アイテス List of Products and Services

The EBSD method allows us to confirm the distribution of crystal sizes and the orientation of crystal orientations. In this case, it was found that there is a significant orientation difference in the valleys of the screw, suggesting that there is a large residual stress. Additionally, it was observed that small crystal grains are distributed on the surface of the screw. [Summary] ■ Analysis Method - Observation of crystal structure using EBSD ■ Results - It was found that there is a significant orientation difference in the valleys of the screw - It is inferred that there is a large residual stress - It was also observed that small crystal grains are distributed on the surface of the screw *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices
• Analysis Services

We will introduce an example of analysis of the chip surface wiring (Al) using EBSD. The package resin was opened using a chemical solution/RIE, and an analysis of the Al pattern on the chip surface was conducted using EBSD. As a result, orientation was observed in the Al wiring. The normal orientation is distributed, and it is believed that many crystals are present. 【Overview】 ■ Analysis Method - The package resin was opened using a chemical solution/RIE. - An analysis of the Al pattern on the chip surface was conducted using EBSD. ■ Results - Orientation was observed in the Al wiring. *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices
• Analysis Services

During reliability testing, the samples change continuously. Do you have any questions such as "At what point did the crack occur?", "How does the degradation progress?", or "How much has it changed from the initial state?" By combining this with reliability testing, we will evaluate the subject in a time-series and non-destructive manner. 【Features】 ■ Applicable for observing changes in whiskers, migration, pressure resistance, solder evaluation, chemical erosion tests, and aging products in the market ■ Environmental tests and observation frequency will be conducted according to customer requirements ■ Additional analyses such as electrical characteristics, SEM observation, elemental analysis, and cross-sectional observation are also available *For more details, please refer to the PDF document or feel free to contact us.

• Contract Inspection
• Testing Equipment and Devices
• Other inspection equipment and devices

At Aites Co., Ltd., we conduct depth profile analysis of thin film layers using angle-resolved XPS. By changing the angle between the sample and the XPS photoelectron detector, it is possible to vary the detection depth of the photoelectrons. The data obtained from this is numerically analyzed through simulation and converted into a depth profile. We achieve depth profile analysis of uniform thin films in the nanometer order near the surface, which is difficult to measure using conventional ion etching methods. We also have examples of analyzing the depth profile of HDD magnetic surfaces. 【Features】 ■ Non-destructive depth profile analysis of thin films in the nanometer order is possible ■ Achieves depth profile analysis of uniform thin films *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices
• Contract Analysis

Many defects occur during the manufacturing process of products and during their use. Among these, there are challenges related to material properties, and for those who are wondering, "It’s probably due to the material, but what should I do about it?", we propose solutions from the perspectives of electronics, atoms, molecules, and chemical reaction mechanisms. ■Examples of Challenges - What is causing this discoloration? - Why did it crack so quickly? - Why does it break immediately when subjected to a tensile test? *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• others
• Other environmental analysis equipment

We would like to introduce the sample preparation (sample cutting and resin embedding) for cross-sectional observation conducted by Aites Co., Ltd. We use cutting equipment suitable for cutting large substrates and thick components, such as the band saw "HOZAN K-100" and the IsoMet "Buehler Low Speed Saw." With the "HOZAN K-100," samples up to approximately X150mm, Y230mm, and Z70mm in size can be cut. Additionally, after cutting, the samples are embedded in epoxy resin or similar materials, but it is also possible to embed in resin before cutting. 【Product Lineup】 ■ Band Saw ■ IsoMet ■ Multifunctional Diamond Wire Saw *For more details, please refer to the PDF document or feel free to contact us.

• others

We would like to introduce the cutting process using a wire saw at AITES Co., Ltd. With a wire saw, it is possible to create multiple cross-sections from a single sample by cutting and dividing it. Since it does not involve grinding, observations and analyses can be conducted again. Additionally, in cutting examples, even small and brittle white rice can be divided without causing cracks or chips. If you have any requests ranging from cutting processes to observations and analyses, please feel free to contact us. *For more details, please refer to the PDF document or feel free to reach out to us.

• Processing Contract
• others

Aites Co., Ltd. performs slicing processing using isomet. When you want to observe the cross-section of all connector pins in multiple rows, the usual procedure is to grind down to the next row... However, by performing slicing processing, it is possible to keep the created cross-section as it is. Additionally, we have examples of slicing processing for connector pins with multiple rows. *For more details, please refer to the PDF materials or feel free to contact us.*

• Processing Contract
• others

Our "Micro Raman Spectrophotometer" employs a confocal optical system, allowing for the adjustment of the focal position in the depth direction, similar to a microscope, enabling material analysis of each layer from the surface of multilayer films. Using the confocal function of the micro Raman spectrophotometer, the focus of the Raman laser light can be varied in the depth direction. Additionally, by continuously changing the focal position, it is possible to obtain spectra continuously in the depth direction. 【Features】 ■ Adoption of a confocal optical system ■ Enables material analysis of each layer from the surface of multilayer films ■ Capable of varying the focus of the Raman laser light in the depth direction ■ Allows for continuous spectral acquisition in the depth direction *For more details, please refer to the PDF document or feel free to contact us.

• Spectroscopic Analysis Equipment
• Analytical Equipment and Devices
• Contract Analysis

We offer a service to replace CRT monitors, such as those used in machine tools, with LCD displays. Do you have concerns like "the CRT monitor won't turn on" or "I only want to repair the monitor"? If the monitor can be replaced and the machine tools can be used again, it can lead to cost savings compared to purchasing new equipment. Please feel free to contact us regarding the possibility of repairs. 【Process for Replacement】 1. Check the CRT signal line 2. Connect the signal from the CRT to the signal converter 3. Connect the output of the signal converter to the LCD 4. Adjust the settings of the signal converter and check the screen *You can view the flyer for this service by clicking the download button.

• LCD display

This document introduces a comparison of components in PC monitors and digital clocks using gas chromatography-mass spectrometry (GC-MS). Liquid crystal displays contain small organic substances (liquid crystal molecules). These have evolved into molecular structures suitable for product characteristics due to technological innovations. Our company clarifies these differences at the molecular level using GC-MS, allowing us to confirm that the liquid crystal molecules are appropriate for their intended use and to check for the presence of impurities. [Contents] ■ Component comparison of PC monitors and digital clocks using GC-MS ■ Case studies of GC-MS analysis of liquid crystal components We compared the number of components and characteristics of segment-type liquid crystal displays (digital clocks) and color TFT liquid crystal displays (PC monitors). *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis

At Aites Co., Ltd., we offer analysis and reliability evaluation services for "Crystallinity Analysis of Resin Materials using Micro-Raman Spectroscopy." Using the spectra obtained from a micro-Raman spectrophotometer, it is possible to determine the crystallinity of resin materials in fine detail based on the differences in the half-width of the peaks. We also have analysis cases that investigate the changes in crystallinity from the mouth of PET bottles to the bottle body. Please leave the analysis, evaluation, and reliability assessment to us. [Overview] ■ Crystallinity Analysis of Resin Materials using Raman Spectroscopy - The linewidth of the Raman spectrum changes to reflect crystallinity - It is possible to determine the half-width of the C=O stretching band and the crystallinity - It is possible to determine the relative crystallinity of PET *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis
• Contract Inspection
• Contract measurement

Our company scans the sample surface with a micro probe to achieve nano-level structural analysis. In "shape measurement (tapping mode)," the probe, which is periodically vibrated, lightly taps the sample surface to measure its shape. Additionally, "phase imaging" maps the phase delay between the periodic signal that moves the cantilever and the cantilever's vibration, visualizing differences in physical properties that do not appear in the shape. 【Features】 ■ High-resolution imaging with a micro probe ■ Measurement possible for conductors, semiconductors, and insulators ■ Measurement can be conducted almost non-destructively with minimal contact pressure *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis
• Contract measurement
• Other microscopes

This is an introduction to a case where water droplet-shaped contaminants were created on a Si wafer through reproducibility experiments. Measurements were conducted at the same position using SEM-EDX and TOF-SIMS, and a comparison of the image maps was made. In the TOF-SIMS image map, organic substances (CH, CN), Na, and K were detected around the watermark. While no contaminants were observed around the watermark in the optical image, SEM image, and EDX analysis, the TOF-SIMS image map revealed that trace amounts of contaminants were present. *For more details, please refer to the PDF document or feel free to contact us.*

• Contract Analysis
• Contract Inspection
• Contract measurement

TOF-SIMS can detect elements and organic molecules, as well as fragment ions, making it effective for organic analysis. As an example of organic analysis, we will introduce a case study of polyethylene glycol. Secondary ion mass spectra can provide valuable insights for the qualitative analysis of organic substances. In this case study, we can confirm the characteristic repeating structure of polyethylene glycol (C2H4O) as a peak group with a mass difference of 44. Calculating from the mass number, it is inferred that the terminal groups are H- and HO-, suggesting they are detected as protonated species. *For more details, please refer to the PDF document or feel free to contact us.*

• Contract Analysis
• Contract Inspection
• Contract measurement

TMA (Thermomechanical Analysis) is a method that measures the dimensional changes of a sample while applying a constant load and varying the sample temperature. It provides information on thermal expansion, thermal contraction, glass transition temperature, and more. The temperature range is from -150 to 1000°C, with a maximum size of Φ10×25mm (compression mode, needle insertion mode) and a maximum size of 0.7mm×5mm×20mm (tensile mode) as measurable conditions. This document includes case studies of TMA analysis for semiconductor encapsulants. 【Features】 ■ Thermomechanical measurement ■ Applying a constant load to the sample while varying the sample temperature ■ Measuring the dimensional changes of the sample ■ Obtaining information on thermal expansion, thermal contraction, glass transition temperature, etc. ■ Multiple measurement modes *For more details, please refer to the PDF document or feel free to contact us.

• Contract measurement
• Contract Analysis
• Contract Inspection

TG-DTA (Thermogravimetric Differential Thermal Analysis) is an analysis that simultaneously measures the weight of a sample (TG) and the temperature difference between the sample and a reference material (Differential Thermal Measurement) (DTA) as a function of temperature, while varying the sample's temperature according to a specific program. The measurable conditions are a temperature range of room temperature to 1000°C, a required sample amount of 10 to 20 mg, and sample shapes including film, powder, and bulk. 【Features】 - Thermogravimetric Differential Thermal Analysis - Varies the sample's temperature according to a specific program - Simultaneously measures the sample's weight and the temperature difference from the reference material as a function of temperature - Required sample amount: 10 to 20 mg - Sample shapes include film, powder, and bulk *For more details, please refer to the PDF document or feel free to contact us.

• Contract measurement
• Contract Analysis
• Contract Inspection

DSC (Differential Scanning Calorimetry) is an analytical method that determines the difference in heat flow between a sample and a reference material as a function of temperature changes in the sample, allowing for the observation of the degree of endothermic/exothermic reactions in the sample. The temperature range is -90°C to 550°C, the required sample amount is 5 to 10 mg, and the sample shapes that can be measured include films, powders, and bulk materials. 【Features】 ■ Differential Scanning Calorimetry ■ Observation of the degree of endothermic/exothermic reactions in the sample ■ Temperature range: -90°C to 550°C ■ Required sample amount: 5 to 10 mg ■ Sample shapes: films, powders, bulk *For more details, please refer to the PDF document or feel free to contact us.

• Contract measurement
• Contract Analysis

"DMA (Dynamic Mechanical Analysis)" is an analysis method that applies periodic oscillatory loads to polymer materials and measures the resulting stress and phase difference to determine elasticity and viscosity as a function of temperature. It provides information related to molecular motion and molecular structure of polymers, such as glass transition and relaxation. 【Features】 ■ Dynamic mechanical analysis ■ Applies periodic oscillatory loads to polymer materials ■ Measures elasticity and viscosity as a function of temperature ■ Obtains information related to molecular motion and molecular structure of polymers ■ Multiple measurement modes *For more details, please refer to the PDF document or feel free to contact us.

• Contract measurement
• Contract Analysis
• Weight related measuring instruments

In this document, we introduce various analysis cases conducted by our company using X-ray fluoroscopy and CT inspection equipment. It includes examples such as "BGA solder crack analysis case" from X-ray fluoroscopic observation and oblique CT observation, as well as cases of "surface mount LEDs" and "chip resistors." 【Contents (excerpt)】 ■ BGA solder crack analysis case (X-ray fluoroscopic observation) ■ Surface mount LEDs ■ Chip resistor observation case ■ Reflow simulator ■ Microphone observation case (X-ray fluoroscopic observation & orthogonal CT observation)... ★ Currently offering the 【X-ray fluoroscopy and CT inspection equipment case collection】 for free! You can view it immediately from the "PDF download." *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment
• Contract Inspection
• Contract Analysis

This document introduces an example of analytical methods for molecular structure analysis. It includes structural analysis using IR and Raman for liquid crystal polymers (LCP), TIC data from GC-MS analysis of low molecular weight liquid crystals (for LCD), and detected substances, along with figures and tables. For analysis at the quantum level, please consult the technical group "Aites," which has extensive expertise. [Contents (excerpt)] ■ Liquid Crystal Polymers (LCP) ■ Structural analysis of LCP (fully aromatic polyamide) ■ Structural analysis using IR ■ Structural analysis using Raman ■ Structural analysis using XPS (ESCA) *For more details, please refer to the PDF document or feel free to contact us.

• Analysis Services
• Structural Analysis

X-ray observation is a method of non-destructive testing and is the first inspection conducted for analysis and evaluation. It is effective for initial observation of various components and materials, including implemented circuit boards and electronic parts. Additionally, CT inspection allows for three-dimensional structural capture, enabling visual judgment. The "Cheetah EVO" is equipped with a reflow simulator, allowing real-time observation of phenomena such as void behavior during soldering, which can be utilized for setting reflow conditions and selecting solder. 【Device Specifications】 ■ YXLON Cheetah EVO - X-ray generator: Multi-focus transmission type - Tube voltage: 25-160kV - Tube current: 0.01-1.0mA - Tube power: 64W - Additional features: Orthogonal CT, oblique CT, reflow simulator *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment
• Other inspection equipment and devices

We will introduce a case study of the combined use of X-ray transmission observation and CT scanning equipment with image processing technology. In the transmission X-ray images of normal substrates and defective substrates, the wiring was intricately arranged, and abnormalities were not apparent at first glance. However, image processing allowed us to detect the differences between the images of normal and defective products. Identifying defective areas from a wide field of view is challenging, especially in cases of pattern abnormalities in substrate wiring. However, by using image processing software in conjunction, it becomes possible to discover abnormal areas. [Case Study of Combined Use of Transmission Observation and Image Processing Technology] ■ Detection of differences between images of normal and defective products through image processing - Upon examining the white spots in the X-ray transmission image of the defective product, a shape resembling a broken wire was confirmed. *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment
• Other inspection equipment and devices

We would like to introduce a case of observing a wisdom tooth (third molar) using X-ray CT. Over 10 years ago, the extracted wisdom tooth of the photographer was observed using X-ray CT. Compared to X-ray fluoroscopy images, the enamel on the surface of the tooth and the underlying dentin were clearly observed. [Observation Case of Wisdom Tooth] ■Compared to X-ray fluoroscopy images, the enamel on the surface of the tooth and the underlying dentin can be clearly observed. *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment
• Other inspection equipment and devices

We would like to introduce the features of the YXLON "Cheetah EVO" that we have implemented. The "Reflow Simulator" allows for real-time observation of phenomena such as void behavior during soldering. It can be utilized for setting reflow conditions and selecting solder. 【Features】 ■ Ceramic heater & lamp heating ■ Target size: 40x40x20mm ■ Maximum set temperature: 350 degrees ■ Real-time observation possible ■ Can be used for setting reflow conditions and selecting solder *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment
• Other inspection equipment and devices

We would like to introduce a case study of observing microphone components using X-ray fluoroscopy and orthogonal X-ray CT. MEMS chips and Si chips are transparent, making them only faintly observable. However, in the X-ray fluoroscopic images, the wire bonding and the wiring patterns of the mounting substrate can be observed. In the orthogonal CT images, MEMS chips and Si chips can be observed more clearly compared to the fluoroscopic images. Additionally, while the fluoroscopic images show the observation of overlapping layers, the CT images allow for observation of each layer individually. [Observation Case of Microphones] ■ X-ray Fluoroscopic Images - Wire bonding and wiring patterns of the mounting substrate can be observed. ■ Orthogonal CT Images - MEMS chips and Si chips can be observed more clearly compared to the fluoroscopic images. *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment
• Other inspection equipment and devices

We will introduce a case study of observing chip resistors using X-ray fluoroscopy and CT scanning. Chip resistors have a structure where a thin film of metal (the resistive element) is formed on the surface of ceramics. The L-shaped lines seen in the X-ray image are trimming marks applied to adjust the resistance value. CT observation allows for viewing the desired cross-sectional images and enables three-dimensional observation, making it effective for analysis. If any defects are found through X-ray or CT observation, cross-sectional observation and elemental analysis will be conducted to investigate the cause. [Case Study of Chip Resistor Observation] ■ CT Observation - It is possible to view the desired cross-sectional images. - Effective for analysis due to the ability to observe in three dimensions. *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment
• Other inspection equipment and devices

We would like to introduce a case where the moment a surface-mounted LED is damaged due to overload was captured through X-ray observation. In this case, the surface-mounted LED was powered on, and the voltage and current were gradually increased from the rated values, capturing the process that led to the LED becoming non-functional due to overload. Additionally, you can view the process of the LED becoming non-functional in a video. 【LED Failure Observation Case】 ■ After becoming non-functional - Melting, disconnection - Change in the shape of the wire loop - Delamination of the phosphor - Changes in the shape and size of voids *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment
• Other inspection equipment and devices

We will introduce a case study of BGA solder crack analysis using X-ray imaging and CT scanning. When observing the BGA connection area of a circuit board that had become electrically open using X-ray imaging, cracks were confirmed to have occurred at the BGA connection. Additionally, we examined the cracks in the solder connection area identified through X-ray imaging using oblique CT. Oblique CT provides clear planar information, but spherical shapes like solder balls and voids appear elongated in the vertical direction due to specific factors of oblique CT. While it is difficult to obtain cross-sectional information about the cracks occurring at the solder joint interface, there is the advantage of being able to observe the circuit board non-destructively. [Analysis Cases] ■ X-ray imaging observation ■ Oblique CT observation ■ Orthogonal CT observation ■ Cross-sectional observation *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment
• Other inspection equipment and devices

We will introduce a case of observing an inductor coil (orthogonal CT observation + cross-sectional observation). The inside of an inductor coil that experienced operational failure was observed using X-ray CT. It was confirmed that abnormal shapes occurred in various places of the spirally formed wiring. With X-ray CT observation, it is possible to observe in three dimensions, allowing for a clear understanding of the condition of the abnormal areas. Additionally, cross-sections including the abnormal areas were created through mechanical polishing, and observations were conducted using SEM. *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment
• Other inspection equipment and devices

Here are some observation examples of IC-type coils. By using appropriate methods for X-ray observation, we can clearly capture the internal structure according to the purpose. In transmission observation, we can quickly detect metal foreign objects, and in CT observation, we can obtain three-dimensional images of arbitrary cross-sections, making it suitable for observations where positional information and shape are important. Unlike transmission observation, we can also assess the winding condition of the coil wiring. *For more details, please refer to the PDF materials or feel free to contact us.

• X-ray inspection equipment
• Other inspection equipment and devices

We would like to introduce the products handled by Aites Co., Ltd.: "Evaluation Pattern Wafers," "Silicon Wafer Sales," and "Compound Semiconductors." The "Evaluation Pattern Wafers" are created as test pattern wafers with various structures for evaluating CMP, deposition equipment, cleaning equipment, and various materials. We accept even a few prototype evaluations without any issues and are well-known for our very flexible responses, from mask design to cross-sectional dimension measurement. 【Features】 <Evaluation Pattern Wafers> ■ Creation of test pattern wafers with various structures for evaluating CMP, deposition equipment, cleaning equipment, and various materials. ■ Accepting even a few prototype evaluations without any issues. <Silicon Wafer Sales> ■ A wide range of products from particle-free items for semiconductor front-end processes to inexpensive coin roll wafers for back-end processes. ■ Capable of film processing on silicon wafers, BG thinning, dicing, as well as complex recess processing and through-hole processing. *For more details, please refer to the PDF materials or feel free to contact us.

• Wafer
• Wafer processing/polishing equipment
• Processing Contract

At AITES, we provide total solution services for power devices, including reliability testing, analysis, and evaluation. This includes the "Power Cycle Testing Machine," which can simultaneously conduct transient thermal measurements, as well as "failure analysis of compound semiconductors," "concentration analysis of diffusion layers," and "cross-sectional analysis of modules." We will make proposals based on specific achievements. Keywords: ■General power semiconductors (chips, module TIM materials, etc.) ■Reliability testing/evaluation ■Structural analysis (quality, competitor product RE) ■Failure analysis (identification of failure points, cause investigation, improvement proposals) 【List of Tests】 ■Power Cycle Testing ■Liquid Tank Thermal Shock Testing ■Gate Bias Testing ■Non-destructive observation of semiconductor/package delamination ■Failure analysis of power chips, etc. *For more details, please refer to the PDF materials or feel free to contact us.

• Analytical Equipment and Devices
• Analysis Services

At Aites Co., Ltd., we offer "Module Prototyping and Thermal Resistance Evaluation." In the evaluation of power devices and the materials used in power devices, measuring thermal resistance by actually assembling the device is an effective method for understanding performance. We handle everything from prototyping to evaluation. If you are interested, please feel free to consult with us. 【Features】 <Prototyping of Power Modules> ■ We provide a consistent, flexible, and cost-effective service from chip procurement to module assembly. ■ Suitable for evaluating die attach and TIM materials. <Transient Thermal Resistance Measurement> ■ Using T3Ster (power cycle testing device built-in) for power devices, we conduct measurements of transient thermal resistance, obtain structural functions, and perform thermal analysis. ■ Using that data, we can compare materials, calculate thermal resistance, and estimate defective areas. *For more details, please refer to the PDF document or feel free to contact us.

• Contract measurement
• Contract Analysis
• Contract Inspection

At Aites Co., Ltd., we offer contract power cycle testing using Siemens (Mentor) power cycle testing equipment. We can also handle the creation of various jigs necessary for the tests. Additionally, we accommodate various observations and measurements of power devices. We can capture changes before and after tests such as power cycle testing. 【Features】 ■ We can handle the creation of various jigs necessary for the tests. ■ We accommodate various observations and measurements of power devices. ■ We can capture changes before and after tests such as power cycle testing. *For more details, please refer to the PDF document or feel free to contact us.

• Contract measurement
• Contract Analysis
• Contract Inspection

At AITES Co., Ltd., we offer "environmental testing in a high-power constant temperature and humidity chamber." We can achieve a constant temperature change of up to 15°C/min (-45 to ±155°C). Temperature cycle tests can be conducted by controlling the temperature gradient. Additionally, the temperature control range is wider than that of typical constant temperature and humidity chambers, allowing control at 95°C. 【Features】 ■ Two high-power constant temperature and humidity chambers introduced ■ Constant temperature change of up to 15°C/min (-45 to ±155°C) possible ■ Temperature cycle tests can be conducted by controlling the temperature gradient ■ Wider temperature control range than typical constant temperature and humidity chambers ■ Controllable at 95°C *For more details, please refer to the PDF materials or feel free to contact us.

• Contract measurement
• Contract Analysis
• Contract Inspection

This document presents the bonding interface of Cu wire bonding in semiconductor packages. It provides a detailed explanation of the samples and methods, various wire bonding techniques, results, and discussions, accompanied by figures and photographs. 【Contents】 ■ Introduction ■ Samples and Methods ■ Various Wire Bonding Techniques ■ Results and Discussion ■ Conclusion ■ References *For more details, please refer to the PDF document or feel free to contact us.

• Wiring materials
• Other electronic parts

This document explains the bonding interface of Cu wire bonding in semiconductor packages. It details the purpose and wire bonding, as well as the characteristics of Cu wire bonding, the Cu-Al compounds at the bonding center, micro voids, and the growth (diffusion) of Cu-Al compounds, accompanied by diagrams and photographs. [Contents (excerpt)] ■ Purpose and wire bonding ■ Samples and methods ■ Procedures and flow ■ Characteristics of Cu wire bonding ■ Selection of cross-section preparation methods *For more details, please refer to the PDF document or feel free to contact us.

• Wiring materials
• Other electronic parts

At Aites Co., Ltd., we conduct analysis of semiconductor diffusion layers using sMIM. The Scanning Microwave Impedance Microscopy (sMIM) features a signal that has a linear correlation with dopant concentration. sMIM scans the sample by irradiating microwaves from the tip of a metal probe attached to an SPM and measures the reflected waves to obtain sMIM-C images that have a linear correlation with the concentration of the diffusion layer. The C component of Zs obtained from reflectivity consists of oxide film capacitance and depletion layer capacitance, and by utilizing the fact that the depletion layer width changes depending on impurity concentration, we detect changes in concentration as changes in C. [Application Examples] ■ sMIM-C: Visualization of diffusion layers and semi-quantitative evaluation of dopant concentration for various semiconductor devices such as Si, SiC, GaN, InP, GaAs, etc. ■ dC/dV: Evaluation of diffusion layer shape, determination of p/n polarity, visualization of depletion layers. *For more details, please refer to the PDF materials or feel free to contact us.

• Contract Analysis
• Other contract services

We would like to introduce the products handled by Aites Co., Ltd.: "Evaluation Pattern Wafers," "Silicon Wafer Sales," and "Compound Semiconductors." The "Evaluation Pattern Wafers" are created as test pattern wafers with various structures for evaluating CMP, deposition equipment, cleaning equipment, and various materials. We accept even a few prototype evaluations without any issues and are well-known for our very flexible responses, from mask design to cross-sectional dimension measurement. 【Features】 <Evaluation Pattern Wafers> - Creation of test pattern wafers with various structures for evaluating CMP, deposition equipment, cleaning equipment, and various materials. - Accepting even a few prototype evaluations without any issues. <Silicon Wafer Sales> - A wide range of products from particle-free items for semiconductor front-end processes to inexpensive coin roll wafers for back-end processes. - Capable of film processing on silicon wafers, BG thinning, dicing, as well as complex notch processing and through-hole processing. *For more details, please refer to the PDF materials or feel free to contact us.

• Wafer
• Wafer processing/polishing equipment
• Processing Contract

This document introduces the defects of solar cell modules and presents case studies where various cross-sectional processing was conducted for observation and analysis, along with the factors contributing to degradation. It includes an introduction to "the basic structure of solar cells" and discusses "non-destructive analysis and destructive analysis" using diagrams and photographs. We encourage you to read it. 【Contents】 ■ Introduction ■ Basic structure of solar cells ■ Non-destructive analysis and destructive analysis ■ Various defect modes ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

• Other analyses

Our company supports customers in solving their challenges and issues not only with electronic components but also with a wide range of products, parts, and materials, including inorganic and organic materials, through failure analysis, defect analysis, structural analysis, and reliability evaluation. This document introduces how to approach analysis and evaluation techniques from various perspectives. We hope it serves as a starting point for problem-solving and provides assistance in unraveling issues for our customers. [Contents] ■ Introduction ■ Image of Joining and Positioning of Our Evaluation and Analysis Techniques ■ Causes of Defects ■ Methods ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

• Other analyses

One of the reliability evaluation methods, the ion migration evaluation test, has become increasingly important as a pre-evaluation due to the transition of products towards being lighter, shorter, and smaller. This document presents an overview of ion migration evaluation and the details of the test implementation using an example of an evaluation test conducted at our company. We will also introduce the usefulness of the continuous measurement (In-Situ) equipment used in the evaluation tests. [Contents] ■ Introduction ■ Ion Migration ■ Ion Migration Evaluation Test ■ Evaluation Method ■ Evaluation Test Case ■ Conclusion ■ References *For more details, please refer to the PDF document or feel free to contact us.

• others

We have introduced the "GC-MS Gas Chromatograph Mass Spectrometer" manufactured by Shimadzu Corporation. This is one of the analytical methods aimed at qualitative and quantitative analysis of components contained in samples, used for the qualitative and quantitative analysis of volatile organic compounds such as parts, materials, residual solvents, and additives. It is necessary for the measurement target to be gasified (with a boiling point below 300°C), but it is suitable for component analysis of mixtures due to its higher sensitivity compared to IR and RAMAN, as well as the ability to separate components in the GC section. 【Overview of GC-MS Equipment】 ■ GC-MS Main Unit: GC-2030, GCMS-QP2020 NX ■ Headspace Sampler: HS-20 ■ Pyrolysis Analyzer: Multi-Shot Pyrolyzer Py-3030 ■ Specifications ・Detection Limit: Several ppm (varies depending on the measurement target) ・Headspace: 40–300°C, Sample Size 13mm x 40mm or smaller ・Pyrolysis Analyzer: 50–1050°C (EGA measurement compatible), Sample Size up to 4mm *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices
• Contract Analysis

The "Cheetah EVO" is an X-ray inspection and CT scanning device equipped with a reflow simulator, allowing real-time observation of behaviors such as voids during soldering. It can be utilized for setting reflow conditions and selecting solder. Our company has examples of using this product for "observation of inductor coils," as well as "BGA solder crack analysis" and "observation of IC-type coils." 【Device Specifications (Excerpt)】 ■ X-ray Generator: Multi-focus transmission type ■ Tube Voltage: 25–160 kV ■ Tube Current: 0.01–1.0 mA ■ Tube Power: 64 W *For more details, please refer to the PDF materials or feel free to contact us.

• X-ray inspection equipment
• Other inspection equipment and devices