This is a device that detects the wafer edge using laser light and measures the diameter by comparing it with a calibration wafer (reference wafer).
- The diameter of the wafer is measured non-contact. - By rotating the stage, the A diameter (3 points) and B diameter can be measured. - The LOT NO. and other information can be read using a barcode reader. - The measurement values are saved in Excel format on the accompanying computer.
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We have received orders from the semiconductor industry.
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☆Dedicated Semiconductor Website Now Open!! https://www.wafer-measurement-inspection.com/ At Justem Co., Ltd., we design, manufacture, and sell automation and labor-saving machines for the wafer manufacturing process, including non-contact thickness measurement machines for wafers, wafer thickness sorting machines, automated lapping and polishing machines, and wafer transfer machines, targeting materials such as Si, SiC, and sapphire, through our unique technology development. We have provided these to many customers. We also design, manufacture, and sell specialized machines for electronic component processing and automotive parts processing. We also accept demo measurements for thickness measurement of various materials.