This is a device that detects the edge of a wafer and measures its diameter through image processing.
- The diameter of the wafer is measured non-contact. - By rotating the stage, it also accommodates the diameter of the orifice surface and the depth of the notch. - The camera mounting section has a mechanism that allows for manual adjustment in the vertical direction.
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☆Dedicated Semiconductor Website Now Open!! https://www.wafer-measurement-inspection.com/ At Justem Co., Ltd., we design, manufacture, and sell automation and labor-saving machines for the wafer manufacturing process, including non-contact thickness measurement machines for wafers, wafer thickness sorting machines, automated lapping and polishing machines, and wafer transfer machines, targeting materials such as Si, SiC, and sapphire, through our unique technology development. We have provided these to many customers. We also design, manufacture, and sell specialized machines for electronic component processing and automotive parts processing. We also accept demo measurements for thickness measurement of various materials.
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