A film formation technology with excellent reproducibility that utilizes high energy to forge the material itself!
The sputtering method is a technique that involves colliding high-energy particles (argon) generated by plasma with a film-forming material (target), which knocks out the material components and deposits them onto a substrate such as glass or silicon wafers to form a thin film. Our company also offers coating services using the sputtering method, in addition to ion plating and vacuum deposition methods. Currently, the types of films available using the sputtering method are Ti, TiN, and TiC.
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basic information
■Supported film types: Ti, TiN, TiC ■Maximum allowable size: φ12 inches × t50mm ■Compatible substrates ・Si Wafer ・Glass ・Film ・Ceramics ・Metal materials (may be restricted depending on the material) ・Others
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Company information
Our company offers contract processing (coating services) for functional thin films using ion plating, vacuum deposition, sputtering, and plasma CVD. Since our inception, we have focused on "functional thin films" such as conductivity, insulation, and corrosion resistance. We accommodate various types of films, including metal films, reactive films like oxide, carbide, and nitride films, as well as their laminated films. We have established a system to respond to a wide range of requests, from small-scale prototypes, development, and research to medium-sized production runs. Currently, we have 11 deposition devices in operation, ranging from small machines with a diameter of 300mm to inline mass production machines with a film formation area of 1000mm x 900mm. All processes, from the unboxing of substrates entrusted by customers to the packaging of the coated products, are conducted within a clean room. If you are considering functional thin films, please feel free to contact us! Based on our flexible response and over 35 years of experience, we will meet your needs! *Information about our exhibition participation is also available on our website. Please take a look.
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