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Electronic Components and Semiconductors
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アイテス

EstablishmentJanuary 1, 1993
capital3000Ten thousand
number of employees106
addressShiga/Otsu-shi/1-60 Kuribayashi Town
phone077-599-5015
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last updated:Nov 27, 2025
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Defects and Physical Analysis Defects and Physical Analysis
Processing observation Processing observation
Surface and chemical analysis Surface and chemical analysis
Reliability test Reliability test
Electrical equipment repair Electrical equipment repair
Wafer processing Wafer processing
Solar panel inspection and testing equipment Solar panel inspection and testing equipment
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Sampling techniques for the analysis of microscopic foreign substances

We will report rapid analysis results using various sampling techniques regarding foreign substances that significantly impact the yield of electronics products.

■Special Sampling Techniques for Foreign Substances in Multilayer Films - Foreign substances buried in metal films on substrates Metal film etching ⇒ Transfer to Si wafer ⇒ FT-IR analysis - Foreign substances in multilayer films Cutting off the surface layer ⇒ Transfer to Si wafer ⇒ FT-IR analysis Microtome/FIB thinning ⇒ Transfer to Si wafer ⇒ FT-IR analysis

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Surface analysis using TOF-SIMS.

TOF-SIMS can analyze light elements and inorganic substances as well as large organic molecules.

■TOF-SIMS Three Analysis Modes - High-resolution mass spectrum - Depth profile analysis - Surface mapping analysis

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Total Solution for Quality Technology

We provide quick and accurate solutions based on technology and experience for quality initiatives that consider performance, reliability, disposal, and recycling from the product planning stage.

● Comprehensive technical services covering the entire product life cycle We provide support throughout the entire product life cycle, including raw material evaluation during development necessary for improving the quality of electronic components, reliability testing and result analysis, timely feedback of failure analysis and results to the development and manufacturing sites after shipment, and consulting for quality problem resolution. ● Prompt analysis and reporting of reliability test results For defects identified in reliability testing, we assist in accurate and timely cause identification and analysis through a rich and efficient analysis menu. ● Use only the services you need, as much as you need You can freely choose from a range of services, including conducting tests and inspections based on a predetermined evaluation plan, developing evaluation and analysis plans for problem resolution, result analysis, cause investigation, and consultation, according to your needs.

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Latch-up test contract service

We provide latch-up testing services to evaluate the resistance of CMOS ICs and semiconductor products containing them to latch-up destruction.

■ We support products such as IC modules, electronic components, and subsystems with up to 512 pins. ■ We provide testing that complies with major domestic and international standards such as JEDEC, JEITA, and AEC. ■ We propose and conduct tests tailored to our customers' requests and objectives. ■ In the event of any issues with reliability, we assist with failure analysis and root cause investigation to resolve the problem.

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