COM-HPC Client equipped with 13th generation Intel Core.

congatec, a leading vendor of embedded and edge computing technology, has announced a new carrier board design training program to share best practices for design methods using state-of-the-art computer-on-modules such as the COM-HPC and SMARC standards. The goal is to enable system architects to quickly, easily, and efficiently delve deeply into the design rules of these PICMG and SGET standards. This training course will explain the fundamentals of design for all mandatory and recommended items of the standards, and by providing best practice schematics for computer-on-module carrier boards, it will allow developers to efficiently start their own carrier board design projects. The focus is on designing carrier boards that comply with the standards, allowing participants to learn about the essential interoperability, scalability, and durability needed to build custom embedded computing platforms. The target audience includes developers from OEMs, VARs, and system integrators.

Congatec has announced a new COM-HPC Client computer-on-module equipped with the high-end version of the 13th generation Intel Core processor. This powerful socket version further expands the portfolio of high-performance COM-HPC modules that have already been released in a soldered version. The new conga-HPC/cRLS computer-on-module is in the COM-HPC Client Size C (120x160mm) form factor, and its optimal application areas require vast memory capacity combined with excellent multi-core and multi-threaded performance, large cache, or high bandwidth through advanced I/O technology. The target market includes industrial sectors that require extremely high performance, such as edge applications using artificial intelligence (AI) and machine learning (ML) in fields like healthcare, as well as any type of embedded and edge computing solutions that need to integrate workloads.

congatec, a leading vendor of embedded and edge computing technology, has announced the launch of COM-HPC Client and COM Express computer-on-modules equipped with high-end 13th generation Intel Core processors in BGA form factor. congatec expects rapid ramp-up and expansion of mass production for products adopting this new module. This is because the new processors, which will be supplied long-term, significantly improve various functionalities while being fully hardware-compatible with the previous generation modules, allowing for very quick and easy implementation.