アイテス Product Lineup

We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, analysis can be performed using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes. [Summary] < Elemental Analysis by EDX > - Surface analysis shows the distribution of Ni, Cu, and Sn within the compounds. < Crystallographic Orientation Analysis by EBSD > - By combining this with elemental analysis using EDX, it is possible to estimate the composition. - In some cases, analysis can be performed using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes. *For more details, please download the PDF or feel free to contact us.

• Contract Analysis

We would like to introduce the results of our investigation into the behavior of strain during moisture absorption and drying using strain gauges. It was observed that the material expands when absorbing moisture and contracts back to its original state when drying, with the strain returning to the condition prior to moisture absorption. Regarding FR-1, it is presumed that it did not return to its original state due to changes in the chemical structure of the material caused by hydrolysis. 【Test Overview】 ■ 85℃ 50% ⇒ 85℃ 85% ⇒ 85℃ 50% ■ Test Materials ・FR-1 Paper Phenolic (single-sided board) ・FR-4 Glass Epoxy (single-sided board) ■ Strain Gauge ■ Foil Strain Gauge for Composite Materials *For more details, please download the PDF or feel free to contact us.

• Contract measurement

We would like to introduce our "Microscopic FT-IR Imaging Measurement." It is possible to visualize the distribution of substances as a two-dimensional image within a specified plane. This allows for the evaluation of changes in the distribution of substances that would be difficult to assess with regular point measurements, using visible images. 【Analysis Suitable for Imaging Measurement】 ■ Evaluation of the diffusion state of substances (assessment of the mixing of substances in a mixture, evaluation of the locations of impurities, etc.) ■ Evaluation of molecular structural changes (assessment of the degree of oxidation from the surface to the interior of resin products, etc.) ■ Qualitative analysis of minute foreign substances that are difficult to sample *For more details, please download the PDF or feel free to contact us.

• Other measurement, recording and measuring instruments

We offer the "CP Processing Device Arblade5000_Wide Area Cross-Section Milling." The "Arblade5000" enables extensive processing by combining a high milling rate with wide area cross-section milling capabilities. With the wide area cross-section milling holder, the cross-section milling width can be expanded up to a maximum of 10mm, making it effective for electronic components that require wide area milling. 【Features】 ■ Approximately double the width of processing is possible ■ The previously localized observation range can be significantly expanded ■ Equipped with a cooling temperature adjustment function to control temperature rise caused by ion beam irradiation ■ The observable range is approximately 8mm *For more details, please download the PDF or feel free to contact us.

• Processing Contract
• Other measurement, recording and measuring instruments

We would like to introduce the "IOL testing of discrete semiconductors" that we conduct. Under normal temperature conditions, we repeatedly turn the power ON/OFF, applying stress to the device due to temperature changes caused by the device's own heat generation during power ON. During the power OFF (cooling) phase, forced cooling is also performed using a fan. 【Adjustment Conditions】 ■ Temperature Rise: 125℃ ■ Heating Time: 5 minutes ■ Cooling Time: 5 minutes ■ Fan Operating Time: 2 minutes *For more details, please download the PDF or feel free to contact us.

• Public Testing/Laboratory

We will introduce the observation of metallic structures through chemical treatment. By performing chemical treatment on metallic samples, it is possible to clearly observe the metallic structure. Observing the structure can confirm the condition of the sample as well as the history of applied heat and stress, providing clues about the quality of the product and any defects based on the structural shape. In the published catalog, you can find details on the observation of metallic structures, such as the macrostructure of aluminum plates and the soldered parts of copper terminals. Additionally, we offer other services such as cross-sectional observation and various analysis services. Please feel free to contact us if you have any requests. [Contents] ■ Macrostructure of aluminum plates ■ Soldered parts of copper terminals ■ Brass screws ■ Welded parts of SUS rods *For more details, please download the PDF or feel free to contact us.

• Public Testing/Laboratory

There are three main measurement methods for "microscopic FT-IR": "transmission method," "reflection method," and "ATR method." In "microscopic FT-IR," which combines FT-IR with an optical microscope, it is possible to measure small substances on the order of several tens of micrometers that are difficult to measure with conventional FT-IR, using an aperture (field stop). While the transmission method is the basic measurement method in microscopic FT-IR measurements, the reflection method or ATR method may be more suitable depending on the shape of the sample and the feasibility of sampling. 【Characteristics of Measurement Methods】 ■ Transmission Method - Infrared light is irradiated onto the sample, and the transmitted light is measured. - Information is obtained from the thickness of the material that the infrared light has passed through. ■ Reflection Method - Infrared light is irradiated onto the sample, and the reflected light is measured. - Information is obtained from the surface of the sample. *For more details, please download the PDF or feel free to contact us.

• Other microscopes

We would like to introduce an example of "observation of semiconductors through mechanical polishing" conducted by our company. While there are advantages and disadvantages, it is possible to create cross-sections with mechanical polishing that are comparable to those produced by FIB or CP. Based on years of accumulated know-how, our company will propose the most appropriate processing methods according to the observation purpose, sample composition, and structure. If you have any concerns, please feel free to contact us at the information below. 【Observation Examples】 ■ Semiconductor_Si ■ Compound Semiconductor_GaN ■ Compound Semiconductor_GaP ■ Compound Semiconductor_GaAs *For more details, please refer to the PDF materials or feel free to contact us.

• Wafer processing/polishing equipment

We would like to introduce the "Strain Measurement of Thermal Shock Testing" conducted by our company. A sample with a strain gauge attached was set up in the thermal shock testing device, and the wiring of the strain gauge was connected to an external data logger to record the strain data in real-time during the test. The strain behavior during the thermal shock test was observed for two types of copper-clad laminates, and it was noted that significant strain occurred with changes in temperature. It was found that FR-1 exhibited greater strain compared to FR-4. [Test Conditions] ■ Temperature Cycle: -30°C to 120°C ■ Exposure Time at Each Temperature: 30 min ■ Test Materials - FR-1 Paper Phenolic (Double-sided board) - FR-4 Glass Epoxy (Double-sided board) ■ Strain Gauge: Foil strain gauge for printed circuit boards *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis

We would like to introduce a case of particle size measurement of cathode active materials using laser diffraction conducted by our company. In air or liquid, laser light is irradiated onto particles, and the angular dependence of the intensity of light scattered by the particles is measured. The angular dependence of the scattered light intensity is measured, and from that data, the particle size distribution (particle size distribution) is calculated. Commercially available reagents were used as samples, and measurements were conducted in a dry state without dispersing in a solvent. The particle size measurement results for NMC oxide showed a monodisperse state with particle sizes below several tens of micrometers, and the median diameter was calculated to be 12 μm. 【Case Overview】 ■ Measurement Method ・Dry ■ Particle Size Measurement Results for NMC Oxide ・Monodisperse state with particle sizes below several tens of micrometers ・Median diameter is 12 μm *For more details, please refer to the PDF document or feel free to contact us.

• Laser microscope
• Other measurement, recording and measuring instruments

We would like to introduce an example of cross-sectional observation of mounted components conducted by our company. Using commercially available computer circuit boards, we observed the solder joints of mounted components and the internal structures of the components with a metallurgical microscope. The observation modes of the metallurgical microscope include bright field observation, dark field observation, and polarized light observation, among others. Additionally, there are observations using transmitted light, and the observation mode is selected according to the sample. By conducting cross-sectional observations before and after reliability testing, we can evaluate the reliability of the product. When observing, it is important to select an appropriate "observation mode" to clearly capture the condition of the solder joint interface and defects such as cracks. [Case Overview] ■ Using commercially available computer circuit boards ■ Observing the solder joints of mounted components and the internal structures of the components with a metallurgical microscope ・Observation modes: bright field observation, dark field observation, polarized light observation, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

We would like to introduce our service for "various cross-sectional observations of mounted components on circuit boards." Inside various electronic devices around us, there are circuit boards equipped with electronic components. When observing a mounted circuit board, you can see that numerous components are tightly soldered together, and it is necessary to confirm that the components are properly joined, as improper connections can prevent normal operation. Please contact us if you are considering observations before and after reliability testing or cross-sectional observations. 【Examples of Observations (Partial)】 ■ Ceramic Capacitors ■ Transistors ■ Chip Resistors ■ QFP ■ Connector Pins *For more details, please refer to the PDF materials or feel free to contact us.

• Analytical Equipment and Devices

We would like to introduce our "Chemical Analysis Concierge Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis method within organic or inorganic analysis is the best fit. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analytical instrument can measure different targets, it is necessary to choose a method that aligns with your objectives based on the information available. 【Features】 ■ Reporting only the data for which results have been obtained ■ Results report can include up to 2 methods ■ If you wish to receive results for more than 3 methods, additional costs will apply *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis

Our company conducts thorough evaluations and verifications of FPD from various angles. In structural analysis, we assess FPD products and products incorporating advanced technologies for any potential issues in characteristics or structure, and provide reports. In defect analysis, we approach and investigate the causes of product defects in increasingly sourced overseas products via the shortest route. Additionally, in reliability testing, we propose suitable reliability testing methods and conditions based on our extensive know-how, tailored to the customer's objectives and needs. 【Our Strengths】 ■ Problem-Solving Ability - Proposals for analytical methods well-versed in the liquid crystal manufacturing process ■ Investigative Ability - Deep insights and advanced, sub-micron level fine sample processing techniques ■ Specialized Equipment - Considerations using a combination of diverse analytical instruments *For more details, please refer to the PDF document or feel free to contact us.

• Public Testing/Laboratory

We will introduce the observation of the shape of conductive particles in COG implementation. ICs and liquid crystal panels are implemented using the COG method with ACF (anisotropic conductive film). A resin ball is used as the core, and a metal layer (such as nickel or gold) is deposited on its surface for conductivity. During connection, the particles deform appropriately to electrically connect the IC and the panel. To confirm the degree of particle deformation and the connection state, cross-sectional observations were conducted, revealing that the particle deformation amount was "medium," indicating an appropriate level of deformation. By examining the deformation of conductive particles from both the planar and cross-sectional directions, we can explore the correlation with display defects. Please feel free to contact us for any inquiries regarding panel-related defects. [Summary] - In implemented ICs, slight "warping" or "tilting" can cause differences in particle deformation between the edges and the center, potentially leading to display defects. - By examining the deformation of conductive particles from both the planar and cross-sectional directions, we can explore the correlation with display defects. *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices

Due to the suspected malfunction at the switch part of the appliance that has stopped powering on, we will introduce a case study along with the work flow. First, we check for any shape changes such as swelling, cracking, or discoloration through visual observation. In the electrical check, we verify whether the malfunction can be reproduced and whether it is an open or short circuit. An internal observation using X-rays revealed that the contact terminals inside the switch had melted, scattered, and disappeared, leading to an open circuit failure. Ultimately, we will submit a report that includes the consideration of the cause. We also welcome inquiries regarding analysis after non-destructive testing, so please feel free to consult us. 【Basics of Non-Destructive Observation】 ■1: Visual Confirmation ■2: Electrical Confirmation ■3: Internal Observation with X-rays *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis

Our company analyzes the spectra of UV-curable resins before and after UV irradiation. We irradiate UV-curable resin (acrylic type) with ultraviolet light and obtain Raman spectra before and after irradiation. Through the analysis of the Raman spectra, the curing reaction can be estimated to some extent. For a more detailed analysis of the curing mode, analyses such as GCMS are necessary, but our company can provide not only structural estimation but also reaction estimation through spectral analysis. 【Features of Raman Spectral Analysis】 ■ The curing reaction can be estimated to some extent. ■ We provide support for both structural estimation and reaction estimation. *For more details, please refer to the PDF materials or feel free to contact us.

• Contract Analysis
• plastic

This is an example of evaluating the maximum pore diameter and pore size distribution of non-woven fabric sheets using the bubble point method. The sample is immersed in a chemical solution and air pressure is applied. The pressure is increased until it overcomes the surface tension of the chemical solution absorbed in the sheet, resulting in the appearance of bubbles; this pressure is referred to as the bubble point. The maximum pore diameter can be calculated based on the bubble point pressure and the surface tension of the chemical solution. 【Calculation Formula】 ■d = Cy/P ・d: Maximum pore diameter ・C: Constant ・y: Surface tension of the chemical solution ・P: Differential pressure *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices

"DYNAMIC SIMS" is a secondary ion mass spectrometry method that can detect trace amounts of all elements (from H to U) in samples with high sensitivity, ranging from ppm to ppb. It allows for qualitative analysis and depth profiling, and additionally enables high-precision quantitative analysis using standard samples (conducted at our partner company's facility). The minimum beam diameter is approximately 30 µm, and it can be further reduced depending on the material. 【Features】 ■ Automatic loading/unloading of samples, high throughput (24 samples/load) ■ Unmatched depth profiling capability and high depth resolution, wide dynamic range ■ Optimized for the analysis of glass, metals, ceramics, silicon, compound semiconductors, shallow implants, etc. ■ Highest detection limit: from ppm to ppb (10^-6 to 10^-9) *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices

The "tensile test" is a test that measures the load and displacement (elongation) when a material is pulled at a constant speed, in order to determine the physical and mechanical properties of the material. By pulling the test specimen in a constant temperature chamber, it is possible to determine and understand the temperature dependence of these properties. Our company is capable of conducting material property tests under temperature-controlled environments. We can also propose conditions tailored to the materials and properties you wish to measure. Please feel free to consult with us. 【Test Equipment Specifications】 ■ Constant Temperature Chamber Temperature Range: -40 to 250℃ ■ Load Cell: 50kN, 1kN ■ Load Accuracy: ±1% of load indication value ■ Test Speed: 0.0005 to 1000 mm/min ■ Travel Distance ・Tensile Test Section: 1485 mm *For more details, please refer to the PDF document or feel free to contact us.

• Other services
• Strength Testing Equipment

This document introduces a pretreatment method to enable the analysis of substances that are difficult to analyze using GC/MS. The pretreatment that converts difficult-to-analyze substances into analyzable substances is called "derivatization." Methods such as esterification, acylation, and silylation are used selectively according to the type and characteristics of the difficult-to-analyze substances. GC/MS measurements were conducted on citric acid solutions and citric acid solutions after esterification. It was found that citric acid, being a carboxylic acid, could not be effectively detected without derivatization, but after esterification, trimethyl citrate was detected, confirming the presence of citric acid. By performing appropriate derivatization, more accurate analysis becomes possible. [Analyzable Substances] ■ High volatility ■ High thermal stability ■ Low polarity *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices

We will introduce a case where a series of analyses, from identifying failure points to cross-sectional observation, was conducted on an oxide-based all-solid-state battery that was destroyed during reliability testing. Heat generation analysis revealed a strong tendency for heat generation on the side, and X-ray transmission observation showed a white linear contrast anomaly near the boundary where heat generation was observed in the X-ray transmission image. It is suspected that some abnormality is occurring in the white line area. When CP cross-sectional SEM observation was performed on the area where the anomaly was visible, layer delamination was observed. It is inferred that delamination occurred between the current collector and electrolyte layers due to the positive (negative) electrode layer expanding and contracting repeatedly during reliability testing. 【Case Overview】 ■ Sample Information: Oxide-based all-solid-state battery that experienced degradation due to charge and discharge testing ■ Heat Generation Analysis Result: A strong tendency for heat generation was observed on the side ■ Other Analysis Contents: - X-ray transmission observation - CP cross-sectional observation and elemental analysis using SEM *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis

This is an introduction to the analysis of the components of mica sheet adhesives using GC/MS. To investigate what components are contained in the mica sheet, spectroscopic measurements were conducted, suggesting that silicone-based adhesives are used. To examine the composition of the silicone-based adhesive, GC/MS measurements were performed. It was found that pentacyclooctasiloxane is used, and it was also discovered that dibutyl phthalate is added as a plasticizer and chain-saturated hydrocarbons such as tridecane are added as lubricants. 【Components of the mica sheet】 ■ Pentacyclooctasiloxane (cage-like polymethylsilsesquioxane) ■ Dibutyl phthalate ■ Chain-saturated hydrocarbons such as tridecane *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices
• Spectroscopic Analysis Equipment

This document introduces the characteristics of each spectroscopy method and the spectra obtained when comparing infrared spectroscopy and Raman spectroscopy. Both infrared spectroscopy and Raman spectroscopy are vibrational spectroscopies that investigate the vibrational energy of molecules, but the shapes of the spectra obtained from each method differ even when measuring the same substance. Infrared spectroscopy and Raman spectroscopy are complementary; information that cannot be obtained through a single analysis can be acquired more detailed and accurately by conducting both analyses. For more details, please refer to the catalog provided. 【Characteristics of Infrared Spectroscopy】 ■ Infrared absorption occurs when the dipole moment changes with vibration (infrared active). ■ Vibrations that cause a distortion in the symmetry of the molecule (leading to an electronic dipole) are highly infrared active. *For more information, please refer to the PDF materials or feel free to contact us.

• Vibration Testing

We would like to introduce an example of analyzing the purity of phosphorus pentasulfide using ion chromatography for the composition analysis of raw materials for all-solid-state batteries. Phosphorus pentasulfide is one of the raw materials used in the production of electrolytes for sulfide-based all-solid-state batteries. As a pretreatment for IC measurement, the powder of phosphorus pentasulfide was dissolved in alkaline water and converted into phosphate and sulfide salts. Subsequently, sulfide ions were oxidized to sulfate ions to prepare the IC measurement solution. For more details, please refer to the published catalog. 【Solid Electrolytes (Partial)】 ■Li3PS4 ■Li7P3S11 ■Li6PS5Cl ■Li6PS5Br *For more information, please refer to the PDF materials or feel free to contact us.

• Analytical Equipment and Devices

We will introduce the analysis of good products for liquid crystal displays by Aites Co., Ltd. First, we conduct optical microscope observations focusing on the FPC, FOG, COG, and sealing materials in the state of the cell panel as part of the appearance observation. Next, we dismantle the cell panel to check the sealing materials, PI film, and TFT shape. If any defects are found during the good product analysis, we will propose additional analyses such as cross-sectional observation of wiring and foreign matter analysis to investigate the cause. Please feel free to consult us when needed. [Contents of Appearance Observation] ■ Are there any corrosion or foreign matter on the FPC wiring? ■ Is there any issue with the FOG bonding? ■ Is there any issue with the COG bonding? ■ Are there any breaks or defects in the sealing material? *For more details, please refer to the PDF document or feel free to contact us.

• Analysis Services

We will introduce the comparison between Raman spectroscopy analysis by Aites Co., Ltd. and FTIR. Spectroscopic analysis is suitable for component analysis of foreign substances and qualitative analysis. Both Raman and FT-IR can obtain spectra based on the structure of the analysis target. However, since each has its strengths and weaknesses, it is necessary to choose between the two depending on the analysis target. 【Features】 ■ Measurement in the order of several micrometers, which is difficult to analyze with IR, is possible. ■ No sampling is required. *For more details, please refer to the PDF materials or feel free to contact us.

• Testing Equipment and Devices

We would like to introduce the quality technology of AITES Co., Ltd., specifically regarding the dynamic viscoelasticity measurement of polyurethane rubber. DMA is an analysis that applies periodic vibrational loads to polymer materials and measures elasticity and viscosity as a function of temperature from the resulting stress and phase difference. In this instance, we conducted measurements using cylindrical rubber samples in compression mode. The measurement results indicate that the glass transition temperature is -15.7°C, as shown by the temperature dispersion curve of Tan δ, and we created a master curve based on the time-temperature superposition principle. Please feel free to consult us when needed. 【Methods of Applying Load】 ■ Tension ■ Compression ■ Bending with both ends supported ■ Free-supported three-point bending ■ Shear (sliding) *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices

A commitment to environmental consideration and waste-free development and manufacturing is required in the field of technology, and there is a need for global contributions to technology from a planetary perspective. This document introduces case studies that identify the substances of discarded and floating microplastics and compare the degradation levels of recycled materials, assisting in the determination of their usability. Please take a moment to read it. [Contents] ■ Case studies on the identification and analysis of microplastic substances ■ Comparative analysis of molecular weight distribution between unused polypropylene materials and recycled products (pellets) ■ Comparative analysis of polyethylene terephthalate (PET) materials using microscopic IR analysis *For more details, please download the PDF or feel free to contact us.

• Water quality testing

We would like to introduce our "Continuous Power Supply Test for Multilayer Ceramic Capacitors." Assuming the failure mode is a short circuit, we can conduct a continuous power supply test under high temperature and high humidity conditions while continuously measuring the changes in leakage current. We believe this is an effective method for comparing the performance of multiple products by manufacturer, lot, etc. Additionally, we can assist with the design and fabrication of the test boards. 【Features】 ■ Design and implementation of device mounting boards as needed ■ Compatible with sizes such as 0603 and 1005 ■ Monitoring devices connect to samples via a resistance board to calculate leakage current values ■ After testing, capacitance measurements can be conducted to confirm the degree of capacitance degradation *For more details, please refer to the PDF document or feel free to contact us.

• Testing Equipment and Devices

The "Pressure Repetition Test" involves supplying compressed air at a specified pressure to products that require airtightness, to check for any leaks. It is also possible to conduct a durability test that repeats the pressurization and release states, and it can be performed in a heated state in combination with an environmental test chamber. Additionally, the timing of any leaks can be confirmed from the logged pressure data. 【Device Specifications】 ■ Pressurization Pressure: Max 0.7 MPa (gauge pressure) ■ Maximum Number of Cycles: Max 32,000 cycles ■ Pressure Holding Time: Max 3,000 seconds ■ Monitor: Recording of the pressure sensor values (gauge pressure) during the test ■ Connection with Test Samples: Air tube (connection method can be adapted to the test sample) *For more details, please refer to the PDF document or feel free to contact us.

• Testing Equipment and Devices

When heat is applied to materials, various properties change. Thermal analysis is suitable for investigating such properties. Depending on the changes in the properties we want to observe, we use different devices and combine them as necessary. By understanding the various changes that occur when materials are subjected to heat, we can gain insights into how they will behave in practical applications. When combined with other chemical analyses, it is also possible to estimate the relationship with molecular-level structures. If you have any questions about the relationship between materials and heat, please feel free to consult us. 【Analysis Equipment (Excerpt)】 <DSC (Differential Scanning Calorimeter)> ■ Changes observed: Heat flow (exothermic/endothermic) ■ Properties that can be determined: Melting point (freezing point), glass transition, crystallization, specific heat capacity ■ Applicable materials: Plastics, rubber, metals ■ Analysis examples: Measurement of the curing degree of thermosetting resins, measurement of the transformation temperature of shape memory alloys *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices

Our company conducts evaluations of brightness and color uniformity for emitting surfaces such as OLEDs, titled "Evaluation of Brightness and Color Uniformity of LCD Displays." In brightness measurement (using a two-dimensional photometer to measure the display surface), we compare the digital camera images of the LCD display surface with the results obtained from the brightness measurements conducted with the two-dimensional photometer. While the distribution of uniformity is difficult to discern in the digital camera images, the color scale display of the brightness distribution highlights areas with brightness uniformity issues, making it easier to understand. 【Overview of Measurement Equipment】 ■ Measurement Items: Tristimulus values (X, Y, Z), chromaticity (x, y) ■ Measurement Range: 0.01 cd/m² to 1,000,000 cd/m² ■ Effective Pixel Count: 1376 × 1024 ■ Emitting Surface Size: Approximately 15 to 115 inches ■ Installation Method/Fixtures: Vertical, horizontal, etc., adaptable to shape *For more details, please refer to the PDF document or feel free to contact us.

• Public Testing/Laboratory

The "Xenon Weather Meter" is an accelerated weathering testing machine that uses a xenon arc lamp as the light source. By combining exposure conditions such as irradiation, temperature and humidity, and rainfall, it artificially reproduces outdoor and indoor environments, allowing for the evaluation of weather resistance and light resistance of test specimens in a shorter time than natural exposure tests. The xenon lamp used as the light source has a spectral distribution that closely approximates the ultraviolet and visible parts of sunlight, with precise control of the appropriate filters and irradiance. This enables tests with good correlation and reproducibility to outdoor exposure. This testing is conducted as a service by our partner companies. 【Features】 - The combination of filters used can reproduce outdoor direct sunlight and indoor sunlight through window glass. - In high-energy testing machines, irradiation is conducted at about three times the intensity of sunlight, allowing for quicker evaluation of light resistance. - It is adopted as a testing method in various fields such as automobiles, paints, construction, plastics, printed materials, and textiles. *For more details, please refer to the PDF materials or feel free to contact us.

• Testing Equipment and Devices
• Weather resistance test
• Environmental Test Equipment

The method of processing observation samples can result in different information being obtained. You may have observed the solder joint from a cross-section in two dimensions, but have you ever wondered how the compound grows in three dimensions? In this document, we present examples of observations of the Cu pad and solder joint. We include both "cross-sectional observation" and "planar observation." [Contents] ■ Cross-sectional observation - Before etching treatment - After etching treatment ■ Planar observation *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis
• Analytical Equipment and Devices

Due to the risk of depletion of natural ingredients, artificially synthesized alternative components may be used, and their identification is suitable for separation and analysis using methods such as GCMS. This time, we focused on sandalwood (Byakudan), which is used as a raw material for incense. We tested whether the components of sandalwood could be detected in two types of incense (A and B) with its fragrance. In incense A, santanol was detected, while in incense B, santanol was not detected, and another fragrant component was found. Among these, bugdanol is a type of synthetic fragrance, and due to its structural characteristics, it is believed to have a sandalwood-like scent. [Components of Incense A] ■ Bugdanol: Trace amounts ■ Cedrol: None ■ α-Santalol: Present ■ β-Santalol: Present *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis
• Analytical Equipment and Devices

Shape memory alloys are alloys that have the property of returning to their original shape when heated above a specific temperature, even after being deformed. The manifestation of shape memory is due to a phase transformation (martensitic transformation). By capturing the thermal energy changes during the transformation using Differential Scanning Calorimetry (DSC), we measured the transformation temperatures of three types of shape memory alloy products and investigated their relationship with composition through elemental analysis. When a deformed wire is immersed in hot water, it instantly returns to its original shape. 【Transformation Temperature Measurement by DSC】 - Investigated the transformation temperatures of three types of shape memory alloys using DSC. - It was found that the transformation temperatures are in the order of A > B > C. - Shape memory alloy C is believed to be in a superelastic state at room temperature. - Af: A 45.91, B 41.20, C 11.83 - Ms: A 43.75, B 36.25, C -15.59 *For more details, please refer to the PDF document or feel free to contact us.

• Contract measurement

Condensation caused by rapid changes in temperature and humidity can lead to corrosion of products and leaks or malfunctions due to ion migration. The "Condensation Cycle Test" involves temperature changes and humidification, forcing condensation to occur repeatedly to evaluate its effects. We can also observe the time-dependent changes before and after the condensation test, so please feel free to contact us if you need assistance. 【Test Chamber Specifications】 ■ Model: TSA-203D (ESPEC) ■ Internal Dimensions: W650×H460×D670 ■ Temperature Range ・High-Temperature Exposure: -10℃ to +100℃ ・Low-Temperature Exposure: -40℃ to +10℃ ■ Humidity Range: 40 to 95% RH (High-Temperature Exposure) ■ Power supply during testing is also possible *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis

Our company can measure the optical properties of LCD displays and OLEDs using a spectroradiometer. By conducting measurements before and after testing, we can quantitatively evaluate changes in optical properties. Spectral radiance is measured in four patterns: white, red, green, and blue. It is possible to measure various optical properties such as luminance, chromaticity, and dominant wavelength. 【Measurement Device Overview】 ■ Measurement Items: Spectral radiation, luminance, chromaticity ■ Measurement Range: 0.0005 cd/m² to 5,000,000 cd/m² ■ Wavelength Measurement Range: 380 nm to 780 nm ■ Wavelength Resolution: 1 nm (Effective wavelength width [half-width]: 5 nm) ■ Installation Method/Fixtures: Vertical, horizontal, etc., depending on the shape *For more details, please refer to the PDF document or feel free to contact us.

• Spectroscopic Analysis Equipment
• Contract measurement

Our company conducts a "Solder Heat Resistance Test (SMD)" to evaluate the heat resistance of surface mount devices (SMD) during the soldering process. We replicate moisture absorption prior to mounting through humidification treatment and assess the presence of delamination or cracks through heating treatment that corresponds to the thermal stress during soldering. As part of the post-test inspection, we perform the same inspection as the initial measurement, and if necessary, we also conduct analyses such as cross-sectional observation of defective areas. 【Flow of Solder Heat Resistance Test】 ■ Initial Measurement ■ Temperature Cycle (shipping condition) ■ Drying Treatment (Baking) ■ Humidification Treatment (Soaking) ■ Heating Treatment (Reflow) ■ Final Measurement *For more details, please refer to the PDF document or feel free to contact us.

• Testing Equipment and Devices

Our company conducts "defect analysis of overseas manufactured displays." We can perform detailed analysis from confirming the phenomenon, hypothesizing the defect occurrence mechanism, to narrowing down the production processes that caused the issue. We carry out lighting observations, panel disassembly, and optical microscope observations tailored to the defect symptoms. If it is necessary to narrow down the defective areas and conduct detailed analysis, we will propose appropriate methods. 【Examples of detailed analysis (partial)】 ■ Cross-sectional observation of wiring ■ Foreign object analysis ■ Liquid crystal component analysis ■ Electrical characteristic measurement *Additional costs will be incurred. *For more details, please refer to the PDF document or feel free to contact us.

• LCD display

We will introduce a case where ICP measurement was conducted using panels before and after reliability testing, along with quantification. The liquid crystal molecules in an LCD are oriented within the panel, and the display is controlled by changes in the orientation state of the liquid crystal due to voltage. When ionic substances, such as metal elements, are present inside the panel, the liquid crystal does not operate correctly, leading to display defects. Ionic substances are known to increase due to contamination during manufacturing or long-term use, making it important to quantify and understand them as part of panel quality. Metal ions can be quantitatively analyzed using ICP analysis, and depending on the differences in pretreatment methods and detection sensitivity, ICP-AES and ICP-MS are used selectively. [Analysis Content] ■ Comparison of metal element content using ICP-AES analysis ■ Comparison of metal element content using ICP-MS analysis *For more details, please refer to the PDF document or feel free to contact us.

• Analysis Services

Blue light cut film has the effect of suppressing the transmission of visible light, particularly light with a wavelength of 500nm or less, compared to regular PET film. Using a spectrophotometer, we examined how the light transmission of the blue light cut film changes under UV irradiation. The transmission of light in the wavelength range of 350 to 400nm decreased further due to UV irradiation. Additionally, we conducted an analysis of the reactions occurring within the film using GC-MS. [Analysis Content] ■ Light transmission characteristics of regular PET film and blue light cut film ■ UV irradiation on blue light cut film ■ GC-MS analysis of components within the film *For more details, please refer to the PDF document or feel free to contact us.

• Ultraviolet irradiation equipment

At AITES Co., Ltd., high-temperature reverse bias testing (HTRB) for evaluating the oxide film and junction of power devices can be applied up to 2000V. By monitoring the leakage current during the test, the degradation status of the device can be grasped in real-time. Since the power supply is independent, if one device fails during the test, it will not affect the other devices. Additionally, it is possible to set a failure criterion (current value) and to cut off the power supply of the device deemed faulty at the time of failure judgment. 【Features】 ■ Real-time monitoring of the leakage current during testing allows for understanding the degradation status of the device. ■ The independent power supply ensures that if one device fails during testing, it does not affect other devices. ■ The power supply of the device deemed faulty can be cut off at the time of failure judgment. *For more details, please refer to the PDF document or feel free to contact us.

• Testing Equipment and Devices

We will introduce a case where precision planar grinding was applied to remove glass substrate wiring and conductive particles, allowing for the observation of IC chip circuits with minimal damage. Careful planar grinding was performed from the glass substrate side, removing material down to a few micrometers from the IC chip, enabling the observation of the circuit surface. The IC chip circuit surface was clearly visible, and detailed observation at high magnification became possible. There are many samples, like the one in this case, where detailed observation has become possible through planar grinding, as well as samples that can be processed using FIB or CP techniques. If you have any samples you are struggling with, please consult us. We accept requests for planar grinding only, as well as requests that include observation and analysis. [Overview] <Planar Grinding and Optical Observation> ■ Careful planar grinding was performed from the glass substrate side, removing material down to a few micrometers from the IC chip, enabling the observation of the circuit surface. ■ The IC chip circuit surface was clearly visible, and detailed observation at high magnification became possible. *For more details, please refer to the PDF document or feel free to contact us.

• Contract Inspection
• Other contract services