アイテス Product Lineup

There are various types of liquid crystal materials, including low molecular weight compounds used in LCD panels and high molecular weight polymers used in printed circuit boards and electronic components. We would like to introduce examples of molecular structure analysis of these low molecular weight liquid crystals and high molecular weight liquid crystals (LCP). Our company, equipped with a wealth of devices and expertise, can handle reliability testing and analytical analysis of not only liquid crystal materials but also various other materials. Please feel free to consult us regarding the understanding of molecular structures of imported overseas products and materials, as well as troubleshooting issues. 【Case Study Details】 ■ Molecular structure analysis using FT-IR ■ Understanding of surface functional groups (molecular groups) through XPS (ESCA) analysis ■ Example of LCD liquid crystal material analysis using GC-MS *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices
• Contract Analysis
• Contract Analysis

In our company, we can conduct liquid tank thermal shock tests while keeping the LED continuously powered on. This allows for verification of the lighting status during the test and continuous monitoring of current values for evaluation. The liquid tank applies temperature stress using a liquid medium, resulting in more abrupt temperature changes compared to a gas tank. Since we use a highly insulating liquid, electrical tests are possible, and by monitoring the voltage (current) during the test, we can identify points of characteristic change in the LED's lighting status. 【Features】 ■ Testing can be conducted with the LED continuously powered on ■ The liquid tank applies temperature stress using a liquid medium, resulting in abrupt temperature changes ■ Electrical tests are possible due to the use of a highly insulating liquid ■ Points of characteristic change can be identified *For more details, please refer to the PDF document or feel free to contact us.

• Impact Test

The "ESD (HBM・MM) Testing Service" evaluates the resistance to damage caused by ESD using the Human Body Model and Machine Model, which are important for the reliability of semiconductor products and electronic components that include them. We accommodate products such as IC modules, semiconductor products, and subsystems with up to 512 pins. We conduct tests in accordance with major domestic and international standards such as ESDA/JEDEC, JEITA, AEC, and IEC. Additionally, if there are issues with resistance, we assist in problem-solving, including failure analysis and root cause investigation. 【Features】 ■ Supports products such as IC modules, semiconductor products, and subsystems with up to 512 pins ■ Partial support for products with more than 512 pins (consultation required) ■ Conducts tests in accordance with major domestic and international standards such as ESDA/JEDEC, JEITA, AEC, and IEC ■ Proposes and conducts tests tailored to customer requests and objectives ■ Assists in problem-solving, including failure analysis and root cause investigation, if there are issues with resistance *For more details, please refer to the PDF document or feel free to contact us.

• Contract measurement

The "ESD (CDM) Testing Contract Service" evaluates the resistance to damage caused by ESD (Electrostatic Discharge) according to device charging models, which are important for the reliability of semiconductor products and electronic components that include them. It supports both the Direct Charge Method (Direct CDM) and the Field Induced Method (Field Induced CDM). Additionally, it is possible to determine damage through diode characteristic evaluation methods and other characteristic assessments (using separate equipment). 【Features】 ■ Compatible with various standard conditions such as JEDEC, JEITA (EIAJ also acceptable), and AEC through unit exchange ■ Supports both the Direct Charge Method (Direct CDM) and the Field Induced Method (Field Induced CDM) ■ Also compatible with the Direct Charge Method and Field Induced Method of AEC-Q100-011 ■ Damage determination is also possible through diode characteristic evaluation methods and other characteristic assessments ■ Ensures reliable application through contact confirmation function of applied pins *For more details, please refer to the PDF document or feel free to contact us.

• Contract measurement

In this document, we introduce the microtome and knives, along with examples of cross-sectional observations. The "microtome" is a device used to prepare cross-sectional observation samples for TEM, SEM, and OM, utilizing glass knives or diamond knives for sample cutting. Glass knives are mainly used for sample preparation (trimming), while diamond knives are used for finishing. For cross-sectional observations, the preparation of the cross-section was carried out on the gold-plated terminal part of a flexible cable. We invite you to read it. [Contents] ■ Equipment and knives ■ Cross-sectional observation examples *For more details, please refer to the PDF document or feel free to contact us.

• Testing Equipment and Devices

We would like to introduce the cross-sectional observation of Pb-free solder after reliability testing conducted by our company. Pb-free solder assemblies (Sn/Ag/Cu alloy solder) were subjected to three types of reliability tests. We compared the initial products with those after testing to check for the presence of cracks and the growth of intermetallic compound layers. To gradually confirm the durability of the solder joints through observations of crack progression, we recommend the TC test, which allows for cross-sectional observation after extraction at each cycle. 【Test Conditions】 (1) TC Test (Temperature Cycle) 125℃ for 20 minutes / -40℃ for 20 minutes / 1000 cycles (2) HT Test (High-Temperature Storage) 150℃ for 1000 hours (3) TH Test (Temperature and Humidity) 85℃ / 85% RH for 1000 hours *For more details, please refer to the PDF document or feel free to contact us.

• Solder

One of the features of EPMA is the guide network map method. In SEM-EDX, the measurement range is narrow, and for curved samples, surface analysis may not be accurately measured. However, by using the guide network map method of EPMA, extensive analysis becomes possible. This method automatically measures adjacent continuous areas and displays them collectively, making it useful for measuring surfaces with uneven height differences or for measuring large surfaces. 【Features of the Guide Network Map Method】 - A method for automatically measuring adjacent continuous areas and displaying them collectively. - Used for measuring surfaces with uneven height differences or for measuring large surfaces. *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis

Are you struggling with LCD analysis? We, at ITES, are here to help you find a solution! Structural Analysis: We evaluate and report on potential issues related to characteristics and structure in FPD products and advanced technologies that are constantly evolving. Defect Analysis: We approach and investigate the causes of manufacturing defects in increasing overseas products through the shortest route. Reliability Testing: Based on your objectives and needs, we propose the optimal reliability testing methods and conditions using our extensive know-how. [Contents] ■ Did you know? What is a display? ■ Panel analysis case studies ■ Tell me more! ITES's LCD analysis ■ ITES can perform these types of analysis!

• Contract Analysis

We would like to introduce a case study of foreign matter analysis conducted on laminate film. Upon inspecting the back side of the laminate film, a black foreign object was identified. Therefore, we carried out an investigation to identify the layer of origin and component analysis of this black foreign object. First, we considered the methods based on the objectives of the analysis. This time, we focused on the position of the foreign object and its components, and decided to prepare a cross-section of the foreign object for elemental analysis. 【Case Overview】 ■ A black foreign object was identified upon inspecting the back side of the laminate film. ■ We conducted an investigation to identify the layer of origin and component analysis of the black foreign object. ■ We prepared a cross-section of the foreign object and conducted elemental analysis. *For more details, please refer to the PDF document or feel free to contact us.

• Surface treatment contract service
• Contract Analysis

We will introduce a case study on fish-eye analysis of laminated film. In the multi-layer laminated film used for containers such as refillable shampoos, a part resembling a foreign substance was observed. Upon magnified observation, it appeared to be several tens of micrometers in diameter and looked like a fish-eye. To clarify the cause, a cross-sectional observation was conducted. There are various methods for preparing cross-sections, but we implemented a mechanical polishing method that allows for extensive observation. [Case Overview] ■ Background: Discovered a part that appears to be a foreign substance in the multi-layer laminated film ■ Objective: Conducted cross-sectional observation to clarify the cause ■ Cross-section preparation method: Implemented a mechanical polishing method that allows for extensive observation *For more details, please refer to the PDF document or feel free to contact us.

• Surface treatment contract service
• Contract Analysis

Our company can perform good product characteristic measurements, defective characteristic measurements, and reliability evaluations for specific TFTs in liquid crystal panels. In the "Electrical characteristic measurement of TFTs at various temperatures," we can disassemble the monitor in display mode and measure the electrical characteristics of the pixel TFTs within the panel. In the "DC bias stress test," we apply an arbitrary DC bias to the Gate and Drain and measure the Vth shift when stress is applied to the TFT, conducting reliability verification. 【Features】 - Electrical characteristic measurements can be performed on the pixel TFTs within the panel. - Measurements can be conducted before and after annealing, under light exposure, heating, or cooling conditions. - From the measurement results, indicators such as Ion, Ioff, Vth, and mobility can be calculated. - Verification of actual values in good product analysis and clarification of causes of defects can be performed. *For more details, please refer to the PDF document or feel free to contact us.

• LCD display

This document introduces a guide to mass spectrometry. In the analysis of organic compounds, information is obtained and analyzed from various analytical methods based on the functional groups, skeletal structures, and masses of the compounds. There are various methods for analyzing the mass of compounds, each with its own strengths in terms of the type of analysis and targets. Additionally, these methods can be selectively used according to the application or combined with other analytical techniques to obtain the necessary information. [Contents] ■ Methods mainly used in mass spectrometry - GC-MS - LC-MS - MALDI-TOFMS - GPC *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices
• Food Testing/Analysis/Measuring Equipment

This document introduces a colorimeter that quantifies the color of objects. When light is irradiated onto an object, optical phenomena occur on the surface and inside the object, allowing for the quantification of the object's color by detecting the scattered light. As an example, we present test results that quantify the color differences between conditions where water-based paint was irradiated with ultraviolet (UV) light and conditions without UV treatment. We encourage you to download and take a look. [Contents] ■ Colorimeter (Device Structure) ■ L*a*b* Color Space ■ Visual Inspection of Water-Based Paint and Conversion to L*a*b* Color Space *For more details, please refer to the PDF document or feel free to contact us.

• Testing Equipment and Devices
• Analytical Equipment and Devices

We will introduce examples of observation and analysis of coating films used in various products such as automobiles and mobile phones. The "Triple Ion Polisher (CP)" can process samples containing both hard and soft materials without causing damage, while the "Microtome" is capable of not only producing cross-sections but also performing planar inclined cutting. Additionally, the "Desktop Inclined Cutting Machine" can extract sample surfaces that are 6 to 300 times the original thickness as surface information, and the "Desktop SEM (Scanning Electron Microscope)" has a mode for observation under low vacuum (charge reduction), allowing for the observation and elemental analysis of samples that release volatile components. [Observation of Plastic Coating (Mobile Phone Case)] ■ Triple Ion Polisher (CP) ■ Microtome ■ Desktop Inclined Cutting Machine ■ Desktop SEM (Scanning Electron Microscope) *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices
• Other environmental analysis equipment

Plastic molded products made by injection molding undergo processes such as resin melting, filling into molds, and cooling and holding pressure. If these conditions are not appropriate, internal stresses (residual stresses) may remain, leading to molding defects. A two-dimensional birefringence measurement system can visualize birefringent phase differences (strain) and flow direction/stress direction (principal axis orientation), which are indicators of that stress. As an example, we will introduce a birefringence evaluation comparing polystyrene (PS) molded products under different heating conditions. 【Device Principle】 ■ When light is applied to a transparent body with birefringence, its polarized state changes. ■ By using a birefringence measurement device, it is possible to visualize the polarization information with a dedicated polarization image sensor. ■ By using wavelengths of 523nm, 543nm, and 575nm, birefringence can be evaluated by comparing the polarized states before and after passing through the transparent body. *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis
• Other contract services

There are many types of thermoplastic resins, but among them, ABS is widely used in various products due to its unique molecular structure. As an engineering plastic, ABS resin is utilized in a wide range of fields, including electronic products, automobiles, home appliances, and IT-related products. We examined the characteristic IR spectrum of ABS resin using FT-IR analysis. [Shapes] ■Head to tail ■Head to head ■Tail to tail *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis
• Other contract services

We would like to introduce a case study of ion chromatography analysis conducted by our company (solid surfaces). Solid surfaces can also be measured using ion chromatography by extracting them into a solution. Additionally, average data can be obtained for sample surfaces larger than a few centimeters, making it suitable for relative comparisons of flat samples such as printed circuit boards. You can view the analysis flow for liquid samples and solid surfaces by downloading the PDF below. 【Overview of Liquid Sample Analysis】 ■ Liquid samples are introduced into the device for measurement after solution preparation such as dilution and filtration. ■ Measurement results are reported in solution concentration [mg/L]. *For more details, please refer to the PDF document or feel free to contact us.

• Other contract services

In our evaluation of the properties of various materials, it can be said that glass plates with less indentation are harder, while plastic cases with more indentation are softer. Additionally, glass plates and plastic cases with a high recovery amount have a higher proportion of elasticity, whereas metals with a low recovery amount have a higher proportion of plasticity. Furthermore, we also evaluate material properties that can be understood from the diagrams. Please feel free to contact us if you have any inquiries. 【Overview】 ■ Evaluation of the properties of various materials ■ Material properties that can be understood from diagrams *For more details, please refer to the PDF document or feel free to contact us.

• Other contract services

After the solder durability test on the circuit board, if cracks occur in the solder joints, the crack rate will be calculated to confirm whether the cracks are within the allowable standards. The evaluation standards after the solder durability test can be individually defined based on the product environmental specifications, so most customers have their own standards. The measurement methods vary according to the shape of the components, but when you make a request, we will carry out the tests according to your specifications. 【Service Contents】 ■ Solder joints of BGA - Calculation of crack rate for ball joints ■ Solder joints of chip resistors - Calculation of crack rate for both ends of square and rectangular terminals ■ Solder joints of coil components - Calculation of crack rate for ribbon leads and QFP leads *For more details, please refer to the PDF document or feel free to contact us.

• Contract measurement

The biggest advantage of angled CT is that it allows for non-destructive CT observation. It is suitable for obtaining planar information and can provide information for each layer in a multilayer substrate. Additionally, by using a length measurement tool, it is also possible to measure lengths. In our measurements, we observed a difference of about 7-14% compared to the results from optical microscope images, but it seems effective for those who want to understand internal structures non-destructively. Please feel free to contact us when needed. 【Features】 ■ Non-destructive CT observation ■ Suitable for obtaining planar information ■ Capable of obtaining information for each layer in multilayer substrates *For more details, please refer to the PDF document or feel free to contact us.

• Other contract services

Polyethylene resin is a versatile plastic that is commonly found and used in many applications. Depending on the application, the reaction processes (synthesis/polymerization) differ, such as soft types and hard types. Due to the differences in synthesis/polymerization, it is divided into low-density polyethylene (LDPE) and high-density polyethylene (HDPE). Our company has analyzed the subtle spectral differences using FT-IR. For more details, please refer to the PDF download below. 【Overview】 ■Polyethylene polymerization process ■IR measurement results ■Spectral overlay and spectral analysis ■Testing evaluation analysis services *For more information, please refer to the PDF document or feel free to contact us.

• Other contract services

The materials that make up the product are varied, but if there is significant or uneven internal stress during the manufacturing process, it can lead to issues such as deformation, cracking, and reduced performance due to usage and environmental conditions. By using 'WPA (Wide Polarization Analysis)', it becomes possible to understand internal stress and strain states by evaluating the orientation, strain, and birefringence of the material. Please feel free to consult with us. 【Features】 ■ Ability to understand internal stress and strain states ■ Clarification of material strain and birefringence from a molecular perspective ■ Analysis of defects and theories through multiple methods in a matrix - Raman spectroscopy (qualitative/strain/crystallinity), XRD (X-ray diffraction), AFM/SEM/TEM (crystal structure observation), DSC (degree of crystallization), etc. *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis
• Other contract services

The quality of diamonds is determined by the 4Cs (Cut, Color, Carat, Clarity). Clarity refers to the degree of inclusions and blemishes. I took a look at the clarity using a microscope, and I would like to share my findings. Even items that appear clean at first glance may have inclusions or cracks when magnified. The microscope allows us to observe tiny defects that cannot be seen with the naked eye. Additionally, the microscope is also used for the inspection and observation of semiconductor electronic components and silicon chips. Please feel free to contact us if you need our services. [Features] - The microscope can observe tiny defects that cannot be seen with the naked eye. - Inspections and observations of semiconductor electronic components and silicon chips are also conducted. *For more details, please refer to the PDF document or feel free to contact us.

• Microscope
• Other microscopes
• Contract measurement

Regarding aluminum electrolytic capacitors that have malfunctioned due to aging degradation, we conducted an internal condition check using X-ray CT, and we would like to introduce the findings. In the degraded products, the internal pressure increased due to gas generated from the decomposition of the electrolyte, and as degradation progressed, there was a risk of the electrolyte being ejected due to the opening of the pressure relief valve. Additionally, it is believed that the gradual volatilization of the electrolyte due to deformation of the rubber cap, which leads to a decrease in airtightness, ultimately results in capacity loss and open failure. 【Overview】 ■Appearance Comparison - Conducted visual inspection of both normal and degraded products. ■Internal Comparison using X-ray CT - Conducted internal observation of both normal and degraded products using X-ray CT. *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment
• Other inspection equipment and devices

We will introduce a case comparing the analysis of lithium (Li) using TOF-SIMS and SEM-EDX. While SEM-EDX is used for the analysis of contamination and foreign substances, it is difficult to detect Li with general EDX, excluding windowless EDX. On the other hand, TOF-SIMS can detect Li with high sensitivity. Please feel free to contact us if you need assistance. 【Overview】 ■ Analysis of stains on copper plates ■ SEM-EDX analysis → Difficult to detect Li ■ TOF-SIMS analysis → Li detectable *For more details, please refer to the PDF document or feel free to contact us.

• Contract measurement

Thermal analysis is a method for identifying defective areas by detecting heat generated at leak points due to applied voltage using a high-sensitivity InSb camera. By detecting the weak heat generated from shorts and leaks with a high-sensitivity InSb camera, it is possible to non-destructively identify the failure points of electronic components such as semiconductors. Furthermore, non-destructive observation can also be performed using X-ray inspection equipment. 【Features】 ■ Identifying defective areas by detecting heat generated at leak points with a high-sensitivity InSb camera ■ Analyzing samples in a non-destructive state, and also capable of analyzing electronic components that are difficult to analyze with OBIRCH or emission methods ■ Using the lock-in function to acquire phase information allows for high-precision identification of heat generation points *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis

At AITES, we are conducting a structural analysis of Nylon 6.10. Nylon possesses flexibility and a texture similar to silk, while also having high strength and durability that natural fibers do not have, described as "stronger than steel and finer than a spider's silk." We will elucidate these characteristics at the molecular level using our FT-IR and pyrolysis GC-MS. 【Nylon 6.10 Interfacial Polymerization Reaction Mechanism】 1. Electron withdrawal by chlorine leads to a deficiency of electrons in adjacent carbon. 2. The non-bonding electrons of the amine attack the carbon as a nucleophile. 3. The oxygen atom is activated to form an unstable intermediate. 4. Hydrogen chloride is eliminated, forming an amide bond. 5. Interfacial polymerization progresses, resulting in polymerization. *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis

We conduct "pigment and polymer analysis using MALDI-TOFMS." With "MALDI-TOFMS," it is possible to obtain molecular weight information for insoluble substances such as pigments, molecular weight information for synthetic polymers, and information on terminal groups. Please feel free to contact us for mass confirmation of synthetic compounds or for structural analysis in combination with other analytical methods. 【Features】 ■ Adoption of Matrix-Assisted Laser Desorption Ionization Mass Spectrometry (MALDI) ■ Ability to obtain information regarding the composition of compounds ■ Suitable for analyzing polymers that are small compared to GPC and large compared to LCMS ■ Mass numbers are detected as absolute values *For more details, please refer to the PDF document or feel free to contact us.

• Contract measurement
• Contract Inspection

Various defects such as cracks, discoloration, delamination, deformation, and reduction in material strength can occur in products and components. Many of these issues are often caused by the materials that make up the products, and analyzing these materials can sometimes lead to solutions. This document introduces an approach to understanding what is happening through chemistry and reaction mechanisms. [Contents] ■ Cracks (breaks), delamination ■ Discoloration, deformation ■ Chemical reaction mechanisms (example of epoxy resin curing) *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis

At AITES, we conduct "simple measurement of band gaps using XPS." It is possible to simply measure the band gaps of materials or thin films with relatively wide band gaps among semiconductors and insulators using XPS. When measuring the band gap of β-Ga2O3 using the O1s peak, the band gap of this β-Ga2O3 was measured to be approximately 4.9 eV, based on the difference between the peak position of O1s and the energy loss edge due to the band gap. 【Features】 ■ Can be easily measured using XPS ■ Simple measurement of thin films with wide band gaps, such as SiON, is also possible ■ Supports semiconductors other than oxide-based materials *For more details, please refer to the PDF document or feel free to contact us.

• Contract measurement

There are many types of vinyl polymers, and they exhibit various properties depending on the molecular structure of their side chains. Additionally, differences in crystallinity arise from the bonding configuration of these side chains (stereoisomers). In this document, we present the results of IR analysis of representative vinyl polymers, including polyethylene, polypropylene, polystyrene, and polyvinyl chloride (PVC). Aites conducts advanced data analysis based on chemical theory, ensuring that even subtle differences are not overlooked. Please feel free to consult us at any time. 【Contents】 ■ Analysis Sample: Vinyl Polymers ■ IR Spectrum (ATR Method) ■ IR Spectrum Comparison (Overlay) *For more details, please refer to the PDF document or feel free to contact us.

• Contract measurement

At AITES, we conduct "Authenticity Investigations (Comparative Observations)." We compare the item under investigation with genuine or standard products, examining differences in structure and whether any silent changes have occurred. We support various observations, including visual inspections, unboxing observations, electrical property measurements, destructive and non-destructive observations, reliability testing, and material investigations. 【Features】 ■ Comparison of the item under investigation with genuine or standard products ■ Investigation of differences in structure and whether any silent changes have occurred *For more details, please refer to the PDF materials or feel free to contact us.

• Contract measurement

Polarizing films and light diffusion films are used in LCD products and design applications. They can deteriorate due to environmental conditions such as temperature and humidity, which can lead to a decrease in their polarizing and diffusion properties, affecting LCD screens and designs. This document presents case studies analyzing the deterioration caused by temperature and humidity stress using FT-IR. [Contents] - Sample used and its properties - Deterioration analysis results of polarizing films (comparison of IR spectra before and after testing at 70°C and 85% humidity for 1 week) - Deterioration analysis results of light diffusion films (comparison of IR spectra before and after testing at 70°C and 85% humidity for 1 week) - Other available analytical methods *For more details, please refer to the PDF document or feel free to contact us.

• Other contract services

PMMA (acrylic), PET (polyethylene terephthalate), and PC (polycarbonate) are utilized in many applications, taking advantage of their characteristic transparency. They are essential materials for industrial products such as peripheral components of liquid crystal displays, protective films for mobile device screens, headlight covers, optical fibers, and textiles. This document presents the results of IR analysis of these raw materials (pellets). [Contents] - Analysis Sample: Characteristics of Ester/Carbonate-based Polymers - IR Spectrum (ATR Method) - Spectrum Comparison (Overlay) - Other Related Analysis Services *For more details, please refer to the PDF document or feel free to contact us.

• Other contract services

Aites analyzed photopolymerization initiators in UV-curable resins using GCMS and detected Irgacure 184, a type of photoinitiator (photo radical polymerization initiator). There are various structures of photoinitiators, and the wavelength of light they absorb and their reaction mechanisms differ depending on their structure. Such substances cannot be identified through main component analysis like IR, making thermal desorption GCMS analysis effective. Our company conducts characterization of various materials by analyzing and identifying trace components in materials using thermal desorption GCMS. Please feel free to contact us when needed. [Examples of photoinitiators] ■ Photo radical polymerization initiators ■ Photoinitiators for positive photoresists ■ Light crosslinking agents for negative photoresists *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis

This document introduces the structural analysis of MEMS components. It includes "non-destructive observation of accelerometers" using X-ray imaging to observe the internal structure of the package, as well as "optical microscope and SEM observation after mechanical polishing of accelerometers" and "cross-sectional observation of microphones (CROSS BEAM FIB/SEM)." Please feel free to download and take a look. [Contents] ■ Non-destructive observation of accelerometers ■ Optical microscope and SEM observation after mechanical polishing of accelerometers ■ Cross-sectional observation of microphones (CROSS BEAM FIB/SEM) *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis

EPMA has superior detection resolution compared to EDX. Even in cases where the detection positions of elements are close in EDX, making peak separation difficult, it may be possible to achieve peak separation with EPMA. This document introduces the peak separation of 47Ag and 17Cl. It includes cross-sectional observations of chip resistors, X-ray spectra of 47Ag, and mapping comparisons. [Contents] ■ Peak separation of 47Ag and 17Cl ■ X-ray spectrum of 47Ag ■ Mapping comparison *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis

Our company utilizes various surface analysis techniques to assist in resolving issues such as foreign substances, discoloration, and contamination. We conduct a wide range of analyses, from micro-regions to bulk samples, including "EDX," which is energy-dispersive X-ray analysis; "AES," which detects Auger electrons using electron beams; and "XPS," which allows for the analysis of insulators and chemical bonding states. Please feel free to contact us when you need our services. 【Analysis Methods】 ■EDX (EDS): Energy-dispersive X-ray analysis ■AES: Auger electron spectroscopy ■XPS (ESCA): X-ray photoelectron spectroscopy ■TOF-SIMS: Time-of-flight secondary ion mass spectrometry *For more details, please refer to the PDF materials or feel free to contact us.

• Analytical Equipment and Devices
• Spectroscopic Analysis Equipment
• Contract Analysis

Materials often undergo changes and discoloration depending on the usage environment. These changes and discoloration can lead to issues with the product's performance and design, but by understanding and clarifying the changes in molecular structure through chemical analysis, it becomes possible to address or avoid these problems. This document presents case studies that have been compared and verified through elemental and bonding state analysis via surface analysis. [Contents] ■ Analysis Samples ■ Elemental Analysis Results by XPS (ESCA) ■ Bonding State Analysis Results by XPS (ESCA) for Polycarbonate ■ Bonding State Analysis Results by XPS (ESCA) for Polyvinyl Chloride *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis

Here is a case study of silicon wafers analyzed using EBSD. A small piece was cut from the wafer, and an IPF map was obtained for a central area of 50×50μm. The measurement area shows red, indicating the {001} plane, and the absence of grain boundaries confirms that it is a single crystal. Since the measured silicon wafer is a single crystal, the IPF map, pole figure, and inverse pole figure resulted in relatively simple outcomes. *For more details, please refer to the PDF document or feel free to contact us.*

• Analytical Equipment and Devices
• Analysis Services

The ZEISS "FE-SEM ULTRA55" is equipped with a GEMINI column, allowing for high-resolution observation at extremely low acceleration voltages. It also features multiple detectors, enabling the observation of various samples. Composition information can be obtained using two types of backscattered electron detectors, and high-resolution EDX analysis can be performed even at low acceleration voltages. 【Features】 ■ High-brightness electron gun for detailed SEM images ■ Ultra-surface analysis at extremely low acceleration voltages ■ In-lens SE detector sensitive to surface information ■ Composition information obtained from two types of backscattered electron detectors ■ High-resolution EDX analysis even at low acceleration voltages ■ Observation without deposition *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices
• Other contract services

In the evaluation of BGA and CSP solder, the area ratio of voids within the solder can be measured from transmitted X-ray image data. Furthermore, by combining mechanical polishing, a comprehensive evaluation is possible. Please feel free to consult us when needed. 【Features】 ■ Non-destructive evaluation of BGA (Ball Grid Array) solder - The area ratio (%) of voids within the solder can be measured non-destructively from images obtained through X-ray transmission observation. ■ Cross-sectional observation of CSP (Chip Size Package) and BGA (Ball Grid Array) - Cross-sectional observation through mechanical polishing allows for the observation of defects such as shrinkage cavities that are difficult to see with X-ray observation. *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices
• Other contract services

The materials that make up the products are diverse, but the performance of the products often hinges on the characteristics of these materials. At AITES, we provide comprehensive support from reliability testing of materials to observation and physical/chemical analysis. This document presents a case study comparing the molecular structure and thermal property changes of plastic materials before and after exposure to ultraviolet light and constant temperature and humidity conditions. [Contents] ■ Constant temperature and humidity testing, and ultraviolet irradiation (Sample: Polyethylene (PE) pellets) ■ Results of IR, Raman, and EGA analysis *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices
• Other contract services

Plastic extrusion/injection molding processing is set according to the heat resistance temperature (melting point Tm) of the raw materials, but due to the degradation and alteration of the materials, there are cases where molding becomes difficult at the specified setting temperature. By checking the melt flow rate (MFR) of plastic raw material pellets or powders, it is possible to determine whether there are any changes compared to conventional products. We present a case where untreated (no load), temperature and humidity load (constant temperature and humidity test), and UV-irradiated PP (polypropylene) were injected and evaluated at a temperature of 230°C and a load of 5kg, so please take a look at the PDF download. [Evaluation Case] ■PP: Polypropylene ■8585: 85°C 85% × 336 hours ■UV: UV irradiation 253.7nm × 336 hours ■Injection time: 10 minutes (converted from 3 minutes) *For more details, please refer to the PDF materials or feel free to contact us.

• Contract measurement
• Other contract services

Epoxy resin is transparent, has a low shrinkage rate, and is often used for making cross-sections. However, since it is a thermosetting resin, it generates heat during the curing process. The temperature of heat generation varies depending on the amount used and the mixing ratio of the main agent and hardener. When embedding large samples such as printed circuit boards and touch panels, the epoxy resin can generate enough heat to deform the sample substrate. Therefore, we investigated how much heat is actually generated during curing. For more details, please refer to the PDF download below. 【Overview】 ■ Temperature profile acquisition - Without heat prevention treatment for a large amount of resin (large container) ■ Temperature profile acquisition - With heat prevention treatment for a large amount of resin (large container) ■ Resin embedding is possible even for larger printed circuit boards without cutting before embedding. *For more details, please refer to the PDF document or feel free to contact us.

• Analysis Services
• Other contract services