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  6. Plating chemicals and processes for printed circuit boards/semiconductor package substrates.

Plating chemicals and processes for printed circuit boards/semiconductor package substrates.

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last updated:Jan 06, 2023

奥野製薬工業 大阪・放出、東京、名古屋など
奥野製薬工業 大阪・放出、東京、名古屋など
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Okuno Pharmaceutical Industry introduces plating chemicals and processes under the theme of "OKUNO products contributing to the development of printed circuit boards/semiconductor package substrates"!

From prototype creation to introducing outsourcing partners, please feel free to consult us about any surface treatment concerns. Okuno Pharmaceutical Industry will be presenting the latest plating chemicals and processes at the 24th Semiconductor and Sensor Packaging Exhibition / Semiconductor Backend Process Specialized Exhibition (ISP), which will be held at Tokyo Big Sight from January 25 (Wednesday) to January 27 (Friday), 2023. 【Related Technology Associations】 ◆ Latest surface treatment processes and plating chemicals for semiconductor wafers https://premium.ipros.jp/okuno/product/category/62111/ ◆ Latest plating and surface treatment chemicals for polyimide, PET, LCP, and glass https://premium.ipros.jp/okuno/product/category/49378/ ◆ Printed circuit boards, printed wiring boards, and circuit formation technology https://premium.ipros.jp/okuno/product/category/61629/ A company introduction video titled "Turning Imagination into Reality" is currently available on our website. ◆ Okuno Pharmaceutical Industry Co., Ltd. website https://www.okuno.co.jp/

    Surface treatment contract serviceChemicalsCoating Agent
奥野製薬工業_サムネ.PNG

Plating chemicals and processes for printed circuit boards/semiconductor package substrates.

奥野製薬工業_サムネ.PNG
奥野製薬工業_サムネ.PNG

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Electroless plating process for copper/aluminum ceramic substrates for power modules.

Electroless plating process for copper/aluminum ceramic substrates for power modules.

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Surface treatment technology for TGV: Electroless copper plating process on glass substrates, PLOPX.

Surface treatment technology for TGV: Electroless copper plating process on glass substrates, PLOPX.

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invitation_isp2023

We will be exhibiting at the 24th Semiconductor and Sensor Packaging Exhibition / Specialized Exhibition for Semiconductor Backend Processes (ISP).

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Okuno Pharmaceutical Industry Co., Ltd. will exhibit at the 24th Semiconductor and Sensor Packaging Exhibition / Semiconductor Backend Process Specialized Exhibition (ISP), which will be held at Tokyo Big Sight from January 25 (Wednesday) to January 27 (Friday), 2023. We will showcase products from OKUNO that contribute to the development of printed circuit boards and semiconductor package substrates, including plating chemicals and processes for glass interposers, semiconductor wafers, and package substrates, RDL (redistribution layer) and 3D wiring formation technologies, and the latest surface treatments for power devices. Our booth location is [24-8] in East Hall 3. All of our staff sincerely look forward to welcoming you. Advance registration is required for attendance. By registering in advance, admission will be free. For more details, please visit the websites below. Our website: https://www.okuno.co.jp/news/invitation_isp2023.html Official website: https://www.nepconjapan.jp/tokyo/ja-jp/about/isp.html

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奥野製薬工業

奥野製薬工業 大阪・放出、東京、名古屋など

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Our company is a research and development-oriented enterprise that supports global manufacturing through science in the fields of surface treatment, inorganic materials, and food. 【Surface Treatment Division】 - We launched a new brand of surface treatment chemicals for semiconductor back-end processes called "TORYZA," offering various plating chemicals and equipment such as copper plating additives for ultra-fine wiring and electroless plating processes for UBM formation. - We propose surface treatment chemicals for plastic plating that provide high added value, such as beautiful metallic appearance, luxury feel, and antibacterial and antiviral properties. - We offer process chemicals for anodizing and dyeing aluminum alloys that beautifully enhance the appearance of casings for smartphones and other devices. We also have environmentally friendly processes and surface treatment chemicals for antibacterial and antiviral applications in our lineup. - We provide electroless nickel plating chemicals and various environmentally friendly products, including low-temperature and long-life types, that impart new functions to materials, such as corrosion resistance, wear resistance, and lubricity. 【Inorganic Materials Division】 Total production from design, processing, to mass production of glass. Contributing to the enhancement of design and functionality with high-quality glass materials. 【Food Division】 Bringing "deliciousness" and "safety" to the dining table. Challenging the development of high-function products composed of food ingredients.

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