechanical polishing ■CP processing ■Microtome ■FIB processing ■Analysis of semiconductor diffusion layers, etc. *For more details, please refer to the PDF document or feel free to contact us.

In this document, we introduce various analysis cases conducted by our company using X-ray fluoroscopy and CT inspection equipment. It includes examples such as "BGA solder crack analysis case" from X-ray fluoroscopic observation and oblique CT observation, as well as cases of "surface mount LEDs" and "chip resistors." 【Contents (excerpt)】 ■ BGA solder crack analysis case (X-ray fluoroscopic observation) ■ Surface mount LEDs ■ Chip resistor observation case ■ Reflow simulator ■ Microphone observation case (X-ray fluoroscopic observation & orthogonal CT observation)... ★ Currently offering the 【X-ray fluoroscopy and CT inspection equipment case collection】 for free! You can view it immediately from the "PDF download." *For more details, please refer to the PDF document or feel free to contact us.

X-ray observation is a method of non-destructive testing and is the first inspection conducted for analysis and evaluation. It is effective for initial observation of various components and materials, including implemented circuit boards and electronic parts. Additionally, CT inspection allows for three-dimensional structural capture, enabling visual judgment. The "Cheetah EVO" is equipped with a reflow simulator, allowing real-time observation of phenomena such as void behavior during soldering, which can be utilized for setting reflow conditions and selecting solder. 【Device Specifications】 ■ YXLON Cheetah EVO - X-ray generator: Multi-focus transmission type - Tube voltage: 25-160kV - Tube current: 0.01-1.0mA - Tube power: 64W - Additional features: Orthogonal CT, oblique CT, reflow simulator *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce the features of the YXLON "Cheetah EVO" that we have implemented. The "Reflow Simulator" allows for real-time observation of phenomena such as void behavior during soldering. It can be utilized for setting reflow conditions and selecting solder. 【Features】 ■ Ceramic heater & lamp heating ■ Target size: 40x40x20mm ■ Maximum set temperature: 350 degrees ■ Real-time observation possible ■ Can be used for setting reflow conditions and selecting solder *For more details, please refer to the PDF document or feel free to contact us.

The "Cheetah EVO" is an X-ray inspection and CT scanning device equipped with a reflow simulator, allowing real-time observation of behaviors such as voids during soldering. It can be utilized for setting reflow conditions and selecting solder. Our company has examples of using this product for "observation of inductor coils," as well as "BGA solder crack analysis" and "observation of IC-type coils." 【Device Specifications (Excerpt)】 ■ X-ray Generator: Multi-focus transmission type ■ Tube Voltage: 25–160 kV ■ Tube Current: 0.01–1.0 mA ■ Tube Power: 64 W *For more details, please refer to the PDF materials or feel free to contact us.

Here are some observation examples of IC-type coils. By using appropriate methods for X-ray observation, we can clearly capture the internal structure according to the purpose. In transmission observation, we can quickly detect metal foreign objects, and in CT observation, we can obtain three-dimensional images of arbitrary cross-sections, making it suitable for observations where positional information and shape are important. Unlike transmission observation, we can also assess the winding condition of the coil wiring. *For more details, please refer to the PDF materials or feel free to contact us.

We will introduce a case of observing an inductor coil (orthogonal CT observation + cross-sectional observation). The inside of an inductor coil that experienced operational failure was observed using X-ray CT. It was confirmed that abnormal shapes occurred in various places of the spirally formed wiring. With X-ray CT observation, it is possible to observe in three dimensions, allowing for a clear understanding of the condition of the abnormal areas. Additionally, cross-sections including the abnormal areas were created through mechanical polishing, and observations were conducted using SEM. *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce a case where the moment a surface-mounted LED is damaged due to overload was captured through X-ray observation. In this case, the surface-mounted LED was powered on, and the voltage and current were gradually increased from the rated values, capturing the process that led to the LED becoming non-functional due to overload. Additionally, you can view the process of the LED becoming non-functional in a video. 【LED Failure Observation Case】 ■ After becoming non-functional - Melting, disconnection - Change in the shape of the wire loop - Delamination of the phosphor - Changes in the shape and size of voids *For more details, please refer to the PDF document or feel free to contact us.

We will introduce a case study of observing chip resistors using X-ray fluoroscopy and CT scanning. Chip resistors have a structure where a thin film of metal (the resistive element) is formed on the surface of ceramics. The L-shaped lines seen in the X-ray image are trimming marks applied to adjust the resistance value. CT observation allows for viewing the desired cross-sectional images and enables three-dimensional observation, making it effective for analysis. If any defects are found through X-ray or CT observation, cross-sectional observation and elemental analysis will be conducted to investigate the cause. [Case Study of Chip Resistor Observation] ■ CT Observation - It is possible to view the desired cross-sectional images. - Effective for analysis due to the ability to observe in three dimensions. *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce a case study of observing microphone components using X-ray fluoroscopy and orthogonal X-ray CT. MEMS chips and Si chips are transparent, making them only faintly observable. However, in the X-ray fluoroscopic images, the wire bonding and the wiring patterns of the mounting substrate can be observed. In the orthogonal CT images, MEMS chips and Si chips can be observed more clearly compared to the fluoroscopic images. Additionally, while the fluoroscopic images show the observation of overlapping layers, the CT images allow for observation of each layer individually. [Observation Case of Microphones] ■ X-ray Fluoroscopic Images - Wire bonding and wiring patterns of the mounting substrate can be observed. ■ Orthogonal CT Images - MEMS chips and Si chips can be observed more clearly compared to the fluoroscopic images. *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce a case of observing a wisdom tooth (third molar) using X-ray CT. Over 10 years ago, the extracted wisdom tooth of the photographer was observed using X-ray CT. Compared to X-ray fluoroscopy images, the enamel on the surface of the tooth and the underlying dentin were clearly observed. [Observation Case of Wisdom Tooth] ■Compared to X-ray fluoroscopy images, the enamel on the surface of the tooth and the underlying dentin can be clearly observed. *For more details, please refer to the PDF document or feel free to contact us.

We will introduce a case study of BGA solder crack analysis using X-ray imaging and CT scanning. When observing the BGA connection area of a circuit board that had become electrically open using X-ray imaging, cracks were confirmed to have occurred at the BGA connection. Additionally, we examined the cracks in the solder connection area identified through X-ray imaging using oblique CT. Oblique CT provides clear planar information, but spherical shapes like solder balls and voids appear elongated in the vertical direction due to specific factors of oblique CT. While it is difficult to obtain cross-sectional information about the cracks occurring at the solder joint interface, there is the advantage of being able to observe the circuit board non-destructively. [Analysis Cases] ■ X-ray imaging observation ■ Oblique CT observation ■ Orthogonal CT observation ■ Cross-sectional observation *For more details, please refer to the PDF document or feel free to contact us.

We will introduce a case study of the combined use of X-ray transmission observation and CT scanning equipment with image processing technology. In the transmission X-ray images of normal substrates and defective substrates, the wiring was intricately arranged, and abnormalities were not apparent at first glance. However, image processing allowed us to detect the differences between the images of normal and defective products. Identifying defective areas from a wide field of view is challenging, especially in cases of pattern abnormalities in substrate wiring. However, by using image processing software in conjunction, it becomes possible to discover abnormal areas. [Case Study of Combined Use of Transmission Observation and Image Processing Technology] ■ Detection of differences between images of normal and defective products through image processing - Upon examining the white spots in the X-ray transmission image of the defective product, a shape resembling a broken wire was confirmed. *For more details, please refer to the PDF document or feel free to contact us.

When stress such as warping, bending, or twisting is applied to the printed circuit board, cracks may occur inside the MLCC (Multi-Layer Ceramic Chip Capacitor). Additionally, cracks that occur internally are often hidden by the electrodes, making it difficult to detect them from the exterior. In such cases, how about checking with X-rays? [Observation Details] ■ Oblique CT Observation It is possible to perform CT without destroying the printed circuit board, in its original state. ■ Orthogonal CT Observation It is possible to observe the shape of the components in their original state. *For more details, please refer to the PDF document or feel free to contact us.

Aites Co., Ltd. performs slicing processing using isomet. When you want to observe the cross-section of all connector pins in multiple rows, the usual procedure is to grind down to the next row... However, by performing slicing processing, it is possible to keep the created cross-section as it is. Additionally, we have examples of slicing processing for connector pins with multiple rows. *For more details, please refer to the PDF materials or feel free to contact us.*

We would like to introduce the cutting process using a wire saw at AITES Co., Ltd. With a wire saw, it is possible to create multiple cross-sections from a single sample by cutting and dividing it. Since it does not involve grinding, observations and analyses can be conducted again. Additionally, in cutting examples, even small and brittle white rice can be divided without causing cracks or chips. If you have any requests ranging from cutting processes to observations and analyses, please feel free to contact us. *For more details, please refer to the PDF document or feel free to reach out to us.

We would like to introduce the sample preparation (sample cutting and resin embedding) for cross-sectional observation conducted by Aites Co., Ltd. We use cutting equipment suitable for cutting large substrates and thick components, such as the band saw "HOZAN K-100" and the IsoMet "Buehler Low Speed Saw." With the "HOZAN K-100," samples up to approximately X150mm, Y230mm, and Z70mm in size can be cut. Additionally, after cutting, the samples are embedded in epoxy resin or similar materials, but it is also possible to embed in resin before cutting. 【Product Lineup】 ■ Band Saw ■ IsoMet ■ Multifunctional Diamond Wire Saw *For more details, please refer to the PDF document or feel free to contact us.

The CP method allows for the observation of cross-sections without damage from polishing, compared to mechanical polishing methods. Our triple ion milling device with cooling function achieves high processing precision and a wide processing area through ion beams irradiated from three directions. For materials sensitive to heat, processing can be done while reducing damage with the cooling function. 【Features】 ■ Capable of processing over a wide range with a processing width of approximately 4mm and a processing depth of about 1mm ■ High flatness in both hard and soft materials, enabling the production of cross-sections without physical damage ■ Capable of producing cross-sections with good positional accuracy ■ Processing can be done while cooling (cryogenic) *For more details, please refer to the PDF document or feel free to contact us.

Our company specializes in "cross-section polishing of implemented components and electronic parts." To quickly provide suitable cross-section samples for the observation of various components, we carefully polish each part by hand, using an efficient process without waste. Please feel free to contact us for more information. 【Features】 ■ Quickly providing suitable cross-section samples for the observation of various components ■ Carefully polishing each part by hand, using an efficient process without waste *For more details, please refer to the PDF document or feel free to contact us.

Our company conducts "cross-sectional observation of surface-mounted electronic components." Through cross-sectional observation after mechanical polishing, it is possible to closely examine the solder joint condition (presence of cracks and voids) of electronic components on the mounted substrate, as well as the internal structure of the components. For "SOP components," detailed observation can be made from the overall cross-section to the solder connection, while for "aluminum electrolytic capacitors," it is possible to observe the internal structure of the electrolytic capacitor components and their connection to the substrate. 【Features】 ■ SOP (Small Outline Package) components - Detailed observation can be made from the overall cross-section of SOP components to the solder connection. ■ Chip ceramic capacitors - Detailed observation can be made from cracks in the component material to cracks in the solder area. ■ Aluminum electrolytic capacitors - Observation can be made from the internal structure of the electrolytic capacitor components to their connection to the substrate. *For more details, please refer to the PDF document or feel free to contact us.

Our company supports customers in solving their challenges and issues not only with electronic components but also with a wide range of products, parts, and materials, including inorganic and organic materials, through failure analysis, defect analysis, structural analysis, and reliability evaluation. This document introduces how to approach analysis and evaluation techniques from various perspectives. We hope it serves as a starting point for problem-solving and provides assistance in unraveling issues for our customers. [Contents] ■ Introduction ■ Image of Joining and Positioning of Our Evaluation and Analysis Techniques ■ Causes of Defects ■ Methods ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, it is important to observe not only the shape but also the metal structure.

We will introduce the EBSD analysis of flexible printed circuits (FPC). For flexible circuits used in products with movable parts and bending mechanisms, we conducted an EBSD analysis to check for differences in the Cu wiring between the bending section and the fixed section. As a result, while no significant abnormalities or differences were observed in the optical images of the wiring in the bending and fixed sections, the EBSD analysis revealed areas where strain is accumulated in the wiring of the bending section and areas where low-angle grain boundaries are concentrated. [Analysis Content] ■Appearance of the flexible circuit and optical images of Cu wiring - Appearance of the flexible circuit - Wiring in the bending section - Wiring in the fixed section ■Comparison of Cu wiring in the bending section and fixed section using EBSD - Wiring in the bending section - Wiring in the fixed section *For more details, please refer to the PDF document or feel free to contact us.

Here is an example of the analysis of BGA (Ball Grid Array). In the observation using a microscope, both optical microscopy and SEM are employed. In the crystal analysis using the EBSD method, we utilize the Phase map, Sn Grain map, Sn IPF map, and Sn GROD map, which allow for the inference of crystal states and residual stresses. 【Overview】 ■ Crystal analysis using the EBSD method - Phase map - Sn Grain map - Sn IPF map - Sn GROD map *For more details, please refer to the PDF materials or feel free to contact us.

We will introduce an example of analysis of the chip surface wiring (Al) using EBSD. The package resin was opened using a chemical solution/RIE, and an analysis of the Al pattern on the chip surface was conducted using EBSD. As a result, orientation was observed in the Al wiring. The normal orientation is distributed, and it is believed that many crystals are present. 【Overview】 ■ Analysis Method - The package resin was opened using a chemical solution/RIE. - An analysis of the Al pattern on the chip surface was conducted using EBSD. ■ Results - Orientation was observed in the Al wiring. *For more details, please refer to the PDF document or feel free to contact us.

The EBSD method allows us to confirm the distribution of crystal sizes and the orientation of crystal orientations. In this case, it was found that there is a significant orientation difference in the valleys of the screw, suggesting that there is a large residual stress. Additionally, it was observed that small crystal grains are distributed on the surface of the screw. [Summary] ■ Analysis Method - Observation of crystal structure using EBSD ■ Results - It was found that there is a significant orientation difference in the valleys of the screw - It is inferred that there is a large residual stress - It was also observed that small crystal grains are distributed on the surface of the screw *For more details, please refer to the PDF document or feel free to contact us.

Aites Co., Ltd. conducts analysis using EBSD on pipes. With the EBSD method, it is possible to confirm the distribution of crystal sizes and to check the orientation. Additionally, by highlighting on the map, the features that appear in the graph can be visualized. 【Overview】 ■ Confirmation of crystal size distribution and orientation ■ Visualization of features that appear in the graph *For more details, please refer to the PDF document or feel free to contact us.

We will introduce an example of analysis using EBSD for vias (Cu) formed in a multilayer substrate. With the EBSD method, it is possible to infer the distribution of crystal sizes and residual stress. Additionally, by highlighting on the map, the features that appear in the graph can be visualized. 【Overview】 ■Observation of crystal structure using EBSD ・IPF map ・GROD map ・Crystal grain distribution map *For more details, please refer to the PDF document or feel free to contact us.

We will introduce an example of analysis using EBSD for high melting point solder (Pb-based solder containing a small amount of Sn). With the EBSD method, it is possible to infer the grain distribution and residual stress. Additionally, there are analyses that can be performed simultaneously for metals with different crystal structures, allowing for data acquisition for each metal. 【Features】 ■ Ability to infer grain distribution and residual stress ■ Simultaneous analysis for metals with different crystal structures is possible, enabling data acquisition for each metal *For more details, please refer to the PDF document or feel free to contact us.

We will introduce an example of analysis using EBSD for steel (Fe). Using histograms of gradients and corresponding grain distribution maps, IPF maps, and grain distributions, we observe the crystal structure with EBSD. The EBSD method allows us to confirm the distribution of crystal sizes and the orientation of crystal directions, and by highlighting on the map, we can visualize the features that appear in the graphs. 【Overview】 ■Observation of crystal structure using EBSD ・IPF map ・Grain distribution map ・Grain distribution *For more details, please refer to the PDF document or feel free to contact us.

SEM images, phase maps, and IQ maps of Cu6Sn5 highlighted for each crystal grain, as well as IQ maps of Cu6Sn5 highlighting the rotation angles of grain boundaries, were used to analyze the crystals using the EBSD method. Compounds such as Cu6Sn5 and Ag4Sn are growing at the Cu pad/solder interface, and the distribution of crystal sizes and crystal inclination angles can be shown using histograms. Additionally, by highlighting on the map, the features that appear in the graph can be visualized. [Overview] ■ Crystal analysis using the EBSD method - SEM images - Phase maps - IQ maps of Cu6Sn5 (highlighted for each crystal grain) - IQ maps of Cu6Sn5 (highlighting the rotation angles of grain boundaries) *For more details, please refer to the PDF document or feel free to contact us.

The EBSD method is a technique for analyzing the distribution of crystal grains, microstructure, and crystal phase distribution by calculating the crystal orientation of patterns continuously captured based on the information of the crystal structure of the sample. Materials with a crystalline structure, such as metals and ceramics, are thought to be composed of numerous crystal lattices like cubic ones, and this analytical method examines the orientation of these lattices (crystal orientation). Various maps are used, including IQ maps (Image Quality Maps), IPF maps, GROD maps, and pole figures. 【Features】 ■ The EBSD method is a technique for analyzing the distribution of crystal grains, microstructure, and crystal phase distribution. ■ Uses the TSL Solutions OIM7.0 crystal orientation analysis device. ■ Analyzes the orientation of the crystal lattice (crystal orientation). ■ Changes in crystal orientation and grain size due to different processing conditions (such as rolling and extrusion) can be analyzed. *For more details, please refer to the PDF document or feel free to contact us.

The EBSD (Electron Backscatter Diffraction) method obtains orientation information of individual crystals from the electron diffraction patterns generated by electron beam irradiation and maps this information. Furthermore, it is a technique for investigating not only crystal orientation (texture) but also material microstructural states such as grain distribution and stress-strain as quantitative and statistical data. In the observation of changes before and after compression of a copper plate, IQ maps, GROD maps, and IPF maps (in the Axis 3 direction) can be used to compare the halving of crystal grain size before and after compression. 【Features】 ■ Obtains and maps orientation information of individual crystals ■ Investigates material microstructural states such as crystal orientation, grain distribution, and stress-strain *For more details, please refer to the PDF document or feel free to contact us.

The EBSD (Electron Backscatter Diffraction) method obtains orientation information of individual crystals from the electron diffraction patterns generated by electron beam irradiation and maps this information. It is a technique used to investigate not only crystal orientation (texture) but also material microstructural states such as grain distribution and stress-strain as quantitative and statistical data. For example, when the sample is tilted significantly in a SEM and the electron beam is irradiated, if the sample is crystalline, electron diffraction occurs within the sample. By indexing the resulting pattern, it becomes possible to determine the crystal orientation at that point. By observing the differences in crystal orientation, it is possible to infer the residual stress within the crystal grains. 【Features】 ■ Obtains and maps orientation information of individual crystals ■ Investigates material microstructural states such as crystal orientation, grain distribution, and stress-strain ■ Allows inference of residual stress within crystal grains by observing differences in crystal orientation *For more details, please refer to the PDF document or feel free to contact us.

We offer contract analysis using the shape measurement laser microscope "VK-X200." Observations and measurements are conducted using a 408nm laser. The measurement results are based on a traceability system that connects to national standards, allowing the measurement equipment to be used for non-destructive testing. The laser microscope enables 3D measurement of the surface roughness of samples, as well as measurement of the thickness of transparent films and surface shapes through transparent materials. 【Features】 ■ Capable of 3D measurement of surface roughness of samples ■ Capable of measuring the thickness of transparent films and surface shapes through transparent materials ■ Observations and measurements are conducted using a 408nm laser ■ Measurement results are based on a traceability system that connects to national standards ■ Can be utilized as non-destructive testing equipment *For more details, please refer to the PDF document or feel free to contact us.

We offer contract analysis using the shape measurement laser microscope "VK-X200." Various measurements can be performed, including flatness measurement, width measurement, height measurement, and film thickness measurement. Depending on the size of the subject and the required precision, we select the appropriate objective lens to conduct observations and measurements. The range varies depending on the lens, but due to its coupling function, it is also possible to observe and measure over a wide area. 【Features】 - Various measurements can be performed, including flatness measurement, width measurement, height measurement, and film thickness measurement. - The appropriate objective lens is selected based on the size of the subject and the required precision. - The coupling function allows for observation and measurement over a wide area. *For more details, please refer to the PDF document or feel free to contact us.

This document explains the bonding interface of Cu wire bonding in semiconductor packages. It details the purpose and wire bonding, as well as the characteristics of Cu wire bonding, the Cu-Al compounds at the bonding center, micro voids, and the growth (diffusion) of Cu-Al compounds, accompanied by diagrams and photographs. [Contents (excerpt)] ■ Purpose and wire bonding ■ Samples and methods ■ Procedures and flow ■ Characteristics of Cu wire bonding ■ Selection of cross-section preparation methods *For more details, please refer to the PDF document or feel free to contact us.

This document presents the bonding interface of Cu wire bonding in semiconductor packages. It provides a detailed explanation of the samples and methods, various wire bonding techniques, results, and discussions, accompanied by figures and photographs. 【Contents】 ■ Introduction ■ Samples and Methods ■ Various Wire Bonding Techniques ■ Results and Discussion ■ Conclusion ■ References *For more details, please refer to the PDF document or feel free to contact us.

While lead-free solder is becoming widespread, whiskers formed from Sn plating or solder joints have a significant impact on the reliability of electronic components. Our company offers a consistent whisker evaluation process from reliability testing to analysis. Inspectors carefully observe which components and pins on the substrate have whiskers. 【Features】 ■ Conduct visual inspections of assembled boards after reliability testing to determine the presence of whiskers. ■ If whiskers are detected during visual inspection, observe and measure them using a digital microscope. ■ For more detailed observation and analysis, perform surface SEM/EDX analysis. ■ If necessary, observations and analyses such as cross-sectional observation (SEM) and crystal orientation analysis (EBSD) are also possible. *For more details, please refer to the PDF document or feel free to contact us.

This is an example of analysis using EBSD for ceramics (Al2O3). In the "Observation/Elemental Analysis," it was determined to be Al2O3 based on elemental analysis using EDX, and it was observed that Si was scattered as shown in the map. In the "Analysis using EBSD," the distribution of crystal size and orientation can be confirmed using the EBSD method, and by highlighting the map, the features that appeared in the graph can be visualized. [Analysis Overview] ■ Observation/Elemental Analysis - Observation using SEM and elemental analysis using EDX ■ Analysis using EBSD - Observation of crystal structure using EBSD *For more details, please refer to the PDF document or feel free to contact us.

Our "Ultra-Micro Hardness Measurement for Material Evaluation" allows for the ultra-micro hardness measurement of materials such as metals, polymers, plastics, and ceramics. Additionally, since hardness can be quantified, it is also useful for long-term quality control. The hardness is determined by directly reading the depth of the indentation while applying a load to the indenter. It is also possible to determine characteristic values related to recovery behavior. 【Device Overview】 ■ Test force range: 0.4mN to 1000mN, Accuracy: ±0.02mN ■ Indentation range: 1nm (0.01μm) to 700μm *For more details, please refer to the PDF document or feel free to contact us.

This document introduces a case study on whiskers that occurred on the lead terminals of IC packages, where cross-sections were created through mechanical polishing, followed by SEM observation and EBSD analysis. It includes surface SEM images of the IC package as well as cross-sectional SEM images. It is evident that the crystal grains and grain boundaries measured by the EBSD method are consistent. We encourage you to read it. 【Published Cases】 ■Observation/Cross-section Preparation ■Analysis by EBSD *For more details, please refer to the PDF document or feel free to contact us.

We are pleased to announce the launch of our MEMS processing services / MEMS foundry services. At Omron's Yasu facility in Yasu City, Shiga Prefecture, which boasts the largest 8-inch MEMS line in Japan, we will respond to various customer requests from prototype wafer processing to mass production. URL: https://www.ites.co.jp/wafer/foundry.html ■ Features - Prototyping based on customer design specifications - Participation in prototyping from the product design stage with process proposals - Establishment of mass production lines - Launch of a second fab to enhance production capacity - Rapid ramp-up from prototyping to mass production in a seamless manner *For more details, please refer to the PDF document or feel free to contact us.

The CCD camera module is composed of a complex structure that integrates electronic and mechanical technologies, including sensors, control elements, and AF drive mechanisms, all within a small housing. Additionally, a variety of materials such as metal, glass, and resin are used, making cross-section preparation difficult. Our company can produce cross-sections of such high-difficulty samples with advanced technology. 【Cross-section of CCD Camera Module】 ■ Multiple lenses and filters are built into the small housing ■ Products with AF functionality also incorporate mechanisms for focus adjustment and control elements *For more details, please refer to the PDF document or feel free to contact us.

This document introduces processing damage caused by mechanical polishing methods. Mechanical polishing is a long-established technique for cross-section preparation, capable of producing cross-sections over a wide range, from a few centimeters to about 10 centimeters. However, damage such as altered layers, steps, elongation (stretching), and embedding can occur during processing, leading to issues like "something that should be there is missing" and "something that shouldn't be there is present." At Aites, we perform highly reliable cross-section preparation based on the technology and experience we have cultivated over many years. [Contents] ■ Main processing damages in mechanical polishing methods ■ Importance of polishing finishes tailored to material characteristics ■ Case studies involving solder (BGA) *For more details, please refer to the PDF document or feel free to contact us.