シンアペックス List of Products and Services

This is a tabletop vacuum reflow oven that significantly reduces voids inside solder by changing the pressure within the process chamber, enabling high-quality voidless soldering. The heating area measures 200mm x 200mm x height 50mm and supports heating from both above and below. The pressure can be set arbitrarily within the range of atmospheric pressure to 10Pa, allowing for flexible adjustment of pressure and heating profiles according to the target workpiece. By using an optional formic acid bubbler unit with a heat retention function, it generates a stable concentration of a mixed gas of formic acid and nitrogen, removing the oxide film from the workpiece through a reduction reaction, and it can also accommodate a fluxless soldering process that does not use flux.

• Soldering Equipment
• Reflow Equipment

The SVO-1 Plus is a tabletop reflow oven newly added to the lineup as a higher model of the SVO-1, aimed at further improving heating speed and temperature uniformity. Heaters are arranged above and below the oven, and the output of each heater can be individually set. By optimizing the heating temperature settings and heater output suitable for the target workpieces, it is possible to shorten cycle times and improve the uniformity of workpiece temperatures. In addition to its use for reflow soldering, it can also operate for long periods at a constant temperature, making it suitable for applications such as board drying and thermal curing. 【Features】 ■ Supports heating from above and below the board ■ Individual setting of each heater output ■ Supports heating up to 400°C ■ Temperature profile settings for up to 8 zones ■ Continuous operation at a constant temperature for up to 10 hours *For more details, please download the PDF or contact us.

• Reflow Equipment

The "XQuik III" is an X-ray inspection method reel component counter that meets the needs for further speed and automation in counting reel parts. It executes inspections after the automatic safety door closes, achieving a fast cycle time of about 10 seconds before the door opens again. It is also easy to build automated inspection lines using robots and conveyors. 【Features】 ■ High-speed, high-precision component recognition software "AccuCount Technology" ■ Improved recognition rate for 0402 size components through imaging technology ■ Simultaneous counting of four 7-inch reels (one 15-inch reel) ■ Large touch panel for intuitive operation ■ Standard automatic opening and closing shutter ■ Easy construction of automated inspection lines using robots, etc. ■ Counting accuracy of over 99% *For more details, please request materials or view the PDF data available for download.

• Capacitor

This document discusses the void reduction effects of vacuum pressure reflow. Using a vacuum reflow furnace, a method of reducing voids in solder joints through defoaming and compression is commonly utilized. However, to verify even more effective methods, we conducted reflow soldering using three different conditions and various test samples, and we present the results in detail with images. Please feel free to download and take a look. 【Contents】 ■ Importance of low-void soldering ■ Verification of effective processes for void reduction ■ Test samples ■ Test results ■ Summary of results *For more details, please refer to the PDF document or feel free to contact us.

• Reflow Equipment

The VPF300 is a vacuum and pressure reflow oven that not only creates a vacuum (reduced pressure) inside the chamber but can also apply pressure up to 0.4 MPa, significantly reducing the void rate inside the solder and achieving high-quality soldering. Process conditions such as chamber pressure and heating temperature can be set for each workpiece, and efficient heating and cooling are possible thanks to its unique rapid cooling function. Additionally, it supports formic acid reduction reflow and forming gas reflow, allowing for the establishment of a flux-free soldering process. The 2023 model has improved the cooling mechanism, enhancing maintainability. 【Features】 ■ A wide effective heating area of 300×300 mm ■ Maximum heating temperature of 450℃ ■ The vacuum chamber is equipped with an observation window ■ Features an intuitive touch panel GUI for easy operation *Product documentation can be viewed via "PDF Download." Please feel free to contact us if you wish to request a test.

• Reflow Equipment
• Soldering Equipment

The "SDB2000α" is an ultrasonic servo metal welder that combines unique load control technology with a highly reliable ultrasonic system, achieving highly reproducible metal bonding. During ultrasonic bonding, the ultrasonic output and the pressure applied to the workpiece are continuously measured, and the distance of plastic deformation of the workpiece during the bonding process is detected by fluctuations in motor pulses. This data can be effectively utilized for quality assurance and quality control. 【Features】 ■ Servo press that transmits ultrasonic energy to the workpiece without waste ■ Equipped with a highly reliable digital ultrasonic generator that ensures stable bonding quality ■ The servo press supports a wide range of load control from 200N to 2000N ■ Processing distance is measured by the number of motor pulses, and position control is also available ■ Compatible with ultrasonic systems operating at frequencies of 20kHz or 35kHz ■ The device can be automated to meet user needs (further discussions required) *For more details, please refer to the PDF document or feel free to contact us.

• Welding Machine

The "PB500" is an ultrasonic precision metal welder that enables stable metal joining and is particularly suitable for small and compact joints. With a unique load control method using a high-resolution digital scale [PAT-P], it quickly follows the workpiece displacement during ultrasonic joining, efficiently transmitting ultrasonic energy to the workpiece with a constant load. Additionally, the high-rigidity press unit, specifically designed for ultrasonic metal joining, ensures sufficient strength and stabilizes processing quality. [Features] ■ The high-rigidity press unit offers high-speed and high-precision control in the range of 10N to 520N. ■ Equipped with a highly reliable digital ultrasonic generator that achieves stable joining quality. ■ Various ultrasonic oscillation modes are available. ■ The device can be automated to meet user needs. ■ The ultrasonic horn is designed to match the shape and material of the workpiece. *For more details, please refer to the PDF document or feel free to contact us.

• Welding Machine

The "Fume Extraction and Dust Collection System" captures fumes generated during soldering and laser processing and returns clean air. It features a filter technology that integrates DeepPleat pre-filters and a reverse flow method (drawing in from the bottom of the device), enhancing the filtration efficiency and extending the lifespan of the filters. Additionally, we offer a variety of options to choose from based on application, fume extraction range, and production method. 【Features】 ■ Adopts high-efficiency and economical filter technology ■ Extensive lineup ■ Equipped with iQ operating system *For more details, please refer to the catalog or feel free to contact us.

• Air purifiers

The operation is simply to place the reel in the device's cabinet, close the door, and press the "COUNT" button. Complicated condition settings or setups for inspection are basically unnecessary. The unique image processing technology, AccuCount technology, automatically counts the size and total number of parts.

• Capacitor

Equipped with iQ operation that provides a safe working environment, including automatic air volume adjustment, real-time monitoring of filter status, and a function to notify when to replace the filter.

• Reflow Equipment

This is a tabletop heating furnace capable of heating printed circuit boards and flat workpieces up to 250x330mm as standard. The heating temperature profile can be set for up to 8 zones. It can be used not only for reflow soldering but also for long-term operation at a constant temperature, making it suitable for applications such as drying circuit boards, thermal curing of underfill materials, and die bonding pastes.

• Reflow Equipment

The Model 626 is a multi-wire bonder that supports ball bonding, wedge bonding, and bump bonding all in one machine. Hybond's unique Soft Touch load control is effective for bonding thin and fragile materials. It comes standard with precise wire feeding functionality, stitch bonding, loop height control, independent parameter settings for 1st and 2nd bonds, and tail length settings. The work stage is available in various configurations to suit customer applications.

• Bonding Equipment

A high-performance SMD/BGA rework station that minimizes thermal stress on the implemented components and achieves a highly reproducible heating profile. It demonstrates its true value particularly in the rework of large substrates, high thermal dissipation substrates that are difficult to heat, and high-value-added assembly substrates.

• Other mounting machines

This is a space-saving tabletop reflow oven (heating furnace) using infrared heaters. It can be used not only for reflow soldering but also for low-speed operation at a constant temperature, making it suitable for applications such as drying circuit boards and thermosetting bonding agents.

• Heating device

This is a BGA reballing sheet made of high-temperature resistant polyimide, processed to match the BGA package size, with holes for ball arrangement, and solder balls stored in those holes.

• Other mounting machines

No metal mask required, single-shot method solder ball mounting machine. Since balls are mounted one by one, there is no wasteful consumption of balls. Various ball mounting patterns can be easily set on the touch panel, and the process from flux application to solder ball mounting is done automatically. There is no need to create a metal mask for each pattern, which reduces running costs and makes management easier, allowing for quick responses to needs such as prototyping BGA packages, automating BGA reballing, and partial ball mounting.

• Other mounting machines