Concept of height inspection for BGA solder balls and bumps.
The height of BGA solder balls and bumps cannot be determined from 2D images; 3D measurements are required. What can be seen in 2D are the presence or absence of balls, positional shifts, sizes, and dirt. Since the balls are small and shine like mirrors, the basic method is to illuminate them from multiple directions in sequence and connect the readable spots. 【Points】 ■ The presence and position of the balls are viewed in 2D, while height alignment is assessed in 3D. ■ The apex of the balls is prone to reflection, making it unreadable with light from just one direction. ■ Gaps between the balls may remain as areas that cannot be measured. *For detailed explanations, please refer to the technical notes and downloadable materials in the related links.
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basic information
**Contents of this Technical Note** - What to look for in BGA ball height inspection - Balls are small and shiny, so they cannot be read with light from one direction - Ball absence and position are viewed in 2D, while height and flatness are viewed in 3D - To measure small balls, increase the number of light directions and overlap them - Situations where BGA height inspection is likely to reach its limits - How to proceed when verifying with actual BGA bumps **Consultation** I will confirm whether it can be measured or captured with your workpiece using the actual item. Please consult with a single photo.
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The technical notes can be read by anyone from the related links. We will discuss the costs of development and testing based on the details you provide.
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Applications/Examples of results
【Frequently Asked Questions】 Q. Can the height of the ball be estimated from the size of the 2D image? A. Estimation from the diameter is only possible if the shape of the ball is fixed. Since it can vary depending on how it is flattened or how it is wetted on the substrate side, it is more reliable to measure it if you want to determine the height. Q. Can BGA after mounting be inspected using the same method? A. Balls hidden under the components cannot be seen with optical inspection from above. We will consider different methods for inspecting the components individually before mounting and for confirming after mounting. Q. Is the same thinking applied to the height of bumps? A. The basic principle is the same. However, bumps are even smaller, and the light that returns varies with the material. We will first check whether the resolution is sufficient with stripe or line methods, or if a microscope-like method is needed.
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We specialize in 2D and 3D inspection and measurement technologies using cameras. We possess a wide range of knowledge in optics, mechanics, electronics, and software, enabling us to provide technical support for both hardware and software. Not only do we have personnel with experience working as researchers at image inspection device manufacturers, major electronic component manufacturers, and universities, but we also have numerous successful implementations of developed products in actual production environments, making our ability to adapt advanced technology to on-site needs a strong point. Additionally, we are skilled not only in developing proprietary algorithms but also in using off-the-shelf products such as image processing controllers from Keyence and Omron, allowing us to excel in selecting and utilizing the most suitable equipment for specific needs. In recent years, while AI technology has garnered attention, there are cases where utilizing 2D and 3D technologies can be implemented more easily than AI, and cases where optical devices and mechanical jigs can improve performance and reduce software load. We offer services related to image systems, including "equipment selection," "implementation support," "performance improvement of existing equipment," "technology development," and "joint development," so please feel free to consult with us first.
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