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One of the features of EPMA is the guide network map method. In SEM-EDX, the measurement range is narrow, and for curved samples, surface analysis may not be accurately measured. However, by using the guide network map method of EPMA, extensive analysis becomes possible. This method automatically measures adjacent continuous areas and displays them collectively, making it useful for measuring surfaces with uneven height differences or for measuring large surfaces. 【Features of the Guide Network Map Method】 - A method for automatically measuring adjacent continuous areas and displaying them collectively. - Used for measuring surfaces with uneven height differences or for measuring large surfaces. *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce the cross-sectional observation of Pb-free solder after reliability testing conducted by our company. Pb-free solder assemblies (Sn/Ag/Cu alloy solder) were subjected to three types of reliability tests. We compared the initial products with those after testing to check for the presence of cracks and the growth of intermetallic compound layers. To gradually confirm the durability of the solder joints through observations of crack progression, we recommend the TC test, which allows for cross-sectional observation after extraction at each cycle. 【Test Conditions】 (1) TC Test (Temperature Cycle) 125℃ for 20 minutes / -40℃ for 20 minutes / 1000 cycles (2) HT Test (High-Temperature Storage) 150℃ for 1000 hours (3) TH Test (Temperature and Humidity) 85℃ / 85% RH for 1000 hours *For more details, please refer to the PDF document or feel free to contact us.

In this document, we introduce the microtome and knives, along with examples of cross-sectional observations. The "microtome" is a device used to prepare cross-sectional observation samples for TEM, SEM, and OM, utilizing glass knives or diamond knives for sample cutting. Glass knives are mainly used for sample preparation (trimming), while diamond knives are used for finishing. For cross-sectional observations, the preparation of the cross-section was carried out on the gold-plated terminal part of a flexible cable. We invite you to read it. [Contents] ■ Equipment and knives ■ Cross-sectional observation examples *For more details, please refer to the PDF document or feel free to contact us.

Here is a case study comparing two types of brass with similar elemental compositions. When spectral analysis was performed using SEM-EDX, it was found that brass mainly consists of Cu (copper) and Zn (zinc), and the elemental compositions of both samples appeared to be relatively similar. Additionally, an EBSD analysis was conducted, and the phase map revealed the presence of a β phase with a different crystal structure in part of Sample 1. [Case Overview] <Comparison of Two Brass Materials through Elemental Analysis> ■ Analysis Method: SEM-EDX Analysis ■ Results - Spectral analysis indicated that brass mainly consists of Cu (copper) and Zn (zinc), and the elemental compositions of both samples appeared to be relatively similar. - Surface analysis was conducted for elements Cu and Zn, and no bias in the in-plane distribution was observed. *For more details, please refer to the PDF document or feel free to contact us.

Optical microscopes and SEM (scanning electron microscopes) are commonly used for sample observation, but each has its own characteristics, so it is important to choose the appropriate device according to the purpose. In this document, we compare optical microscopes and SEM using the same sample and introduce the generally mentioned advantages and disadvantages. Please take a moment to read it. 【Contents】 ■ Features of Optical Microscopes ・ Advantages / Disadvantages ・ Recommended for this type of observation ■ Features of SEM (Scanning Electron Microscope) ・ Advantages / Disadvantages ・ Recommended for this type of observation *For more details, please refer to the PDF document or feel free to contact us.

"Energy Dispersive X-ray Spectroscopy (EDS or EDX)" is a method that detects characteristic X-rays generated by electron beam irradiation using a detector attached to an electron microscope (SEM or TEM), allowing for the acquisition of elemental information about samples or foreign substances. When characteristic X-rays generated by irradiating a material with an electron beam enter the detector, a number of electron-hole pairs equivalent to the energy of the characteristic X-rays are produced. By measuring this number (current), it is possible to determine the energy of the characteristic X-rays, and since the energy varies by element, it is possible to investigate the elemental information of the material. [Analysis by EDS (partial)] ■ Qualitative analysis of intermetallic compounds (point analysis) - By examining which elemental characteristic X-ray energy corresponds to the characteristic X-rays in the measured spectrum, the types of elements can be investigated. ■ Semi-quantitative analysis of intermetallic compounds - By examining the intensity (count number) of each characteristic X-ray, the concentration of the contained elements can be calculated. *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce a case study of EDS analysis at the Cu pad interface. In qualitative analysis (point analysis) and semi-quantitative analysis of intermetallic compounds, the concentration of contained elements is calculated by examining the intensity (count numbers) of each characteristic X-ray. For intermetallic compounds, it is possible to estimate the formed compounds based on the calculated concentration ratios. Additionally, in line analysis, it is possible to profile the concentration distribution of each element along a specified line in the SEM image, allowing for the observation of changes in element concentration at the analysis location. 【Features of EDS Analysis】 ■ Qualitative analysis (point analysis) and semi-quantitative analysis of intermetallic compounds - Concentration of contained elements is calculated by examining the intensity (count numbers) of each characteristic X-ray - Intermetallic compounds can be estimated based on the calculated concentration ratios ■ Line analysis - Concentration distribution of each element along a specified line in the SEM image can be profiled - Changes in element concentration at the analysis location can be confirmed *For more details, please refer to the PDF document or feel free to contact us.

We will introduce a case study of a 3D construction method using mechanical polishing. Ceramic capacitors have a structure where thin film electrodes are stacked internally, and X-ray CT cannot confirm the internal electrodes as they appear transparent. Additionally, 3D construction using FIB slice cross-sections is limited to localized confirmation due to the sample being only a few millimeters thick. The 3D construction method using mechanical polishing can complement the areas where X-ray CT and FIB slice cross-sections are not effective, allowing for 3D construction in some cases. [Case Study of 3D Construction of Ceramic Capacitors Using Mechanical Polishing] ■ X-ray CT image: Internal electrodes cannot be confirmed ■ 3D construction using FIB slice cross-sections: Limited to localized confirmation ■ 3D construction using mechanical polishing: Internal electrodes can be confirmed, allowing for extensive 3D observation *For more details, please refer to the PDF document or feel free to contact us.

We will introduce sample processing using mechanical polishing and mechanical polishing combined with ion milling treatment. Mechanical polishing is a common and long-established method for creating cross-sections, allowing for a wide range of cross-sectional production. Additionally, by combining it with ion milling treatment, it is possible to create observation surfaces comparable to those produced by CP processing. At Aites, we propose appropriate processing and observation methods or combinations based on our accumulated know-how. Please feel free to contact us for consultations or inquiries. 【Features】 ■ Mechanical polishing allows for extensive processing and observation. ■ By repeating mechanical polishing and imaging, three-dimensional observation is possible. ■ Observation at any desired location can be performed based on the constructed 3D image. ■ After mechanical polishing, depending on the sample, observation comparable to that of CP processed samples is possible. *For more details, please refer to the PDF materials or feel free to contact us.

The introduction of the "FIB-SEM Helios 5 UC" is scheduled to start service in November! We will provide shorter delivery times and reliable feedback than ever before. We will achieve high-throughput cross-sectional observation and analysis of a wide range of materials, from semiconductor devices such as power devices, ICs, solar cells, and light-emitting elements, to electronic components like MLCCs and soft materials. With a high-quality beam of up to 100nA, we can process large areas quickly, and by finishing the FIB at low acceleration, it is possible to produce high-quality samples with minimal damage layers. 【Main Features of Helios 5 UC】 ■ High-speed, large-area FIB processing ■ Reduced damage layers through low-acceleration finishing ■ Cryo-FIB processing ■ 3D imaging ■ Complete automation of TEM sample preparation *For more details, please refer to the PDF document or feel free to contact us.

Aites Co., Ltd. has introduced the KEYENCE manufactured one-shot 3D shape measuring device 'VR-6200'. It comes with an electric rotation unit, allowing for the reproduction of cross-sectional shapes without cutting. The HDR scanning algorithm enables measurement of glossy surfaces as well. From profile measurement to flat measurement, volume area, and comparative measurement, this single device can perform various measurements. 【Measurable Items】 ■ Profile Measurement ■ Flat Measurement ■ Volume Area ■ Line Roughness Measurement ■ Surface (Flatness) Measurement ■ Comparative Measurement *For more details, please refer to the PDF document or feel free to contact us.

Are you having trouble evaluating whether the axes and the formed holes are according to the design specifications? We attach samples to the KEYENCE "VR-6200" electric rotating unit, obtain 3D data by rotating it 360 degrees, and measure roundness from the profile. Additionally, we measure circularity using the image processing software "WinROOF2021." Please feel free to contact us when you need assistance. 【Features】 <Roundness Measurement Using VR-6200> ■ Attach the sample to the electric rotating unit and rotate it 360 degrees ■ Obtain 3D data and measure from the profile <Circularity Measurement Using Image Processing Software> ■ When measuring the circularity of commercially available probe pins using WinROOF2021, it was observed in the SEM image that they are not perfectly circular. *For more details, please refer to the PDF document or feel free to contact us.

We conducted hardness measurements on aluminum spot welds after performing cross-sectional observations and investigated the trends based on Vickers hardness, Young's modulus, and elasticity ratio. From X-ray radiographic observations, voids were confirmed inside the weld. Cross-sectional observations revealed that the central void was a blowhole. Additionally, the hardness measurement results indicated that the area near the blowhole was hard but had low stiffness and was prone to deformation, while areas slightly away from the blowhole exhibited higher stiffness and were somewhat brittle. [Summary] ■ Observation case of aluminum spot welds: optical microscope images, X-ray images - Voids confirmed inside the weld from X-ray radiographic observations ■ Hardness measurements of aluminum spot weld cross-sections - Measurements conducted centered around the blowhole - Investigation of trends based on Vickers hardness, Young's modulus, and elasticity ratio *For more details, please refer to the PDF document or feel free to contact us.

We will introduce a case where precision planar grinding was applied to remove glass substrate wiring and conductive particles, allowing for the observation of IC chip circuits with minimal damage. Careful planar grinding was performed from the glass substrate side, removing material down to a few micrometers from the IC chip, enabling the observation of the circuit surface. The IC chip circuit surface was clearly visible, and detailed observation at high magnification became possible. There are many samples, like the one in this case, where detailed observation has become possible through planar grinding, as well as samples that can be processed using FIB or CP techniques. If you have any samples you are struggling with, please consult us. We accept requests for planar grinding only, as well as requests that include observation and analysis. [Overview] <Planar Grinding and Optical Observation> ■ Careful planar grinding was performed from the glass substrate side, removing material down to a few micrometers from the IC chip, enabling the observation of the circuit surface. ■ The IC chip circuit surface was clearly visible, and detailed observation at high magnification became possible. *For more details, please refer to the PDF document or feel free to contact us.

The method of processing observation samples can result in different information being obtained. You may have observed the solder joint from a cross-section in two dimensions, but have you ever wondered how the compound grows in three dimensions? In this document, we present examples of observations of the Cu pad and solder joint. We include both "cross-sectional observation" and "planar observation." [Contents] ■ Cross-sectional observation - Before etching treatment - After etching treatment ■ Planar observation *For more details, please refer to the PDF document or feel free to contact us.

Due to the suspected malfunction at the switch part of the appliance that has stopped powering on, we will introduce a case study along with the work flow. First, we check for any shape changes such as swelling, cracking, or discoloration through visual observation. In the electrical check, we verify whether the malfunction can be reproduced and whether it is an open or short circuit. An internal observation using X-rays revealed that the contact terminals inside the switch had melted, scattered, and disappeared, leading to an open circuit failure. Ultimately, we will submit a report that includes the consideration of the cause. We also welcome inquiries regarding analysis after non-destructive testing, so please feel free to consult us. 【Basics of Non-Destructive Observation】 ■1: Visual Confirmation ■2: Electrical Confirmation ■3: Internal Observation with X-rays *For more details, please refer to the PDF document or feel free to contact us.

We will introduce the observation of the shape of conductive particles in COG implementation. ICs and liquid crystal panels are implemented using the COG method with ACF (anisotropic conductive film). A resin ball is used as the core, and a metal layer (such as nickel or gold) is deposited on its surface for conductivity. During connection, the particles deform appropriately to electrically connect the IC and the panel. To confirm the degree of particle deformation and the connection state, cross-sectional observations were conducted, revealing that the particle deformation amount was "medium," indicating an appropriate level of deformation. By examining the deformation of conductive particles from both the planar and cross-sectional directions, we can explore the correlation with display defects. Please feel free to contact us for any inquiries regarding panel-related defects. [Summary] - In implemented ICs, slight "warping" or "tilting" can cause differences in particle deformation between the edges and the center, potentially leading to display defects. - By examining the deformation of conductive particles from both the planar and cross-sectional directions, we can explore the correlation with display defects. *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce our service for "various cross-sectional observations of mounted components on circuit boards." Inside various electronic devices around us, there are circuit boards equipped with electronic components. When observing a mounted circuit board, you can see that numerous components are tightly soldered together, and it is necessary to confirm that the components are properly joined, as improper connections can prevent normal operation. Please contact us if you are considering observations before and after reliability testing or cross-sectional observations. 【Examples of Observations (Partial)】 ■ Ceramic Capacitors ■ Transistors ■ Chip Resistors ■ QFP ■ Connector Pins *For more details, please refer to the PDF materials or feel free to contact us.

We would like to introduce an example of cross-sectional observation of mounted components conducted by our company. Using commercially available computer circuit boards, we observed the solder joints of mounted components and the internal structures of the components with a metallurgical microscope. The observation modes of the metallurgical microscope include bright field observation, dark field observation, and polarized light observation, among others. Additionally, there are observations using transmitted light, and the observation mode is selected according to the sample. By conducting cross-sectional observations before and after reliability testing, we can evaluate the reliability of the product. When observing, it is important to select an appropriate "observation mode" to clearly capture the condition of the solder joint interface and defects such as cracks. [Case Overview] ■ Using commercially available computer circuit boards ■ Observing the solder joints of mounted components and the internal structures of the components with a metallurgical microscope ・Observation modes: bright field observation, dark field observation, polarized light observation, etc. *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce an example of "observation of semiconductors through mechanical polishing" conducted by our company. While there are advantages and disadvantages, it is possible to create cross-sections with mechanical polishing that are comparable to those produced by FIB or CP. Based on years of accumulated know-how, our company will propose the most appropriate processing methods according to the observation purpose, sample composition, and structure. If you have any concerns, please feel free to contact us at the information below. 【Observation Examples】 ■ Semiconductor_Si ■ Compound Semiconductor_GaN ■ Compound Semiconductor_GaP ■ Compound Semiconductor_GaAs *For more details, please refer to the PDF materials or feel free to contact us.

We will introduce the observation of metallic structures through chemical treatment. By performing chemical treatment on metallic samples, it is possible to clearly observe the metallic structure. Observing the structure can confirm the condition of the sample as well as the history of applied heat and stress, providing clues about the quality of the product and any defects based on the structural shape. In the published catalog, you can find details on the observation of metallic structures, such as the macrostructure of aluminum plates and the soldered parts of copper terminals. Additionally, we offer other services such as cross-sectional observation and various analysis services. Please feel free to contact us if you have any requests. [Contents] ■ Macrostructure of aluminum plates ■ Soldered parts of copper terminals ■ Brass screws ■ Welded parts of SUS rods *For more details, please download the PDF or feel free to contact us.

We offer the "CP Processing Device Arblade5000_Wide Area Cross-Section Milling." The "Arblade5000" enables extensive processing by combining a high milling rate with wide area cross-section milling capabilities. With the wide area cross-section milling holder, the cross-section milling width can be expanded up to a maximum of 10mm, making it effective for electronic components that require wide area milling. 【Features】 ■ Approximately double the width of processing is possible ■ The previously localized observation range can be significantly expanded ■ Equipped with a cooling temperature adjustment function to control temperature rise caused by ion beam irradiation ■ The observable range is approximately 8mm *For more details, please download the PDF or feel free to contact us.

We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, analysis can be performed using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes. [Summary] < Elemental Analysis by EDX > - Surface analysis shows the distribution of Ni, Cu, and Sn within the compounds. < Crystallographic Orientation Analysis by EBSD > - By combining this with elemental analysis using EDX, it is possible to estimate the composition. - In some cases, analysis can be performed using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes. *For more details, please download the PDF or feel free to contact us.

At AITES Co., Ltd., we provide a wide range of technical services for evaluation tests of printed circuit boards (mounted boards) equipped with electronic components. We conduct reliability tests, solder joint observations, whisker observations, and cross-sectional observations. We assist with observations in accordance with international standards, offer consultations, and address various concerns regarding observations. Additionally, we offer services such as X-ray observations, appearance inspections, and shape measurements, so please feel free to contact us when needed. 【Service Contents】 ■ Reliability Testing ■ Solder Joint Observation ■ Whisker Observation ■ Cross-Sectional Observation *For more details, please download the PDF or feel free to contact us.

At our company, we created a cross-section of the CMOS image sensor component associated with VR goggles manufactured by Company A through mechanical polishing while keeping the component in its original state, and we conducted structural observations of the CMOS sensor component. During the observation of the sensor component structure and sensor surface, we removed the glass filter and observed the surface of the CMOS sensor, where it was noted that the arrangement of the color filters was in a configuration known as a Bayer filter. In addition to mechanical polishing, methods for creating cross-sections include processing with ion beams such as FIB and CP, as well as microtome methods. Consultations are free, so please feel free to contact us if you are unsure about the method for creating cross-sections. [Overview] ■ Observation of sensor component structure and sensor surface ■ Cross-section creation by mechanical polishing ■ SEM observation of the sensor chip surface layer *For more details, please download the PDF or feel free to contact us.

We would like to introduce our "Appearance Observation and Measurement Services." We offer a variety of equipment to meet your needs, including appearance observation before and after reliability testing, solder joint observation, as well as dimensional and surface roughness measurements of various components. You can also leave the pre-observation processing to us. Our company has IPC-A-610 certified IPC specialists on staff. We assist with observations in accordance with international standards and provide consultations to address various observation-related concerns. 【Equipment】 ■ VHX-X1 ■ VHX-5000 ■ VR-6200 ■ VK-X200 *For more details, please download the PDF or feel free to contact us.

We would like to introduce the "Tracking Camera Cross-Section Observation" through mechanical polishing. Regarding the structure of the tracking camera components, the lens can be confirmed when viewed from above, and while it cannot be clearly seen in the X-ray image, the lens is incorporated into the convex part. Additionally, the cross-sectional structure is the same as that of the RGB sensor, featuring a back-illuminated CMOS structure. However, since color information is not necessary for the tracking camera, there is no color filter layer. A jagged uneven shape was observed on the surface of the photodiode. 【Features】 ■ The cross-sectional structure is a back-illuminated CMOS structure, similar to that of the RGB sensor. ■ There is no color filter layer since color information is not needed for the tracking camera. ■ A jagged uneven shape was observed on the surface of the photodiode. *For more details, please download the PDF or feel free to contact us.

We would like to introduce the "Substrate Deformation Observation" using a 3D shape measurement machine. By applying pressure to a PCB substrate, referencing the bending tests of plastics and PCB substrates, we measure the changes using a 3D shape measurement machine (VR-6200). Since the measurement results can be confirmed with a color palette and line profile, it is possible to visually verify the shape and amount of deformation caused by the applied pressure. 【Features】 ■ Measurement results can be confirmed with a color palette and line profile ■ It is possible to visually verify the shape and amount of deformation caused by the applied pressure *For more details, please download the PDF or feel free to contact us.

We conducted measurements to reconfirm the temperature of heat generation during curing, following the change to a non-toxic epoxy resin. When using a large amount of resin, we apply heat prevention treatment for resin embedding. Without this treatment, the temperature can rise to 138°C during curing. However, with the heat prevention treatment applied, we were able to keep the heat generation during curing to within 30°C, even with a large amount of resin. 【Measurement Results】 ■ Without heat prevention treatment for a large amount of resin (large container) - Heat generation reached up to 138°C during curing. ■ With heat prevention treatment for a large amount of resin (large container) - Heat generation during curing was kept within 30°C. *For more details, please download the PDF or feel free to contact us.

We would like to introduce a case where cross-sections were created and observed for the adhesive parts of pull-back car tires using different methods. Upon conducting SEM observations of the created cross-sections, fillers present within the rubber were confirmed. It was found that the dispersion state of the fillers and the appearance of the adhesive interface were not clear with liquid nitrogen fracturing or mechanical polishing. In contrast, the cross-sections created by cryo ion milling allowed for a clear observation of the dispersion state of the fillers contained in the rubber and the appearance of the adhesive interface with the plastic substrate. 【Cross-section Preparation Methods】 ■ Liquid Nitrogen Fracturing (-196℃) ■ Mechanical Polishing ■ Cryo CP (-150℃) *For more details, please download the PDF or feel free to contact us.

It is a measuring device that can non-contact measure surface shapes such as concavities, undulations, and surface roughness. We will introduce "Heating Deformation Observation" using a 3D shape measuring machine. First, we acquire a 3D texture image at room temperature, and then we acquire a 3D texture image in a heated state. By overlaying the texture images before and after heating and checking the differential texture image and cross-sectional profile, it can be seen that the substrate in the heated state has higher ends and a lower center compared to the room temperature state. 【Features】 ■ It is possible to visualize and confirm shape changes during heating. ■ Depending on your preferences, it is possible to create profiles for temperature rise speed, waiting time, and temperature settings. *For more details, please download the PDF or feel free to contact us.

We will introduce a case study comparing cross-section preparation methods on the surface coating layer of a golf ball and observing the effects of heat from CP processing. There are two layers of coating on the outermost layer of the cover layer, and we conducted a comparison of cross-section preparation methods using this coating layer. SEM observations of the cross-sections prepared using three different methods were performed. While cross-section preparation of soft materials is effectively done using cross-section ion milling (CP), the physical properties may change due to the heat generated during CP processing. In such cases, cross-section preparation using cryo-CP, which mitigates the effects of processing heat through cooling, is effective. 【Cross-section preparation methods】 ■ Mechanical polishing ■ CP ■ Cryo-CP (-50°C) *For more details, please download the PDF or feel free to contact us.

We would like to introduce an example of failure analysis of chip resistors where abnormalities were observed. Upon investigating the cause of the malfunction of the polishing table, abnormalities were confirmed in the chip resistors on the relevant circuit board. Surface observation revealed abnormalities in the chip resistors, and it appeared that the protective film was melting. Elemental analysis using EDX detected elements such as Al and Pb from the abnormal area, raising suspicions that the undercoat layer may be exposed. Next, a cross-sectional sample was prepared through mechanical polishing, and analysis was conducted using SEM/EDX, which showed that the protective film and resistive material appeared to be melting. At Aites, we consider and propose processing, pretreatment, observation methods, and combinations tailored to the observation objectives and the composition and structure of the samples based on our accumulated know-how. Please feel free to contact us for consultations. [Analysis Content] ■ Surface Observation ■ Cross-Sectional Observation *For more details, please download the PDF or feel free to contact us.

Regarding the chip mounted on the main circuit board of the VR goggles manufactured by Company A, upon visual observation, it was inferred that it has a chiplet structure with multiple chips integrated. To examine the structure in more detail, we created a cross-section using X-ray CT observation and mechanical polishing, and we will introduce the structural confirmation. *For detailed information, please refer to the attached PDF document. For more details, feel free to download the PDF or contact us.

At Aites Co., Ltd., we conduct ultrasonic microscope observation (transmission method) of printed circuit boards. In printed circuit boards, issues such as delamination (separation) can occur due to factors like storage environment, thermal and humidity stress, and defects in the manufacturing process, leading to the separation of internal layers of the board. The transmission method involves transmitting ultrasonic waves through the observation sample and converting the received ultrasonic waves into electrical signals for imaging. If there are voids such as delamination, the ultrasonic waves do not transmit, resulting in a black appearance in the image. 【Features】 - Effective for detecting delamination (separation) that is not visible through visual inspection due to internal defects in the board. - Ultrasonic waves are transmitted through the observation sample for imaging. - Areas with voids such as delamination appear black in the image. *For more details, please download the PDF or feel free to contact us.

Wire bonding is a method of connecting electrodes on a semiconductor chip to package terminals using metal wires, which can be broadly categorized into ball bonding and wedge bonding methods. This document presents examples of shape observation of joints using the ball bonding method. The samples included were prepared by mechanical polishing to create cross-sections, but depending on the observation purpose, sample composition, and structure, there are appropriate processing methods. At Aites, we consider and propose processing, pretreatment, observation methods, and combinations based on our accumulated know-how. Please feel free to contact us for consultations. [Observation Overview] - Wire bonding of SOP (Small Outline Package) packages - Wire bonding of LED segment display devices - Wire bonding of surface-mounted LEDs *For more details, please download the PDF or feel free to contact us.