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■Special Sampling Techniques for Foreign Substances in Multilayer Films - Foreign substances buried in metal films on substrates Metal film etching ⇒ Transfer to Si wafer ⇒ FT-IR analysis - Foreign substances in multilayer films Cutting off the surface layer ⇒ Transfer to Si wafer ⇒ FT-IR analysis Microtome/FIB thinning ⇒ Transfer to Si wafer ⇒ FT-IR analysis
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■TOF-SIMS Three Analysis Modes - High-resolution mass spectrum - Depth profile analysis - Surface mapping analysis
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● Comprehensive technical services covering the entire product life cycle We provide support throughout the entire product life cycle, including raw material evaluation during development necessary for improving the quality of electronic components, reliability testing and result analysis, timely feedback of failure analysis and results to the development and manufacturing sites after shipment, and consulting for quality problem resolution. ● Prompt analysis and reporting of reliability test results For defects identified in reliability testing, we assist in accurate and timely cause identification and analysis through a rich and efficient analysis menu. ● Use only the services you need, as much as you need You can freely choose from a range of services, including conducting tests and inspections based on a predetermined evaluation plan, developing evaluation and analysis plans for problem resolution, result analysis, cause investigation, and consultation, according to your needs.
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■ We support products such as IC modules, electronic components, and subsystems with up to 512 pins. ■ We provide testing that complies with major domestic and international standards such as JEDEC, JEITA, and AEC. ■ We propose and conduct tests tailored to our customers' requests and objectives. ■ In the event of any issues with reliability, we assist with failure analysis and root cause investigation to resolve the problem.
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