Thickness measurement device for silicon wafers with a diameter of φ200mm and φ300mm.
This machine is a device for measuring the thickness of silicon wafers with diameters of φ200mm and φ300mm. The setting and measurement of the wafers are performed by manual operation by the operator.
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basic information
- The thickness can be measured at one point in the center and eight points on the outer circumference (TV-9). - Measurement data can be imported into EXCEL.
Price range
Delivery Time
Applications/Examples of results
We have received orders from the semiconductor industry.
Company information
☆Dedicated Semiconductor Website Now Open!! https://www.wafer-measurement-inspection.com/ At Justem Co., Ltd., we design, manufacture, and sell automation and labor-saving machines for the wafer manufacturing process, including non-contact thickness measurement machines for wafers, wafer thickness sorting machines, automated lapping and polishing machines, and wafer transfer machines, targeting materials such as Si, SiC, and sapphire, through our unique technology development. We have provided these to many customers. We also design, manufacture, and sell specialized machines for electronic component processing and automotive parts processing. We also accept demo measurements for thickness measurement of various materials.