11/11 Webinar on Sealing Material Technology for Data Centers

Explaining semiconductor encapsulation materials in the AI era. Learning about the latest trends in low dielectric, high thermal conductivity, and optoelectronic integration technologies.

■Title: "Technological Trends in Packaging for Data Centers and Design/Evaluation Technologies for Encapsulation Materials" This presentation will explain the packaging technologies and encapsulation materials that support semiconductor devices for data centers, which continue to evolve with the spread of AI. It will organize the trends of the latest packaging technologies, such as chiplets and wafer-level packages, while systematically learning the design requirements and evaluation technologies for encapsulation materials, including high purity, moisture resistance, low stress, low dielectric loss, and high thermal conductivity. Furthermore, it will also introduce the latest trends in optoelectronic integration technologies that support next-generation data centers. - Technological trends in packaging for data centers - Design technologies for semiconductor encapsulation materials - Evaluation technologies for semiconductor encapsulation materials - Wafer-level packaging and chiplet technology - Latest trends in optoelectronic integration technology - Designers of semiconductor encapsulation materials - Engineers using semiconductor encapsulation materials - Developers of epoxy resins and hardeners - Research and development personnel from semiconductor material manufacturers

• Other semiconductors
• plastic
• Technical Seminar

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

In this seminar, you will learn the following: - The mixing mechanism and examples of Awatori Nentaro - Stirring methods and heat generation countermeasures according to material viscosity - The latest automation models and syringe filling technology using Awatori Nentaro We will provide not only the basic information about Awatori Nentaro but also the latest updates. During the live demonstration, we will clearly explain how actual materials are mixed and the operation screen of the temperature management solution app for Shinky. Additionally, equipment and optional items will be displayed in the venue, allowing you to consult while viewing the actual products. Please register early!

An explanation of the "detailed risk assessment of hazardous areas," which is essential as the first step in promoting "smart security" and "DX transformation" in hazardous material facilities. We will clearly convey the evaluation methods and points to consider in implementation, incorporating comparisons of old and new evaluation methods as well as recent case studies. There will also be a Q&A session on the day. If you have any questions in advance, please fill them out in the participation input form. You are also welcome to ask questions on the day! We look forward to your participation. Date and Time: October 16, 2026 (Friday) 13:30 - 14:30 (Web seminar via eams)

■Title: "The Complete Picture of Advanced Semiconductor Packaging Technology - From 2.5D/3D and Chiplets to Thermal and Power Solutions, Reliability Evaluation, and PFAS Compliance -" ――A systematic explanation of advanced packaging technologies that support the evolution of AI semiconductors. In addition to the latest technological trends in 2.5D/3D packaging, chiplets, CoWoS, TSV, and glass core substrates, you will learn broadly about manufacturing processes, yield improvement, failure analysis, reliability evaluation, PFAS regulatory compliance, and thermal and power design. Practical case studies and evaluation analysis techniques directly related to work will also be explained in detail. - Basics of semiconductor packaging technology and the evolution of trends - Latest trends in 2.5D/3D and chiplet technology - Reliability testing and failure analysis techniques - Key points for yield improvement - PFAS regulatory compliance and sustainable materials - Thermal and power design technologies for advanced packaging aimed at AI - Engineers and researchers from chemical, electronics, electrical, and automotive manufacturers - Personnel involved in semiconductor backend processes and assembly technologies - Personnel involved in materials and equipment development - Those who want to systematically learn about advanced packaging technologies

■Title: "Fundamentals and Applications of Non-Fluorinated Water-Repellent and Oil-Repellent Coatings, Development Trends" In light of the strengthened PFAS regulations, this presentation will clearly explain non-fluorinated water-repellent and oil-repellent coatings, covering the basics of water-repellent and oil-repellent technologies, the trends in PFAS regulations in various countries, and the latest developments in alternative technologies. It will also introduce the characteristics and application examples of various materials such as silicone-based, urethane-based, polyolefin-based, and hybrid materials, providing knowledge that will be useful for product development and material selection. - Basic knowledge of water repellency and oil repellency - Fundamentals of fluorinated water-repellent and oil-repellent coatings - Overview of PFAS regulations in Europe, the United States, and Japan - Technical trends in non-fluorinated water-repellent and oil-repellent coatings - Characteristics and application examples of various non-fluorinated materials - Planning and development personnel considering the adoption of water-repellent and oil-repellent coatings - Engineers involved in products utilizing coatings - Personnel considering fluorinated alternative materials - Young engineers and students who want to learn about water-repellent and oil-repellent technologies