Glass fiber non-woven fabric "Glasper"
Oji Group Functional Materials Company
Glass paper "Glasspar" made from glass fibers using the wet papermaking method.

小型・薄型かつ高性能な「半導体」の製造プロセスをサポートする製品・技術を大公開!
Date Published:
91~135 item / All 231 items
Oji Group Functional Materials Company
Glass paper "Glasspar" made from glass fibers using the wet papermaking method.
Efficient storage with sliding dividers! You can easily take things out even while wearing gloves, as they slide out for easy access!
A patented dynamic insert that allows for uniform pressure in sintering equipment! Temperature, time, and pressure can be controlled!
A dispenser that can draw lines of 1 micron! 'UPD System'
High-precision jet dispenser capable of micro to large volume application and low to high viscosity application [Pre-coating tests in progress].
High-speed, high-pixel, high-quality camera corresponding to the UV wavelength range.
Achieving the industry's smallest class of chassis size: "CoaXPress" area scan camera series.
With Japan Bopixel's "CoaXPress camera," it is possible to significantly reduce heat generation!
Standalone type with high rigidity and quality, equipped with e-F@ctory utilization error prevention features, automatic router bit exchange, and image teaching capabilities.
Improvement of productivity through parallel setup in the printed circuit board division process, also accommodating inline production processes!
【Monthly Web Seminars Now Held!】Automating the processes from PCB supply to PCB cutting, palletizing onto output trays, and PCB discharge!
High-performance motion controller that leverages overwhelming CPU power.
Consolidating the functions of the motion controller onto a single board!
We support various sizes from G1 to G6h. We provide a wide range of assistance, from the manufacturing of precision, high-quality glass transport cases to logistics support.
A comprehensive catalog of 150 pages featuring connection components across 11 fields, including food and beverage, agriculture, electricity, medical care, and construction industries!
A case of automated visual inspection using an XY robotic system to continuously inspect for missing or misaligned solder balls on IC chips!
A system for inspecting the resin filling state of lead frames on a mass basis, an example of automating appearance inspection using a general-purpose stage that operates on two axes!
We will conduct a quantity inspection of devices such as IC chips arranged on a tray and perform a series of tasks up to printing the label seal at the time of sealing.
The definitive solution for suction and transport: Vacuum tweezers, one-touch air pit.
Ideal for cutting iron, stainless steel, and groove cutting! Powerful type with excellent cutting performance due to its unique blade shape!
We also handle DLC coatings and various other coatings! We meet a wide range of needs.
A new material with a high hardness of 56-58 HRC, high corrosion resistance equivalent to austenitic phase, and high strength of 2000 MPa class has been developed: precipitation-hardened stainless steel!
Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! We offer contract processing for hot melt molding sealing.
"Complete sealing of electronic components in just a few dozen seconds. Waterproof, dustproof, and insulated." A sealing method for electronic components that replaces potting = hot melt molding.
Waterproofing, insulation, and dustproofing for electrical components! We are currently offering a free collection of 'case studies and technical materials' filled with tips and know-how for process improvement!
Introducing non-woven fabrics that exhibit numerous excellent properties such as oil resistance, corrosion resistance, and heat resistance!
Explanation about polyester non-woven fabric! [Currently offering materials on Hirose Paper's 100% PET wet non-woven fabric]
No chemicals are used at all; it can be bonded using heat! Safe to use even for food and other items.
Compatible with CL3 standards! A multi-cable for electronic device wiring that can be delivered immediately.
Leave the contract manufacturing of control boards to Nippo, specializing in software, hardware, and network technology! We accept ODM board development.
Attention design and development personnel! Introducing the circuit board assembly line and assembly process at the Nippo Shimane Factory!
Accurately understand customer needs from their perspective! Propose optimal transportation routes while managing delivery deadlines.
The introduction of iCAD SX has achieved a dramatic increase in the speed and efficiency of design work, promoting the long-standing challenge of reforming design operations through 3D CAD.
3D CAD that achieves a reduction in lead time for semiconductor equipment development! Realizing ultra-fast response handling of 3 million parts in 0.2 seconds.
Improve the development speed of semiconductor component manufacturing lines! Achieve quality enhancement with 3D CAD.
Maximum speed 700mm/s, maximum acceleration 30,000mm/s², layer pitch 50-200μm!
Equipped with a dehumidification unit to protect the filament from moisture that causes quality deterioration!
A tabletop-sized 3D printer of industrial quality that can achieve high speed, high precision, low vibration, low noise, and can also print engineering plastics.
Multiple types of circuit board stacking designs are possible, providing flexibility in design!
Provides essential power efficiency for cost management! Designed for manufacturing flexibility and excellent electrical performance.
Significantly improved design flexibility in applications with space constraints!
From chemicals and food to wastewater and semiconductors. Covering various liquid transport with a single unit!
Increase wear resistance several times. Expanite exceeds the limits of stainless steel.
Recommended for representatives in the petroleum refining industry, automotive industry, and chemical industry!
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