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This document introduces the cross-sectional observation of solar cell modules. An inspection was conducted on a solar cell module that underwent thermal shock testing, and upon performing a cross-sectional observation of the identified abnormal areas, it was confirmed that the interconnector solder joint had fractured. [Contents] - Cross-sectional observation of the fracture - Element map of the fracture *For more details, please refer to the PDF document or feel free to contact us.

Introducing "Crack Observation Using Tabletop SEM (Scanning Electron Microscope)." In the evaluation of product reliability, cross-sectional observation of cracks is essential. While optical microscopy may overlook small cracks, SEM observation allows for clear identification. Moreover, with a tabletop SEM, no conductive treatment is necessary, enabling quick and detailed observation. 【Features】 ■ No need for deposition ■ Easy visibility of crystal grains ■ Fine cracks are easily visible *For more details, please refer to the PDF document or feel free to contact us.

This document introduces the cross-sectional observation of neodymium magnets using a tabletop SEM (scanning electron microscope). Samples with magnetic properties, such as neodymium magnets, cannot be observed in a magnetized state using SEM; however, by applying demagnetization treatment, SEM observation and elemental analysis can be performed. Please take a moment to read it. 【Contents】 ■ Demagnetization of neodymium magnets and cross-sectional observation using SEM (Hitachi High-Tech TM3030Plus) - Demagnetization treatment (SEM observation of the magnet in a magnetized state is not possible, so demagnetization is performed) - Cross-sectional observation - Elemental analysis using EDX *For more details, please refer to the PDF document or feel free to contact us.

This document introduces methods for preparing cross-sections. When conducting observations, analyses, or evaluations, there may be a need to prepare cross-sections. By selecting or combining methods that are appropriate for the purpose, material, and structure, it is possible to obtain highly reliable results. In mechanical processing, we include main cross-section preparation methods such as "mechanical polishing" and "microtome." In ion beam processing, methods like "FIB" and "ion polisher (CP)" are also featured. We encourage you to read it. [Contents] ■ Main cross-section preparation methods ■ Processing conditions ■ Advantages & disadvantages *For more details, please refer to the PDF document or feel free to contact us.

A defective toggle switch component was found where the operating lever does not switch. Upon performing X-ray fluoroscopic observation, it was observed that the internal metal plate was misaligned, revealing the cause of the defect. In this case, the metal plate is supposed to move like a seesaw around the central terminal to switch the circuit, but due to the misalignment of the metal plate in the defective product, the lever could not switch to the opposite side, preventing the circuit from being switched. CT observation provides not only a 3D image but also arbitrary slice cross-sectional images in the X, Y, and Z directions. [Observation Case] ■ Subject: Toggle Switch ■ Observation Method: X-ray fluoroscopic observation, orthogonal CT observation ■ Cause of Defect: Misalignment of the internal metal plate *For more details, please refer to the PDF document or feel free to contact us.

Foreign substances that significantly affect the yield of electronics products must be analyzed promptly. Our company utilizes various sample processing techniques to provide rapid analysis results. The materials introduce the excavation of foreign substances buried in multilayer films and an overview of micro cutting tools. 【Micro Cutting Tool Specifications】 ■ Cutting edge width: 50μm or 100μm ■ Cutting depth: Approximately 2 to 300μm ■ Cutting targets: Resins, glass, Si wafers, metals, etc. *For more details, please refer to the PDF materials or feel free to contact us.

At Aites Co., Ltd., we perform section preparation using a microtome. A "microtome" is a device that slices samples thinly with glass or diamond knives to create cross-sectional observation samples for TEM, SEM, OM, and LM. It is not suitable for hard materials, but it is ideal for preparing sections of soft materials such as films. [Examples of Cross-Section Observation] ■ Liquid Crystal Polarizers ■ Aluminum Cans ■ Telephone Cards ■ Mobile Phone Cases ■ Flexible Cables ■ Yogurt Lids *For more details, please refer to the PDF document or feel free to contact us.

By observing shapes clearly that might be overlooked by the inspector's visual inspection alone, it is possible to accurately grasp defects. Wide-range bulk observation and partial magnification are also possible, accommodating various types of observation. Additionally, we have IPC-A-610 certified IPC specialists on staff who can assist with observations in accordance with international standards, provide consultations, and address various observation-related concerns. 【Features】 ■ Wide-range bulk observation and partial magnification are possible ■ Accommodates various types of observation ■ Clear magnified observation is possible regardless of the location after overall observation ■ Additional observation of unexpected areas is also easy ■ IPC-A-610 certified IPC specialists are on staff *For more details, please refer to the PDF document or feel free to contact us.

EPMA analysis has good energy resolution and detection sensitivity, and is particularly excellent for quantitative analysis of trace components and map analysis. It can accommodate sizes of 100×100mm, allowing for extensive mapping. In the example of foreign substance analysis on indium-tin oxide thin films, it showed better energy resolution, detection limits, and PB ratio compared to SEM-EDX. Additionally, it enables the detection of trace elements and analyses that are difficult to perform with SEM-EDX. 【Features】 ■ Good energy resolution and detection sensitivity ■ Particularly excellent for quantitative analysis of trace components and map analysis ■ Wide-range mapping possible with movable stage ■ Compatible with sizes of 100×100mm *For more details, please refer to the PDF document or feel free to contact us.

We conducted observations, elemental analysis, and EBSD analysis on the fracture area of the damaged crab claw due to long-term use, and we would like to present our findings. In the elemental analysis using EDX, the mapping analysis revealed the distribution of Sb at the grain boundaries of the Pb crystals. Additionally, the EBSD method allowed us to confirm the orientation and misorientation of the crystal grains. 【Analysis Summary】 ■ Elemental Analysis by EDX - The mapping analysis showed the distribution of Sb at the grain boundaries of the Pb crystals. ■ Analysis by EBSD - The EBSD method enabled us to confirm the orientation and misorientation of the crystal grains. *For more details, please refer to the PDF document or feel free to contact us.

We will introduce a case study of failure analysis of an AC adapter through X-ray observation. When observing an AC adapter with unstable output using an X-ray observation device (YXLON Cheetah EVO), a broken wire was discovered. During fluoroscopic observation, no abnormalities were found in the internal components or solder joints, but a location suspected of having a broken wire was identified at the base of the wiring. Non-destructive X-ray observation is effective for initial inspections. [Failure Analysis Case Study] ■ Subject: AC Adapter ■ Equipment Used: X-ray Observation Device (YXLON Cheetah EVO) ■ Broken Wire Location: Base of the Wire *For more details, please refer to the PDF document or feel free to contact us.

By mechanically polishing commercially available rectangular Li-ion batteries and observing them with optical microscopy and ultra-low acceleration FE-SEM, detailed structural analysis and elemental analysis can be performed. The materials introduce the overall structure of the Li-ion battery and detailed structural observations of the Li-ion battery using SEM and ultra-low acceleration FE-SEM through photographs. [Analysis Overview] ■ Overall structure of the Li-ion battery and SEM observation ■ Detailed structural observation of the Li-ion battery using ultra-low acceleration FE-SEM *For more details, please refer to the PDF materials or feel free to contact us.

While lead-free solder is becoming widespread, whiskers formed from Sn plating or solder joints have a significant impact on the reliability of electronic components. Our company observes whiskers using a digital microscope with depth composition capabilities and conducts three-dimensional measurements to evaluate whisker growth. By collaborating with the reliability testing group, we can implement whisker evaluations quickly and eliminate transportation risks. 【Features】 ■ Support from observation to three-dimensional measurement in reliability testing ■ Observation of whiskers using a digital microscope with depth composition capabilities ■ Ability to conduct whisker evaluations quickly and eliminate transportation risks *For more details, please refer to the PDF document or feel free to contact us.

Regarding the separator used in commercially available Li-ion batteries, after conducting material analysis using FT-IR, we confirmed its function of blocking polymer melting at high temperatures. The document presents the material analysis of Li-ion battery separators and observations of the state changes of the separators under high-temperature conditions using graphs and photographs. [Analysis Overview] ■ Material analysis of Li-ion battery separators ■ Observation of state changes of separators under high-temperature conditions - The state changes of the separator were observed over time at a constant temperature of 135°C using FIB/SEM. *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce the equipment owned by Aites Co., Ltd., the Focused Ion Beam (FIB). The "FIB (Focused Ion Beam)" is a device that narrows Ga ions to less than a few micrometers and scans the beam to eject atoms from the sample surface while processing micro-regions. It is capable of cross-sectional processing of micro-regions and the production of TEM samples for semiconductors, MEMS, liquid crystal glass, build-up substrates, and more. 【Available Equipment】 ■ Crossbeam FIB "Carl Zeiss 1540XB" ■ Single Beam FIB "SEIKO SMI 2200" *For more details, please refer to the PDF document or feel free to contact us.

EPMA analysis has good energy resolution and detection sensitivity, making it particularly excellent for quantitative analysis of trace components and map analysis. In a case where a defect occurred in the Au-1st bonding within the package, EDX analysis and EPMA analysis were conducted to identify and confirm the distribution of the corrosive substances. Since EPMA has superior resolution, detection limits, and P/B (peak-to-background) ratios compared to EDX, the distribution of trace Cl could be clearly understood. 【Equipment Specifications】 ■ Manufactured by JEOL Ltd. Jeol-8200 ■ Analysis method: Wavelength dispersive X-ray analysis (WDX) ■ Analyzable elements: B to U ■ Energy resolution: 20 eV (EDX is approximately 130 eV) ■ Detection limit: 0.01% and above ■ Maximum sample dimensions: 100×100 mm *For more details, please refer to the PDF document or feel free to contact us.

In the state analysis using EPMA, changes (shifts and shapes) in the characteristic X-ray peak wavelengths due to differences in the chemical bonding states (ionic valence, crystal structure, coordination number) of oxides and silicates are utilized to estimate the bonding states by comparing with standard spectra. In the identification of two types of copper oxides, when distinguishing between black CuO and red Cu2O by color is difficult, especially for microscopic objects that require an electron microscope, it is possible to grasp the oxidation state using EPMA. Additionally, while XPS is effective for measuring thin oxide layers on aluminum surfaces, EPMA can be used to understand the oxidation state of small foreign particles, bulk materials, and composites. 【Device Specifications】 ■ Manufacturer: JEOL Ltd. Jeol-8200 ■ Analysis Method: Wavelength Dispersive X-ray Analysis (WDX) ■ Analyzable Elements: B to U ■ Energy Resolution: 20 eV (EDX is approximately 130 eV) ■ Detection Limit: 0.01% and above ■ Maximum Sample Size: 100x100 mm *For more details, please refer to the PDF document or feel free to contact us.

We conducted observations using SEM on the fracture surface of a crab claw that was damaged due to long-term use. At the edge of the fracture surface, traces of plastic deformation (dimples) were observed, suggesting that it fractured due to being pulled. In the central area of the fracture surface, the appearance was different, with only a slight presence of dimples, and there were almost no signs of having been pulled apart. It can be inferred that there may have already been voids present in the central area. Various other observations are also possible, so please feel free to contact us. [Overview of Fracture Surface Observation] ■ Edge of the Fracture Surface - Traces of plastic deformation (dimples) were observed. ■ Central Area of the Fracture Surface - Almost no signs of having been pulled apart were observed. - It could be inferred that there may have already been voids present. *For more details, please refer to the PDF document or feel free to contact us.

I would like to introduce the topic of "Cross-sectional observation of copper terminals and elemental analysis using SEM/EDX." We conducted cross-section preparation of the joint area of the copper crimp terminal fixture for resistance measurement, applied chemical etching to the prepared cross-section, and observed the metal structure before and after etching. As a result, we infer that the detected elements are P (phosphorus), Ag (silver), and Cu (copper), indicating that it is a silver-containing phosphorus copper solder material. *For more details, please refer to the PDF document or feel free to contact us.*

We would like to introduce our "Dye and Pry Test for Embedded Components." For confirming the breakage and delamination of packages and embedded components, there are non-destructive testing methods (such as transmission X-ray and CT) and cross-sectional observation. However, these methods make it difficult to capture the spread of delamination in the "plane" of the broken layers. In the Dye and Pry Test, by permeating a colored or fluorescent liquid, we can observe the broken and delaminated layers. Please feel free to contact us if you have any inquiries. 【Flow of the Dye and Pry Test】 ■ Dye immersion ■ Pry ■ Observation using optical microscopy or SEM *For more details, please refer to the PDF document or feel free to contact us.

In the testing environment, whisker observation is an important evaluation, but whiskers are very delicate and sensitive to vibrations and air fluctuations, so care must be taken in handling them during transportation and storage after testing. Our company consolidates the testing chamber, storage, and observation areas on one floor to reduce the risks associated with movement and storage, creating an environment where whiskers do not fall off or disappear. Additionally, we also offer migration observation before and after reliability testing, as well as solder surface observation, so please feel free to contact us. 【Features】 ■ Consistent service from reliability testing to observation ■ Consolidation of testing chamber, storage, and observation areas on one floor ■ Reduced risks associated with movement and storage ■ Whiskers do not fall off or disappear ■ Support for migration observation and solder surface observation before and after reliability testing *For more details, please refer to the PDF document or feel free to contact us.

As a case study of EBSD, we conducted an analysis of the cross-section of an aluminum welding joint from the cross-sectional direction, which I would like to introduce. For a sample where an aluminum plate was spot welded to an aluminum case, we prepared a cross-section of the weld and performed EBSD analysis. In the distribution of grain sizes, it was confirmed that the weld area has a greater number of larger grains compared to the base material. [Analysis Overview] ■ Visualization of Grain Structure - It is evident that the shape and size of the grains in the weld area differ from those in the base material. ■ Distribution of Grain Sizes - It can be confirmed that the weld area has a greater distribution of larger grains compared to the base material. *For more details, please refer to the PDF document or feel free to contact us.

Here are some examples of observations of aluminum spot welds. In internal observations using X-ray radiography, voids were observed inside the weld, and in internal observations using X-ray CT, it was confirmed that the voids are located near the center of the weld (between the two aluminum plates). Additionally, by creating a cross-section of the same sample and combining mechanical polishing with chemical etching treatment, we were able to observe the condition of the weld more clearly. 【Overview】 ■ Internal observation using X-ray radiography - Non-destructive testing and X-ray radiographic observation were conducted - Voids were observed inside the weld ■ Internal observation using X-ray CT - Non-destructive testing and X-ray CT observation were conducted - It was confirmed that the voids are located near the center of the weld ■ Cross-sectional observation using optical microscopy and tabletop SEM - Mechanical polishing and chemical etching A cross-section suitable for the sample allows for clearer observation. *For more details, please refer to the PDF document or feel free to contact us.

We present an observation case of a large sample (expansion valve) measuring 65mm × 28mm. This sample uses magnetic materials, and due to distortion in the images during SEM observation, we primarily conducted observations using an optical microscope. From the appearance and X-ray radiographic observation, it was found that there are some areas that are not visible in the X-ray. [Overview] ■ Appearance and X-ray radiographic observation ■ Cross-sectional observation using an optical microscope *For more details, please refer to the PDF document or feel free to contact us.

Lenses for glasses, cameras, and other devices are coated with various layers. In the case of glasses, multiple coating layers are applied, including a hard coat to protect plastic lenses, an anti-reflective coat to reduce light reflection, and a UV coat to block ultraviolet rays. These layers are applied as extremely thin films, so we observed their structure in cross-section. When observed with a scanning electron microscope (SEM), it was noted that a hard coat/multilayer film is applied on top of the lens substrate, and in the multilayer film, SiO and Nb films are alternately stacked. [Overview] ■ Cross-section preparation method - Prepared with a microtome - The lens removed from the frame was cut into small pieces and embedded in resin - Subsequently, a cross-section was prepared using a microtome, followed by optical microscopy observation, SEM observation, and EDX analysis. *For more details, please refer to the PDF document or feel free to contact us.

SEM observation involves detecting secondary electrons and backscattered electrons generated when electrons irradiate the surface of the sample and scatter in the outermost layer of the sample. These are captured by a detector and displayed as an image on a monitor. There are various types of detectors for capturing electrons, each producing images that leverage their unique characteristics, and the appearance can change by varying the acceleration voltage. In this document, we introduce SEM images captured under various conditions. We encourage you to read it. [Contents] ■ Backscattered Electron Images - Backscattered electron images at high acceleration voltage (AsB detector) - Backscattered electron images at low acceleration voltage (EsB detector) ■ Secondary Electron Images - Differences in appearance based on acceleration voltage - Differences in appearance based on detector position *For more details, please refer to the PDF document or feel free to contact us.

This document presents a case study on the observation, elemental analysis, and ultra-microhardness measurement of a broken crab claw due to long-term use. It includes clear photographs and diagrams illustrating "hardness comparison using an ultra-microhardness tester" and "the relationship between the surface analysis results of the fracture and ultra-microhardness (low load)." We invite you to read it. 【Contents】 ■ Observation of the broken crab claw ■ Hardness comparison using an ultra-microhardness tester ■ Relationship between the surface analysis results of the fracture and ultra-microhardness (low load) *For more details, please refer to the PDF document or feel free to contact us.

EPMA has seven spectroscopic crystals, and by selecting a spectrometer that matches the wavelength of the target element, it achieves good energy resolution and detection sensitivity, allowing for excellent results in quantitative analysis of trace components and map analysis. This document provides detailed information on the "measurement principle of wavelength dispersive X-ray spectrometers (WDS)" and includes examples such as "measurement example of 22Ti" with illustrations. Please take a moment to read it. [Contents] ■ Wavelength Dispersive X-ray Spectrometer (WDS) ■ Measurement Example: 22Ti *For more details, please refer to the PDF document or feel free to contact us.

When conducting EDX analysis, many people may analyze at high acceleration voltages to increase the detection sensitivity of elements. However, depending on the purpose, it is not always the case that high acceleration voltage analysis is preferable. White LEDs generate white light by combining blue LEDs with yellow phosphors (powder), and in this study, we examined how changing the acceleration voltage affects the surface analysis of these phosphors. Please take a moment to read this. [Contents] - Test sample (LED phosphor) - Surface analysis images at different acceleration voltages - Considerations from electron beam scattering regions using Monte Carlo simulations *For more details, please refer to the PDF document or feel free to contact us.

We will introduce the flow from basic and widely applicable optical microscope observation to SEM observation and EDX elemental analysis. Observation using an optical microscope is one of the fundamental observation techniques, allowing for quick examination of general shapes and other features. Its advantage lies in the ability to obtain color information, making it effective for observing abnormalities associated with corrosion and other changes. In this document, we also provide detailed explanations of "observation using SEM" and "elemental analysis using EDX" with the help of photos and graphs. We encourage you to read it. [Contents] ■ Observation using an optical microscope ■ Observation using SEM ■ Elemental analysis using EDX *For more details, please refer to the PDF document or feel free to contact us.

EPMA has superior detection resolution compared to EDX. Even in cases where the detection positions of elements are close in EDX, making peak separation difficult, it may be possible to achieve peak separation with EPMA. This document introduces the peak separation of 22Ti and 56Ba. It includes analysis examples of multilayer ceramic capacitors and X-ray spectra of barium titanate (BaTiO3). [Contents] - Peak separation of 22Ti and 56Ba - Analysis example: Multilayer ceramic capacitors - X-ray spectrum of barium titanate (BaTiO3) *For more details, please refer to the PDF document or feel free to contact us.

Whiskers are often thought to occur at solder joints or component lead areas, but they can also arise from the plated surfaces of flat components. Observing them requires a bit of technique. This document covers differences in appearance based on the equipment used, as well as differences in appearance due to sample angles and the angles of light sources and lenses. [Contents] ■ Differences in appearance based on equipment ■ Differences in appearance based on sample angles ■ Differences in appearance based on light sources and lens angles *For more details, please refer to the PDF document or feel free to contact us.

Here is a case study on cross-sectional observation of connector plating. We observed the cross-section to see how the plating condition of the connector terminals has changed due to use. This time, we prepared cross-sectional samples from two locations with different degrees of striation, one with no striation and the other with striation, to confirm the plating condition. As a result, it was found that compared to the area with no striation, Striation A and Striation B exhibited uneven plating thickness. This is believed to be due to the plating being dragged during the insertion and removal of the connector, causing variations in thickness. [Overview of Connector Plating Cross-Section] - The cross-section was prepared using a triple ion milling polisher (commonly known as CP). - The plating condition of the striated areas was observed using SEM. - Results: - No striation: Surface Au plating thickness is uniform (approximately 350 nm) - Striation A: Surface Au plating thickness is uneven (approximately 490 nm / approximately 350 nm) - Striation B: Surface Au plating thickness is uneven (approximately 130 nm / approximately 650 nm) *For more details, please refer to the PDF document or feel free to contact us.

Epoxy resin is transparent, has a low shrinkage rate, and is often used for making cross-sections. However, since it is a thermosetting resin, it generates heat during the curing process. The temperature of heat generation varies depending on the amount used and the mixing ratio of the main agent and hardener. When embedding large samples such as printed circuit boards and touch panels, the epoxy resin can generate enough heat to deform the sample substrate. Therefore, we investigated how much heat is actually generated during curing. For more details, please refer to the PDF download below. 【Overview】 ■ Temperature profile acquisition - Without heat prevention treatment for a large amount of resin (large container) ■ Temperature profile acquisition - With heat prevention treatment for a large amount of resin (large container) ■ Resin embedding is possible even for larger printed circuit boards without cutting before embedding. *For more details, please refer to the PDF document or feel free to contact us.

In the evaluation of BGA and CSP solder, the area ratio of voids within the solder can be measured from transmitted X-ray image data. Furthermore, by combining mechanical polishing, a comprehensive evaluation is possible. Please feel free to consult us when needed. 【Features】 ■ Non-destructive evaluation of BGA (Ball Grid Array) solder - The area ratio (%) of voids within the solder can be measured non-destructively from images obtained through X-ray transmission observation. ■ Cross-sectional observation of CSP (Chip Size Package) and BGA (Ball Grid Array) - Cross-sectional observation through mechanical polishing allows for the observation of defects such as shrinkage cavities that are difficult to see with X-ray observation. *For more details, please refer to the PDF document or feel free to contact us.

The ZEISS "FE-SEM ULTRA55" is equipped with a GEMINI column, allowing for high-resolution observation at extremely low acceleration voltages. It also features multiple detectors, enabling the observation of various samples. Composition information can be obtained using two types of backscattered electron detectors, and high-resolution EDX analysis can be performed even at low acceleration voltages. 【Features】 ■ High-brightness electron gun for detailed SEM images ■ Ultra-surface analysis at extremely low acceleration voltages ■ In-lens SE detector sensitive to surface information ■ Composition information obtained from two types of backscattered electron detectors ■ High-resolution EDX analysis even at low acceleration voltages ■ Observation without deposition *For more details, please refer to the PDF document or feel free to contact us.

Here is a case study of silicon wafers analyzed using EBSD. A small piece was cut from the wafer, and an IPF map was obtained for a central area of 50×50μm. The measurement area shows red, indicating the {001} plane, and the absence of grain boundaries confirms that it is a single crystal. Since the measured silicon wafer is a single crystal, the IPF map, pole figure, and inverse pole figure resulted in relatively simple outcomes. *For more details, please refer to the PDF document or feel free to contact us.*

EPMA has superior detection resolution compared to EDX. Even in cases where the detection positions of elements are close in EDX, making peak separation difficult, it may be possible to achieve peak separation with EPMA. This document introduces the peak separation of 47Ag and 17Cl. It includes cross-sectional observations of chip resistors, X-ray spectra of 47Ag, and mapping comparisons. [Contents] ■ Peak separation of 47Ag and 17Cl ■ X-ray spectrum of 47Ag ■ Mapping comparison *For more details, please refer to the PDF document or feel free to contact us.

This document introduces the structural analysis of MEMS components. It includes "non-destructive observation of accelerometers" using X-ray imaging to observe the internal structure of the package, as well as "optical microscope and SEM observation after mechanical polishing of accelerometers" and "cross-sectional observation of microphones (CROSS BEAM FIB/SEM)." Please feel free to download and take a look. [Contents] ■ Non-destructive observation of accelerometers ■ Optical microscope and SEM observation after mechanical polishing of accelerometers ■ Cross-sectional observation of microphones (CROSS BEAM FIB/SEM) *For more details, please refer to the PDF document or feel free to contact us.

At AITES, we conduct "Authenticity Investigations (Comparative Observations)." We compare the item under investigation with genuine or standard products, examining differences in structure and whether any silent changes have occurred. We support various observations, including visual inspections, unboxing observations, electrical property measurements, destructive and non-destructive observations, reliability testing, and material investigations. 【Features】 ■ Comparison of the item under investigation with genuine or standard products ■ Investigation of differences in structure and whether any silent changes have occurred *For more details, please refer to the PDF materials or feel free to contact us.

The quality of diamonds is determined by the 4Cs (Cut, Color, Carat, Clarity). Clarity refers to the degree of inclusions and blemishes. I took a look at the clarity using a microscope, and I would like to share my findings. Even items that appear clean at first glance may have inclusions or cracks when magnified. The microscope allows us to observe tiny defects that cannot be seen with the naked eye. Additionally, the microscope is also used for the inspection and observation of semiconductor electronic components and silicon chips. Please feel free to contact us if you need our services. [Features] - The microscope can observe tiny defects that cannot be seen with the naked eye. - Inspections and observations of semiconductor electronic components and silicon chips are also conducted. *For more details, please refer to the PDF document or feel free to contact us.

After the solder durability test on the circuit board, if cracks occur in the solder joints, the crack rate will be calculated to confirm whether the cracks are within the allowable standards. The evaluation standards after the solder durability test can be individually defined based on the product environmental specifications, so most customers have their own standards. The measurement methods vary according to the shape of the components, but when you make a request, we will carry out the tests according to your specifications. 【Service Contents】 ■ Solder joints of BGA - Calculation of crack rate for ball joints ■ Solder joints of chip resistors - Calculation of crack rate for both ends of square and rectangular terminals ■ Solder joints of coil components - Calculation of crack rate for ribbon leads and QFP leads *For more details, please refer to the PDF document or feel free to contact us.

We will introduce examples of observation and analysis of coating films used in various products such as automobiles and mobile phones. The "Triple Ion Polisher (CP)" can process samples containing both hard and soft materials without causing damage, while the "Microtome" is capable of not only producing cross-sections but also performing planar inclined cutting. Additionally, the "Desktop Inclined Cutting Machine" can extract sample surfaces that are 6 to 300 times the original thickness as surface information, and the "Desktop SEM (Scanning Electron Microscope)" has a mode for observation under low vacuum (charge reduction), allowing for the observation and elemental analysis of samples that release volatile components. [Observation of Plastic Coating (Mobile Phone Case)] ■ Triple Ion Polisher (CP) ■ Microtome ■ Desktop Inclined Cutting Machine ■ Desktop SEM (Scanning Electron Microscope) *For more details, please refer to the PDF document or feel free to contact us.

We will introduce a case study on fish-eye analysis of laminated film. In the multi-layer laminated film used for containers such as refillable shampoos, a part resembling a foreign substance was observed. Upon magnified observation, it appeared to be several tens of micrometers in diameter and looked like a fish-eye. To clarify the cause, a cross-sectional observation was conducted. There are various methods for preparing cross-sections, but we implemented a mechanical polishing method that allows for extensive observation. [Case Overview] ■ Background: Discovered a part that appears to be a foreign substance in the multi-layer laminated film ■ Objective: Conducted cross-sectional observation to clarify the cause ■ Cross-section preparation method: Implemented a mechanical polishing method that allows for extensive observation *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce a case study of foreign matter analysis conducted on laminate film. Upon inspecting the back side of the laminate film, a black foreign object was identified. Therefore, we carried out an investigation to identify the layer of origin and component analysis of this black foreign object. First, we considered the methods based on the objectives of the analysis. This time, we focused on the position of the foreign object and its components, and decided to prepare a cross-section of the foreign object for elemental analysis. 【Case Overview】 ■ A black foreign object was identified upon inspecting the back side of the laminate film. ■ We conducted an investigation to identify the layer of origin and component analysis of the black foreign object. ■ We prepared a cross-section of the foreign object and conducted elemental analysis. *For more details, please refer to the PDF document or feel free to contact us.